Temperature-controllable electroplating Hull cell

Abstract

The utility model relates to the technical field of material electroplating, and particularly discloses a temperature-controllable electroplating Hull cell, which comprises a constant temperature assembly and a circulating assembly, the constant temperature assembly comprises a bottom support, a controller and a plurality of heating pipes, the bottom support is provided with a heating groove, the plurality of heating pipes are fixedly connected in the heating groove, the plurality of heating pipes are parallel to each other, and the circulating assembly is connected with the controller. The controller is fixedly connected to the interior of the bottom support and located below the heating groove. The circulating assembly comprises an upper Hall cell, a lower Hall cell, an input pipeline, an output pipeline and four supporting rods, the upper ends of the four supporting rods are fixedly connected to the four corners of the upper Hall cell respectively, and the lower portions of the four supporting rods are fixedly connected to the four corners of the lower Hall cell respectively. According to the utility model, heating and temperature control can be carried out on the Hull cell, exchange and uniformity of electroplating liquid on the upper layer and the lower layer are realized, and the temperature of the experiment electroplating liquid is kept stable, so that the actual production conditions of a production line are better simulated.

Description

Technical Field

[0001] The utility model relates to the technical field of material electroplating, in particular to a temperature-controllable electroplating Hall tank. Background Art

[0002] The Hall cell test only requires a small amount of plating solution, and after a short test, the plating effect of the plating solution in a wide current density range can be obtained. Since the test is sensitive to the composition of the plating solution and the operating conditions, it is often used to determine the concentration and pH value of each component of the plating solution, determine the current density range for obtaining a good coating, and is also often used for abnormal analysis of the plating solution. Therefore, the Hall cell has become an indispensable tool for electroplating research and electroplating process control.

[0003] The existing technology still has the following areas for improvement: Most of the Hall cells currently on the market cannot be heated or temperature controlled. If the temperature does not reach the specified value, it is easy to cause incomplete electroplating reaction, making it difficult to truly simulate the effect of electroplating on the production line, affecting the accurate judgment of performance. Utility Model Content

[0004] In order to solve the above-mentioned problems existing in the prior art, the utility model provides a temperature-controllable electroplating Hall cell, which can heat and control the temperature of the Hall cell, realize the exchange and uniformity of the upper and lower layers of plating solution, maintain the temperature of the experimental plating solution stable, thereby better simulating the actual production conditions of the production line.

[0005] The purpose of the utility model can be achieved through the following technical solutions:

[0006] A temperature-controllable electroplating Hall cell comprises a constant temperature component and a circulation component, wherein the constant temperature component is fixedly connected below the circulation component;

[0007] The constant temperature assembly includes a bottom bracket, a controller and a plurality of heating tubes, the bottom bracket is provided with a heating groove, a plurality of the heating tubes are fixedly connected in the heating groove, the plurality of the heating tubes are parallel, the controller is fixedly connected inside the bottom bracket, and the controller is located below the heating groove;

[0008] The circulation component includes an upper Hall trough, a lower Hall trough, an input pipe, an output pipe and four support rods. The upper ends of the four support rods are respectively fixedly connected to the four corners of the upper Hall trough, and the lower ends of the four support rods are respectively fixedly connected to the four corners of the lower Hall trough. The output pipes are fixedly connected on the left sides of the upper Hall trough and the lower Hall trough, and the input pipes are fixedly connected on the right sides of the upper Hall trough and the lower Hall trough.

[0009] Furthermore, four support grooves are respectively formed on the bottom bracket, and the lower end of each support rod is fixedly connected in the corresponding support groove.

[0010] Furthermore, a water pump and a first switch valve are fixedly arranged on the input pipeline, and a second switch valve is fixedly arranged on the output pipeline.

[0011] Furthermore, a liquid level sensor is fixedly arranged on the inner wall of the upper Hall slot, and a temperature sensor is fixedly arranged on the inner wall of the lower Hall slot.

[0012] Furthermore, the input pipe is located at the upper end of the upper Hall slot, the output pipe is located at the lower end of the upper Hall slot, the input pipe is located at the lower end of the lower Hall slot, and the output pipe is located at the upper end of the lower Hall slot.

[0013] Furthermore, the area formed by the plurality of heating tubes is smaller than the area of ​​the lower Hall slot.

[0014] The beneficial effects of the utility model are:

[0015] (1) By setting up a circulation component, the technical effect that can be achieved is that the input pipe and the output pipe can realize the exchange and uniformity of the upper and lower layers of plating solution, so that the heated plating solution at the bottom can be circulated to the upper part, the temperature of the experimental plating solution can be kept stable, the time of experimental operation can be saved, and the actual production conditions of the production line can be better simulated.

[0016] (2) By setting a constant temperature component, the technical effect that can be achieved is that the heating tube can heat and control the temperature of the Hall slot, and the heating amount of the heating tube can be controlled by the temperature sensor to keep the plating solution at a constant temperature.

[0017] (3) By setting up a liquid level sensor, the technical effect that can be achieved is that the liquid level sensor can detect the liquid level of the upper Hall tank, thereby controlling the switching of the first switch valve and the second switch valve to ensure that the liquid level in the upper Hall tank is fixed. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to facilitate understanding by those skilled in the art, the present invention is further described below in conjunction with the accompanying drawings.

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 It is a top view of the thermostatic component in the utility model;

[0021] Figure 3 It is a top sectional view of the utility model;

[0022] Description of main component symbols:

[0023] In the figure: 1. Upper Hall slot; 2. Liquid level sensor; 3. Support rod; 4. Input pipe; 5. Water pump; 6. First switch valve; 7. Temperature sensor; 8. Bottom bracket; 9. Controller; 10. Heating tube; 11. Lower Hall slot; 12. Output pipe; 13. Second switch valve; 14. Support slot; 15. Heating slot. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application; obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application without making creative work are within the scope of protection of the present application.

[0025] In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0026] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "set / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0027] Reference Figures 1 to 3 , a temperature-controllable electroplating Hall cell disclosed by the utility model, includes a constant temperature component and a circulation component, wherein the constant temperature component is fixedly connected below the circulation component.

[0028] The constant temperature component includes a bottom bracket 8, a controller 9 and eight heating tubes 10. A heating groove 15 is opened on the bottom bracket 8. The eight heating tubes 10 are fixedly connected in the heating groove 15. The eight heating tubes 10 are parallel. The controller 9 is fixedly connected inside the bottom bracket 8 and is located below the heating groove 15.

[0029] The circulation component includes an upper Hall slot 1, a lower Hall slot 11, an input pipe 4, an output pipe 12 and four support rods 3. The upper ends of the four support rods 3 are respectively fixedly connected to the four corners of the upper Hall slot 1, and the lower ends of the four support rods 3 are respectively fixedly connected to the four corners of the lower Hall slot 11. The output pipe 12 is fixedly connected to the left side of the upper Hall slot 1 and the lower Hall slot 11, and the input pipe 4 is fixedly connected to the right side of the upper Hall slot 1 and the lower Hall slot 11.

[0030] The input pipe 4 and the output pipe 12 can realize the exchange and uniformity of the upper and lower layers of plating solution, so that the heated plating solution at the bottom can be circulated to the top, thereby maintaining the temperature of the experimental plating solution stable, saving the time of experimental operation, and better simulating the actual production conditions of the production line.

[0031] Four supporting grooves 14 are respectively formed on the bottom bracket 8 , and the lower end of each supporting rod 3 is fixedly connected in the corresponding supporting groove 14 .

[0032] A water pump 5 and a first switch valve 6 are fixedly arranged on the input pipe 4, and a second switch valve 13 is fixedly arranged on the output pipe 12. The input pipe 4 is used to transport the plating solution from the lower Hall tank 11 to the upper Hall tank 1, and the output pipe 12 is used to transport the plating solution from the upper Hall tank 1 to the lower Hall tank 11.

[0033] A liquid level sensor 2 is fixedly mounted on the inner wall of the upper Hall slot 1, and a temperature sensor 7 is fixedly mounted on the inner wall of the lower Hall slot 11. The liquid level sensor 2 and the first switch valve 6 are controlled by signal transmission, and the liquid level sensor 2 and the second switch valve 13 are controlled by signal transmission.

[0034] The temperature sensor 7 is controlled by signal transmission with the control board, and the temperature sensor 7 is controlled by signal transmission with the eight heating tubes 10 . The eight heating tubes 10 can be heated independently, and the area formed by the eight heating tubes 10 is smaller than the area of ​​the lower Hall slot 11 .

[0035] The heating tube 10 can heat and control the temperature of the Hall tank, and the heating amount of the heating tube 10 is controlled by the temperature sensor 7 to keep the plating solution at a constant temperature. The liquid level sensor 2 can detect the liquid level of the upper Hall tank 1, thereby controlling the switch of the first switch valve 6 and the second switch valve 13 to ensure that the liquid level in the upper Hall tank 1 is maintained at 250 or 273 ml.

[0036] The input pipe 4 is located at the upper end of the upper Hall slot 1 , and the output pipe 12 is located at the lower end of the upper Hall slot 1 . The input pipe 4 is located at the lower end of the lower Hall slot 11 , and the output pipe 12 is located at the upper end of the lower Hall slot 11 .

[0037] The working principle and use process of the utility model are as follows: the temperature sensor 7 detects the temperature of the electroplating liquid in the lower Hall slot 11 and transmits a signal to the control board. The control board turns on different numbers of heating tubes 10 according to the current temperature to control the temperature of the electroplating liquid in the lower Hall slot 11.

[0038] When the liquid level sensor 2 detects that the liquid level of the upper Hall tank 1 has not reached the specified value, the first switch valve 6 and the water pump 5 are opened to transport the plating solution in the lower Hall tank 11 to the upper Hall tank 1. When the plating solution in the upper Hall tank 1 is cooled, the first switch valve 6, the second switch valve 13 and the water pump 5 are opened to exchange the plating solutions in the upper Hall tank 1 and the lower Hall tank 11 to maintain the temperature and liquid level of the plating solution in the upper Hall tank 1.

[0039] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A temperature-controllable electroplating Hall cell, characterized in that: It includes a constant temperature component and a circulation component, wherein the constant temperature component is fixedly connected below the circulation component; The constant temperature assembly includes a bottom bracket, a controller and a plurality of heating tubes, the bottom bracket is provided with a heating groove, a plurality of the heating tubes are fixedly connected in the heating groove, the plurality of the heating tubes are parallel, the controller is fixedly connected inside the bottom bracket, and the controller is located below the heating groove; The circulation component includes an upper Hall trough, a lower Hall trough, an input pipe, an output pipe and four support rods. The upper ends of the four support rods are respectively fixedly connected to the four corners of the upper Hall trough, and the lower ends of the four support rods are respectively fixedly connected to the four corners of the lower Hall trough. The output pipes are fixedly connected on the left sides of the upper Hall trough and the lower Hall trough, and the input pipes are fixedly connected on the right sides of the upper Hall trough and the lower Hall trough.

2. The temperature-controllable electroplating Hall cell according to claim 1, characterized in that: The bottom bracket is respectively provided with four support grooves, and the lower end of each support rod is respectively fixedly connected in the corresponding support groove.

3. The temperature-controllable electroplating Hall cell according to claim 1, characterized in that: A water pump and a first switch valve are fixedly arranged on the input pipeline, and a second switch valve is fixedly arranged on the output pipeline.

4. The temperature-controllable electroplating Hall cell according to claim 1, characterized in that: A liquid level sensor is fixedly arranged on the inner wall of the upper Hall slot, and a temperature sensor is fixedly arranged on the inner wall of the lower Hall slot.

5. The temperature-controllable electroplating Hall cell according to claim 1, characterized in that: The input pipe is located at the upper end of the upper Hall slot, the output pipe is located at the lower end of the upper Hall slot, the input pipe is located at the lower end of the lower Hall slot, and the output pipe is located at the upper end of the lower Hall slot.

6. The temperature-controllable electroplating Hall cell according to claim 1, characterized in that: The area formed by the plurality of heating tubes is smaller than the area of ​​the lower Hall slot.

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