Light bar and LED lamp tube
By setting a metal solder layer on the substrate of the LED light strip, the cross-sectional area and current bearing value of the metal wire are improved, and the problem of insufficient current bearing value of the conductive wire is solved, thereby achieving higher current bearing capacity and lower production costs.
Patent Information
- Application Number
- CN202421365243.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-14
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2034-06-14
AI Technical Summary
In LED light strips, due to space limitations, the width and thickness of the conductive wires are difficult to increase, resulting in insufficient current load value, which easily leads to heating and burning of the circuit, and it is difficult to achieve differentiated processing in local areas, increasing production costs.
By providing a metal solder layer on the substrate of the lamp strip, the cross-sectional area of the metal wire is indirectly increased, thereby increasing the current carrying value, while taking into account the cost of processing and production.
The current carrying value of the metal wire is increased, avoiding the problem of circuit heating and burning, and reducing production costs.
Smart Images
Figure CN222669898U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of lighting technology, and in particular to a light bar and an LED light tube. Background Art
[0002] LED lamps are widely used in the field of lighting technology. The light strips in the lamps generally include a substrate and LED lamp beads arranged on the surface of the substrate. In the circuit layer in the substrate, the conductive wires of the LED driving circuit are pre-laid, generally copper wires. The conductive wires are used to electrically connect the LED lamp beads. For safety reasons, the inlet and outlet lines of the LED lamp beads often need to flow with large currents.
[0003] Considering that the conductive lines are affected by the layout, components, pads and vias, it is common for the circuit to heat up and burn out due to instantaneous fluctuations when the incoming and outgoing lines do not meet the expected current carrying value. The current carrying capacity depends on the following factors: line width, line thickness (copper foil thickness), and allowable temperature rise (the temperature that the power material can withstand). It can be understood that the wider and thicker the trace, the greater the current carrying capacity.
[0004] However, in the case of light strip installation and in the design of lamps with limited space, increasing the width of the conductive wire is not allowed due to space limitations. Since the above problems mainly occur in local areas of the circuit layer, if only local conductive wires are processed differently, it is difficult to achieve differentiated processing of the same layer of lines. If the conductive wire material is optimized as a whole or the thickness of the circuit layer is increased, the processing and production costs will increase by 30-100%. Utility Model Content
[0005] Based on this, it is necessary to provide a light bar to address the above technical problems.
[0006] The light strip of the present application includes a long strip-shaped substrate and LED lamp beads arranged on the substrate, the substrate has an insulating layer, a circuit layer and a solder resist layer, the substrate is provided with a component group constituting a driving power supply, a metal wire located in the circuit layer is provided between the component group and the LED lamp beads, the solder resist layer has a window exposing the metal wire, and a metal solder layer is loaded in the window.
[0007] Several optional methods are also provided below, but they are not intended to be additional limitations on the above-mentioned overall solution, but are merely further supplements or preferences. Under the premise that there are no technical or logical contradictions, each optional method can be combined with the above-mentioned overall solution separately, and multiple optional methods can also be combined.
[0008] Optionally, the component group is arranged at an end of the substrate.
[0009] Optionally, the thickness of the metal welding layer is 150-200 μm.
[0010] Optionally, the metal solder layer is formed by reflow soldering.
[0011] Optionally, the component group includes a first category of components and a second category of components, the first category of components have plug pins, and the second category of components are surface mount components.
[0012] Optionally, the LED lamp bead is a patch component.
[0013] Optionally, the first category of components are fixed by wave soldering, and the second category of components and the LED lamp beads are fixed by reflow soldering.
[0014] Optionally, the light strip is a flexible light strip.
[0015] Optionally, the substrate further includes a base layer, and the insulating layer is located between the circuit layer and the base layer.
[0016] The present application provides an LED lamp tube, comprising a shell, and a light strip as described in the present application and arranged in the shell.
[0017] The light strip and LED light tube of the present application have at least the following technical effects:
[0018] The substrate surface of the light bar of the present application is welded with component groups and LED lamp beads at the same time, which is beneficial to the production and processing of the product. The present application indirectly increases the cross-sectional area of the metal wire at the location through the metal welding layer, so that it can flow a larger current, increase the current carrying value of the metal wire at the corresponding location, and take into account the processing and production costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 This is a schematic diagram of a partial structure of a light bar in one embodiment of the present application;
[0020] Figure 2 This is a schematic diagram of the cross-sectional structure of a light bar in one embodiment of the present application;
[0021] Figure 3 for Figure 2 A schematic diagram of the structure in which a metal welding layer is added;
[0022] Figure 4 This is a cross-sectional schematic diagram of a light bar in one embodiment of the present application;
[0023] Figure 5 This is a schematic diagram of the partial structure of an LED lamp tube in one embodiment of the present application;
[0024] The reference numerals in the figures are described as follows:
[0025] 100, substrate; 101, solder mask layer; 102, circuit layer; 103, insulation layer; 104, base layer; 200,
[0026] LED lamp beads; 300, component group; 400, window; 410, metal welding layer; 500, shell. DETAILED DESCRIPTION
[0027] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0028] It should be noted that when a component is referred to as being "connected" to another component, it may be directly connected to the other component or there may be a central component. When a component is referred to as being "disposed on" another component, it may be directly disposed on the other component or there may be a central component at the same time.
[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.
[0030] In this application, the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number or order of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0031] In this application, the terms "comprises" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a system, product or device comprising a series of units is not necessarily limited to those units explicitly listed, but may include other units not explicitly listed or inherent to these products or devices.
[0032] In the present application, the terms "corresponding", "corresponding", "matching", "adaptable", such as "B corresponding to A", "B corresponding to A", "A corresponds to B", or "B corresponds to A", indicate that B has a corresponding relationship with A in shape, position or function, and B can be determined according to A. Determining B according to A does not mean determining B only according to A, but B can also be determined according to A and / or other information.
[0033] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, so that the internal connection of two elements or the interaction relationship between two elements can be achieved. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0034] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0035] See also Figure 1 to Figure 3 An embodiment of the present application provides a light bar, which includes a long strip substrate 100 and an LED lamp bead 200 disposed on the substrate 100. The substrate 100 has an insulating layer 103, a circuit layer 102 and a solder resist layer 101. The substrate 100 is provided with a component group 300 constituting a driving power supply, the component group 300 is disposed at the end of the substrate 100, and a metal wire in the circuit layer 102 is provided between the component group 300 and the LED lamp bead 200. The solder resist layer 101 has a window 400 exposing the metal wire, and a metal solder layer 410 is loaded in the window 400.
[0036] The light bar surface of this embodiment is directly welded with a component group, which is convenient for production and processing. The present application indirectly increases the cross-sectional area of the metal wire at the location through the metal welding layer, so that it can flow a larger current, increase the current carrying value of the metal wire at the corresponding location, and take into account the cost of processing and production.
[0037] Experiments show that, taking copper wire as an example, a metal wire with a width of 1 mm, a thickness of 35 μm, and a room temperature of 25°C can allow a current of 2.3 A to pass through. If the thickness is increased to 70 μm, other conditions being the same, the metal wire can allow a current of 3.2 A to pass through. The metal soldering layer 410 of this embodiment is formed by wave soldering or reflow soldering, and has a thickness of 150 to 200 μm. For example, it is formed by passing through a tin furnace or applying solder paste and then reflow soldering. The current carrying value I of the metal wire in the corresponding area is greater than 2.3 A, which meets the expected interception flow requirements.
[0038] The component group 300 includes two types of components, including first type components and second type components. The first type components have plug pins, and the second type components and the LED lamp bead 200 are SMD components. The first type components are fixed by wave soldering, and the second type components and the LED lamp bead 200 are fixed by reflow soldering.
[0039] See also Figure 4 The technical solutions of the light bar provided in each embodiment of the present application meet the applicability of all light bar materials such as FR-4, CEM-1, aluminum substrate, soft light bar (flexible light bar), etc. In one embodiment, the substrate 100 further includes a base layer 104, and the insulating layer 103 is between the circuit layer 102 and the base layer 104, and the base layer 104 can improve the structural strength of the substrate 100.
[0040] See also Figure 5 The present application provides an LED lamp tube, which may be, for example, a straight tube lamp, a U-shaped lamp, etc. The LED lamp tube includes a shell 500, and a light strip provided in the shell 500, as provided in each embodiment of the present application.
[0041] The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification. When the technical features in different embodiments are embodied in the same figure, it can be regarded that the figure also discloses the combination examples of the various embodiments involved.
[0042] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application.
Claims
1. A light bar, comprising a long strip substrate and LED lamp beads arranged on the substrate, wherein the substrate has an insulating layer, a circuit layer and a solder resist layer, characterized in that: The substrate is provided with a component group constituting a driving power supply, a metal wire located in the circuit layer is provided between the component group and the LED lamp bead, the solder resist layer has a window exposing the metal wire, and a metal solder layer is loaded in the window.
2. The light bar according to claim 1, characterized in that: The component group is arranged at the end of the substrate.
3. The light bar according to claim 1, characterized in that: The thickness of the metal welding layer is 150-200 μm.
4. The light bar according to claim 1, characterized in that: The metal soldering layer is formed by reflow soldering.
5. The light bar according to claim 1, characterized in that: The component group includes a first type of components and a second type of components, the first type of components have plug pins, and the second type of components are surface mount components.
6. The light bar according to claim 5, characterized in that: The LED lamp bead is a patch component.
7. The light bar according to claim 6, characterized in that: The first category of components are fixed by wave soldering, and the second category of components and the LED lamp beads are fixed by reflow soldering.
8. The light bar according to claim 1, characterized in that: The light strip is a flexible light strip.
9. The light bar according to claim 1, characterized in that: The substrate further includes a base layer, and the insulating layer is between the circuit layer and the base layer.
10. LED lamp, characterized in that, The invention comprises a shell, and a light bar as claimed in any one of claims 1 to 9 arranged in the shell.