Semiconductor refrigeration module structure capable of automatically eliminating condensate water

Abstract

The utility model discloses a semiconductor refrigeration module structure capable of automatically eliminating condensate water, which relates to the technical field of semiconductor refrigeration and comprises at least one semiconductor refrigeration sheet, a cold-end radiating fin, a hot-end radiating fin, a water inlet pipe, a water outlet pipe and a water outlet pipe. The semiconductor refrigeration module structure capable of automatically eliminating condensate water comprises a plurality of semiconductor refrigeration pieces, a cold-end cooling fin which is attached to the heating face of each semiconductor refrigeration piece, a water collecting tank located under the cold-end cooling fin, and a capillary permeation piece which is arranged in the water collecting tank, penetrates through a hot-end cooling fin and a cold-end fan and is fixedly arranged on the side, back to the semiconductor refrigeration pieces, of the cold-end cooling fin. According to the semiconductor refrigeration module, the purpose that the whole semiconductor refrigeration module does not need to discharge condensate water can be achieved, the troubles that an existing semiconductor refrigeration module needs to be provided with a drainage pipeline and a water collecting device needs to be arranged at a water outlet of the pipeline are avoided, the size of the semiconductor refrigeration module is reduced, and the production cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor refrigeration, in particular to a semiconductor refrigeration module structure for automatically eliminating condensed water. Background Art

[0002] Semiconductor refrigeration is also known as electronic refrigeration or thermoelectric refrigeration. It uses a PN junction composed of special semiconductor materials to form a thermocouple pair to produce the Peltier effect, which is a new refrigeration method using direct current cooling.

[0003] When the semiconductor refrigeration module is in use, a certain amount of condensed water will be generated at its cold end. This condensed water is usually of no use value. The most common method is to discharge it by adding pipes. For some mobile equipment using semiconductor refrigeration modules, a water collection device must be installed at the outlet of the pipe, thereby increasing the volume of the semiconductor refrigeration module and adding additional production costs. Utility Model Content

[0004] In order to overcome the shortcomings of the prior art, the utility model provides a semiconductor refrigeration module structure that automatically eliminates condensed water, so as to solve the problem that the existing semiconductor refrigeration module needs to be equipped with a drainage pipe, and a water collecting device is also provided at the water outlet of the pipe, thereby increasing the volume of the semiconductor refrigeration module and increasing additional production costs.

[0005] In order to solve the above technical problems, the utility model provides the following technical solutions: a semiconductor refrigeration module structure for automatically eliminating condensed water, comprising:

[0006] At least one semiconductor refrigeration plate, each of which has a heating surface and a cooling surface;

[0007] The cold end heat sink is attached to the cooling surface of each semiconductor cooling chip;

[0008] The hot end heat sink is attached to the heating surface of each semiconductor refrigeration chip;

[0009] The water collection tank is located directly below the cold end heat sink;

[0010] A capillary penetration member is arranged in the water collecting tank and penetrates the heat sink at the hot end;

[0011] The cold end fan is fixedly arranged on the side of the cold end heat sink facing away from the semiconductor refrigeration plate.

[0012] Preferably, a hot-end fan is fixed to the side of the hot-end heat sink facing away from the semiconductor refrigeration plate.

[0013] Preferably, the capillary permeable member is sponge, foam or porous plastic.

[0014] Preferably, a plurality of first heat dissipation fins are provided between the cold-end heat sink and the cold-end fan, the first heat dissipation fins are fixedly provided on the cold-end heat sink, and the first heat dissipation fins are perpendicular to the water collecting tank.

[0015] Preferably, the total bottom area of ​​the first heat sink fins and the cold end heat sink is not larger than the slot size of the water collecting tank.

[0016] Preferably, a plurality of second heat sinks are provided between the hot end heat sink and the hot end fan, and the capillary permeable member passes through the second heat sink and is flush with a side of the second heat sink facing away from the hot end heat sink.

[0017] Preferably, the semiconductor refrigeration sheet is wrapped with a heat insulating member, and the heat insulating member is also located on the periphery of the capillary permeable member.

[0018] Preferably, the thermal insulation member is made of rubber or plastic, and the area of ​​the thermal insulation member is not less than the area of ​​any side directly opposite to the cold-end heat sink and the hot-end heat sink.

[0019] Preferably, the cold end heat sink and the hot end heat sink are made of aluminum alloy, copper or ceramic.

[0020] Preferably, thermally conductive interface materials are filled between the bonding surfaces of the semiconductor refrigeration sheet and the cold-end heat sink and the hot-end heat sink.

[0021] Compared with the prior art, the utility model can achieve the following beneficial effects:

[0022] By energizing the semiconductor refrigeration chip, the semiconductor refrigeration chip absorbs heat on the side that is in contact with the cold-end heat sink, thereby reducing the temperature of the cold-end heat sink and condensing the moisture in the air near its surface to form condensed water droplets. The condensed water droplets drip onto the capillary permeable member on the water collecting tank due to gravity. Under the action of the capillary force of the capillary permeable member, the condensed water penetrates from one end of the water collecting tank to the hot-end heat sink area along the capillary permeable member. Since the semiconductor refrigeration chip releases heat on the side that is in contact with the hot-end heat sink, the air temperature around the hot-end heat sink rises, thereby heating the condensed water on the capillary permeable member in the hot-end heat sink area and evaporating it into water vapor, which dissipates in the air, thereby achieving the purpose of not having to discharge condensed water from the entire semiconductor refrigeration module, avoiding the need to set up a drainage pipe in the existing semiconductor refrigeration module, and avoiding the trouble of setting up a water collection device at the water outlet of the pipe, reducing the volume of the semiconductor refrigeration module and reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0024] Figure 2 For this utility model Figure 1 Schematic diagram of explosion structure;

[0025] Among them: 1. cold end fan; 2. cold end heat sink; 21. first heat sink fin; 3. water collecting tank; 4. semiconductor refrigeration plate; 5. hot end heat sink; 51. second heat sink fin; 52. first through hole; 6. hot end fan; 7. capillary penetration member; 8. thermal insulation member; 81. second through hole. DETAILED DESCRIPTION

[0026] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific embodiments. However, the following embodiments are only preferred embodiments of the present invention, not all of them. Based on the embodiments in the implementation mode, other embodiments obtained by those skilled in the art without creative work all belong to the protection scope of the present invention. The experimental methods in the following embodiments are conventional methods unless otherwise specified. The materials, reagents, etc. used in the following embodiments are all commercially available unless otherwise specified.

[0027] like Figure 1 and Figure 2 As shown, the utility model provides a semiconductor refrigeration module structure for automatically eliminating condensed water, including at least one semiconductor refrigeration sheet 4, a cold end heat sink 2, a hot end heat sink 5, a water collecting tank 3, a capillary permeation member 7 and a cold end fan 1:

[0028] Each semiconductor refrigeration sheet 4 has a heating surface and a cooling surface;

[0029] The cold end heat sink 2 is attached to the cooling surface of each semiconductor cooling sheet 4;

[0030] The hot end heat sink 5 is attached to the heating surface of each semiconductor refrigeration sheet 4;

[0031] The water collecting tank 3 is located directly below the cold end heat sink 2;

[0032] The capillary permeable member 7 is arranged in the water collecting tank 3 and penetrates the hot end heat sink 5. The hot end heat sink 5 is provided with a first through hole 52 for the capillary permeable member 7 to pass through. The outer surface of the capillary permeable member 7 is in contact with the inner wall of the first through hole 52.

[0033] The cold end fan 1 is fixedly arranged on the side of the cold end heat sink 2 facing away from the semiconductor cooling sheet 4;

[0034] When in use, the semiconductor refrigeration sheet 4 is powered on, and the semiconductor refrigeration sheet 4 absorbs heat on the side that is attached to the cold end heat sink 2, so that the temperature of the cold end heat sink 2 is reduced, and the moisture in the air near its surface condenses to form condensed water droplets, which drip onto the capillary penetration member 7 on the water collecting tank 3 due to the action of gravity. Under the action of the capillary force of the capillary penetration member 7 (capillary force phenomena such as towels absorbing water and groundwater rising along the soil are all capillary phenomena, which are common knowledge), the condensed water penetrates from one end of the water collecting tank 3 to the hot end heat sink 5 area along the capillary penetration member 7. Since the semiconductor refrigeration sheet 4 releases heat on the side that is attached to the hot end heat sink 5, the air temperature around the hot end heat sink 5 increases, thereby heating the condensed water on the capillary penetration member 7 in the hot end heat sink 5 area to evaporate into water vapor and dissipate in the air;

[0035] The condensed water after volatilization will be continuously replenished from the water collecting tank 3 through the capillary permeation part 7, so that the condensed water generated by the cold end heat sink 2 can be volatilized at the hot end heat sink 5, and the purpose of the entire semiconductor refrigeration module not needing to discharge the condensed water is achieved, avoiding the need to set up a drainage pipe in the existing semiconductor refrigeration module and the trouble of setting up a water collecting device at the water outlet of the pipe, reducing the volume of the semiconductor refrigeration module and reducing the production cost.

[0036] like Figure 2 As shown, a hot end fan 6 is fixed to the hot end heat sink 5 on the side facing away from the semiconductor cooling sheet 4;

[0037] By setting up the hot end fan 6, the air can be blown to achieve rapid convection heat exchange between the hot end heat sink 5 and the surrounding air, which not only cools the hot end heat sink 5, but also blows the hot air around the hot end heat sink 5 onto the capillary permeable member 7, so that the moisture on the capillary permeable member 7 is quickly evaporated.

[0038] The capillary permeable member 7 is a sponge, foam or porous plastic or other materials having micro channels or pore structures inside.

[0039] like Figure 2 As shown, a plurality of first heat dissipation fins 21 are provided between the cold end heat sink 2 and the cold end fan 1, the cold end fan 1 is fixed on the first heat dissipation fins 21, the first heat dissipation fins 21 are fixed on the cold end heat sink 2, and the first heat dissipation fins 21 are perpendicular to the water collecting tank 3;

[0040] By setting the first heat dissipation fin 21, the cooling area can be increased, thereby improving the cooling efficiency. By setting the first heat dissipation fin 21 perpendicular to the water collecting tank 3, it is ensured that the moisture in the air can quickly fall into the water collecting tank 3 after condensing into condensed water on the first heat dissipation fin 21.

[0041] like Figure 2As shown, the total bottom surface area of ​​the first heat sink fin 21 and the cold end heat sink 2 is not larger than the slot size of the water collecting tank 3;

[0042] It is ensured that when the water vapor in the air condenses on the cold end heat sink 2 and the first heat sink fin 21 to form condensed water and drips along the gravity direction, the water collecting tank 3 can completely collect it, thereby ensuring that the condensed water can be completely adsorbed by the capillary permeable member 7.

[0043] like Figure 2 As shown, a plurality of second heat dissipation fins 51 are provided between the hot end heat sink 5 and the hot end fan 6, the hot end fan 6 is fixed on the second heat dissipation fins 51, and the capillary permeable member 7 passes through the second heat dissipation fins 51 and is flush with the side of the second heat dissipation fins 51 facing away from the hot end heat sink 5, ensuring that the capillary permeable member 7 is in full contact with the hot end heat sink 5 and the second heat dissipation fins 51;

[0044] By adding the second heat dissipation fin 51, the heat dissipation area can be significantly increased, thereby improving the heat dissipation efficiency, and the hot end fan 6 can blow the hot air around the hot end heat sink 5 and the second heat dissipation fin 51 to the surface of the capillary permeable member 7 to the maximum extent, thereby accelerating the evaporation of water on the surface of the capillary permeable member 7.

[0045] like Figure 2 As shown, the semiconductor cooling sheet 4 is wrapped with a heat insulating member 8, and the heat insulating member 8 is also arranged on the periphery of the capillary permeable member 7. The heat insulating member 8 has a second through hole 81 for the capillary permeable member 7 to pass through;

[0046] By providing the heat insulating member 8, the semiconductor cooling sheet 4 and the capillary permeable member 7 are relatively isolated from the external environment, which plays a certain protective role for the semiconductor cooling sheet 4 and the capillary permeable member 7.

[0047] like Figure 1 and Figure 2 As shown, the heat insulating member 8 is made of rubber or plastic, and the area of ​​the heat insulating member 8 is not less than the area of ​​any side directly opposite to the cold end heat sink 2 and the hot end heat sink 5;

[0048] Here, the size of the hot end heat sink 5 is set to be larger than that of the cold end heat sink 2, and the size of the heat insulation member 8 is the same as the area of ​​the side of the hot end heat sink 5 facing the cold end heat sink 2;

[0049] Another function of the thermal insulation member 8 is to ensure that the thermal insulation member 8 can reduce the heat transfer between the cold end heat sink 2 and the hot end heat sink 5 to the greatest extent, thereby enhancing the performance of the semiconductor refrigeration module.

[0050] The cold-end heat sink 2 and the hot-end heat sink 5 are made of aluminum alloy, copper or ceramic. Since the greater the thermal conductivity of the material, the faster the heat transfer speed and the smaller the thermal resistance, the thermal conductivity effect can be improved by using these materials with large thermal conductivity as the cold-end heat sink 2 and the hot-end heat sink 5.

[0051] The bonding surfaces between the semiconductor refrigeration sheet 4 and the cold end heat sink 2 and the hot end heat sink 5 are filled with thermal conductive interface materials, which can be thermal conductive silicone grease or thermal conductive pads, so as to reduce the contact thermal resistance between them and improve the thermal conductivity effect.

[0052] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor refrigeration module structure for automatically eliminating condensed water, characterized in that: include: At least one semiconductor refrigeration sheet (4), each of the semiconductor refrigeration sheets (4) having a heating surface and a cooling surface; The cold end heat sink (2) is bonded to the cooling surface of each semiconductor cooling sheet (4); The hot end heat sink (5) is attached to the heating surface of each semiconductor refrigeration sheet (4); A water collecting tank (3) is located directly below the cold end heat sink (2); A capillary permeation member (7) is disposed in the water collecting tank (3) and penetrates the hot end heat sink (5); The cold end fan (1) is fixedly arranged on the side of the cold end heat sink (2) facing away from the semiconductor cooling sheet (4).

2. The semiconductor refrigeration module structure for automatically eliminating condensed water according to claim 1 is characterized in that: A hot end fan (6) is fixed on the side of the hot end heat sink (5) facing away from the semiconductor cooling sheet (4).

3. The semiconductor refrigeration module structure for automatically eliminating condensed water according to claim 1 is characterized in that: The capillary permeable member (7) is sponge, foam or porous plastic.

4. The semiconductor refrigeration module structure for automatically eliminating condensed water according to claim 3 is characterized in that: A plurality of first heat dissipation fins (21) are provided between the cold end heat sink (2) and the cold end fan (1); the first heat dissipation fins (21) are fixedly arranged on the cold end heat sink (2); and the first heat dissipation fins (21) are perpendicular to the water collecting tank (3).

5. The semiconductor refrigeration module structure for automatically eliminating condensed water according to claim 4 is characterized in that: The total bottom surface area of ​​the first heat dissipation fins (21) and the cold end heat dissipation fins (2) is no larger than the size of the notch of the water collecting tank (3).

6. The semiconductor refrigeration module structure for automatically eliminating condensed water according to claim 2 is characterized in that: A plurality of second heat dissipation fins (51) are provided between the hot end heat dissipation fin (5) and the hot end fan (6), and the capillary permeable member (7) passes through the second heat dissipation fins (51) and is flush with a side of the second heat dissipation fin (51) that is opposite to the hot end heat dissipation fin (5).

7. The semiconductor refrigeration module structure for automatically eliminating condensed water according to claim 1 is characterized in that: The semiconductor refrigeration sheet (4) is wrapped with a heat insulating member (8) on the periphery, and the heat insulating member (8) is also located on the periphery of the capillary permeable member (7).

8. The semiconductor refrigeration module structure for automatically eliminating condensed water according to claim 7 is characterized in that: The heat insulating member (8) is made of rubber or plastic, and the area of ​​the heat insulating member (8) is not less than the area of ​​any side directly opposite to the cold end heat sink (2) and the hot end heat sink (5).

9. The semiconductor refrigeration module structure for automatically eliminating condensed water according to claim 1, characterized in that: The cold end heat sink (2) and the hot end heat sink (5) are made of aluminum alloy, copper or ceramic.

10. The semiconductor refrigeration module structure for automatically eliminating condensed water according to claim 1, characterized in that: The bonding surfaces between the semiconductor refrigeration sheet (4) and the cold end heat sink (2) and the hot end heat sink (5) are filled with heat conductive interface material.

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