Temperature sensor and temperature measuring device
By using Peltier temperature control plate and thermopile chip in the temperature sensor to maintain the temperature in the accommodating space, the problem of inaccurate measurement under thermal shock is solved, and the measurement accuracy and thermal shock resistance are improved.
Patent Information
- Application Number
- CN202420509500.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-15
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2034-03-15
AI Technical Summary
The stable output temperature performance of existing temperature sensors is affected under thermal shock, and accurate temperature measurement cannot be achieved.
A temperature sensor is designed, using a Peltier temperature control board, packaging tube cap, thermopile chip and filter. Through the heating and cooling state of the Peltier temperature control board, the temperature in the accommodating space is kept constant, and the impact of external ambient temperature changes on the thermopile chip is reduced.
The measurement accuracy and thermal shock resistance of the temperature sensor are improved, ensuring accurate temperature measurement can still be achieved under thermal shock conditions.
Smart Images
Figure CN222671225U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of infrared detection, in particular to a temperature sensor and a temperature measuring device. Background Art
[0002] As a key electronic device, temperature sensors are widely used in many fields such as industry, medical treatment, automobiles, home appliances, and environmental protection. For example, in the industrial field, temperature sensors can be used to monitor temperature changes in the production process to ensure the stability of the process and the controllability of product quality. In the medical field, temperature sensors play a role in medical equipment such as thermometers and ventilators, providing doctors with patient temperature data support. In the field of automotive electronics, temperature sensors play a key role in engine control, battery management systems, etc., improving vehicle performance and fuel efficiency. In addition, temperature sensors occupy an important position in the fields of home appliances, Internet of Things devices, environmental monitoring, and scientific research.
[0003] However, in actual applications, existing temperature sensors are susceptible to thermal shock (thermal shock refers to a rapid change in temperature, usually caused by instantaneous heating or cooling). Specifically, this sudden temperature change will affect the output temperature stability of the sensor, causing its measured temperature to change, making it impossible to achieve accurate temperature measurement. Utility Model Content
[0004] The utility model aims to provide a temperature sensor and a temperature measuring device, which are used to keep the interior of the temperature sensor at a constant temperature in a working state, thereby improving the measurement accuracy and thermal shock resistance of the temperature sensor.
[0005] In order to achieve the above-mentioned purpose, in a first aspect, the utility model provides a temperature sensor, which includes: a Peltier temperature control board, a packaging tube cap, a thermopile chip and a filter. The packaging tube cap is arranged on the Peltier temperature control board and is airtightly connected to the Peltier temperature control board. The packaging tube cap and the Peltier temperature control board form a storage space, and a window is arranged on the side of the packaging tube cap away from the Peltier temperature control board. The thermopile chip is arranged on the Peltier temperature control board and is located in the storage space. The setting position of the thermopile chip on the Peltier temperature control board is opposite to the window. The filter covers the window and is airtightly connected to the packaging tube cap. The filter is used to filter light in the external environment.
[0006] In the case of adopting the above technical solution, the temperature sensor provided by the utility model includes a Peltier temperature control board and a packaging tube cap arranged on the Peltier temperature control board. The packaging tube cap is airtightly connected to the Peltier temperature control board, and the two enclose a storage space for accommodating the thermopile chip. In the actual application process, when the temperature sensor is working, the Peltier temperature control board has a heating state and a cooling state to maintain a constant temperature in the storage space. Specifically, when the external environment temperature is lower than the reference temperature of the thermopile chip (such as 35°C, of course, it can also be set to other suitable values), the Peltier temperature control board is in a heating state, and the temperature in the storage space is increased and maintained to the reference temperature by controlling its own power. When the external environment temperature is higher than the reference temperature, the Peltier temperature control board is in a cooling state, and the temperature in the storage space is reduced and maintained to the reference temperature by controlling its own power. At the same time, when the external environment temperature changes, the heating or cooling temperature of the Peltier temperature control board can be adjusted by regulating the power size of the Peltier temperature control board, thereby adjusting the temperature in the storage space. It can be seen that even if the temperature sensor is affected by thermal shock during operation, the Peltier temperature control board can keep the temperature in the accommodation space stable at a constant temperature, thereby reducing the impact of changes in the external environment temperature on the temperature of the thermopile chip, improving the temperature sensor's ability to resist thermal shock, and thus improving the accuracy of the temperature sensor's measurement results. In addition, the temperature sensor provided by the utility model does not need to be provided with a temperature measuring element for measuring the temperature of the accommodation space, which is conducive to simplifying the internal structure of the temperature sensor, realizing the miniaturization of the temperature sensor, and can also prevent the temperature sensor output result from being biased due to the internal resistance of the temperature measuring element in the existing temperature sensor or due to integration problems, which makes the measured accommodation space temperature inaccurate, further improving the accuracy of the temperature sensor's measurement results.
[0007] Furthermore, compared with the traditional substrate with heating resistor, the Peltier temperature control board has the advantages of simple structure, small size, fast heating and cooling rate, and high density, which is more conducive to improving the working performance of the temperature sensor. In addition, the Peltier temperature control board has not only a heating state, but also a cooling state, which can adjust the temperature in the accommodation space according to the different external ambient temperatures, which can not only improve the thermal shock resistance of the temperature sensor, but also further improve the working performance of the temperature sensor at higher extreme temperatures.
[0008] In one example, the thermopile chip includes a support structure, an insulation film and a thermopile structure. The support structure is arranged on a Peltier temperature control plate, and a cavity is arranged on a side of the support structure close to the Peltier temperature control plate. The insulation film is suspended on the cavity. The thermopile structure is arranged on the insulation film.
[0009] In one example, the thermopile structure includes a first thermopile structure and a second thermopile structure that are centrally symmetrically disposed on the thermal insulation film.
[0010] In one example, the thermopile structure includes a cold end and a hot end electrically connected to the cold end; the cold end and the hot end are both located on the thermal insulation film.
[0011] In one example, the minimum distance from the cold end and / or the hot end to the edge of the thermal insulation film is greater than or equal to 120 μm and less than or equal to 250 μm.
[0012] In one example, in the same thermopile structure, the minimum distance from the cold end to the edge of the thermal insulation film is equal to the minimum distance from the hot end to the edge of the thermal insulation film.
[0013] In one example, the above-mentioned Peltier temperature control plate includes a first substrate and a second substrate arranged opposite to each other, and at least one Peltier element located between the first substrate and the second substrate. The thermopile chip is arranged on the side of the first substrate away from the Peltier element. In the above case, the Peltier element has a heating portion and a cooling portion opposite to the heating portion. The Peltier temperature control plate has a heating state and a cooling state; when the Peltier temperature control plate is in a heating state, one end of the Peltier element in contact with the first substrate is the heating portion, and the other end of the Peltier element in contact with the second substrate is the cooling portion. When the Peltier temperature control plate is in a cooling state, one end of the Peltier element in contact with the first substrate is the cooling portion, and the other end of the Peltier element in contact with the second substrate is the heating portion.
[0014] In one example, the first substrate and / or the second substrate comprises a ceramic substrate.
[0015] In one example, the packaging cap is an electromagnetic shielding cap.
[0016] In one example, the packaging tube cap is a metal tube cap.
[0017] In a second aspect, the utility model provides a temperature measuring device, which includes: a flexible circuit board, a temperature sensor provided by the first aspect and various implementations thereof, and a temperature measuring element. The flexible circuit board is provided with a conductive lead and an electromagnetic shielding net wrapped around the outer periphery of the conductive lead. The electromagnetic shielding net is grounded. The temperature sensor is arranged on the flexible circuit board. The temperature measuring element is arranged on the flexible circuit board. The temperature measuring element is electrically connected to the Peltier temperature control board through the conductive lead. The temperature measuring element is used to measure the current temperature of the external environment and send it to the Peltier temperature control board.
[0018] In one example, the electromagnetic shielding mesh comprises a metal wire mesh.
[0019] In one example, the temperature measuring element is a temperature measuring resistor.
[0020] In one example, the temperature measuring device is a temperature measuring gun.
[0021] The beneficial effects of the second aspect of the present invention and its various implementations can be analyzed by referring to the beneficial effects of the first aspect and its various implementations, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:
[0023] Figure 1 A schematic longitudinal cross-sectional view of the structure of the temperature sensor provided in the embodiment of the utility model Figure 1 ;
[0024] Figure 2 The circuit principle of the Peltier element in the embodiment of the utility model is Figure 1 ;
[0025] Figure 3 The circuit principle of the Peltier element in the embodiment of the utility model is Figure 2 ;
[0026] Figure 4 This is a schematic diagram of the distribution of the thermopile structure on the thermal insulation film in an embodiment of the utility model;
[0027] Figure 5 This is a schematic diagram of the structure of the flexible circuit board in the embodiment of the utility model;
[0028] Figure 6 A schematic longitudinal cross-sectional view of the structure of the temperature sensor provided in the embodiment of the utility model Figure 2 .
[0029] Figure numerals: 11 is a Peltier temperature control board, 12 is a packaging cap, 13 is a window, 14 is a thermopile chip, 15 is a filter, 16 is a supporting structure, 17 is an insulating film, 18 is a first thermopile structure, 19 is a second thermopile structure, 20 is a flexible circuit board, 21 is a heating part, 22 is a cooling part, 23 is an N-type semiconductor part, 24 is a P-type semiconductor part, and 25 is an internal temperature measuring element. DETAILED DESCRIPTION
[0030] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the present disclosure. In addition, in the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessary confusion of the concepts of the present disclosure.
[0031] Various structural schematic diagrams according to embodiments of the present disclosure are shown in the accompanying drawings. These figures are not drawn to scale, and some details are magnified and some details may be omitted for the purpose of clear expression. The shapes of various regions and layers shown in the figures and the relative sizes and positional relationships therebetween are only exemplary, and may deviate in practice due to manufacturing tolerances or technical limitations, and those skilled in the art may further design regions / layers with different shapes, sizes, and relative positions according to actual needs.
[0032] In the context of the present disclosure, when a layer / element is referred to as being "on" another layer / element, the layer / element may be directly on the other layer / element, or there may be an intermediate layer / element between them. In addition, if a layer / element is "on" another layer / element in one orientation, then when the orientation is reversed, the layer / element may be "under" the other layer / element. In order to make the technical problems, technical solutions and beneficial effects to be solved by the utility model clearer, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model.
[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined. The meaning of "several" is one or more, unless otherwise clearly and specifically defined.
[0034] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0035] Among the various types of sensors, temperature sensors are second to none in terms of application areas and quantity. With the development of modern electronic technology, temperature sensors, as a key electronic device, are widely used in many fields such as industry, medical treatment, automobiles, home appliances, environmental protection, etc. For example: in the industrial field, temperature sensors can be used to monitor temperature changes in the production process to ensure the stability of the process and the controllability of product quality. In the medical field, temperature sensors play a role in medical equipment such as thermometers and ventilators, providing doctors with patient temperature data support. In the field of automotive electronics, temperature sensors play a key role in engine control, battery management systems, etc., improving vehicle performance and fuel efficiency. In addition, temperature sensors occupy an important position in the fields of home appliances, Internet of Things devices, environmental monitoring and scientific research. As the demand for temperature control in various industries becomes more and more stringent and precise, the reliability requirements for products are more stringent, the volume requirements are smaller, the sensitivity requirements are higher, and the installation and use requirements are more convenient.
[0036] Among them, for the thermopile temperature sensor, it is a detection device that can measure the temperature of the object to be measured by detecting the infrared energy of the object to be measured at a certain distance. Specifically, the thermopile temperature sensor generally includes a packaging shell with an infrared light-transmitting window, and a thermopile chip arranged inside the packaging shell. The thermopile chip is arranged relative to the infrared light-transmitting window. Based on this, during the operation of the thermopile sensor, when the distance between the thermopile sensor and the object to be measured meets the detection distance requirement, the infrared energy radiated by the object to be measured can heat up the hot end of the thermopile assembly after passing through the infrared light-transmitting window, thereby causing a temperature difference between the hot end and the cold end of the thermopile assembly. According to the Seebeck effect, when there is a temperature difference between the hot end and the cold end of the thermopile assembly, a temperature difference electromotive force can be generated between the hot end and the cold end of the thermopile assembly, so that the temperature signal can be converted into a thermoelectromotive force signal. The thermoelectromotive force signal output by the thermopile temperature sensor can be converted into the temperature of the object to be measured through instruments such as electrical instruments, thereby realizing the temperature measurement of the object to be measured.
[0037] However, in actual applications, existing temperature sensors are susceptible to thermal shock (thermal shock refers to a rapid change in temperature, usually caused by instantaneous heating or cooling). Specifically, the temperature of the thermopile chip changes rapidly due to thermal shock. This sudden temperature change will affect the output temperature stability of the temperature sensor, causing its measured temperature to change, making it impossible to achieve accurate temperature measurement.
[0038] In order to solve the above technical problems, in the first aspect, the embodiment of the utility model provides a temperature sensor. Figure 1As shown, the temperature sensor includes: a Peltier temperature control board 11, a packaging tube cap 12, a thermopile chip 14 and a filter 15. The packaging tube cap 12 is arranged on the Peltier temperature control board 11 and is airtightly connected to the Peltier temperature control board 11. The packaging tube cap 12 and the Peltier temperature control board 11 form a receiving space, and a window 13 is arranged on the side of the packaging tube cap 12 away from the Peltier temperature control board 11. The thermopile chip 14 is arranged on the Peltier temperature control board 11 and is located in the receiving space. The setting position of the thermopile chip 14 on the Peltier temperature control board 11 is opposite to the window 13. The filter 15 covers the window 13 and is airtightly connected to the packaging tube cap 12. The filter 15 is used to filter light in the external environment.
[0039] In actual application, Figures 1 to 3 As shown, when the temperature sensor provided in the embodiment of the utility model is working, the Peltier temperature control plate 11 has a heating state and a cooling state to maintain the temperature in the accommodation space constant. Specifically, when the external environment temperature is lower than the reference temperature, the Peltier temperature control plate 11 is in a heating state, and the temperature in the accommodation space is increased and maintained to the reference temperature by controlling its own power. When the external environment temperature is higher than the reference temperature, the Peltier temperature control plate 11 is in a cooling state, and the temperature in the accommodation space is reduced and maintained to the reference temperature by controlling its own power. At the same time, when the external environment temperature changes, the heating or cooling temperature of the Peltier temperature control plate 11 can be adjusted by regulating the power of the Peltier temperature control plate 11, thereby adjusting the temperature in the accommodation space. It can be seen that even if the temperature sensor is affected by thermal shock during operation, the above-mentioned Peltier temperature control plate 11 can also keep the temperature in the accommodation space stable at a certain constant temperature (i.e., the reference temperature, which can be 5°C, and of course can also be set to other suitable values according to the requirements of the actual application scenario), thereby reducing the impact of changes in the external ambient temperature on the temperature of the thermopile chip 14, improving the temperature sensor's ability to resist thermal shock, and thereby improving the accuracy of the temperature sensor's measurement results. In addition, the temperature sensor provided in the embodiment of the utility model does not need to be provided with a temperature measuring element for measuring the temperature of the accommodation space, which is conducive to simplifying the internal structure of the temperature sensor and realizing the miniaturization of the temperature sensor. It can also prevent the temperature sensor output result from being biased due to the internal resistance of the temperature measuring element in the existing temperature sensor or due to problems such as integration, which makes the measured accommodation space temperature inaccurate, thereby further improving the accuracy of the temperature sensor's measurement results. Of course, if Figure 6As shown, the temperature sensor provided by the embodiment of the utility model may also be provided with an internal temperature measuring element 25 for measuring the temperature of the accommodation space, so that when the Peltier temperature control plate 11 and / or the element for detecting the temperature of the external environment is damaged and cannot work normally during the actual application process, the temperature of the accommodation space can be measured by the above-mentioned internal temperature measuring element 25, thereby improving the structural reliability of the temperature sensor. Specifically, whether the above-mentioned internal temperature measuring element 25 needs to be provided in the accommodation space can be determined according to actual needs, and no specific limitation is made here. Furthermore, compared with the traditional substrate provided with a heating resistor, the Peltier temperature control plate 11 has the advantages of simple structure, small size, fast heating and cooling rate, and high density, which is more conducive to improving the working performance of the temperature sensor. In addition, the Peltier temperature control plate 11 has not only a heating state, but also a cooling state, and can adjust the temperature in the accommodation space according to the different external environment temperatures, which can not only improve the thermal shock resistance of the temperature sensor, but also further improve the working performance of the temperature sensor at higher extreme temperatures.
[0040] Specifically, the embodiment of the utility model does not impose any specific limitation on the structure of the Peltier temperature control plate, as long as the temperature in the accommodation space of the temperature sensor can be kept stable at a constant temperature through the Peltier effect.
[0041] Exemplarily, the above-mentioned Peltier temperature control plate may include a first substrate and a second substrate arranged opposite to each other, and at least one Peltier element located between the first substrate and the second substrate. The above-mentioned thermopile chip is arranged on the side of the first substrate away from the Peltier element. In the above case, the Peltier element has a heating portion and a cooling portion opposite to the heating portion. The Peltier temperature control plate has a heating state and a cooling state. Moreover, when the Peltier temperature control plate is in a heating state, one end of the Peltier element in contact with the first substrate is the heating portion, and the other end of the Peltier element in contact with the second substrate is the cooling portion. When the Peltier temperature control plate is in a cooling state, one end of the Peltier element in contact with the first substrate is the cooling portion, and the other end of the Peltier element in contact with the second substrate is the heating portion.
[0042] Specifically, in terms of the connection method, the Peltier element can be arranged on the second substrate by means of embedding or bonding. Moreover, the second substrate can be fixedly connected to the first substrate by means of bonding or threaded connection. In addition, a portion of at least one of the first substrate and the second substrate corresponding to the Peltier element can be provided with a groove to accommodate the Peltier element.
[0043] As for the first substrate and the second substrate, the first substrate and / or the second substrate may include a silicon substrate, a silicon carbide substrate or a ceramic substrate. Preferably, the first substrate and / or the second substrate include a ceramic substrate. Based on this, since the ceramic substrate has a high thermal conductivity, when at least one of the first substrate and the second substrate includes a ceramic substrate, it is beneficial for the Peltier temperature control plate to have a good uniform temperature effect, and further facilitates the temperature sensor to change synchronously in each area of the accommodation space after being subjected to thermal shock, thereby further improving the temperature sensor's ability to resist thermal shock.
[0044] As for the above-mentioned Peltier elements, the number of Peltier elements of the Peltier temperature control plate and the distribution of the Peltier elements between the first substrate and the second substrate can be set according to actual needs and are not specifically limited here. Figure 2 and Figure 3 As shown, the Peltier element may further include an N-type semiconductor portion 23 and a P-type semiconductor portion 24. The N-type semiconductor portion 23 and the P-type semiconductor portion 24 included in the same Peltier element are connected via the heating portion 21 or the cooling portion 22. In addition, when a plurality of Peltier elements are disposed between the first substrate and the second substrate, and the plurality of Peltier elements are connected in series, the N-type semiconductor portions 23 and the P-type semiconductor portions 24 included in the plurality of Peltier elements may be connected alternately in sequence via the heating portion 21 or the cooling portion 22, thereby realizing the series connection of the plurality of Peltier elements.
[0045] Among them, the heating part and / or cooling part of the above-mentioned Peltier element can be made of materials with good electrical conductivity and thermal conductivity such as aluminum and / or stainless steel. The materials of the above-mentioned N-type semiconductor part and P-type semiconductor part can be set according to the actual application situation, and are not specifically limited here. For example: the material of the N-type semiconductor part can be: silicon doped with phosphorus. The material of the P-type semiconductor part can be: silicon doped with boron.
[0046] Specifically, Figure 2 As shown, because the energy level of the P-type semiconductor is lower than that of the N-type semiconductor, when a positive direct current is passed through the Peltier element, the carriers start from the power supply, and in the process of being conducted from the P-type semiconductor part 24 to the N-type semiconductor part 23 via a conduction part, this conduction part will absorb heat from the outside. In other words, at this time, the conduction part is the cooling part 22. Afterwards, in the process of the carriers being conducted from the N-type semiconductor part 23 to the P-type semiconductor part 24 via another conduction part and the power supply, this conduction part will dissipate heat to the outside. In other words, at this time, the conduction part is the heating part 21. On the contrary, Figure 3As shown, when reverse direct current is passed through the Peltier element, the carriers start from the power supply, and in the process of being conducted from the N-type semiconductor part 23 to the P-type semiconductor part 24 through a conducting part, this conducting part will emit heat to the outside. That is to say, at this time, the conducting part is the heating part 21. Afterwards, in the process of the carriers being conducted from the P-type semiconductor part 24 to the N-type semiconductor part 23 through another conducting part and the power supply, this conducting part will absorb the heat from the outside. That is to say, at this time, the conducting part is the cooling part 22. It can be seen from the above content that according to the different directions of the direct current passed through the Peltier element, the cooling part 22 and the heating part 21 included in the Peltier element will be converted.
[0047] In actual application, it is understood that the degree of heating or cooling of the accommodation space by the Peltier temperature control board is affected by the power of the DC current passing through the Peltier element. Therefore, the power and current direction of the DC current can be set according to the current temperature and change of the external environment and the reference temperature. Figure 1 and Figure 2 As shown, when the external environment temperature is lower than the reference temperature, it is necessary to pass a forward direct current of appropriate power into the Peltier element located between the first substrate and the second substrate to put the Peltier temperature control plate 11 in a heating state; at this time, if the external environment temperature decreases, the power of the forward direct current can be appropriately increased to appropriately increase the heating rate of the Peltier temperature control plate 11; if the external environment temperature increases, the power of the forward direct current can be appropriately reduced to appropriately reduce the heating rate of the Peltier temperature control plate 11.
[0048] In addition, if Figure 1 and Figure 3 As shown, when the external environment temperature is higher than the reference temperature, the above-mentioned reverse direct current can be passed into the Peltier element to put the Peltier temperature control plate in a cooling state; at this time, if the external environment temperature decreases, the power of the reverse direct current can be appropriately reduced to appropriately reduce the cooling rate of the Peltier temperature control plate 11; if the external environment temperature increases, the power of the reverse direct current can be appropriately increased to appropriately increase the cooling rate of the Peltier temperature control plate 11.
[0049] The power variation range of the direct current supplied to the Peltier element can be determined according to the variation range of the external environment temperature, which is not specifically limited here.
[0050] Regarding the above-mentioned packaging tube cap, in terms of the connection method, the packaging tube cap can be airtightly connected to the Peltier temperature control board by bonding or threaded connection.
[0051] In terms of material, the packaging cap can be an electromagnetic shielding cap to prevent the thermopile chip from being interfered by other electronic devices, further improving the measurement accuracy of the temperature sensor. Specifically, the packaging cap can be any packaging cap with electromagnetic shielding effect, such as a metal cap.
[0052] The shape and size of the window disposed on the side of the packaging tube cap away from the Peltier temperature control board can be determined according to the shape and size of the thermopile chip, as long as it can be applied to the temperature sensor provided in the embodiment of the utility model.
[0053] For the above-mentioned thermopile chip, the embodiment of the utility model does not specifically limit the specific structure of the thermopile chip.
[0054] For example, Figure 4 As shown, the thermopile chip may include a support structure 16, an insulation film 17 and a thermopile structure. The support structure 16 is disposed on the Peltier temperature control board, and a cavity is disposed on one side of the support structure 16 close to the Peltier temperature control board. The insulation film 17 is suspended on the cavity. The thermopile structure is disposed on the insulation film 17.
[0055] The support structure may be any substrate having a supporting function, such as a silicon substrate, a silicon-on-insulator substrate or a silicon carbide substrate. The morphology of the cavity provided with the support structure may be determined according to the number of thermopile structures and the distribution of the thermopile structures on the thermal insulation film, and is not specifically limited here.
[0056] For the above-mentioned thermal insulation film, the thermal insulation film may include at least one film layer such as a silicon dioxide film and / or a silicon nitride film that can be suspended on the cavity.
[0057] For the thermopile structure, from the structural point of view, Figure 4 As shown, the thermopile structure includes a cold end and a hot end electrically connected to the cold end. Based on this, only the hot end of the thermopile structure can be located on the insulation film, or both the cold end and the hot end can be located on the insulation film 17. Among them, when the cold end and the hot end of the thermopile structure are both located on the insulation film 17, in the process of measuring the temperature of the object to be measured, the thermopile structure will not directly contact the packaging tube cap and the Peltier temperature control plate, as well as the external environment outside the packaging tube cap, which can reduce the heat exchange rate between the external environment and the thermopile structure, and can achieve the synchronization of the heat exchange rate between the insulation film 17 and the thermopile structure, and the heat exchange rate between the gas inside the accommodation space and the thermopile structure, to a certain extent reduce the temperature effect of the external environment temperature on the thermopile structure, so that the output of the noise voltage of the thermopile structure is zero.
[0058] When the cold end and the hot end of the thermopile structure are both arranged on the insulation film, the cold end and the hot end can have a certain distance from the edge of the insulation film. The minimum distance between the cold end and / or the hot end and the edge of the insulation film can be determined according to the actual manufacturing accuracy and the measurement accuracy requirements of the thermopile structure in the actual application scenario.
[0059] Exemplarily, the minimum spacing from the cold end and / or the hot end to the edge of the insulation film may be greater than or equal to 120 μm and less than or equal to 250 μm. For example, the minimum spacing from the cold end and / or the hot end to the edge of the insulation film may be 120 μm, 150 μm, 180 μm, 200 μm, 220 μm or 250 μm, etc. In this case, the minimum spacing is within the above range, which can prevent the high manufacturing precision requirements for the thermopile structure formed on the insulation film with a smaller range due to the small minimum spacing, which is conducive to reducing the difficulty of thermopile chip manufacturing. At the same time, it can also prevent the poor synchronization of the heat exchange rate between the insulation film and the thermopile structure due to the close proximity of the cold end and / or the hot end to the edge of the insulation film, and the heat exchange rate between the gas inside the accommodation space and the thermopile structure, thereby ensuring that the temperature sensor has a high resistance to thermal shock.
[0060] In addition, if Figure 4 As shown, in the same thermopile structure, the minimum distance from the cold end to the edge of the insulation film 17 and the minimum distance from the hot end to the edge of the insulation film 17 can be equal, so as to make the heat exchange rate of the cold end and the hot end the same and improve the measurement accuracy of the temperature sensor.
[0061] In terms of quantity and distribution, the thermopile chip may be provided with only one thermopile structure or may be provided with at least two thermopile structures, wherein the distribution of different thermopile structures on the thermal insulation film may be determined according to the actual application scenario.
[0062] For example, Figure 4 As shown, the above-mentioned thermopile structure may include a first thermopile structure 18 and a second thermopile structure 19 arranged on the insulating film 17 in a centrally symmetrical manner to reduce the influence of thermal shock on the temperature sensor. Specifically, when the temperature sensor is subjected to thermal shock, both the first thermopile structure 18 and the second thermopile structure 19 will have output signals, and both output signals are interference signals. Because the first thermopile structure 18 and the second thermopile structure 19 are distributed in a centrally symmetrical manner, the output signal of the first thermopile structure 18 will be subtracted from the output signal of the second thermopile structure 19 distributed in a centrally symmetrical manner to ensure that after the thermal shock comes, the temperature sensor does not interfere with the output signal, thereby further improving the ability of the temperature sensor to resist thermal shock.
[0063] For the above-mentioned filter, the filter can be set inside the accommodation space or outside the accommodation space, as long as it can be airtightly connected to the packaging tube cap. Because the filter is an optical device used to select the required radiation band, it has selective transmittance to the spectrum. Among them, the filter can only transmit infrared light, thereby preventing light of other bands from radiating to the thermopile chip through the window, so that the heat detected by the hot end of the thermopile structure is only the infrared energy radiated by the object to be measured, which can further improve the temperature measurement accuracy of the thermopile infrared sensor.
[0064] In a second aspect, the present invention provides a temperature measuring device. Figure 5 As shown, the temperature measuring device includes: a flexible circuit board 20, a temperature sensor provided by the first aspect and various implementations thereof, and a temperature measuring element. The flexible circuit board 20 is provided with a conductive lead and an electromagnetic shielding net wrapped around the outer periphery of the conductive lead, and the electromagnetic shielding net is grounded. The temperature sensor is arranged on the flexible circuit board 20. The temperature measuring element is arranged on the flexible circuit board 20. The temperature measuring element is electrically connected to the Peltier temperature control board through the conductive lead. The temperature measuring element is used to measure the current temperature of the external environment and send it to the Peltier temperature control board.
[0065] The electromagnetic shielding net provided in the flexible circuit may include any mesh structure with electromagnetic shielding function, such as a metal wire mesh. The location of the temperature sensor and the temperature measuring element on the flexible circuit board, and the distribution of the conductive leads in the flexible circuit board may be determined according to the actual application scenario, and are not specifically limited here.
[0066] In addition, the temperature measuring element can be a temperature measuring resistor or a thermocouple having a temperature measuring function. The temperature measuring element is used to measure the current temperature value of the external environment and send the current temperature value to the Peltier temperature control board. The control circuit in the Peltier temperature control board can determine the direction and power of the direct current passed to the Peltier element according to the current temperature value and change of the external environment and the reference temperature of the thermopile chip.
[0067] As for the type of the temperature measuring device provided in the embodiment of the utility model, it can be any device with a temperature measuring function, such as a temperature measuring gun.
[0068] The beneficial effects of the second aspect and its various implementations in the embodiments of the utility model can be analyzed by referring to the beneficial effects of the first aspect and its various implementations, and will not be repeated here.
[0069] In the above description, the technical details of the patterning and etching of each layer are not described in detail. However, those skilled in the art should understand that various technical means can be used to form layers, regions, etc. of desired shapes. In addition, in order to form the same structure, those skilled in the art can also design methods that are not completely the same as the methods described above. In addition, although the various embodiments are described above separately, this does not mean that the measures in the various embodiments cannot be used in combination to advantage.
[0070] The embodiments of the present disclosure are described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of the present disclosure. The scope of the present disclosure is defined by the appended claims and their equivalents. Without departing from the scope of the present disclosure, a person skilled in the art may make a variety of substitutions and modifications, which should all fall within the scope of the present disclosure.
Claims
1. A temperature sensor, characterized in that: include: Peltier temperature control board; A packaging tube cap is arranged on the Peltier temperature control board and is airtightly connected to the Peltier temperature control board; the packaging tube cap and the Peltier temperature control board enclose a containing space, and a window is arranged on a side of the packaging tube cap away from the Peltier temperature control board; A thermopile chip is arranged on the Peltier temperature control board and is located in the accommodation space; the arrangement position of the thermopile chip on the Peltier temperature control board is opposite to the window; A filter is covered on the window and is airtightly connected to the packaging tube cap; the filter is used to filter the light in the external environment.
2. The temperature sensor according to claim 1, characterized in that: The thermopile chip comprises a supporting structure, a thermal insulation film and a thermopile structure; The support structure is arranged on the Peltier temperature control plate, and a cavity is arranged on one side of the support structure close to the Peltier temperature control plate; the thermal insulation film is suspended on the cavity; and the thermopile structure is arranged on the thermal insulation film.
3. The temperature sensor according to claim 2, characterized in that: The thermopile structure includes a first thermopile structure and a second thermopile structure that are centrally symmetrically disposed on the thermal insulation film.
4. The temperature sensor according to claim 2, characterized in that: The thermopile structure includes a cold end and a hot end electrically connected to the cold end; the cold end and the hot end are both located on the thermal insulation film.
5. The temperature sensor according to claim 4, characterized in that: The minimum distance between the cold end and / or the hot end and the edge of the thermal insulation film is greater than or equal to 120 μm and less than or equal to 250 μm; and / or, In the same thermopile structure, the minimum distance from the cold end to the edge of the thermal insulation film is equal to the minimum distance from the hot end to the edge of the thermal insulation film.
6. The temperature sensor according to claim 1, characterized in that: The Peltier temperature control board comprises a first substrate and a second substrate arranged opposite to each other, and at least one Peltier element located between the first substrate and the second substrate; the thermopile chip is arranged on a side of the first substrate away from the Peltier element; The Peltier element has a heating part and a cooling part opposite to the heating part; the Peltier temperature control plate has a heating state and a cooling state; when the Peltier temperature control plate is in the heating state, one end of the Peltier element in contact with the first substrate is the heating part, and the other end of the Peltier element in contact with the second substrate is the cooling part; when the Peltier temperature control plate is in the cooling state, one end of the Peltier element in contact with the first substrate is the cooling part, and the other end of the Peltier element in contact with the second substrate is the heating part.
7. The temperature sensor according to claim 6, characterized in that: The first substrate and / or the second substrate includes a ceramic substrate.
8. The temperature sensor according to claim 1, characterized in that: The packaging tube cap is an electromagnetic shielding tube cap; and / or, The packaging tube cap is a metal tube cap.
9. A temperature measuring device, characterized in that: include: Flexible circuit boards; The flexible circuit board is provided with a conductive lead and an electromagnetic shielding net wrapped around the conductive lead; The electromagnetic shielding net is grounded; The temperature sensor according to any one of claims 1 to 8; the temperature sensor is arranged on the flexible circuit board; And a temperature measuring element is arranged on the flexible circuit board; the temperature measuring element is electrically connected to the Peltier temperature control board through the conductive lead; the temperature measuring element is used to measure the current temperature of the external environment and send it to the Peltier temperature control board.
10. The temperature measuring device according to claim 9, characterized in that: The electromagnetic shielding net comprises a metal wire net; and / or, The temperature measuring element is a temperature measuring resistor; and / or, The temperature measuring device is a temperature measuring gun.