Terminal and radiator thereof

Abstract

The utility model discloses a terminal and a radiator thereof, and relates to the technical field of heat dissipation, the radiator is installed between a mainboard and a bottom plate of the terminal, a core plate is arranged on one side of the mainboard deviating from the bottom plate, the mainboard is provided with a first through hole to accommodate a main chip arranged on the core plate, and the radiator comprises a heat dissipation main body and a buffer assembly. The heat dissipation body comprises a first heat conduction part and a second heat conduction part which are connected through a heat conduction block, the heat conduction block is provided with a second through hole in a penetrating mode, the first heat conduction part is provided with a fixing piece and a protruding part, the fixing piece is detachably connected to the mainboard so as to fix the heat dissipation body, and the protruding part corresponds to the first through hole so as to absorb heat of the main chip. The second through hole formed in the heat conduction block can improve the heat conduction and heat dissipation speed of the heat conduction block, then the protruding part is promoted to rapidly absorb the heat of the main chip, the buffer piece is further arranged between the heat dissipation body and the terminal, and therefore the technical problem that the temperature of the core board cannot be rapidly reduced is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, in particular to a terminal and a heat sink thereof. Background Art

[0002] The core board needs to be installed on the terminal product. When the core board is working, the temperature of the main chip will rise rapidly, causing the temperature of the entire product to remain high, so a radiator should be installed under the core board to conduct the temperature faster and extend the product life.

[0003] To install the radiator, you need to first insert the screw fixing frame into the fixing hole of the circuit board, then turn the circuit board over, install the radiator on the back, and use a screwdriver to tighten the screws to fix them in the fixing frame. The installation is not quick and easy enough. Moreover, when the ambient temperature is relatively high, the silicone pad that is closely combined with the main chip has a relatively slow heat conduction speed. There is only one thermal rib at the bottom of the radiator to conduct temperature. The 2.5mm thick silicone pad at the bottom cannot conduct heat quickly, resulting in the temperature of the core board not being able to drop quickly.

[0004] Therefore, how to provide a heat sink to at least partially solve the above-mentioned drawbacks is a technical problem that those skilled in the art currently need to solve. Utility Model Content

[0005] The utility model aims to provide a terminal and a radiator thereof, which solve the technical problem that the temperature of a core board cannot be quickly reduced.

[0006] To achieve the above purpose, the utility model provides a radiator installed between the mainboard and the bottom plate of the terminal, the core board is arranged on the side of the mainboard away from the bottom plate, and the mainboard is provided with a first through hole to accommodate the main chip arranged on the core board, and the radiator includes:

[0007] The heat dissipation body comprises a first heat conduction part and a second heat conduction part connected by a heat conduction block, the heat conduction block is provided with a through-type second through hole, the first heat conduction part is provided with a fixing member and a protrusion, the fixing member is detachably connected to the main board to fix the heat dissipation body, and the protrusion is arranged corresponding to the first through hole to absorb the heat of the main chip;

[0008] The buffer component is used for buffering between the heat dissipation body and the terminal.

[0009] Preferably, a semi-liquid silicone grease layer is provided between the protruding portion and the main chip, and the semi-liquid silicone grease layer is attached to the bottom surface of the main chip to conduct the heat of the main chip to the protruding portion.

[0010] Preferably, the raised portion is located in the middle of the first heat conducting portion, and the cross-sectional area of ​​the raised portion perpendicular to the first direction is larger than the cross-sectional area of ​​the main chip perpendicular to the first direction, so that the semi-liquid silicone grease layer sprayed on the top surface of the raised portion is spread all over the bottom surface of the main chip.

[0011] Preferably, the thickness of the semi-liquid silicone grease layer is 0.5-1 mm.

[0012] Preferably, the fixing members are located around the first heat conducting portion and are all penetrated through the first heat conducting portion, and a third through hole for the fixing members to penetrate is provided on the mainboard, so that the heat dissipation body can be detachably connected to the mainboard.

[0013] Preferably, the fixing member is a nylon claw screw.

[0014] Preferably, the buffer assembly comprises:

[0015] A plurality of conductive foams are arranged between the first heat conducting part and the mainboard, and the conductive foams are located between adjacent fixing members;

[0016] The silicone pad is arranged between the second heat conducting part and the bottom plate and is used for buffering and heat conduction.

[0017] Preferably, the silicone pad is spread all over the bottom surface of the second heat-conducting part, and the thickness of the silicone pad is 0.8-1.2 mm.

[0018] Preferably, the heat-conducting block includes heat-conducting ribs arranged at intervals through the second through holes, the length of the tops of all the heat-conducting ribs in the extension direction of the second through holes is equal to the length of the first heat-conducting part in the extension direction of the second through holes, and the length of the bottoms of the heat-conducting ribs in the extension direction of the second through holes is equal to the length of the second heat-conducting part in the extension direction of the second through holes.

[0019] A terminal is provided with the above-mentioned radiator.

[0020] Compared with the above-mentioned background technology, the heat sink provided by the utility model is installed between the mainboard and the bottom plate of the terminal, the core board is arranged on the side of the mainboard away from the bottom plate, and the mainboard is provided with a first through hole to accommodate the main chip arranged on the core board, the heat sink includes a heat dissipation body and a buffer component, the heat dissipation body includes a first heat conducting part and a second heat conducting part connected by a heat conducting block, the heat conducting block is provided with a through-type second through hole, the first heat conducting part is provided with a fixing part and a protrusion, the fixing part is detachably connected to the mainboard to fix the heat dissipation body, the protrusion is arranged corresponding to the first through hole to absorb the heat of the main chip; the buffer component is used for buffering between the heat dissipation body and the terminal.

[0021] Specifically, the radiator is installed between the main board and the base plate, and the first heat-conducting part of the radiator is provided with a protrusion corresponding to the main chip on the core board, which is used to absorb the heat generated by the operation of the main chip. The heat is then conducted to the heat-conducting block provided with a through-type second through hole through the first heat-conducting part. The second through hole provided in the heat-conducting block can improve the heat conduction and heat dissipation speed of the heat-conducting block, thereby promoting the protrusion to quickly absorb the heat of the main chip. A buffer is also provided between the heat dissipation body and the terminal to slow down or even avoid the collision between the heat dissipation body and the main board and the base plate. This arrangement solves the technical problem that the temperature of the core board cannot be quickly reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0023] Figure 1 A schematic diagram of the structure of the radiator provided by the embodiment of the utility model in the installed state;

[0024] Figure 2 A schematic diagram of the structure of a radiator provided by an embodiment of the utility model;

[0025] Figure 3 This is a schematic diagram of the structure of the contact between the heat sink and the main chip provided by an embodiment of the utility model.

[0026] in:

[0027] 1- Mainboard, 2- Bottom board, 3- Core board, 4- Main chip;

[0028] 110 - heat conducting block, 120 - first heat conducting portion, 121 - fixing member, 122 - raised portion, 130 - second heat conducting portion, 140 - second through hole;

[0029] 210-conductive foam, 220-silicone pad. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] In order to enable those skilled in the art to better understand the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0032] In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "middle" and "all around" indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the position or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as a limitation of the present invention.

[0033] The purpose of the utility model is to provide a terminal and a heat sink thereof, which solves the technical problem that the temperature of the core board 3 cannot be quickly reduced.

[0034] It should be noted that, in this embodiment, the direction X in the drawings is defined as the first direction.

[0035] See also Figures 1 to 3 To achieve the above purpose, the utility model provides a heat sink installed between a mainboard 1 and a bottom plate 2 of a terminal, a core board 3 is arranged on a side of the mainboard 1 away from the bottom plate 2, and the mainboard 1 is provided with a first through hole to accommodate a main chip 4 arranged on the core board 3, and the heat sink includes a heat dissipation body and a buffer component.

[0036] Among them, the above-mentioned terminals can be concentrators, collectors, electric energy meters, dedicated transformer collection terminals, load management terminals, distribution transformer monitoring terminals, intelligent gateway terminals, etc., and are not specifically limited here.

[0037] It should be noted that the size of the first through hole should be slightly smaller than the core board 3 so that the four sides of the core board 3 can be welded to the main board 1, and the main chip 4 arranged on the core board 3 can be located in the first through hole, which is used for the subsequent radiator to quickly cool the main chip 4.

[0038] The heat dissipation body includes a first heat-conducting part 120 and a second heat-conducting part 130 connected by a heat-conducting block 110. The heat-conducting block 110 is provided with a through-type second through hole 140. The first heat-conducting part 120 is provided with a fixing part 121 and a protruding part 122. The fixing part 121 is detachably connected to the mainboard 1 to fix the heat dissipation body. The protruding part 122 is arranged corresponding to the first through hole to absorb the heat of the main chip 4.

[0039] The buffer component is used for buffering between the heat dissipation body and the terminal.

[0040] Specifically, the radiator is installed between the main board 1 and the base plate 2, and the first heat-conducting part 120 of the radiator is provided with a protrusion 122 corresponding to the main chip 4 on the core board 3, which is used to absorb the heat generated by the operation of the main chip 4. The heat is then conducted to the heat-conducting block 110 provided with a through-type second through hole 140 through the first heat-conducting part 120. The second through hole 140 provided in the heat-conducting block 110 can improve the heat conduction and heat dissipation speed of the heat-conducting block 110, thereby promoting the protrusion 122 to quickly absorb the heat of the main chip 4. A buffer is also provided between the heat dissipation body and the terminal to slow down or even avoid the collision between the heat dissipation body and the main board 1 and the base plate 2. This arrangement solves the technical problem that the temperature of the core board 3 cannot be quickly reduced.

[0041] Preferably, the heat-conducting block 110 includes heat-conducting ribs arranged at intervals through the second through hole 140, the length of the top of all the heat-conducting ribs in the extension direction of the second through hole 140 is equal to the length of the first heat-conducting part 120 in the extension direction of the second through hole 140, and the length of the bottom of the heat-conducting ribs in the extension direction of the second through hole 140 is equal to the length of the second heat-conducting part 130 in the extension direction of the second through hole 140.

[0042] In this embodiment, the number of the second through holes 140 is preferably two, the number of the thermal ribs is preferably three, and the three parallel thermal ribs are arranged in sequence through the two second through holes 140, and both ends of all the thermal ribs are connected to the first thermal conductive part 120 and the second thermal conductive part 130, so that the heat passing through the first thermal conductive part 120 can be conducted to the second thermal conductive part 130 along the thermal ribs, and the second through hole 140 is located between the first thermal conductive part 120 and the second thermal conductive part 130, which can increase the heat dissipation efficiency to accelerate the absorption of heat from the main chip 4 by the protrusion 122 on the first thermal conductive part 120.

[0043] Among them, the length of the top of all the thermal ribs in the extension direction of the second through hole 140 is equal to the length of the first heat conducting part 120 in the extension direction of the second through hole 140, and the length of the bottom of the thermal ribs in the extension direction of the second through hole 140 is equal to the length of the second heat conducting part 130 in the extension direction of the second through hole 140, so as to increase the contact area between the two ends of the thermal ribs and the first heat conducting part 120 and the second heat conducting part 130, thereby increasing the heat conduction effect.

[0044] In addition, the second through hole 140 is preferably a square hole, the corners of the square hole are all provided with rounded corners, and the top and bottom of the two side surfaces of the heat conductive block 110 away from the second through hole 140 are preferably provided with rounded corners, that is, the connection between the two ends of the thermal conductive rib and the first heat conductive part 120 and the second heat conductive part 130 is provided with rounded corners to prevent stress concentration and increase the structural strength of the heat dissipation body.

[0045] It should be noted that the number of the second through holes 140 , the number of the thermal conductive ribs, and the contact areas between the thermal conductive ribs and the first thermal conductive part 120 and the second thermal conductive part 130 can all be adjusted according to actual conditions as long as the above purpose can be achieved.

[0046] Preferably, a semi-liquid silicone grease layer is provided between the raised portion 122 and the main chip 4, and the semi-liquid silicone grease layer is adhered to the bottom surface of the main chip 4 to conduct the heat of the main chip 4 to the raised portion 122. The raised portion 122 is located in the middle of the first heat conducting portion 120, and the cross-sectional area of ​​the raised portion 122 perpendicular to the first direction is larger than the cross-sectional area of ​​the main chip 4 perpendicular to the first direction, so that the semi-liquid silicone grease layer sprayed on the top surface of the raised portion 122 is spread all over the bottom surface of the main chip 4, and the thickness of the semi-liquid silicone grease layer is 0.5-1mm.

[0047] It can be understood that the semi-liquid silicone grease layer has good thermal conductivity and can quickly transfer the heat of the main chip 4 to the protrusion 122, thereby quickly reducing the temperature of the main chip 4. Preferably, the protrusion 122 is located in the middle of the first heat-conducting part 120, and the cross-sectional area of ​​the protrusion 122 perpendicular to the first direction is larger than the cross-sectional area of ​​the main chip 4 perpendicular to the first direction, that is, the semi-liquid silicone grease layer is coated on the top surface of the protrusion 122 with a larger cross-sectional area, so that the sprayed semi-liquid silicone grease layer can be in full contact with the bottom surface of the main chip 4 to increase the heat transfer effect.

[0048] Among them, the thickness of the semi-liquid silicone grease layer is preferably 0.5-1mm, and the semi-liquid silicone grease layer can fit tightly to the protrusion 122 and the main chip 4 for heat conduction. The thickness of the semi-liquid silicone grease layer can be adjusted according to actual conditions as long as the above purpose can be achieved.

[0049] Preferably, the fixing members 121 are located around the first heat conducting part 120 and are all penetrated through the first heat conducting part 120. A third through hole for the fixing members 121 to penetrate is provided on the mainboard 1 so that the heat dissipation body can be detachably connected to the mainboard 1. The fixing members 121 are specifically nylon claw screws.

[0050] By means of the nylon claw screws provided around the first heat conducting part 120 and the corresponding third through holes on the mainboard 1 for the nylon claw screws to pass through, the radiator can be quickly fixed to the mainboard 1 by manual pressing, thereby increasing the installation efficiency of the radiator. The nylon claw screws pass through the third through holes from bottom to top and then are clamped with the upper surface of the mainboard 1. The number and type of the fixing parts 121 can be adjusted according to actual conditions as long as the above-mentioned purpose can be achieved.

[0051] Preferably, the buffer component includes a silicone pad 220 and a plurality of conductive foams 210, the plurality of conductive foams 210 are arranged between the first heat-conducting part 120 and the mainboard 1, and the conductive foams 210 are located between adjacent fixing parts 121; the silicone pad 220 is arranged between the second heat-conducting part 130 and the bottom plate 2 for buffering and heat conduction, the silicone pad 220 is spread on the bottom surface of the second heat-conducting part 130, and the thickness of the silicone pad 220 is 0.8-1.2 mm.

[0052] It can be understood that the buffer component includes a silicone pad 220 and a plurality of conductive foams 210. The silicone pad 220 is arranged between the second heat-conducting part 130 and the bottom plate 2, and is used to transfer heat through the second heat-conducting part 130. The thickness of the silicone pad 220 is preferably 0.8-1.2 mm. While playing a buffering role, it can increase the heat conduction speed so that the second heat-conducting part 130 can be quickly cooled down. A plurality of conductive foams 210 are arranged between the first heat-conducting part 120 and the mainboard 1, and the conductive foam 210 is preferably located around the top surface of the first heat-conducting part 120. Through the buffering effect of the conductive foam 210 and the mainboard 1, the upward movement of the heat dissipation body is buffered, thereby slowing down the movement of the protrusion 122 toward the main chip 4.

[0053] In addition, a guide bar capable of abutting the main board 1 is further provided on the top surface of the first heat conducting portion 120. Preferably, there are two guide bars parallel to each other. The abutment between the guide bar and the main board 1 can limit the maximum height of the movement of the protrusion 122. The thickness of the main board 1 and the main chip 4 in the first direction can determine the position of the main chip 4 in the first through hole (for example, when the thickness of the main board 1 and the main chip 4 in the first direction are consistent, the bottom surface of the main chip 4 and the bottom surface of the main board 1 are at the same height). Then, the distance between the main chip 4 and the protrusion 122 when the guide bar abuts the bottom surface of the main board 1 can be calculated through the thickness difference between the guide bar and the protrusion 122 in the first direction. That is, it can be determined whether the thickness of the semi-liquid silicone grease layer in the first direction meets the requirements at the extreme position. Similarly, the thickness of the guide bar in the first direction can be set according to the distance requirement between the main chip 4 and the protrusion 122 at the extreme position, so as to achieve the purpose of quickly conducting the heat of the main chip 4 to the protrusion 122.

[0054] This embodiment also includes a terminal, which can be a concentrator, a collector, an electric energy meter, a special transformer collection terminal, a load management terminal, a distribution transformer monitoring terminal, an intelligent gateway terminal, etc. The terminal is also equipped with the above-mentioned radiator and also has the beneficial effects of the above-mentioned radiator.

[0055] It should be noted that, in this specification, relational terms such as first and second are merely used to distinguish one entity from other entities, but do not necessarily require or imply any actual relationship or order between these entities.

[0056] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0057] This article uses specific examples to illustrate the principles and implementation methods of the utility model. The above examples are only used to help understand the method and core ideas of the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the utility model.

Claims

1. A heat sink, installed between a main board (1) and a bottom board (2) of a terminal, wherein a core board (3) is arranged on a side of the main board (1) away from the bottom board (2), and the main board (1) is provided with a first through hole to accommodate a main chip (4) arranged on the core board (3), characterized in that: The radiator comprises: A heat dissipation body, comprising a first heat conduction part (120) and a second heat conduction part (130) connected via a heat conduction block (110), the heat conduction block (110) being provided with a through-type second through hole (140), the first heat conduction part (120) being provided with a fixing member (121) and a protruding part (122), the fixing member (121) being detachably connected to the mainboard (1) to fix the heat dissipation body, and the protruding part (122) being provided corresponding to the first through hole to absorb heat from the main chip (4); A buffer component is used for buffering between the heat dissipation body and the terminal.

2. The heat sink according to claim 1, characterized in that: A semi-liquid silicone grease layer is provided between the protruding portion (122) and the main chip (4), and the semi-liquid silicone grease layer is adhered to the bottom surface of the main chip (4) to conduct the heat of the main chip (4) to the protruding portion (122).

3. The heat sink according to claim 2, characterized in that: The raised portion (122) is located in the middle of the first heat conducting portion (120), and the cross-sectional area of ​​the raised portion (122) perpendicular to the first direction is larger than the cross-sectional area of ​​the main chip (4) perpendicular to the first direction, so that the semi-liquid silicone grease layer sprayed on the top surface of the raised portion (122) is spread all over the bottom surface of the main chip (4).

4. The heat sink according to claim 2, characterized in that: The thickness of the semi-liquid silicone grease layer is 0.5-1 mm.

5. The heat sink according to claim 1, characterized in that The fixing members (121) are located around the first heat conducting portion (120) and are all penetrated through the first heat conducting portion (120); a third through hole for the fixing members (121) to penetrate is provided on the main board (1), so that the heat dissipation body can be detachably connected to the main board (1).

6. The heat sink according to claim 1, characterized in that The fixing member (121) is specifically a nylon claw screw.

7. The heat sink according to claim 5, characterized in that: The buffer assembly comprises: a plurality of conductive foams (210) disposed between the first heat conducting portion (120) and the mainboard (1), the conductive foams (210) being located between adjacent fixing members (121); A silica gel pad (220) is arranged between the second heat conducting part (130) and the bottom plate (2) and is used for buffering and heat conduction.

8. The heat sink according to claim 7, characterized in that: The silica gel pad (220) is spread over the bottom surface of the second heat conducting part (130), and the thickness of the silica gel pad (220) is 0.8-1.2 mm.

9. The radiator according to any one of claims 1 to 8, characterized in that: The heat-conducting block (110) comprises heat-conducting ribs spaced apart through the second through hole (140), the length of the top of all the heat-conducting ribs in the extension direction of the second through hole (140) being equal to the length of the first heat-conducting portion (120) in the extension direction of the second through hole (140), and the length of the bottom of the heat-conducting ribs in the extension direction of the second through hole (140) being equal to the length of the second heat-conducting portion (130) in the extension direction of the second through hole (140).

10. A terminal, characterized in that: A radiator according to any one of claims 1 to 9 is installed.

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