Pin bending device

Abstract

The utility model relates to the technical field of electronic components, and discloses a pin bending device which comprises a machining table and a bending assembly arranged on the machining table, a bending groove is formed in the machining table, a containing groove communicated with the bending groove is formed in the machining table, and a spring is fixedly installed in the machining table; when the device is used, a worker can pull the pull ring, the pull ring can drive the L-shaped plate to move backwards, then a semiconductor can be placed in the placing groove, the pin of the semiconductor faces outwards, then the worker can loosen the pull ring, the L-shaped plate can extrude the semiconductor and rotate the threaded rod under the cooperation of the spring, and the semiconductor can be placed in the placing groove. The threaded rod can drive the extrusion plate to move downwards to press and fix the semiconductor under the cooperation of the sliding block and the sliding groove, and finally, the electric push rod can drive the bending plate to move downwards to bend the pin, so that the shaking of the semiconductor pin in the bending process can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic components, in particular to a pin bending device. Background Art

[0002] The pin cross-section of a semiconductor component is rectangular, and this type of pin is generally called a flat pin. Before this type of semiconductor component is soldered into an electronic product, its pin must be bent and formed according to process requirements (usually 90°) before assembly can be completed successfully.

[0003] The utility model with the existing announcement number CN220942979U discloses a flat pin bending tool for semiconductor component processing, including an upper base, a lower base, a movable base and a fixed base. The lower end of the upper base is provided with a movable connecting piece, the upper end of the movable base is connected to the movable connecting piece, the lower end of the movable base is provided with an elastic pressure plate and a bending pressure plate close to each other, a compression spring is installed between the elastic pressure plate and the movable base, and the compression spring gives the elastic pressure plate a downward elastic force, when the elastic pressure plate is in normal state, its lower surface is located below the lower surface of the bending pressure plate, the fixed base is installed on the upper side of the lower base, and a pin support plate is provided on the fixed base, the pin support plate is located directly below the elastic pressure plate and is vertically staggered with the bending pressure plate.

[0004] In the above technical solution, the inventors found that there are at least the following problems: when in use, the staff is required to hold the semiconductor component with one hand to fit the component body with the side of the pin support plate, and press the handle with the other hand, which is more troublesome to operate. Once the hand used to fix the semiconductor shakes during the bending process, it may cause the semiconductor pin to fail to be bent and defects to appear. Therefore, a pin bending device is proposed. Utility Model Content

[0005] 1. Technical issues to be resolved

[0006] In view of the deficiencies in the prior art, the utility model provides a pin bending device to solve the problems mentioned in the above background technology.

[0007] (II) Technical solution

[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a pin bending device, comprising a processing table and a bending assembly arranged on the processing table, a bending groove is opened inside the processing table, a placement groove connected to the bending groove is opened inside the processing table, a spring is fixedly installed inside the processing table, one end of the spring passes through the placement groove and is fixedly connected to an L-plate, the top of the L-plate is threadedly connected to a threaded rod, one end of the threaded rod is rotatably connected to an extrusion plate, and a sliding assembly is arranged on one side of the extrusion plate.

[0009] Preferably, a bracket is fixedly installed on the top of the processing table, and the bending assembly includes an electric push rod, which is fixedly installed inside the bracket, and a bending plate is fixedly installed on the telescopic end of the electric push rod pointing vertically downward, and the bending plate is adapted to the bending groove.

[0010] Preferably, a pull ring is fixedly installed on one side of the L-plate.

[0011] Preferably, the sliding assembly includes a sliding block, one side of which is fixedly connected to the extrusion plate, and a sliding groove adapted to the sliding block is provided inside the L-plate.

[0012] Preferably, a rubber anti-skid pad is fixedly installed on the bottom of the processing table.

[0013] Preferably, a telescopic rod is fixedly installed inside the processing table, and the telescopic end of the telescopic rod is fixedly connected to the L-plate.

[0014] (III) Beneficial effects

[0015] The utility model provides a pin bending device, which has the following beneficial effects:

[0016] First: when in use, the staff can pull the pull ring, the pull ring can drive the L plate to move backward, and then the semiconductor can be placed in the placement slot with the semiconductor pin facing outward. Then the staff can loosen the pull ring, and the L plate can squeeze the semiconductor with the cooperation of the spring, and rotate the threaded rod. The threaded rod can drive the extrusion plate to move downward with the cooperation of the slider and the slide groove to press and fix the semiconductor. Finally, the electric push rod can drive the bending plate to move downward to bend the pin, thereby reducing the shaking of the semiconductor pin during the bending process, which may lead to bending failure and high defect rate.

[0017] Second: During the bending process, workers can place semiconductor parts into multiple placement slots, so that the bending assembly can bend multiple semiconductor pins at a time, greatly improving the bending efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the front cross-sectional structure of the processing table of the utility model;

[0020] Figure 3 For this utility model Figure 1 Enlarged structural diagram at A in the middle.

[0021] In the figure: 1. processing table; 2. bending assembly; 21. electric push rod; 22. bending plate; 3. bending groove; 4. spring; 5. L plate; 6. threaded rod; 7. extrusion plate; 8. sliding assembly; 81. slider; 82. slide groove; 9. bracket; 10. pull ring; 11. rubber anti-slip pad; 12. telescopic rod. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0024] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0025] like Figure 1-3 As shown, the utility model provides a technical solution: a pin bending device, including a processing table 1 and a bending assembly 2 arranged on the processing table 1, a rubber anti-skid pad 11 is fixedly installed at the bottom of the processing table 1, and the rubber anti-skid pad 11 can increase the anti-skid performance of the processing table 1, and can make the processing table 1 more stable when in use. A bracket 9 is fixedly installed on the top of the processing table 1, and the bending assembly 2 includes an electric push rod 21, and the electric push rod 21 is fixedly installed inside the bracket 9. The telescopic end of the electric push rod 21 is fixedly installed with a bending plate 22 vertically downward, and the bending plate 22 is adapted to the bending groove 3. When in use, the electric push rod 21 can drive the bending plate 22 to move downward to bend the pin.

[0026] Furthermore, a bending groove 3 is provided inside the processing table 1, and a plurality of placement grooves connected with the bending groove 3 are provided inside the processing table 1. A spring 4 is fixedly installed inside the processing table 1, and one end of the spring 4 penetrates into the placement groove and is fixedly connected with an L plate 5. The top of the L plate 5 is threadedly connected with a threaded rod 6, and one end of the threaded rod 6 is rotatably connected with an extrusion plate 7. A sliding assembly 8 is provided on one side of the extrusion plate 7, and the sliding assembly 8 includes a slider 81, and one side of the slider 81 is fixedly connected with the extrusion plate 7. A slide groove 82 adapted to the slider 81 is provided inside the L plate 5, and the slider 81 and the slide groove 82 can limit the moving range of the extrusion plate 7, and at the same time can make the extrusion plate 7 move more smoothly.

[0027] Furthermore, a pull ring 10 is fixedly installed on one side of the L-plate 5, and the pull ring 10 can be convenient for the staff to pull the pull ring 10 to move. A telescopic rod 12 is fixedly installed inside the processing table 1, and the telescopic end of the telescopic rod 12 is fixedly connected to the L-plate 5. The telescopic rod 12 can limit the movement range of the L-plate 5 and reduce the up and down shaking of the L-plate 5 when it moves.

[0028] The working process of the utility model is as follows: when in use, the staff can pull the pull ring 10, and the pull ring 10 can drive the L plate 5 to move backward, and then the semiconductor can be placed in the placement groove with the semiconductor pin facing outward. Then the staff can loosen the pull ring 10, and the L plate 5 can squeeze the semiconductor with the cooperation of the spring 4, and rotate the threaded rod 6. The threaded rod 6 can drive the squeezing plate 7 to move downward with the cooperation of the slider 81 and the slide groove 82 to press the semiconductor and fix the semiconductor. Finally, the electric push rod 21 can drive the bending plate 22 to move downward to bend the pin, thereby reducing the shaking of the semiconductor pin during the bending process, which may lead to bending failure and high defect rate.

[0029] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0030] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A pin bending device, comprising a processing table (1) and a bending assembly (2) arranged on the processing table (1), characterized in that: The processing table (1) is provided with a bending groove (3) inside, the processing table (1) is provided with a placement groove connected to the bending groove (3), a spring (4) is fixedly installed inside the processing table (1), one end of the spring (4) passes through the placement groove and is fixedly connected to an L-plate (5), the top of the L-plate (5) is threadedly connected to a threaded rod (6), one end of the threaded rod (6) is rotatably connected to an extrusion plate (7), and a sliding component (8) is provided on one side of the extrusion plate (7).

2. A pin bending device according to claim 1, characterized in that: A bracket (9) is fixedly mounted on the top of the processing table (1); the bending assembly (2) comprises an electric push rod (21) which is fixedly mounted inside the bracket (9); a bending plate (22) is fixedly mounted on the telescopic end of the electric push rod (21) which is vertically downward; the bending plate (22) is adapted to the bending groove (3).

3. A pin bending device according to claim 1, characterized in that: A pull ring (10) is fixedly mounted on one side of the L-plate (5).

4. A pin bending device according to claim 1, characterized in that: The sliding assembly (8) comprises a sliding block (81), one side of which is fixedly connected to the extrusion plate (7), and a sliding groove (82) adapted to the sliding block (81) is provided inside the L-plate (5).

5. A pin bending device according to claim 1, characterized in that: A rubber anti-skid pad (11) is fixedly mounted on the bottom of the processing table (1).

6. A pin bending device according to claim 1, characterized in that: A telescopic rod (12) is fixedly installed inside the processing table (1), and the telescopic end of the telescopic rod (12) is fixedly connected to the L-plate (5).

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