Wafer conveying device and semiconductor vacuum processing equipment

Abstract

The utility model discloses a wafer conveying device and semiconductor vacuum processing equipment, and the wafer conveying device comprises a pedestal; the driving mechanism is arranged below the base, and the driving mechanism comprises a first motor and a second motor; the transmission mechanism is arranged above the base and comprises a first rotating assembly, a second rotating assembly, a first connecting assembly and a second connecting assembly, the first rotating assembly is coaxially arranged below the second rotating assembly, and the first connecting assembly is fixedly connected with the first rotating assembly; the second connecting assembly is fixedly connected with the second rotating assembly, the first motor is connected with the first rotating assembly, and the second motor is connected with the second rotating assembly; and the wafer bearing mechanism is connected with the first connecting assembly and the second connecting assembly.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer conveying device and semiconductor vacuum processing equipment. Background Art

[0002] Wafer handling is a critical step in the semiconductor manufacturing process. Traditional wafer handling robots typically utilize single, off-the-shelf robots, which are complex, costly, and space-consuming, making them unsuitable for confined spaces, particularly within vacuum equipment. Therefore, a new wafer transfer mechanism is needed that combines high-precision motion with a compact, lightweight, and energy-efficient design, while enabling efficient and high-precision wafer handling. Utility Model Content

[0003] In order to solve at least one technical problem in the prior art, the present invention provides a wafer transfer device and a semiconductor vacuum processing equipment. The technical solution is as follows:

[0004] In a first aspect, the present invention provides a wafer conveying device, comprising:

[0005] base;

[0006] A driving mechanism is provided below the base, and includes a first motor and a second motor;

[0007] A transmission mechanism is provided above the base, and includes: a first rotating assembly, a second rotating assembly, a first connecting assembly, and a second connecting assembly, wherein the first rotating assembly is coaxially provided below the second rotating assembly, the first connecting assembly is fixedly connected to the first rotating assembly, the second connecting assembly is fixedly connected to the second rotating assembly, the first motor is connected to the first rotating assembly, and the second motor is connected to the second rotating assembly;

[0008] A wafer carrying mechanism is connected to the first connecting component and the second connecting component.

[0009] Furthermore, the first connecting assembly and the second connecting assembly both include: a first connecting arm and a second connecting arm, the first connecting arm is hinged to the second connecting arm, and the second connecting arm is hinged to the wafer carrying mechanism.

[0010] Furthermore, the first connecting arm of the first connecting assembly includes: a first connecting portion and a second connecting portion, the second connecting portion is hinged to the second connecting arm, the first connecting portion is connected to the first rotating assembly, the first connecting portion has an inclined section, the inclined section is connected to the second connecting portion, and the second connecting arm of the first connecting assembly and the second connecting arm of the second connecting assembly are located in the same plane.

[0011] Furthermore, the first rotating assembly and the second rotating assembly both include: a gear and a ring gear, the gear being eccentrically arranged in the ring gear and meshing with the ring gear, the gear of the first rotating assembly being coaxially connected to the first motor, the gear of the second rotating assembly being coaxially connected to the second motor, the ring gear of the first rotating assembly being fixedly connected to the first connecting assembly, and the ring gear of the second rotating assembly being fixedly connected to the second connecting assembly.

[0012] Furthermore, the wafer carrying mechanism includes: a wafer carrying plate, and the first connecting component and the second connecting component are symmetrically connected to two sides of the wafer carrying plate.

[0013] Furthermore, the driving mechanism further includes: a first harmonic reducer and a second harmonic reducer, the first harmonic reducer is connected to the first motor, and the second harmonic reducer is connected to the second motor.

[0014] Furthermore, the driving mechanism further includes: a first coupling and a second coupling, the first coupling being connected to the first harmonic reducer and the first rotating assembly, and the second coupling being connected to the second harmonic reducer and the second rotating assembly.

[0015] Furthermore, the transmission mechanism includes: a shell, the shell is sleeved on the outside of the first rotating assembly and the second rotating assembly, and the shell is fixedly arranged above the base.

[0016] Furthermore, a sensor is provided on the shell, and the sensor is used to detect the relative position of the wafer carrying mechanism and the shell.

[0017] In a second aspect, the present invention further provides a semiconductor vacuum processing device, comprising: a wafer conveying device as described in any one of the first aspects.

[0018] The beneficial effects of the technical solution provided by the embodiment of the utility model include at least:

[0019] The wafer conveying device provided by the utility model provides two sets of driving and conveying components for the wafer carrying mechanism, thereby realizing the extension and rotation of the wafer carrying mechanism;

[0020] The wafer conveying device provided by the utility model arranges the transmission mechanism above the base and the drive mechanism below the base, which reduces the space occupied by the conveying device and facilitates the installation and disassembly of the drive mechanism.

[0021] The wafer conveying device provided by the utility model realizes the extension and rotation of the wafer carrying mechanism through the cooperation of the gear ring and the gear, thereby improving the conveying accuracy of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 This is a schematic cross-sectional view of a wafer conveying device provided by an embodiment of the present utility model;

[0024] Figure 2 It is a schematic diagram of the top view of the wafer conveying device provided by an embodiment of the present utility model.

[0025] In the figure: 1 base; 2 first motor; 3 second motor; 4 first rotating assembly; 5 second rotating assembly; 6 first connecting assembly; 7 second connecting assembly; 8 first harmonic reducer; 9 second harmonic reducer; 10 first coupling; 11 second coupling; 12 housing; 13 wafer carrier;

[0026] 4.1 Gear; 4.2 Ring gear; 6.1 First connecting arm; 6.2 Second connecting arm;

[0027] 6.1.1 First connection; 6.1.2 Second connection;

[0028] 6.1.1.1 Inclined section. DETAILED DESCRIPTION

[0029] To make the purpose, technical solutions, and advantages of the present invention more clear, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0030] It should be noted that the expressions "first" and "second" used in the embodiments of the present invention are intended to distinguish two non-identical entities or non-identical parameters with the same name. It can be seen that "first" and "second" are only for the convenience of expression and should not be understood as limitations on the embodiments of the utility model. Subsequent embodiments will not explain this one by one.

[0031] like Figure 1 and Figure 2 As shown, the utility model provides a wafer conveying device, comprising: a base 1, a driving mechanism, a transmission mechanism and a wafer carrying mechanism. Wherein, the driving mechanism and the wafer carrying mechanism are both arranged above the base 1, and the driving mechanism is arranged below the base 1. The driving mechanism comprises: a first motor 2 and a second motor 3. The transmission mechanism comprises: a first rotating component 4, a second rotating component 5, a first connecting component 6, and a second connecting component 7. The first rotating component 4 is coaxially arranged with the second rotating component 5, and the first rotating component 4 is rotatably arranged below the second rotating component 5. The first connecting component 6 is fixedly connected to the first rotating component 4, and the second connecting component 7 is fixedly connected to the second rotating component 5. The first rotating component 4 is connected to the first motor 2, and the second rotating component 5 is connected to the second motor 3. The wafer carrying mechanism is connected to the first connecting component 6 and the second connecting component 7.

[0032] In the wafer conveying device provided in this embodiment, the first motor 2 drives the first rotating component 4 to rotate, the first rotating component 4 drives the first connecting component 6 to move, the second motor 3 drives the second rotating component 5 to rotate, and the second rotating component 5 drives the second connecting component 7 to move. The two drive structures of the first motor 2 and the second motor 3 drive the two transmission structures of the first rotating component 4, the second rotating component 5, the first connecting component 6, and the second connecting component 7 to move simultaneously, realizing the rotation of the wafer carrying mechanism, so that the wafer can be transported to different chambers of the semiconductor vacuum processing equipment. In addition, the wafer handling device with inverted upper and lower motors inside the traditional semiconductor vacuum processing equipment needs to remove the cable of the upper motor during the equipment maintenance process, and then re-execute the return to origin action, which causes time waste and affects the equipment production capacity. The wafer transmission device provided in this embodiment arranges the transmission mechanism above the base 1 and the drive mechanism below the base 1, which reduces the space occupied by the conveying device and facilitates the installation and disassembly of the drive mechanism.

[0033] In one embodiment, the first connecting assembly 6 and the second connecting assembly 7 each include: a first connecting arm 6.1 and a second connecting arm 6.2. The first connecting arm 6.1 is hinged to the second connecting arm 6.2, and the second connecting arm 6.2 is hinged to the wafer carrying mechanism.

[0034] In this embodiment, the first rotating assembly 4 is fixedly connected to the first connecting arm 6.1, and the first connecting arm 6.1 can rotate in response to the rotation of the first rotating assembly 4. The first connecting arm 6.1 is hingedly connected to the second connecting arm 6.2, and the second connecting arm 6.2 rotates in response to the rotation of the first connecting arm 6.1. The second connecting arm 6.2 is hingedly connected to the wafer supporting mechanism, and the wafer supporting mechanism can be linearly moved by the rotation of the second connecting arm 6.2, thereby achieving the expansion and contraction of the wafer supporting mechanism.

[0035] In one embodiment, the first connecting assembly 6 and the second connecting assembly 7 differ in the structure of the first connecting arm 6.1. The first connecting assembly 6 includes: a first connecting portion 6.1.1 and a second connecting portion 6.1.2, wherein the first connecting portion 6.1.1 and the second connecting portion 6.1.2 are fixedly connected, the first connecting portion 6.1.1 is connected to the first rotating assembly 4, and the second connecting portion 6.1.2 is hinged to the second connecting arm 6.2. Since the first connecting assembly 6 is connected to the first rotating assembly 4 disposed below, in order to ensure that the second connecting arm 6.2 of the first connecting assembly 6 and the second connecting arm 6.2 of the second connecting assembly 7 are located in the same plane, the first connecting portion 6.1.1 of the first connecting assembly 6 has an inclined section 6.1.1.1, which can drive the wafer carrying mechanism to operate smoothly in the same plane.

[0036] In one embodiment, the first rotating assembly 4 and the second rotating assembly 5 include a gear 4.1 and a ring gear 4.2. Gear 4.1 and ring gear 4.2 form a planetary gear set. Gear 4.1 is eccentrically positioned within ring gear 4.2 and meshes with the other gears, allowing it to rotate along the inner circumference of ring gear 4.2 while rotating. A first motor 2 is coaxially connected to gear 4.1 of the first rotating assembly 4, driving gear 4.1 to rotate, thereby driving ring gear 4.2. A second motor 3 is coaxially connected to gear 4.1 of the second rotating assembly 5, driving gear 4.1 to rotate, thereby driving ring gear 4.2. The ring gear 4.2 of the first rotating assembly 4 is fixedly connected to the first connecting assembly 6, and the rotation of the ring gear 4.2 drives the first connecting assembly 6 to move. The ring gear 4.2 of the second rotating assembly 5 is fixedly connected to the second connecting assembly 7, and the rotation of the ring gear 4.2 drives the second connecting assembly 7 to move.

[0037] As mentioned above, traditional wire rope-pulled wafer handling devices are limited by rotational blind spots, and the wire rope-based power transmission method has low repeatability and positioning accuracy. The wafer transfer device disclosed in this embodiment achieves the expansion and contraction and rotation of the wafer carrying mechanism through the cooperation of gear 4.1 and ring gear 4.2, thereby improving the transfer accuracy of wafers.

[0038] In one embodiment, the wafer support mechanism includes: a wafer support plate 13, a first connecting component 6, and a second connecting component 7 symmetrically connected to either side of the wafer support plate 13. In this embodiment, the connection position between the first connecting component 6 and the wafer support plate 13 and the connection position between the second connecting component 7 and the wafer support plate 13 are symmetrical along the axis of the wafer support plate 13, allowing the wafer support plate 13 to rotate and extend smoothly under the drive of the first connecting component 6 and the second connecting component 7.

[0039] In one embodiment, the driving mechanism further includes: a first harmonic reducer 8 and a second harmonic reducer 9 . The first harmonic reducer 8 is connected to the first motor 2 , and the second harmonic reducer 9 is connected to the second motor 3 .

[0040] Furthermore, the drive mechanism also includes a first coupling 10 and a second coupling 11. The first coupling 10 is connected between the first harmonic reducer 8 and the first rotating assembly 4, and the second coupling 11 is connected between the second harmonic reducer 9 and the second rotating assembly 5. Furthermore, the first coupling 10 is connected to the gear 4.1 of the first rotating assembly 4, and the second coupling 11 is connected to the gear 4.1 of the second rotating assembly 5.

[0041] As described above, the wafer transfer device provided by the embodiment of the present invention is primarily constructed with a motor for driving the movement of the wafer carrier; a coupling for transmitting the motor's power; a planetary gear set for transmitting and optimizing the power transmitted to and from the motor; and a harmonic reducer for increasing the motor's torque while minimizing the motor's transmission error. When the transfer device is in operation, the motor generates power, which is transmitted by the coupling to the respective planetary gear sets, thereby driving the rotation and extension of the manipulator.

[0042] In one embodiment, the transmission mechanism further includes: a housing 12 , which is sleeved on the outside of the first rotating assembly 4 and the second rotating assembly 5 , and is fixedly disposed above the base 1 .

[0043] Furthermore, a sensor (not shown in the figure) is provided on the housing 12 for detecting the relative position between the wafer supporting mechanism and the housing 12 .

[0044] As described above, the wafer conveying device provided by the embodiment of the present invention detects the current position of the wafer carrier through a sensor, which is conducive to controlling the movement of the wafer carrier according to the real-time status of the wafer carrier.

[0045] Based on the wafer conveying device provided by the above-mentioned embodiment of the present invention, the embodiment of the present invention further provides a semiconductor vacuum processing equipment, including the above-mentioned wafer conveying device.

[0046] The above is a detailed introduction to the technical solutions provided by this application. Specific examples are used herein to illustrate the principles and implementation methods of this application. The description of the above embodiments is only intended to help understand the method and core concept of this application. At the same time, for those skilled in the art, based on the concept of this application, there may be changes in the specific implementation methods and application scope. In summary, the contents of this specification should not be understood as limiting this application.

[0047] All the above optional technical solutions can be arbitrarily combined to form optional embodiments of the present invention, and will not be described in detail here.

[0048] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wafer conveying device, characterized in that: include: Base; A driving mechanism, the driving mechanism is arranged below the base, and the driving mechanism comprises: a first motor and a second motor; A transmission mechanism, the transmission mechanism is arranged above the base, and the transmission mechanism includes: a first rotating assembly, a second rotating assembly, a first connecting assembly and a second connecting assembly, the first rotating assembly is coaxially arranged below the second rotating assembly, the first connecting assembly is fixedly connected to the first rotating assembly, the second connecting assembly is fixedly connected to the second rotating assembly, the first motor is connected to the first rotating assembly, and the second motor is connected to the second rotating assembly; A wafer carrying mechanism is connected to the first connecting component and the second connecting component.

2. The device according to claim 1, characterized in that The first connecting component and the second connecting component both include: a first connecting arm and a second connecting arm, the first connecting arm is hinged to the second connecting arm, and the second connecting arm is hinged to the wafer carrying mechanism.

3. The device according to claim 2, characterized in that The first connecting arm of the first connecting component includes: a first connecting part and a second connecting part, the second connecting part is hinged to the second connecting arm, the first connecting part is connected to the first rotating component, the first connecting part has an inclined section, the inclined section is connected to the second connecting part, and the second connecting arm of the first connecting component and the second connecting arm of the second connecting component are located in the same plane.

4. The device according to claim 1, characterized in that The first rotating assembly and the second rotating assembly both include: a gear and a gear ring, the gear being eccentrically disposed in the gear ring and meshing with the gear ring, the gear of the first rotating assembly being coaxially connected to the first motor, the gear of the second rotating assembly being coaxially connected to the second motor, the gear ring of the first rotating assembly being fixedly connected to the first connecting assembly, and the gear ring of the second rotating assembly being fixedly connected to the second connecting assembly.

5. The device according to claim 1, characterized in that The wafer carrying mechanism comprises: a wafer carrying plate, and the first connecting component and the second connecting component are symmetrically connected to two sides of the wafer carrying plate respectively.

6. The device according to claim 1, characterized in that The driving mechanism further includes: a first harmonic reducer and a second harmonic reducer, wherein the first harmonic reducer is connected to the first motor, and the second harmonic reducer is connected to the second motor.

7. The device according to claim 6, characterized in that The driving mechanism further includes: a first coupling and a second coupling, wherein the first coupling is connected to the first harmonic reducer and the first rotating assembly, and the second coupling is connected to the second harmonic reducer and the second rotating assembly.

8. The device according to claim 1, characterized in that The transmission mechanism comprises: a shell, the shell is sleeved on the outer sides of the first rotating assembly and the second rotating assembly, and the shell is fixedly arranged above the base.

9. The device according to claim 8, characterized in that A sensor is arranged on the shell, and the sensor is used to detect the relative position between the wafer carrying mechanism and the shell.

10. A semiconductor vacuum processing equipment, characterized in that: include: The wafer conveying device as described in any one of claims 1 to 9.

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