Semiconductor part cleaning and bearing device
By installing components such as motors, lead screws, guide rods and rails in the semiconductor parts cleaning and bearing device, clamping and fixing semiconductor parts of different sizes, and absorbing impact forces through the limiting device, the problem that existing devices cannot fix parts of different sizes is solved, and the universality and stability of the equipment are improved.
Patent Information
- Application Number
- CN202421326467.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-12
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2034-06-12
AI Technical Summary
The existing semiconductor parts cleaning and bearing devices cannot meet the clamping and fixing of semiconductor parts of different sizes, resulting in the need to replace other bearing equipment, which is relatively inconvenient.
By providing a motor, a first lead screw, a first guide rod, a first guide rail, a second guide rod, a clamping plate, a second guide rail, a second lead screw, a rotating handle and a bearing plate, the bearing plate can be achieved to carry and clamp the multiple semiconductor parts of different sizes, and the impact force generated during the clamping process is absorbed through the limiting device to prevent damage to the semiconductor parts.
It improves the versatility and stability of the equipment, and can effectively fix semiconductor parts of different sizes to prevent the risk of damage caused by excessive clamping force.
Smart Images
Figure CN222673015U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of carrier devices, in particular to a semiconductor parts cleaning carrier device. Background Art
[0002] Semiconductor parts cleaning carriers are key equipment in the semiconductor manufacturing process, used to carry and fix semiconductor parts during the cleaning process. The design and function of this device is critical to ensure the efficiency of the cleaning process and the cleanliness of the parts.
[0003] However, the existing semiconductor parts cleaning carrier device still has certain defects. For example, it is unable to clamp and fix semiconductor parts of different sizes, which results in the need to replace other carrier devices when semiconductor parts of different sizes need to be cleaned, which is inconvenient. Utility Model Content
[0004] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art and to provide a semiconductor parts cleaning and carrying device. Through the arrangement of a motor, a first lead screw, a first guide rod, a first guide rail, a second guide rod, a clamping plate, a second guide rail, a second lead screw, a rotating handle, and a carrying plate, a plurality of semiconductor parts of different sizes can be carried and clamped, thereby improving the versatility and stability of the equipment. At the same time, through the arrangement of a limit device, the impact force generated during the clamping process can be absorbed, thereby preventing the risk of damage to the semiconductor parts due to excessive clamping force.
[0005] The utility model also provides a semiconductor parts cleaning carrying device as described above, comprising:
[0006] A base frame, the left surface of the base frame is fixedly connected to a motor, the output end of the motor is fixedly connected to a first lead screw, the upper surface of the base frame is provided with a slide groove, the inner surface of the slide groove is fixedly connected to a first guide rod, the inner surface of the base frame is fixedly connected to a bearing plate, the outer surface of the first lead screw is threadedly connected to a first guide rail, the inner surface of the first guide rail is fixedly connected to a second guide rod, the outer surface of the second guide rod is slidably connected to a clamping plate, the outer surface of the first guide rod is slidably connected to the second guide rail, the inner surface of the second guide rail is rotatably connected to a second lead screw, and the outer surface of the second lead screw is fixedly connected to a rotating handle.
[0007] The limiting device comprises a U-shaped block, a spring and a rubber plate. The inner surface of the U-shaped block is fixedly connected to the spring, and one end of the spring away from the U-shaped block is fixedly connected to the rubber plate.
[0008] According to the semiconductor parts cleaning and carrying device, the upper surface of the carrying plate is provided with card slots, and the number of the card slots is multiple and linearly distributed, so as to facilitate the carrying of semiconductor parts.
[0009] According to the semiconductor parts cleaning carrier device, the outer surface of the first lead screw is rotatably connected to the base frame, and the motor is electrically connected to an external power source.
[0010] According to the semiconductor parts cleaning carrier device, the inner surface of the slide groove is adapted to the second guide rail, and the number of the second guide rails is two and they are distributed on the left and right.
[0011] According to the semiconductor parts cleaning carrier device, the number of the first guide rails is two and they are distributed on the left and right, and the clamping groove corresponds to the U-shaped block, which is convenient for clamping and fixing the semiconductor parts.
[0012] According to the semiconductor parts cleaning carrier device, the inner surface of the first guide rail contacts the clamping plate, and the inner surface of the second guide rail contacts the clamping plate.
[0013] According to the semiconductor parts cleaning carrier device, the outer surface of the second lead screw is threadedly connected to the clamping plate, and the inner surface of the U-shaped block is in contact with the rubber plate.
[0014] According to the semiconductor parts cleaning carrier device, the outer surface of the first guide rail is in contact with the base frame, and the side surface of the clamping plate is fixedly connected to the U-shaped block.
[0015] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The utility model is further described below in conjunction with the accompanying drawings and embodiments;
[0017] Figure 1 This is a schematic diagram of the overall structure of a semiconductor parts cleaning carrier device of the utility model;
[0018] Figure 2 for Figure 1 A schematic diagram of the structure enlargement at the center A;
[0019] Figure 3 This is a schematic diagram of the structure of a limiting device of a semiconductor parts cleaning carrier device of the utility model;
[0020] Figure 4 It is a partial structural schematic diagram of a semiconductor parts cleaning carrier device of the utility model.
[0021] Legend:
[0022] 1. Base frame; 2. Motor; 3. First lead screw; 4. Slide groove; 5. First guide rod; 6. First guide rail; 7. Second guide rod; 8. Clamping plate; 9. Second guide rail; 10. Second lead screw; 11. Turning handle; 12. Limiting device; 13. U-shaped block; 14. Spring; 15. Rubber plate; 16. Loading plate; 17. Slot. DETAILED DESCRIPTION
[0023] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.
[0024] Reference Figure 1-4 The utility model embodiment is a semiconductor parts cleaning carrying device, which includes: a base frame 1, a motor 2 is fixedly connected to the left surface of the base frame 1, a first lead screw 3 is fixedly connected to the output end of the motor 2, a slide groove 4 is arranged on the upper surface of the base frame 1, a first guide rod 5 is fixedly connected to the inner surface of the slide groove 4, a carrying plate 16 is fixedly connected to the inner surface of the base frame 1, a first guide rail 6 is threadedly connected to the outer surface of the first lead screw 3, a second guide rod 7 is fixedly connected to the inner surface of the first guide rail 6, a clamping plate 8 is slidably connected to the outer surface of the second guide rod 7, a second guide rail 9 is slidably connected to the outer surface of the first guide rod 5, a second lead screw 10 is rotatably connected to the inner surface of the second guide rail 9, and the second lead screw The outer surface of 10 is fixedly connected with a rotating handle 11, and the upper surface of the carrying plate 16 is provided with a card slot 17, the number of the card slots 17 is multiple and linearly distributed, the outer surface of the first lead screw 3 is rotatably connected with the base frame 1, the motor 2 is electrically connected with the external power supply, the inner surface of the slide groove 4 is adapted to the second guide rail 9, the number of the second guide rails 9 is two and distributed on the left and right, the number of the first guide rails 6 is two and distributed on the left and right, the inner surface of the first guide rail 6 is in contact with the clamping plate 8, the inner surface of the second guide rail 9 is in contact with the clamping plate 8, the outer surface of the second lead screw 10 is threadedly connected with the clamping plate 8, the outer surface of the first guide rail 6 is in contact with the base frame 1, and the side surface of the clamping plate 8 is fixedly connected with the U-shaped block 13.
[0025] The limiting device 12 includes a U-shaped block 13, a spring 14 and a rubber plate 15. The inner surface of the U-shaped block 13 is fixedly connected to the spring 14, and one end of the spring 14 away from the U-shaped block 13 is fixedly connected to the rubber plate 15. The slot 17 corresponds to the U-shaped block 13, and the inner surface of the U-shaped block 13 is in contact with the rubber plate 15.
[0026] Working principle: When cleaning, insert the semiconductor parts into the card slots 17 in sequence. First, according to the height of the semiconductor parts, rotate the rotating handles 11 on both sides, and then drive the second screw 10 to drive the clamping plates 8 on both sides to move up and down along the second guide rails 9 to a position suitable for the height of the semiconductor parts. Then start the motor 2 to drive the first screw 3 to drive the corresponding two first guide rails 6 and the two second guide rails 9 to move toward each other. When the U-shaped blocks 13 on both sides clamp the semiconductor parts, under the action of the rubber plate 15 and the spring 14, the risk of damage to the semiconductor parts due to rigid clamping can be avoided.
[0027] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.
Claims
1. A semiconductor parts cleaning carrier, characterized in that: include: A base frame (1), wherein a motor (2) is fixedly connected to the left surface of the base frame (1), a first lead screw (3) is fixedly connected to the output end of the motor (2), a slide groove (4) is arranged on the upper surface of the base frame (1), a first guide rod (5) is fixedly connected to the inner surface of the slide groove (4), a bearing plate (16) is fixedly connected to the inner surface of the base frame (1), the first lead screw (3) is threadedly connected to the first guide rail (6), the inner surface of the first guide rail (6) is fixedly connected to the second guide rod (7), the outer surface of the second guide rod (7) is slidably connected to a clamping plate (8), the outer surface of the first guide rod (5) is slidably connected to the second guide rail (9), the inner surface of the second guide rail (9) is rotatably connected to the second lead screw (10), and the outer surface of the second lead screw (10) is fixedly connected to a rotating handle (11); A limiting device (12), the limiting device (12) comprising a U-shaped block (13), a spring (14) and a rubber plate (15), the inner surface of the U-shaped block (13) being fixedly connected to the spring (14), and one end of the spring (14) away from the U-shaped block (13) being fixedly connected to the rubber plate (15).
2. A semiconductor parts cleaning carrier according to claim 1, characterized in that: The upper surface of the carrying plate (16) is provided with a card slot (17), and the card slots (17) are multiple and linearly distributed.
3. A semiconductor parts cleaning carrier according to claim 1, characterized in that: The outer surface of the first lead screw (3) is rotatably connected to the base frame (1), and the motor (2) is electrically connected to an external power source.
4. A semiconductor parts cleaning carrier according to claim 1, characterized in that: The inner surface of the slide groove (4) is adapted to the second guide rail (9), and the number of the second guide rails (9) is two and they are distributed on the left and right.
5. A semiconductor parts cleaning carrier according to claim 2, characterized in that: The number of the first guide rails (6) is two and they are distributed on the left and right sides, and the clamping groove (17) corresponds to the U-shaped block (13).
6. A semiconductor parts cleaning carrier according to claim 1, characterized in that: The inner surface of the first guide rail (6) is in contact with the clamping plate (8), and the inner surface of the second guide rail (9) is in contact with the clamping plate (8).
7. A semiconductor parts cleaning carrier according to claim 1, characterized in that: The outer surface of the second lead screw (10) is threadedly connected to the clamping plate (8), and the inner surface of the U-shaped block (13) is in contact with the rubber plate (15).
8. A semiconductor parts cleaning carrier according to claim 1, characterized in that: The outer surface of the first guide rail (6) is in contact with the base frame (1), and the side surface of the clamping plate (8) is fixedly connected to the U-shaped block (13).