Photovoltaic diode semiconductor jumper wire
By designing the platform part and the second working part of the photovoltaic diode semiconductor jumper as a unified plane, and setting depressions and protrusions and through holes in the second working part, the problem of stretching and extrusion of solder on the die surface at high temperature is solved, and the electrical and thermal stability after welding is achieved.
Patent Information
- Application Number
- CN202420617056.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-28
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2034-03-28
AI Technical Summary
During semiconductor packaging, solder expands and cools at high temperatures to stretch and squeeze the die surface, resulting in problems such as chip surface delamination and solder short circuit.
A photovoltaic diode semiconductor jumper is designed, the platform part and the second working part are located on the same horizontal plane, the second working part is recessed at one end face to form a recess, and the protrusion is protruded outwardly on the opposite end face to form a protrusion, and a first through-hole that penetrates the protrusion is provided to control the flow and distribution of solder.
It effectively avoids the outward extension of solder and polytin phenomenon, reduces the problems of electrical failure and thermoelectric stress failure after soldering, and improves the reliability and life of semiconductor devices.
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Figure CN222673033U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductors, in particular to a photovoltaic diode semiconductor jumper. Background Art
[0002] In the semiconductor packaging process, solder needs to be melted at high temperature to weld the jumper to the tube core. In the existing jumper design, when the amount of solder is too large, the solder will climb along the jumper due to the better wettability of the solder and the jumper, so that tin aggregation occurs at the bend. When the solder cools, it will shrink, thereby stretching the surface of the tube core; and when the solder is heated, it will expand, squeezing the surface of the tube core, causing delamination failure on the chip surface. For the frame welding method forward current semiconductor product structure, the current common implementation structure is composed of a number of metal substrates, a number of tube cores and a number of metal jumpers connected to form a circuit, and a welding connection (such as solder paste and solder sheet) to weld the tube core, forming a welding assembly, and then the final semiconductor device product is formed by epoxy resin compression molding. Since copper has excellent electrical conductivity, thermal conductivity, deformation, tensile resistance and easy processing and molding, the jumper is usually made of copper metal material and is more closely attached to the epoxy resin material during the plastic molding process.
[0003] Regarding the structure of the jumper, the State Intellectual Property Office published a Chinese utility model patent entitled "A Semiconductor Jumper" with application number "202120303966.8" on September 28, 2021. The jumper in this case consists of a "first working part", "first connecting part", "platform part", "second connecting part" and "first working part" as one working part. When the jumper is welded to the tube core, the solder on the tube core should be prevented from deviating from the center of the tube core, and the tube core is prone to tin aggregation with the second working part. However, in the actual process of assembling and processing the jumper products, it was found that after welding, the jumper generates a lot of heat under high current operation, and all materials in the device have thermal expansion and cold indentation, resulting in a high scrap rate. In severe cases, problems such as open circuit and failure of the tube core may occur. Utility Model Content
[0004] In response to the shortcomings existing in the above-mentioned problems, the utility model provides a photovoltaic diode semiconductor jumper, including an integrated first working part, a connecting part, a platform part and a second working part, wherein the platform part and the second working part are located on the same horizontal plane, one end surface of the second working part is recessed downward to form a recessed part, and the opposite end surface thereof protrudes outward to form a raised part, and a first through hole penetrating the raised part is provided on the bottom surface of the recessed part.
[0005] Preferably, the first working part is provided with a clamping part matching with the jumper disk, and the clamping part is an arc chamfer provided at the top corners of two opposite ends of the first working part.
[0006] Preferably, at least one second through hole is formed on the connecting portion.
[0007] Preferably, two second through holes are provided on the connecting portion and are symmetrically arranged front to back.
[0008] Preferably, at least one third through hole is formed on the second working portion, and the third through hole is located at one side of the recessed portion.
[0009] Preferably, two third through holes are provided on the second working portion and are symmetrically arranged front to back.
[0010] Preferably, the height difference between the second working part and the first working part is greater than the height of a tube die.
[0011] Preferably, the first working portion and the platform portion have the same width.
[0012] Preferably, the bottom width and length of the concave portion and the convex portion are respectively 1.2 mm-1.3 mm smaller than the width and length of the metal surface on the upper surface of the corresponding tube core.
[0013] Compared with the prior art, the beneficial effects of the utility model are:
[0014] The platform part and the second working part of the utility model are in a unified plane, which solves the problem that the excess solder will not extend outwards or to the side of the tube core, avoids the occurrence of tin aggregation, and will not cause electrical failure problems. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 This is a front view of the photovoltaic diode semiconductor jumper in the utility model;
[0016] Figure 2 It is a left side view of the photovoltaic diode semiconductor jumper in the utility model;
[0017] Figure 3 This is a structural diagram of the photovoltaic diode semiconductor jumper in the utility model. DETAILED DESCRIPTION
[0018] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0019] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.
[0020] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0021] The following is combined with Figure 1 The utility model is further described in detail:
[0022] Reference Figure 1-3 The utility model provides a photovoltaic diode semiconductor jumper, comprising an integrated first working part 1, a connecting part 2, a platform part 3 and a second working part 4, the platform part 3 and the second working part 4 are located on the same horizontal plane, one end surface of the second working part 4 is recessed downward to form a recessed part 43, and the opposite end surface thereof is protruded outward to form a protruding part 44, and a first through hole 41 penetrating the protruding part 44 is provided on the bottom surface of the recessed part 43. The height difference between the second working part 4 and the first working part 1 is greater than the height of a tube core 45, and the first working part 1 and the platform part 3 have the same width.
[0023] Furthermore, the first working part 1 is provided with a clamping part that matches the jumper tray, and the clamping part is an arc chamfer provided at the top corners of the two opposite ends of the first working part 1. The jumper is placed in the jumper tray before welding. In order to ensure the stability of the jumper in the jumper tray, a jumper tray clamping part corresponding to the clamping part is provided in the jumper tray to ensure that the jumper is clamped in the jumper tray. Before the first working part 1 is welded to the substrate frame, the solder is on the substrate frame, and the operator fits the bottom of the first working part 1 with the bottom plate frame, and the solder is adhered to the bottom of the first working part 1. When welding in the welding furnace, the solder melts and flows and spreads along the bottom of the first working part 1 and the upper surface of the substrate frame. The increase in the adhesion area of the first working part 1 allows the solder to be more fully and evenly spread on the bottom of the first working part 1 and the surface of the substrate for welding. The parallelism after welding is more fitted and no warping occurs.
[0024] Furthermore, at least one second through hole 21 is provided on the connecting portion 2. The second through hole 21 in the connecting portion 2 can make the parts in the plastic seal more firmly when the epoxy resin is encapsulated, and can ensure that the lower part of the connecting portion 2 is completely filled with epoxy resin during the production process. Two second through holes 21 are provided on the connecting portion 2 and are symmetrically arranged front and back.
[0025] In this embodiment, the platform portion 3 and the second working portion 4 are located at the same horizontal plane, and the area of the second working portion 4 is increased, which is more conducive to the heat dissipation of the tube core 45 during operation, and better transmits the forward current, and does not cause the problem of "electrical sparking" failure and thermoelectric stress failure in the later stage. The third through hole 42 of the second working portion 4 can make it more firmly fastened to the components in the plastic seal when the epoxy resin is encapsulated, and can ensure that the second working portion 4 is completely filled with epoxy resin material during the production process. The third through hole 42 of the second working portion 4 can make it more firmly fastened to the components in the plastic seal when the epoxy resin is encapsulated, and can ensure that the second working portion 4 is completely filled with epoxy resin material during the production process. At least one third through hole 42 is opened on the second working portion 4, and the third through hole 42 is located on one side of the recessed portion 43. Two third through holes 42 are arranged on the second working portion 4 and are symmetrically arranged front and back.
[0026] Specifically, the best use effect of the product can be achieved when the bottom width and length of the concave portion 43 and the convex portion 44 are 1.2mm-1.3mm smaller than the width and length of the metal surface on the corresponding tube core 45, and the area can be set according to the size of the tube core 45 to cope with different tube cores 45. The bottom of the second working portion 4 is in contact with the tube core 45. During the high-temperature welding process, the solder further melts and flows, and the excess solder will flow out in the first through hole 41, and the rest will remain in the convex portion 44. The solder will not extend to the side of the tube core 45, avoiding the occurrence of tin aggregation and causing welding short circuits. At the same time, it also increases the effective contact area between the tube core 45 and the solder, and will not cause failure problems such as "electrical sparks" and "tube core 45 open circuit" in the later stage.
[0027] In this embodiment, the second working portion 4 is provided with a serrated clamping portion which is completely wrapped with the plastic-encapsulated epoxy resin. The second working portion 4 is provided with a serrated clamping portion which is chamfered and retracted, and is respectively provided at the vertex angles of the two extreme directions of the second working portion 4 .
[0028] A further improvement of the technical solution of the present invention is that the first working portion 1 is provided with an arc chamfer to facilitate the absorption of the jumper wire during the working process, and the jumper wire and the jumper wire tray can be completely fitted without jamming.
[0029] A further improvement of the technical solution of the present invention is that the second through hole 21 is provided on the connecting portion 2 and the platform portion 3, which is beneficial for tightly wrapping the connecting portion 2 when the epoxy resin is used to mold the connecting portion 2, so that the connecting portion 2 and the platform portion 3 will not move or be misplaced in the internal space.
[0030] A further improvement of the technical solution of the present invention is that the platform portion 3 is consistent in width with the first working portion 1, which can increase the tube core 45 to better transmit forward current and dissipate heat faster during use, and will not cause later "electrical spark" failure and thermoelectric stress failure problems.
[0031] A further improvement of the technical solution of the present invention is that during welding, the upper surface of the tube core 45 is welded to the raised portion 44 of the second working portion 4, and the solder is on the upper surface of the tube core 45 (i.e., the metal layer on the upper surface of the tube core 45). During high-temperature welding, the solder will further melt and flow, and the additional platform portion 3 and the second working portion 4 are formed into a unified plane, which solves the problem that excess solder will not extend outward or to the side of the tube core 45, avoids the occurrence of tin aggregation, and will not cause electrical failure problems.
[0032] The further improvement of the technical solution of the present invention is that: the second working part 4 is provided with a serrated clamping part which is completely wrapped with the plastic encapsulation epoxy resin, which is beneficial to the epoxy resin molding. In the actual jumper assembly and product processing process, it is found that after welding, the jumper generates a lot of heat due to the operation of large current, and all materials in the device have thermal expansion and cold indentation, resulting in a high scrap rate. In severe cases, problems such as open circuit and failure of the tube core occur. It can be tightly wrapped so that it will not move or dislocate in the internal space, increase the effective contact area, and increase the heat dissipation space to reduce the problem of thermal stress failure.
[0033] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may be subject to various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims
1. A photovoltaic diode semiconductor jumper, characterized in that: It includes an integrated first working part, a connecting part, a platform part and a second working part, wherein the platform part and the second working part are located in the same horizontal plane, one end surface of the second working part is recessed downward to form a recessed part, and the opposite end surface thereof protrudes outward to form a protruding part, and a first through hole penetrating the protruding part is provided on the bottom surface of the recessed part.
2. The photovoltaic diode semiconductor jumper according to claim 1, characterized in that: The first working part is provided with a clamping part matching with the jumper disk, and the clamping part is an arc chamfered part provided at the top corners of two opposite ends of the first working part.
3. The photovoltaic diode semiconductor jumper according to claim 2, characterized in that: At least one second through hole is formed on the connecting portion.
4. The photovoltaic diode semiconductor jumper according to claim 3, characterized in that: The connecting portion is provided with two second through holes which are symmetrically arranged front to back.
5. The photovoltaic diode semiconductor jumper according to claim 4, characterized in that: At least one third through hole is formed on the second working portion, and the third through hole is located at one side of the recessed portion.
6. The photovoltaic diode semiconductor jumper according to claim 5, characterized in that: The second working portion is provided with two third through holes which are symmetrically arranged front to back.
7. The photovoltaic diode semiconductor jumper according to claim 1, characterized in that: The height difference between the second working part and the first working part is greater than the height of a tube die.
8. The photovoltaic diode semiconductor jumper according to claim 1, characterized in that: The first working portion and the platform portion have the same width.
9. The photovoltaic diode semiconductor jumper according to claim 1, characterized in that: The bottom surface width and length of the concave portion and the convex portion are respectively 1.2 mm to 1.3 mm smaller than the width and length of the metal surface on the upper surface of the corresponding tube core.
Citation Information
Patent Citations
Semiconductor jumper wire
CN214313192U