Heating device applied to semiconductor film forming

Abstract

The utility model discloses a heating device applied to semiconductor film formation, which comprises a heating plate and a plurality of heating units, the heating plate is used for heating a semiconductor film, the heating units are uniformly arranged below the heating plate so as to realize uniform heating of the heating plate, and through the arrangement, each heating unit positioned below the heating plate can heat the semiconductor film uniformly. The heat of each position on the heating plate can be kept consistent so as to realize uniform heating of the semiconductor film.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor film heating, in particular to a heating device used for semiconductor film formation. Background Art

[0002] Existing heating devices usually heat semiconductor films unevenly, resulting in uneven heating of the semiconductor films, reducing product stability and seriously affecting product quality. This problem is particularly prominent when heating large-size semiconductor films. Therefore, there is an urgent need on the market for a heating device that can achieve uniform heating of semiconductor films. Utility Model Content

[0003] The purpose of the utility model is to address the technical problems existing in the background technology and to propose a heating device used for semiconductor film formation, including a heating plate and a plurality of heating units. The heating plate is used to heat the semiconductor film. The heating units are evenly arranged under the heating plate to achieve uniform heating of the heating plate.

[0004] Furthermore, the heating unit is a heating tube, the length of the heating tube matches the width of the heating plate, and a plurality of heating tubes are arranged below the heating plate and are arranged equidistantly along the length direction of the heating plate.

[0005] Furthermore, it also includes a connecting seat, the heating plate is arranged on the connecting seat, and a plurality of mounting grooves are arranged on the connecting seat, and the mounting grooves are used for installing the heating tubes.

[0006] Furthermore, a first insertion opening and a second insertion opening are formed on the side wall of the connecting seat at both ends of the installation groove, and the two ends of the heating tube are respectively inserted into the first insertion opening and the second insertion opening to achieve the installation of the heating tube and the installation groove.

[0007] Furthermore, the diameter of the heating tube is smaller than the depth of the mounting groove, and the heating plate is arranged on the top wall of the mounting groove.

[0008] Furthermore, the heating units are distributed in a dot matrix below the heating plate.

[0009] Compared with the prior art, the utility model has the following beneficial technical effects: since the utility model includes a heating plate and a plurality of heating units, the heating units are evenly arranged under the heating plate. Specifically, the heating units are heating tubes, the length of the heating tubes matches the width of the heating plate, and the plurality of heating tubes are arranged under the heating plate and are equidistantly arranged along the length direction of the heating plate. That is, through the above arrangement, the heating units located under the heating plate can keep the heat at various positions on the heating plate consistent, so as to achieve uniform heating of the semiconductor film. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1This is an explosion state diagram of the utility model;

[0011] Figure 2 This is another explosion state diagram of the utility model;

[0012] Figure 3 This is a partial enlarged view of point A. DETAILED DESCRIPTION

[0013] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0014] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.

[0015] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or a specific connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0016] The specific embodiments of the present utility model are described in detail below with reference to the accompanying drawings.

[0017] like Figure 1-Figure 3 As shown, the utility model proposes a heating device for semiconductor film formation, including a heating plate 1 and a plurality of heating units 11. The heating plate 1 is used to heat the semiconductor film. The heating units 11 are evenly arranged under the heating plate 1 to achieve uniform heating of the heating plate 1.

[0018] As an implementation mode of this embodiment, a spray plate 4 can also be placed above the heating plate 1, and the semiconductor material can be sprayed onto the spray plate 4 through the spray mechanism to form a semiconductor film. Furthermore, during heating, the heating unit 11 can be powered on to start. It can be understood that since the heating units 11 are evenly distributed under the heating plate 1, the heat generated by each heating unit 11 can achieve uniform heating of the heating plate 1, so that the heat at each position on the heating plate 1 is kept consistent. The heat on the heating plate 1 can be conducted to the semiconductor film through the spray plate 4 to achieve uniform heating of the semiconductor film. The structure is simple and the operation is convenient.

[0019] Furthermore, in this embodiment, the heating unit 11 is a heating tube, the length of the heating tube matches the width of the heating plate 1, and a plurality of heating tubes are arranged under the heating plate 1 and are arranged equidistantly along the length direction of the heating plate 1. The heating tubes arranged equidistantly and side by side can achieve uniform heating of the heating plate 1.

[0020] Furthermore, in this embodiment, the heating device also includes a connecting seat 2, the heating plate 1 is arranged on the connecting seat 2, and a plurality of mounting grooves 21 are arranged on the connecting seat 2. The mounting grooves 21 are used for installing the heating tube. Specifically, the two ends of the mounting groove 21 form a first insertion port 201 and a second insertion port 202 on the side wall of the connecting seat 2. The two ends of the heating tube are respectively inserted into the first insertion port 201 and the second insertion port 202 to realize the installation of the heating tube and the mounting groove 21. The diameter of the heating tube is smaller than the depth of the mounting groove 21, and the heating plate 1 is arranged on the top wall of the mounting groove 21.

[0021] Furthermore, as another implementation of this embodiment, the heating units 11 are distributed in a dot matrix below the heating plate 1 to achieve uniform heating of the heating plate 1 .

[0022] Furthermore, in this embodiment, the heating device also includes a conveying mechanism 3, which includes a transmission motor 31, a transmission roller 32 and a conveyor belt 33. The transmission rollers 32 are arranged in pairs on both sides of the connecting seat 2, and the conveyor belt 33 is connected end to end and is sleeved on the transmission roller 32. The spray plate 4 is placed on the conveyor belt 33. That is, through the above arrangement, the heating plate 1 and the connecting seat 2 are "embedded" in the conveyor belt 33. When the heating plate 1 is heated, the heat will be transferred to the semiconductor film through the conveyor belt 33 and the spray plate 4 in turn. Further, the transmission motor 31 is connected to the transmission roller 32, and the transmission motor 31 drives the transmission roller 32 to rotate, thereby driving the conveyor belt 33 to move, so as to drive the spray plate 4 to move, thereby realizing the transportation function of the spray plate 4.

[0023] The above are one or more implementation methods provided in combination with specific content, and it is not intended that the specific implementation of the utility model is limited to these descriptions. Any method, structure, etc. similar to or identical to the method, structure, etc. of the utility model, or any technical deduction or replacement based on the concept of the utility model, shall be deemed to be within the protection scope of the utility model.

Claims

1. A heating device for semiconductor film formation, characterized in that: The invention comprises a heating plate (1) and a plurality of heating units (11), wherein the heating plate (1) is used to heat a semiconductor film, the length of the heating unit (11) matches the width of the heating plate (1), and the plurality of heating units (11) are arranged below the heating plate (1) and are arranged equidistantly along the length direction of the heating plate (1) to achieve uniform heating of the heating plate (1).

2. A heating device for semiconductor film formation according to claim 1, characterized in that: The heating unit (11) is a heating tube.

3. A heating device for semiconductor film formation according to claim 2, characterized in that: It also comprises a connecting seat (2), the heating plate (1) is arranged on the connecting seat (2), and the connecting seat (2) is provided with a plurality of mounting grooves (21), and the mounting grooves (21) are used for mounting the heating tube.

4. A heating device for semiconductor film formation according to claim 3, characterized in that: The two ends of the installation groove (21) form a first insertion opening (201) and a second insertion opening (202) on the side wall of the connecting seat (2), and the two ends of the heating tube are respectively inserted into the first insertion opening (201) and the second insertion opening (202) to achieve the installation of the heating tube and the installation groove (21).

5. A heating device for semiconductor film formation according to claim 4, characterized in that: The diameter of the heating tube is smaller than the depth of the mounting groove (21), and the heating plate (1) is arranged on the top wall of the mounting groove (21).

6. The heating device for semiconductor film formation according to claim 1, characterized in that: The heating units (11) are arranged in a dot matrix below the heating plate (1).

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