Circuit board and electronic equipment

Abstract

The utility model discloses a circuit board and electronic equipment. The circuit board comprises at least one substrate, at least one conductive layer and at least one connecting layer. At least one side surface of at least one substrate along the thickness direction of the circuit board is provided with at least one recess, the recess does not penetrate through the other side surface of the circuit board along the thickness direction, and at least one conductive layer covers at least one side surface of the substrate along the thickness direction of the circuit board. The connecting layer is connected with the conductive layer, and the connecting layer is at least partially embedded in the recess. According to the circuit board, the connecting layer connected with the conductive layer is arranged, and the connecting layer is at least partially embedded in the recess, so that the connecting area of the connecting layer and the substrate is increased, the connecting strength of the connecting layer and the substrate is further improved, the probability that the connecting layer falls off is reduced, or the connecting layer is prevented from falling off, and the after-sales cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of printed circuit boards (PCBs), in particular to a circuit board and an electronic device. Background Art

[0002] For high-power devices, the PCB copper foil substrate requires a corresponding trace width to ensure the safe transmission of large currents, thereby ensuring the normal operation of high-power devices.

[0003] In the related art, copper strips are added to the outer wiring area of ​​the PCB copper foil carrier to reduce resistance, thereby ensuring the safe passage of large currents. However, the difficulty of connecting the copper strips to the PCB copper foil carrier increases, and the stability and reliability decrease, making the copper strips easy to fall off, and increasing after-sales costs. Utility Model Content

[0004] The embodiments of the utility model provide a circuit board and an electronic device to solve at least one of the above-mentioned technical problems.

[0005] The utility model provides a circuit board. The circuit board comprises:

[0006] At least one substrate, at least one side surface of at least one substrate along the thickness direction of the circuit board is provided with at least one recess, and the recess does not penetrate the other side surface of the circuit board along the thickness direction;

[0007] At least one conductive layer, at least one of the conductive layers is coated on at least one side of the substrate along the thickness direction of the circuit board;

[0008] At least one connecting layer is provided, the connecting layer is connected to the conductive layer, and the connecting layer is at least partially embedded in the recess.

[0009] The above-mentioned circuit board, by providing a connecting layer connecting the conductive layer, the connecting layer is at least partially embedded in the recess, so that the connection area between the connecting layer and the substrate is increased, thereby improving the connection strength between the connecting layer and the substrate, reducing the probability of the connecting layer falling off or avoiding the connection layer falling off, and reducing after-sales costs.

[0010] In some embodiments, the recess is formed by a milling process, and the connection layer and the recess match in shape.

[0011] In this way, the connection layer and the recess form an interference fit, thereby improving the connection stability between the connection layer and the recess, thereby ensuring safe operation of the circuit board.

[0012] In some embodiments, the substrate has a recess on one side along the thickness direction of the circuit board, the conductive layer is covered on the side of the substrate having the recess, and the connecting layer is located in the recess and connected to the conductive layer.

[0013] In this way, the connection layer fills the matching recess, thereby ensuring that the single-sided circuit board has the ability to carry excessive current in a local area, thereby ensuring the normal operation of high-power equipment.

[0014] In some embodiments, the circuit board includes a substrate and two conductive layers, the two conductive layers are respectively covered on two opposite side surfaces of the substrate along the thickness direction of the circuit board, and two recesses are respectively provided on two side surfaces of the substrate along the thickness direction of the circuit board, and the two recesses are staggered along the thickness direction of the circuit board.

[0015] In this way, the two connection layers are respectively filled and matched with the two recesses, thereby ensuring that the double-sided circuit board has the ability to carry excessive current in two local areas, thereby ensuring the normal operation of multiple high-power devices.

[0016] In some embodiments, the circuit board includes a plurality of the substrates and a plurality of the conductive layers, and the plurality of the conductive layers and the plurality of substrates are alternately arranged in sequence along the thickness direction of the circuit board, one of the substrates is provided with the recess on the first side along the thickness direction of the circuit board, and another substrate is provided with the recess on the second side along the thickness direction of the circuit board, and the first side and the second side are two opposite sides along the thickness direction of the circuit board.

[0017] In this way, the two connection layers are respectively filled and matched with the two recesses, thereby ensuring that the multi-layer circuit board has the ability to handle excessive current in two local areas, thereby ensuring the normal operation of multiple high-power devices.

[0018] In some embodiments, the circuit board includes a plurality of the substrates and a plurality of the conductive layers, and the plurality of conductive layers and the plurality of substrates are alternately arranged in sequence along the thickness direction of the circuit board;

[0019] The multiple substrates include a first substrate, a second substrate and a third substrate, wherein the first substrate, the second substrate and the third substrate are three substrates adjacent to each other in sequence along the thickness direction of the circuit board, the second substrate is provided with a recess on each of the two side surfaces along the thickness direction of the circuit board, the first substrate is provided with a first through hole along the thickness direction of the circuit board, the third substrate is provided with a second through hole along the thickness direction of the circuit board, one of the connecting layers passes through the first through hole and is partially located in one of the recesses, and another of the connecting layers passes through the second through hole and is partially located in another of the recesses.

[0020] In this way, the two connection layers are respectively filled and matched with the two recesses, thereby ensuring that the multi-layer circuit board has the ability to handle excessive current in four local areas, thereby ensuring the normal operation of multiple high-power devices.

[0021] In some embodiments, the circuit board includes a plurality of the substrates and a plurality of the conductive layers, and the plurality of conductive layers and the plurality of substrates are alternately arranged in sequence along the thickness direction of the circuit board;

[0022] The multiple substrates include a fifth substrate and a sixth substrate, the fifth substrate and the sixth substrate are two substrates adjacent to each other in sequence along the thickness direction of the circuit board, the sixth substrate is provided with a recess on a side close to the fifth substrate, and the fifth substrate is provided with a recess on a side close to the sixth substrate, the two recesses are staggered along the thickness direction of the circuit board, the fifth substrate is also provided with a third through hole along the thickness direction of the circuit board, one of the connection layers passes through the third through hole and is partially located in the recess of the sixth substrate, and the other connection layer is located in the recess of the fifth substrate.

[0023] In this way, the two connection layers are respectively filled and matched with the two recesses, thereby ensuring that the multi-layer circuit board has the ability to handle excessive current in three local areas, thereby ensuring the normal operation of multiple high-power devices.

[0024] In some embodiments, the circuit board includes a plurality of the substrates and a plurality of the conductive layers, and the plurality of conductive layers and the plurality of substrates are alternately arranged in sequence along the thickness direction of the circuit board;

[0025] The multiple substrates include a seventh substrate, an eighth substrate and a ninth substrate, the seventh substrate, the eighth substrate and the ninth substrate are three substrates adjacent to each other in sequence along the thickness direction of the circuit board, the eighth substrate is provided with a fourth through hole along the thickness direction of the circuit board, a side of the seventh substrate close to the eighth substrate is provided with a first recess, a side of the ninth substrate close to the eighth substrate is provided with a second recess, one of the connecting layers passes through the fourth through hole and is partially located in the first recess and the second recess respectively, a side of the eighth substrate close to the ninth substrate is provided with a third recess, a side of the ninth substrate close to the eighth substrate is also provided with a fourth recess, the third recess and the fourth recess are correspondingly arranged along the thickness direction of the circuit board, and another connecting layer is located in the third recess and the fourth recess.

[0026] In this way, the two connection layers are respectively filled with matching multiple recesses, thereby ensuring that the multi-layer circuit board has the ability to handle excessive current in three local areas, thereby ensuring the normal operation of multiple high-power devices.

[0027] In some embodiments, the recess extends to the side of the substrate along a direction perpendicular to the thickness direction of the circuit board, and the connection layer includes a portion protruding from the side of the substrate along a direction perpendicular to the thickness direction of the circuit board.

[0028] In this way, while ensuring that the thickness of the circuit board does not increase, the connection layer is embedded on the side of the circuit board to reduce the local resistance of the circuit board, thereby improving the circuit board's ability to handle large currents.

[0029] In some embodiments, the circuit board further includes a protective layer and a silk-screen layer, wherein the protective layer is coated on a side of the conductive layer facing away from the substrate, and the silk-screen layer is coated on an outer side of the protective layer.

[0030] In this way, the conductive layer is insulated from the external environment, thereby ensuring the safe operation of the circuit board and reducing safety risks.

[0031] The utility model provides an electronic device in an embodiment, wherein the electronic device comprises the circuit board in any one of the above embodiments.

[0032] The above-mentioned electronic device, by providing a connecting layer connected to the conductive layer, the connecting layer is at least partially embedded in the recess, so that the connection area between the connecting layer and the substrate is increased, thereby improving the connection strength between the connecting layer and the substrate, reducing the probability of the connecting layer falling off or avoiding the connecting layer falling off, and reducing after-sales costs.

[0033] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0035] Figures 1 to 9 It is a cross-sectional view of a circuit board according to an embodiment of the present utility model.

[0036] Description of main component reference numerals:

[0037] Circuit board-10, substrate-11, conductive layer-12, connecting layer-13, recess-14, protective layer-15, silk screen layer-16, first side-101, second side-102, first substrate-111, second substrate-112, third substrate-113, fourth substrate-114, fifth substrate-115, sixth substrate-116, seventh substrate-117, eighth substrate-118, ninth substrate-119, tenth substrate-120, eleventh substrate-121, tenth The second substrate 122, the thirteenth substrate 123, the fourteenth substrate 124, the fifteenth substrate 125, the sixteenth substrate 126, the seventeenth substrate 127, the eighteenth substrate 128, the connecting portion 131, the end portion 132, the first recess 141, the second recess 142, the third recess 143, the fourth recess 144, the first through hole 1111, the second through hole 1131, the third through hole 1151, the fourth through hole 1181, and the notch 1211. DETAILED DESCRIPTION

[0038] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0039] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In the description of the present utility model, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0040] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0041] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0042] The disclosure herein provides many different embodiments or examples for realizing different structures of the utility model. In order to simplify the disclosure of the utility model, the components and settings of specific examples are described herein. Of course, they are merely examples, and the purpose is not to limit the utility model. In addition, the utility model may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the utility model provides various specific examples of processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and / or the use of other materials.

[0043] See also Figures 1 to 3 The present utility model provides a circuit board 10. The circuit board 10 includes at least one substrate 11, at least one conductive layer 12 and at least one connecting layer 13. At least one substrate 11 is provided with at least one recess 14 on at least one side along the thickness direction of the circuit board 10, and the recess 14 does not penetrate the other side of the circuit board 10 along the thickness direction. At least one conductive layer 12 is covered on at least one side of the substrate 11 along the thickness direction of the circuit board 10. The connecting layer 13 is connected to the conductive layer 12, and the connecting layer 13 is at least partially embedded in the recess 14.

[0044] The above-mentioned circuit board 10 is provided with a connecting layer 13 connected to the conductive layer 12, and the connecting layer 13 is at least partially embedded in the recess 14, so that the connection area between the connecting layer 13 and the substrate 11 is increased, thereby improving the connection strength between the connecting layer 13 and the substrate 11, reducing the probability of the connecting layer 13 falling off or avoiding the connecting layer 13 falling off, thereby reducing after-sales costs.

[0045] Specifically, the substrate 11 serves as a carrier of the circuit board 10 and can be made of an organic polymer material that is resistant to high temperature and high pressure and has good mechanical properties and stability, so as to carry electronic components and arrange conductive circuits, thereby ensuring the safety and stability of the circuit board 10.

[0046] For example, in some examples, the substrate 11 may be made of glass fiber, epoxy resin, polyimide, or a composite carrier formed by any combination thereof, or other materials, which are not specifically limited herein.

[0047] In one embodiment, if Figure 1 As shown, the conductive layer 12 can be copper foil, which can be coated on the substrate 11 by chemical plating, mechanical pressing or other methods, wherein the conductive layer 12 can be formed into a conductive circuit by etching copper or other methods, thereby ensuring the normal operation of the electronic components on the circuit board 10.

[0048] In one embodiment, the conductive layer 12 may be arranged on one side of the substrate 11 or on both sides of the substrate 11 to ensure that the circuit board 10 forms a normal working circuit, which is not specifically limited herein.

[0049] In one embodiment, the connection layer 13 may be a copper strip or a copper sheet, which may be embedded in the substrate 11 and connected to the conductive layer 12 to increase the circuit board 10's ability to carry excessive current, prevent the conductive circuit from overheating, and thereby reduce safety risks.

[0050] Please combine Figures 1 to 3 At least one substrate 11 is provided with at least one recess 14 on at least one side surface along the thickness direction of the circuit board 10. It can be understood that in the circuit board 10, a recess 14 can be provided on a single side surface of a substrate 11, or a recess 14 can be provided on both sides of a substrate 11. The number of recesses 14 is not limited, and at least one recess 14 can be provided on at least one side surface of multiple substrates 11 along the thickness direction of the circuit board 10. It is only necessary to ensure that a recess 14 is provided on any one side surface of a substrate 11 in the circuit board 10 to ensure that the connection layer 13 passes through the recess 14 so that the local area of ​​the circuit board 10 has the ability to pass excessive current. No specific limitation is made here.

[0051] For example, there may be three substrates 11, one of which has the recess 14, two of which may have recesses 14 respectively, or all three of which may have recesses 14, and the recesses 14 are located on at least one side of the substrate 11 along the thickness direction of the circuit board 10, without specific limitation here.

[0052] In one embodiment, the connecting layer 13 is at least partially embedded in the recess 14, so that the connecting layer 13 is connected to the conductive layer 12 while ensuring a stable connection between the connecting layer 13 and the recess 14, thereby ensuring the normal operation of the electronic components and further improving the safety and stability of the circuit board 10.

[0053] It can be understood that the connection layer 13 can be partially embedded in the recess 14 or entirely located in the recess 14 to ensure the stability of the connection layer 14, and no specific limitation is made herein.

[0054] In one embodiment, the recess 14 does not penetrate the other side of the circuit board 10 along the thickness direction. It can be understood that the recess 14 does not continuously penetrate the upper and lower sides of the circuit board 10 as a whole along the thickness direction of the circuit board 10. While ensuring that the circuit board 10 has the ability to carry excessive current, the material usage of the connecting layer 13 is reduced, that is, the usage of copper bars or copper sheets is reduced, thereby reducing the production cost of the circuit board 10.

[0055] For example, in some examples, the recess 14 may pass through the upper side of the substrate 11 along the thickness direction of the circuit board 10 but not through the lower side of the substrate 11 along the thickness direction of the circuit board 10 (eg, Figure 1 As shown), they may also pass through the upper side and lower side of the same substrate 11 along the thickness direction of the circuit board 10, but the two recesses 14 are staggered and not connected as a whole (as shown in FIG. Figure 2 As shown), the upper and lower sides of the different substrates 11 along the thickness direction of the circuit board 10 can also be respectively passed through, but the two recesses 14 are not connected as a whole (as shown in FIG. Figure 3 As shown), to reduce the amount of connecting layer 13, no specific limitation is made here.

[0056] In some embodiments, the recess 14 is formed by a milling process, and the connection layer 13 and the recess 14 match in shape.

[0057] In this way, the connection layer 13 and the recess 14 form an interference fit, thereby improving the connection stability between the connection layer 13 and the recess 14 , thereby ensuring the safe operation of the circuit board 10 .

[0058] Specifically, in one embodiment, the recess 14 can be formed by milling in a local area of ​​the substrate 11 using a milling cutter. While ensuring that the thickness of the circuit board 10 is constant, the connecting layer 13 is embedded in the recess 14. Compared with directly welding copper strips on the circuit board 10 in the related art, the space occupied by the connecting layer 13 on the circuit board 10 is reduced, while the circuit board 10 can be guaranteed to have the ability to handle large currents and good stability.

[0059] It can be understood that, in one example, the recess 14 can be a rectangular groove or a slot of other shapes to match the shape of the connecting layer 14, thereby ensuring that the connecting layer 13 and the recess 14 form an interference fit, thereby improving the connection stability between the connecting layer 13 and the recess 14.

[0060] In one embodiment, the connection layer 13 and the recess 14 can be aligned and pressed together to ensure that the connection layer 13 and the recess 14 are stably combined, thereby ensuring that the circuit board 10 works safely.

[0061] In one embodiment, the current value of the large current can be tens of amperes or hundreds of amperes, and the specific value depends on the actual application scenario of the circuit board 10. For example, the actual application scenario of the circuit board 10 can be batteries, high-power equipment, refrigerators, air conditioners, washing machines, or battery swap stations, etc., and no specific restrictions are made here.

[0062] See also Figure 1 In some embodiments, a recess 14 is provided on one side of the substrate 11 along the thickness direction of the circuit board 10 , the conductive layer 12 is covered on the side of the substrate 11 where the recess 14 is provided, and the connecting layer 13 is located in the recess 14 and connected to the conductive layer 12 .

[0063] In this way, the connection layer 13 fills the matching recess 14, thereby ensuring that the single-sided circuit board 10 has the ability to carry excessive current in a local area, thereby ensuring the normal operation of high-power equipment.

[0064] Specifically, in one embodiment, Figure 1 As shown, the circuit board 10 is formed into a single-sided board by connecting a substrate 11 and a conductive layer 12 to form a conductive path, thereby ensuring that the circuit board 10 works normally.

[0065] The recess 14 can be arranged in the middle of the substrate 11, or on the left and right sides of the substrate 11, or at other positions, as long as the connection layer 13 and the conductive layer 12 are connected after lamination, and no specific limitation is made here.

[0066] In one embodiment, if Figure 1 As shown, the recess 14 is square and can be arranged on the upper side of the substrate 11 to match and crimp with the square connection layer 13 , thereby ensuring the stability of the connection between the connection layer 13 and the recess 14 .

[0067] Furthermore, the conductive layer 12 is covered on the upper side of the substrate 11 and can be connected to the connecting layer 13 crimped in the recess 14, so that the conductive layer 12 and the connecting layer 13 form a conductive path, thereby ensuring the normal operation of the circuit board 10. At the same time, it can ensure that the circuit board 10 has the ability to pass large current in the local area where the connecting layer 13 is embedded to meet the power requirements of high-power equipment.

[0068] In another embodiment, the recess 14 is square and can be arranged on the lower side of the substrate 11, and the conductive layer 12 is covered on the lower side of the substrate 11 (not shown), so that the conductive layer 12 and the connecting layer 13 form a conductive path, so that the circuit board 10 meets the power requirements of high-power equipment, and no specific restrictions are made here.

[0069] See also Figure 2In some embodiments, the circuit board 10 includes a substrate 11 and two conductive layers 12, the two conductive layers 12 are respectively covered on two opposite side surfaces of the substrate 11 along the thickness direction of the circuit board 10, and two recesses 14 are respectively provided on the two side surfaces of the substrate 11 along the thickness direction of the circuit board 10, and the two recesses 14 are staggered along the thickness direction of the circuit board 10.

[0070] In this way, the two connection layers 13 fill and match the two recesses 14 respectively, thereby ensuring that the double-sided circuit board 10 has the ability to handle excessive current in two local areas, thereby ensuring the normal operation of multiple high-power devices.

[0071] Specifically, in one embodiment, Figure 2 As shown, the circuit board 10 is formed into a double-sided board by covering two opposite sides of a substrate 11 along the thickness direction of the circuit board 10 with conductive layers 12, thereby forming multiple conductive paths to ensure the normal operation of the circuit board 10.

[0072] It can be understood that the two recesses 14 are respectively arranged on the two opposite sides of the substrate 11 along the thickness direction of the circuit board 10, that is, respectively arranged on the upper side and the lower side of the substrate 11, so as to ensure that the two connecting layers 13 respectively pressed into the two recesses 14 are each connected to an adjacent conductive layer 12, thereby ensuring that the double-sided circuit board 10 has the ability to carry excessive current in two local areas.

[0073] The two recesses 14 may also be arranged on the left and / or right side of the substrate 11, or at other positions, as long as the two connection layers 13 after lamination are each connected to one of the conductive layers 12, without any specific limitation.

[0074] In one embodiment, if Figure 2 As shown, the two recesses 14 are square and are respectively arranged on the upper side and the lower side of the substrate 11 to match and crimp with the two square connecting layers 13 , thereby ensuring the stability of the connection between the connecting layer 13 and the recesses 14 .

[0075] Furthermore, the two conductive layers 12 are respectively covered on the upper and lower sides of the substrate 11, and can be connected to the connecting layer 13 crimped in the recess 14, so that the conductive layer 12 and the connecting layer 13 form a conductive path, thereby ensuring the normal operation of the circuit board 10. At the same time, it can ensure that the circuit board 10 has the ability to pass large currents in multiple local areas where the connecting layer 13 is embedded, so as to meet the power requirements of high-power equipment.

[0076] It is understandable that Figure 2 As shown, the two recesses 14 are staggered along the thickness direction of the circuit board 10 so that Figure 2The left recess 14 passes through the upper side of the substrate 11 and is connected to one of the conductive layers 12, but does not pass through the lower side of the substrate 11, and at the same time Figure 2 The recess 14 on the right passes through the lower side of the substrate 11 and is connected to another conductive layer 12, but does not pass through the upper side of the substrate 11, thereby ensuring that the recess 14 does not continuously penetrate the substrate 11 as a whole along the thickness direction of the circuit board 10, thereby achieving the purpose of saving copper materials and reducing the production cost of the circuit board 10, while ensuring that multiple local areas of the circuit board 10 have the ability to pass large currents, thereby ensuring the normal operation of multiple high-power devices arranged on the circuit board 10.

[0077] See also Figure 3 In some embodiments, the circuit board 10 includes multiple substrates 11 and multiple conductive layers 12, and the multiple conductive layers 12 and the multiple substrates 11 are alternately arranged in sequence along the thickness direction of the circuit board 10. One of the substrates 11 is provided with a recess 14 on the first side 101 along the thickness direction of the circuit board 10, and the other substrate 11 is provided with a recess 14 on the second side 102 along the thickness direction of the circuit board 10. The first side 101 and the second side 102 are two opposite sides along the thickness direction of the circuit board 10.

[0078] In this way, the two connection layers 13 fill and match the two recesses 14 respectively, thereby ensuring that the multilayer circuit board 10 has the ability to handle excessive current in two local areas, thereby ensuring the normal operation of multiple high-power devices.

[0079] Specifically, in one embodiment, multiple conductive layers 12 and multiple substrates 11 are alternately arranged in sequence along the thickness direction of the circuit board 10 to form a multi-layer "conductive layer-substrate-conductive layer" sandwich structure to meet the practical application of circuit boards 10 of different specifications or types.

[0080] For example, in one example, Figure 3 As shown, there can be three substrates 11 and four conductive layers 12, and the three substrates 11 and the four conductive layers 12 are alternately arranged in sequence along the thickness direction of the circuit board 10, so that each substrate 11 is covered with conductive layers 12 on both sides along the thickness direction of the circuit board 10 to form multiple conductive paths, thereby ensuring the normal operation of the circuit board 10.

[0081] In one embodiment, a recess 14 is provided on the first side surface 101 of one of the substrates 11 along the thickness direction of the circuit board 10 to ensure that the conductive layer 12 located on the first side surface 101 can be connected to one of the connecting layers 12, thereby ensuring that a conductive path is formed on the first side surface 101 of the circuit board 10.

[0082] Another substrate 11 is provided with a recess 14 on the second side surface 102 along the thickness direction of the circuit board 10 to ensure that the conductive layer 12 located on the second side surface 102 can be connected to another connecting layer 12, thereby ensuring that a conductive path is formed on the second side surface 102 of the circuit board 10.

[0083] That is, recesses 14 may be provided on two opposite sides along the thickness direction of the circuit board 10 to ensure that the two connecting layers 13 fill and match the two recesses 14 respectively, thereby ensuring that the multilayer circuit board 10 has the ability to carry excessive current in two local areas, thereby ensuring the normal operation of multiple high-power devices.

[0084] In one embodiment, if Figure 3 As shown, the first side surface 101 may be an upper side surface, the second side surface 102 may be a lower side surface, and the first side surface 101 and the second side surface 102 are respectively located on two substrates 11 and are disposed in a back-to-back staggered manner, so that the circuit board 10 works normally.

[0085] In another embodiment, the first side 101 may be the lower side, the second side 102 may be the upper side (not shown), and the first side 101 and the second side 102 are respectively located on two substrates 11 and are disposed back to back so that the circuit board 10 works normally.

[0086] In other embodiments, the first side 101 and the second side 102 may also be two opposite sides of two adjacent substrates 11, respectively, to ensure that the first side 101 and the second side 102 are arranged opposite to each other along the thickness direction of the circuit board 10, so that the multilayer circuit board 10 can have the ability to pass large current in multiple local areas, and no specific restrictions are made here.

[0087] In one embodiment, the two recesses 14 may also be disposed on the left and / or right sides of the plurality of substrates 11, or may be disposed at other positions, as long as the two connecting layers 13 after lamination are each connected to one of the conductive layers 12, without any specific limitation.

[0088] See also Figure 4 In some embodiments, the circuit board 10 includes a plurality of substrates 11 and a plurality of conductive layers 12, and the plurality of conductive layers 12 and the plurality of substrates 11 are alternately arranged in sequence along the thickness direction of the circuit board 10;

[0089] The multiple substrates 11 include a first substrate 111, a second substrate 112 and a third substrate 113. The first substrate 111, the second substrate 112 and the third substrate 113 are three substrates adjacent to each other in sequence along the thickness direction of the circuit board 10. The second substrate 112 is provided with a recess 14 on both side surfaces along the thickness direction of the circuit board 10. The first substrate 111 is provided with a first through hole 1111 along the thickness direction of the circuit board 10. The third substrate 113 is provided with a second through hole 1131 along the thickness direction of the circuit board 10. One of the connecting layers 13 passes through the first through hole 1111 and is partially located in one of the recesses 14. The other connecting layer 13 passes through the second through hole 1131 and is partially located in the other recess 14.

[0090] In this way, the two connection layers 13 fill and match the two recesses 14 respectively, thereby ensuring that the multilayer circuit board 10 has the ability to handle excessive current in four local areas, thereby ensuring the normal operation of multiple high-power devices.

[0091] Specifically, in one embodiment, Figure 4 As shown, the first substrate 111 can be an upper substrate, the second substrate 112 can be an intermediate substrate, and the third substrate 113 can be a lower substrate, so as to alternate with the multiple conductive layers 12 in sequence to form the circuit board 10, thereby ensuring that the circuit board 10 works normally.

[0092] In one embodiment, if Figure 4 As shown, the first through hole 1111 can be a square groove, which can penetrate the first substrate 111 along the thickness direction of the circuit board 10 and connect to the recess 14 located on the left side of the second substrate 112, so that a connecting layer 13 is pressed and connected to the first through hole 1111 and the recess 14 located on the left side of the second substrate 112, thereby ensuring that the connecting layer 13 forms a conductive path with the top two conductive layers 12.

[0093] Similarly, the second through hole 1131 can be a square groove, which can penetrate the third substrate 113 along the thickness direction of the circuit board 10 and connect to the recess 14 located on the right side of the second substrate 112, so that another connecting layer 13 is pressed and connected to the second through hole 1131 and the recess 14 located on the right side of the second substrate 112, thereby ensuring that the connecting layer 13 forms a conductive path with the two bottom conductive layers 12.

[0094] In one embodiment, the two recesses 14 may also be disposed on the left and / or right sides of the plurality of substrates 11, or may be disposed at other positions, as long as the two connecting layers 13 after lamination are each connected to one of the conductive layers 12, without any specific limitation.

[0095] In summary, the circuit board 10 can be filled and embedded in two recesses 14 staggered along the thickness direction of the circuit board 10 through two connecting layers 13 to reduce the space occupied by the connecting layer 13 on the circuit board 10. At the same time, the connecting layer 13 does not continuously penetrate the thickness direction of the circuit board 10 as a whole, reducing the material and cost of the connecting layer 13, thereby ensuring that the multi-layer circuit board 10 has the ability to carry excessive current in multiple local areas, thereby ensuring the normal operation of multiple high-power devices.

[0096] See also Figure 5 In some embodiments, the circuit board 10 includes a plurality of substrates 11 and a plurality of conductive layers 12, and the plurality of conductive layers 12 and the plurality of substrates 11 are alternately arranged in sequence along the thickness direction of the circuit board 10;

[0097] The multiple substrates 11 include a fourth substrate 114, a fifth substrate 115 and a sixth substrate 116. The fourth substrate 114, the fifth substrate 115 and the sixth substrate 116 are three substrates adjacent to each other in sequence along the thickness direction of the circuit board 10. A recess 14 is provided on a side of the sixth substrate 116 close to the fifth substrate 115, and a recess 14 is provided on a side of the fifth substrate 115 close to the sixth substrate 116. The two recesses 14 are staggered along the thickness direction of the circuit board 10. The fifth substrate 115 is also provided with a third through hole 1151 along the thickness direction of the circuit board 10, wherein one connecting layer 13 passes through the third through hole 1151 and is partially located in the recess 14 of the sixth substrate 116, and the other connecting layer 13 is located in the recess 14 of the fifth substrate 115.

[0098] In this way, the two connection layers 13 fill and match the two recesses 14 respectively, thereby ensuring that the multilayer circuit board 10 has the ability to handle excessive current in three local areas, thereby ensuring the normal operation of multiple high-power devices.

[0099] Specifically, in one embodiment, Figure 5 As shown, the fourth substrate 114 can be an upper substrate, the fifth substrate 115 can be an intermediate substrate and the sixth substrate 116 can be a lower substrate, so as to alternate with the multiple conductive layers 12 in sequence to form the circuit board 10, thereby ensuring that the circuit board 10 works normally.

[0100] In one embodiment, if Figure 5 As shown, the third through hole 1151 can be a square groove, which can penetrate the fifth substrate 115 along the thickness direction of the circuit board 10 and connect to the recess 14 located on the sixth substrate 116, so that a connecting layer 13 is pressed and connected to the third through hole 1151 and the recess 14 located on the sixth substrate 116, thereby ensuring that the connecting layer 13 forms a conductive path with the two middle conductive layers 12.

[0101] In one embodiment, the fifth substrate 115 may be provided with a recess 14 on the right side of the third through hole 1151, so that another connecting layer 13 is pressed and connected with the recess 14 located on the right side of the third through hole 1151, thereby ensuring that the connecting layer 13 forms a conductive path with the conductive layer 12 located between the fifth substrate 115 and the sixth substrate 116.

[0102] In one embodiment, the two recesses 14 and the third through hole 1151 can also be arranged on the left side and / or right side of the multiple substrates 11, or can be arranged at other positions. It only needs to ensure that the two connecting layers 13 after pressing are each connected to the conductive layer 12 to form a conductive path, and no specific limitation is made here.

[0103] In summary, the circuit board 10 can be filled and embedded in the recess 14 located on the right side of the third through hole 1151 and the recess 14 and the third through hole 1151 located on the sixth substrate 116 through two connecting layers 13, respectively, so as to reduce the space occupied by the connecting layer 13 on the circuit board 10. At the same time, the connecting layer 13 does not continuously penetrate the thickness direction of the circuit board 10 as a whole, thereby reducing the material and cost of the connecting layer 13, thereby ensuring that the multi-layer circuit board 10 has the ability to carry excessive current in multiple local areas, thereby ensuring the normal operation of multiple high-power devices.

[0104] It is worth mentioning that Figure 5 The fifth substrate 115 and the sixth substrate 116 can first be milled with slots, and then the two connecting layers 13 are placed in position respectively, and then the fifth substrate 115 is pressed downward and the sixth substrate 116 is pressed upward, so that the two connecting layers 13 are clamped in the middle part of the circuit board 10, thereby ensuring that the multi-layer circuit board 10 has the ability to carry excessive current in multiple local areas.

[0105] See also Figure 6 In some embodiments, the circuit board 10 includes a plurality of substrates 11 and a plurality of conductive layers 12, and the plurality of conductive layers 12 and the plurality of substrates 11 are alternately arranged in sequence along the thickness direction of the circuit board 10;

[0106] The multiple substrates 11 include a seventh substrate 117, an eighth substrate 118 and a ninth substrate 119. The seventh substrate 117, the eighth substrate 118 and the ninth substrate 119 are three substrates adjacent to each other in sequence along the thickness direction of the circuit board 10. The eighth substrate 118 is provided with a fourth through hole 1181 along the thickness direction of the circuit board 10. A first recess 141 is provided on a side of the seventh substrate 117 close to the eighth substrate 118. A second recess 142 is provided on a side of the ninth substrate 119 close to the eighth substrate 118. One of the connecting layers 13 passes through the fourth through hole 1181 and is partially located in the first recess 141 and the second recess 142, respectively. A third recess 143 is provided on a side of the eighth substrate 118 close to the ninth substrate 119. A fourth recess 144 is also provided on a side of the ninth substrate 119 close to the eighth substrate 118. The third recess 143 and the fourth recess 144 are correspondingly arranged along the thickness direction of the circuit board 10. Another connecting layer 13 is located in the third recess 143 and the fourth recess 144.

[0107] In this way, the two connection layers 13 are respectively filled with matching multiple recesses 14, thereby ensuring that the multilayer circuit board 10 has the ability to handle excessive current in three local areas, thereby ensuring the normal operation of multiple high-power devices.

[0108] Specifically, in one embodiment, Figure 6 As shown, the seventh substrate 117 can be an upper substrate, the eighth substrate 118 can be an intermediate substrate and the ninth substrate 119 can be a lower substrate, so as to alternate with multiple conductive layers 12 in sequence to form a circuit board 10, thereby ensuring that the circuit board 10 works normally.

[0109] In one embodiment, if Figure 6 As shown, the fourth through hole 1181 can be a square groove, which can penetrate the eighth substrate 118 along the thickness direction of the circuit board 10 and connect the first recess 141 located on the seventh substrate 117 and the second recess 142 located on the left side of the ninth substrate 119, so that one of the connecting layers 13 is pressed together to connect the first recess 141, the fourth through hole 1181 and the second recess 142, thereby ensuring that one of the connecting layers 13 forms a conductive path with the two middle conductive layers 12.

[0110] In one embodiment, the eighth substrate 118 may be provided with a third recess 143 on the right side of the fourth through hole 1181, and the ninth substrate 119 may be provided with a fourth recess 144 on the right side of the second recess 142, and the third recess 143 and the fourth recess 144 are arranged relatively connected along the same conductive layer 12, so that another connecting layer 13 is crimped in the third recess 143 and the fourth recess 144, thereby ensuring that another connecting layer 13 forms a conductive path with the conductive layer 12 located between the eighth substrate 118 and the ninth substrate 119.

[0111] In one embodiment, multiple recesses 14 and third through holes 1151 can also be arranged on the left side and / or right side of the multiple substrates 11, or can be arranged at other positions. It only needs to ensure that the two connecting layers 13 after pressing are each connected to the conductive layer 12 to form a conductive path, and no specific limitation is made here.

[0112] In summary, the circuit board 10 can be filled and embedded in the first recess 141, the fourth through hole 1181, the second recess 142, and the third recess 143 and the fourth recess 144 which are staggered along the thickness direction of the circuit board 10 through two connecting layers 13, so as to reduce the space occupied by the connecting layer 13 on the circuit board 10. At the same time, the connecting layer 13 does not continuously penetrate the thickness direction of the circuit board 10 as a whole, thereby reducing the material and cost of the connecting layer 13, thereby ensuring that the multi-layer circuit board 10 has the ability to carry excessive current in multiple local areas, thereby ensuring the normal operation of multiple high-power devices.

[0113] It is worth mentioning that Figure 6 The seventh substrate 117, the eighth substrate 118 and the ninth substrate 119 can first be milled with slots, and then the two connecting layers 13 are respectively placed in position, and then the three substrates 11 are pressed together toward the middle, so that the two connecting layers 13 are clamped in the middle slot of the circuit board 10, thereby ensuring that the multi-layer circuit board 10 has the ability to carry excessive current in multiple local areas.

[0114] See also Figures 7 to 9 In some embodiments, the recess 14 extends to the side of the substrate 11 along a direction perpendicular to the thickness direction of the circuit board 10 , and the connecting layer 13 includes a portion protruding from the side of the substrate 11 along a direction perpendicular to the thickness direction of the circuit board 10 .

[0115] In this way, while ensuring that the thickness of the circuit board 10 does not increase, the connection layer 13 is embedded on the side of the circuit board 10 to reduce the local resistance of the circuit board 10, thereby improving the ability of the circuit board 10 to pass large currents.

[0116] Specifically, in one embodiment, the connecting layer 13 can be square, U-shaped, or other shapes, and can be inserted and fixed in the recesses 14 opened on the left and / or right sides of the multiple substrates 11 by pressing, thereby ensuring that the connecting layer 13 is connected to the conductive layer 12 to form a conductive path, thereby ensuring that the circuit board 10 has the ability to conduct excessive current.

[0117] In one embodiment, if Figures 7 to 9 As shown, the connection layer 13 is arranged on the right side of the plurality of substrates 11 in a direction perpendicular to the thickness direction of the circuit board 10, which can ensure that the thickness of the circuit board 10 remains unchanged, that is, without increasing the cost of the circuit board 10, by embedding the connection layer 13 on the side of the circuit board 10 to reduce the resistance, thereby improving the circuit board 10's ability to carry excessive current.

[0118] In another embodiment, the connecting layer 13 is arranged on the left side of the plurality of substrates 11 in a direction perpendicular to the thickness direction of the circuit board 10 (not shown), so as to ensure that the thickness of the circuit board 10 remains unchanged, that is, without increasing the cost of the circuit board 10, by embedding the connecting layer 13 on the side of the circuit board 10 to reduce the resistance, the ability of the circuit board 10 to carry excessive current is improved.

[0119] See also Figure 7 In some embodiments, the circuit board 10 includes a plurality of substrates 11 and a plurality of conductive layers 12, and the plurality of conductive layers 12 and the plurality of substrates 11 are alternately arranged in sequence along the thickness direction of the circuit board 10;

[0120] The multiple substrates 11 include a tenth substrate 120, an eleventh substrate 121 and a twelfth substrate 122. The tenth substrate 120, the eleventh substrate 121 and the twelfth substrate 122 are three substrates adjacent to each other in sequence along the thickness direction of the circuit board 10. A side surface of the tenth substrate 120 close to the eleventh substrate 121 is provided with a recess 14 extending to the side surface of the tenth substrate 120 in a direction perpendicular to the thickness direction of the circuit board 10. A side surface of the twelfth substrate 122 close to the eleventh substrate 121 is provided with a recess 14 extending to the side surface of the twelfth substrate 122 in a direction perpendicular to the thickness direction of the circuit board 10. A side surface of the eleventh substrate 121 is provided with a notch 1211 extending along the thickness direction of the circuit board 10. The connecting layer 13 is at least partially located in the notch 1211 and the two recesses 14.

[0121] In this way, a connection layer 13 fills the matching gap 1211 and the plurality of recesses 14, thereby ensuring that the multilayer circuit board 10 has the ability to handle excessive current in two local areas, thereby ensuring the normal operation of a plurality of high-power devices.

[0122] Specifically, in one embodiment, Figure 7 As shown, the tenth substrate 120 can be an upper substrate, the eleventh substrate 121 can be an intermediate substrate and the twelfth substrate 122 can be a lower substrate, so as to alternate with the multiple conductive layers 12 in sequence to form the circuit board 10, thereby ensuring that the circuit board 10 works normally.

[0123] In one embodiment, the notch 1211 may be a slot hole penetrating the eleventh substrate 121 and extending to the side of the eleventh substrate 121 . The notch 1211 may be a square slot hole and may be used to connect and fix the connection layer 13 to ensure the normal operation of the circuit board 10 .

[0124] In one embodiment, if Figure 7As shown, the notch 1211 connects a recess 14 located on the lower side of the tenth substrate 120 and another recess 14 located on the upper side of the twelfth substrate 122, so that the connecting layer 13 can be pressed into the notch 1211 and the two recesses 14 from right to left, thereby ensuring that the connecting layer 13 forms a conductive path with the two middle conductive layers 12.

[0125] In another embodiment, the notch 1211, a recess 14 located on the lower side of the tenth substrate 120, and another recess 14 located on the upper side of the twelfth substrate 122 may also be arranged on the left side of the multiple substrates 11 (not shown in the figure), and the notch 1211 and the two recesses 14 are aligned and connected, so that the connecting layer 13 can be pressed into the notch 1211 and the two recesses 14 from left to right, thereby ensuring that the connecting layer 13 forms a conductive path with the two middle conductive layers 12, and no specific limitation is made here.

[0126] In summary, the circuit board 10 can be filled and embedded in the gap 1211 and the two recesses 14 extending to the side of the substrate 11 in the direction perpendicular to the thickness direction of the circuit board 10 through the connecting layer 13 to reduce the space occupied by the connecting layer 13 on the circuit board 10. At the same time, the connecting layer 13 does not continuously penetrate the thickness direction of the circuit board 10 as a whole, reducing the material and cost of the connecting layer 13, thereby ensuring that the multi-layer circuit board 10 has the ability to carry excessive current in multiple local areas, thereby ensuring the normal operation of multiple high-power devices.

[0127] In other embodiments, the connecting layer 13 may also be crimped accordingly according to different settings of the recess 14 and / or the notch 1211 so that the connecting layer 13 is connected to the conductive layer 12 to form a conductive path, thereby ensuring that the circuit board 10 has the ability to pass large currents, and no specific limitations are made here.

[0128] See also Figure 8 In some embodiments, the circuit board 10 includes a plurality of substrates 11 and a plurality of conductive layers 12, and the plurality of conductive layers 12 and the plurality of substrates 11 are alternately arranged in sequence along the thickness direction of the circuit board 10;

[0129] The multiple substrates 11 include a thirteenth substrate 123, a fourteenth substrate 124 and a fifteenth substrate 125. The thirteenth substrate 123, the fourteenth substrate 124 and the fifteenth substrate 125 are three substrates adjacent to each other in sequence along the thickness direction of the circuit board 10. The side of the thirteenth substrate 123 facing away from the fourteenth substrate 124 is provided with a recess 14 extending to the side of the thirteenth substrate 123 in a direction perpendicular to the thickness direction of the circuit board 10. The side of the fifteenth substrate 125 facing away from the fourteenth substrate 124 is provided with a recess 14 extending to the side of the fifteenth substrate 125 in a direction perpendicular to the thickness direction of the circuit board 10. The connecting layer 13 includes a connecting portion 131 and two end portions 132. The connecting portion 131 connects the two end portions 132. The two end portions 132 are respectively at least partially located in the two recesses 14. The connecting portion 131 is protrudingly arranged on the side of the substrate 11.

[0130] In this way, one connection layer 13 fills and matches two recesses 14, thereby ensuring that the multilayer circuit board 10 has the ability to handle excessive current in four local areas, thereby ensuring the normal operation of multiple high-power devices.

[0131] Specifically, in one embodiment, Figure 8 As shown, the thirteenth substrate 123 can be an upper substrate, the fourteenth substrate 124 can be an intermediate substrate and the fifteenth substrate 125 can be a lower substrate, so as to alternate with the multiple conductive layers 12 in sequence to form the circuit board 10, thereby ensuring the normal operation of the circuit board 10.

[0132] In one embodiment, the connecting layer 13 may include a connecting portion 131 and two ends 132, that is, the connecting layer 13 may be U-shaped, so that the connecting portion 131 stably connects the two ends 132, thereby ensuring that the connecting layer 13 is stably crimped in the recess 14, thereby ensuring the normal operation of the circuit board 10.

[0133] In one embodiment, if Figure 8 As shown, a recess 14 is formed on the upper side of the thirteenth substrate 123, and another recess 14 is formed on the lower side of the fifteenth substrate 125, and the two recesses 14 are located on the right side of the multiple substrates 11, so that the U-shaped connecting layer 13 can be pressed into the two recesses 14 from right to left, thereby ensuring that the U-shaped connecting layer 13 forms a conductive path with the two conductive layers 12 on opposite sides along the thickness direction of the circuit board 10.

[0134] In another embodiment, a recess 14 is formed on the upper side of the thirteenth substrate 123, and another recess 14 is formed on the lower side of the fifteenth substrate 125, and the two recesses 14 are located on the left side of the multiple substrates 11 (not shown in the figure), so that the U-shaped connecting layer 13 can be pressed into the two recesses 14 from left to right, thereby ensuring that the U-shaped connecting layer 13 forms a conductive path with the two conductive layers 12 on opposite sides along the thickness direction of the circuit board 10.

[0135] In other embodiments, the two recesses 14 may be respectively arranged on the upper side of the thirteenth substrate 123 and the lower side of the fourteenth substrate 124 (not shown), or may be respectively arranged on the upper side of the fourteenth substrate 124 and the lower side of the fifteenth substrate 125 (not shown), and the two recesses 14 may be located on the left side of the multiple substrates 11, or on the right side of the multiple substrates 11, or may be respectively arranged at other positions of the multiple substrates 11, so that the U-shaped connecting layer 13 is crimped into the two recesses 14 from the left side, the right side or other positions, so that the connecting layer 13 and the conductive layer 12 form a conductive circuit.

[0136] In summary, the circuit board 10 can be filled and embedded in the two recesses 14 extending to the side of the substrate 11 in the direction perpendicular to the thickness direction of the circuit board 10 through the connecting layer 13 to reduce the space occupied by the connecting layer 13 on the circuit board 10. At the same time, the connecting layer 13 does not continuously penetrate the thickness direction of the circuit board 10 as a whole, reducing the material and cost of the connecting layer 13, thereby ensuring that the multi-layer circuit board 10 has the ability to carry excessive current in multiple local areas, thereby ensuring the normal operation of multiple high-power devices.

[0137] See also Fig. 9 In some embodiments, the circuit board 10 includes a plurality of substrates 11 and a plurality of conductive layers 12, and the plurality of conductive layers 12 and the plurality of substrates 11 are alternately arranged in sequence along the thickness direction of the circuit board 10;

[0138] The multiple substrates 11 include a sixteenth substrate 126, a seventeenth substrate 127 and an eighteenth substrate 128. The sixteenth substrate 126, the seventeenth substrate 127 and the eighteenth substrate 128 are three substrates adjacent to each other in sequence along the thickness direction of the circuit board 10. The side of the sixteenth substrate 126 facing away from the seventeenth substrate 127 is provided with a recess 14 extending to the side of the sixteenth substrate 126 in a direction perpendicular to the thickness direction of the circuit board 10, and one of the connecting layers 13 is at least partially located in the recess 14. The side of the seventeenth substrate 127 facing away from the sixteenth substrate 126 is provided with a recess 14 extending to the side of the seventeenth substrate 127 in a direction perpendicular to the thickness direction of the circuit board 10, and the side of the eighteenth substrate 128 close to the seventeenth substrate 127 is provided with a recess 14 extending to the side of the eighteenth substrate 128 in a direction perpendicular to the thickness direction of the circuit board 10, and the other connecting layer 13 is at least partially located in the two recesses 14.

[0139] In this way, the two connection layers 13 are respectively filled with matching multiple recesses 14, thereby ensuring that the multilayer circuit board 10 has the ability to handle excessive current in two local areas, thereby ensuring the normal operation of multiple high-power devices.

[0140] Specifically, in one embodiment, Fig. 9As shown, the sixteenth substrate 126 can be an upper substrate, the seventeenth substrate 127 can be an intermediate substrate and the eighteenth substrate 128 can be a lower substrate, so as to alternate with the multiple conductive layers 12 in sequence to form the circuit board 10, thereby ensuring the normal operation of the circuit board 10.

[0141] In one embodiment, the connection layers 13 may be two and square in shape, and may be used to press at least two recesses 14 respectively, thereby ensuring that the two connection layers 13 are stably pressed in at least two recesses 14, thereby ensuring that the circuit board 10 works normally.

[0142] In one embodiment, if Fig. 9 As shown, a recess 14 is formed on the upper side of the sixteenth substrate 126 and the recess 14 is located on the right side of the multiple substrates 11. One of the connecting layers 13 can be pressed into the recess 14 from right to left, thereby ensuring that one of the connecting layers 13 forms a conductive path with the top conductive layer 12.

[0143] In addition, another recess 14 is formed on the lower side of the seventeenth substrate 127, and another recess 14 is formed on the upper side of the eighteenth substrate 128, and the two recesses 14 located in the seventeenth substrate 127 and the eighteenth substrate 128 are aligned and connected, and the two recesses 14 are located on the right side of the multiple substrates 11, so that another connecting layer 13 can be pressed into the two recesses 14 from right to left, thereby ensuring that another connecting layer 13 forms a conductive path with the conductive layer 12 located between the seventeenth substrate 127 and the eighteenth substrate 128.

[0144] In another embodiment, the plurality of recesses 14 may all be located on the left side of the plurality of substrates 11 (not shown), so that the two connecting layers 13 may be pressed into the plurality of recesses 14 from left to right, thereby ensuring that the two connecting layers 13 form conductive paths with different conductive layers 12 respectively.

[0145] In other embodiments, the plurality of recesses 14 may also be respectively arranged on the left and right sides of the plurality of substrates 11 (not shown), so that the two connecting layers 13 are pressed into the plurality of recesses 14 from different directions, thereby ensuring that the two connecting layers 13 form conductive paths with different conductive layers 12, respectively. No specific limitation is made here.

[0146] In summary, the circuit board 10 can be filled and embedded in multiple recesses 14 extending to the side of the substrate 11 in a direction perpendicular to the thickness direction of the circuit board 10 through two connecting layers 13, so as to reduce the space occupied by the two connecting layers 13 on the circuit board 10. At the same time, the two connecting layers 13 do not continuously penetrate the thickness direction of the circuit board 10 as a whole, thereby reducing the material and cost of the connecting layers 13, thereby ensuring that the multi-layer circuit board 10 has the ability to carry excessive current in multiple local areas, thereby ensuring the normal operation of multiple high-power devices.

[0147] See also Figure 1 In some embodiments, the circuit board 10 further includes a protective layer 15 and a silk screen layer 16 , wherein the protective layer 15 is covered on the side of the conductive layer 12 closest to the outside of the circuit board 10 and facing away from the substrate 11 , and the silk screen layer 16 is covered on the outer side of the protective layer 15 .

[0148] In this way, the conductive layer 12 is insulated from the external environment, thereby ensuring the safe operation of the circuit board 10 and reducing safety risks.

[0149] Specifically, in one embodiment, Figure 1 As shown, the protective layer 15 can be an ink layer, which can be printed on the side of the conductive layer 12 facing away from the substrate 11 to play the role of insulating and protecting the circuit board 10, thereby reducing the leakage, short circuit and other accidents caused by the exposed conductive layer 12.

[0150] In one embodiment, if Figure 1 As shown, when the conductive layer 12 is disposed on the upper side of the substrate 11, an ink layer can be printed on the upper side of the conductive layer 12 to ensure that the conductive layer 12 is insulated from the outside and transmits electricity safely, so that the circuit board 10 can work safely.

[0151] In another embodiment, when the conductive layer 12 is disposed on the lower side of the substrate 11 (not shown), an ink layer can be printed on the lower side of the conductive layer 12 to ensure that the conductive layer 12 is insulated from the outside and transmits electricity safely, thereby allowing the circuit board 10 to operate safely.

[0152] In yet another embodiment, Figure 2 As shown, when the conductive layers 12 are arranged on two opposite sides of the substrate 11, an ink layer can be printed on the upper side of the relatively higher conductive layer 12, and at the same time, an ink layer can be printed on the lower side of the relatively upper conductive layer 12 to ensure that the multiple conductive layers 12 are insulated from the outside and transmit electricity safely, so that the circuit board 10 can work safely.

[0153] In another embodiment, the protective layer 15 may also be a window layer, which can be used to free up free space to fix the electronic components, thereby ensuring that the electronic components are stably located on the substrate 11 and connected to the conductive layer 12, thereby ensuring the normal operation of the electronic components.

[0154] In one embodiment, the silk-screen layer 16 may be words or logos printed on the outside of the protective layer 15 , and may be used to beautify the appearance of the circuit board 10 or identify electronic components, etc., and no specific limitation is made herein.

[0155] The embodiment of the utility model provides an electronic device, which includes a circuit board 10 according to any one of the above embodiments.

[0156] The above-mentioned electronic device, by setting a connecting layer 13 connected to the conductive layer 12 on the circuit board 10, and the connecting layer 13 is at least partially embedded in the recess 14, so that the connection area between the connecting layer 13 and the substrate 11 is increased, thereby improving the connection strength between the connecting layer 13 and the substrate 11, reducing the probability of the connecting layer 13 falling off or avoiding the connecting layer 13 from falling off, thereby reducing after-sales costs.

[0157] It should be noted that the above explanations of the implementation and beneficial effects of the circuit board 10 are also applicable to the electronic device of the implementation of the utility model, and will not be repeated here to avoid redundancy.

[0158] Specifically, in one embodiment, the electronic device includes but is not limited to high-power devices such as energy storage power supplies, refrigerators, air conditioners, washing machines, or battery swap stations, and the normal operation of the electronic device is ensured while improving the overcurrent capability of the circuit board 10.

[0159] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0160] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A circuit board, characterized in that: include: At least one substrate, at least one side surface of at least one substrate along the thickness direction of the circuit board is provided with at least one recess, and the recess does not penetrate the other side surface of the circuit board along the thickness direction; At least one conductive layer, at least one of the conductive layers is coated on at least one side of the substrate along the thickness direction of the circuit board; At least one connecting layer is provided, the connecting layer is connected to the conductive layer, and the connecting layer is at least partially embedded in the recess.

2. The circuit board according to claim 1, characterized in that: The recess is formed by a milling process, and the connection layer matches the recess in shape.

3. The circuit board according to claim 1, characterized in that: The substrate is provided with a recess on one side along the thickness direction of the circuit board, the conductive layer is covered on the side of the substrate provided with the recess, and the connecting layer is located in the recess and connected to the conductive layer.

4. The circuit board according to claim 1, characterized in that: The circuit board includes a substrate and two conductive layers, the two conductive layers are respectively covered on two opposite side surfaces of the substrate along the thickness direction of the circuit board, and two recesses are respectively provided on two side surfaces of the substrate along the thickness direction of the circuit board, and the two recesses are staggered along the thickness direction of the circuit board.

5. The circuit board according to claim 1, characterized in that: The circuit board includes a plurality of substrates and a plurality of conductive layers, wherein the plurality of conductive layers and the plurality of substrates are alternately arranged in sequence along the thickness direction of the circuit board, wherein one of the substrates is provided with the recess on a first side surface along the thickness direction of the circuit board, and another substrate is provided with the recess on a second side surface along the thickness direction of the circuit board, and the first side surface and the second side surface are two opposite sides along the thickness direction of the circuit board.

6. The circuit board according to claim 1, characterized in that: The circuit board comprises a plurality of substrates and a plurality of conductive layers, wherein the plurality of conductive layers and the plurality of substrates are alternately arranged in sequence along the thickness direction of the circuit board; The multiple substrates include a first substrate, a second substrate and a third substrate, wherein the first substrate, the second substrate and the third substrate are three substrates adjacent to each other in sequence along the thickness direction of the circuit board, the second substrate is provided with a recess on each of the two side surfaces along the thickness direction of the circuit board, the first substrate is provided with a first through hole along the thickness direction of the circuit board, the third substrate is provided with a second through hole along the thickness direction of the circuit board, one of the connecting layers passes through the first through hole and is partially located in one of the recesses, and another of the connecting layers passes through the second through hole and is partially located in another of the recesses.

7. The circuit board according to claim 1, characterized in that: The circuit board comprises a plurality of substrates and a plurality of conductive layers, wherein the plurality of conductive layers and the plurality of substrates are alternately arranged in sequence along the thickness direction of the circuit board; The multiple substrates include a fifth substrate and a sixth substrate, the fifth substrate and the sixth substrate are two substrates adjacent to each other in sequence along the thickness direction of the circuit board, the sixth substrate is provided with a recess on a side close to the fifth substrate, and the fifth substrate is provided with a recess on a side close to the sixth substrate, the two recesses are staggered along the thickness direction of the circuit board, the fifth substrate is also provided with a third through hole along the thickness direction of the circuit board, one of the connection layers passes through the third through hole and is partially located in the recess of the sixth substrate, and the other connection layer is located in the recess of the fifth substrate.

8. The circuit board according to claim 1, characterized in that: The circuit board comprises a plurality of substrates and a plurality of conductive layers, wherein the plurality of conductive layers and the plurality of substrates are alternately arranged in sequence along the thickness direction of the circuit board; The multiple substrates include a seventh substrate, an eighth substrate and a ninth substrate, the seventh substrate, the eighth substrate and the ninth substrate are three substrates adjacent to each other in sequence along the thickness direction of the circuit board, the eighth substrate is provided with a fourth through hole along the thickness direction of the circuit board, a side of the seventh substrate close to the eighth substrate is provided with a first recess, a side of the ninth substrate close to the eighth substrate is provided with a second recess, one of the connecting layers passes through the fourth through hole and is partially located in the first recess and the second recess respectively, a side of the eighth substrate close to the ninth substrate is provided with a third recess, a side of the ninth substrate close to the eighth substrate is also provided with a fourth recess, the third recess and the fourth recess are correspondingly arranged along the thickness direction of the circuit board, and another connecting layer is located in the third recess and the fourth recess.

9. The circuit board according to claim 1, characterized in that: The recess extends to the side surface of the substrate along a direction perpendicular to the thickness direction of the circuit board, and the connection layer includes a portion protruding from the side surface of the substrate along a direction perpendicular to the thickness direction of the circuit board.

10. The circuit board according to claim 1, characterized in that: The circuit board comprises a protective layer and a silk-screen layer. The protective layer is covered on a side of the conductive layer closest to the outside of the circuit board and facing away from the substrate, and the silk-screen layer is covered on an outer side of the protective layer.

11. An electronic device, characterized in that: A circuit board comprising any one of claims 1-10.

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