Chip deformation prevention tool
By designing anti-chip deformation tools, using the support surface set by the step and pressing to press and limit the chip, the problem of thermal deformation of the chip during heating is solved, and the stability and effect of welding are achieved.
Patent Information
- Application Number
- CN202420599170.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-26
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2034-03-26
AI Technical Summary
There is a problem of thermal deformation during the heating process of the chip, resulting in abnormal soldering.
A chip deformation tool is designed, including a first side plate and a second side plate. The bottom surfaces of both side plates have a step-stage support surface and a pressing surface, and the height difference is matched with the height of the chip on the PCB board. The tool presses and limits the chip through the support surface and presses to avoid thermal deformation.
Effectively reduce the physical amount of thermal deformation of the chip when heating, avoid soldering abnormalities, ensure soldering effect, and do not affect the solder space between the chip and the PCB board.
Smart Images
Figure CN222674620U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip technology, in particular to a tool for preventing chip deformation. Background Art
[0002] Currently, when heating chips in an SMT reflow oven or soldering station, most chip packaging materials have thermal deformation problems during the heating process, and the thermal deformation problem cannot be avoided by adjusting conventional heating temperature parameters. When the thermal deformation of the chip exceeds a certain limit value, it will cause abnormal chip welding problems.
[0003] Therefore, it is necessary to design a tool that can reduce the physical amount of thermal deformation of the chip under conventional heating parameters. Utility Model Content
[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defect of the prior art that the chip has the problem of thermal deformation when heated, thereby providing a tool to prevent chip deformation.
[0005] In order to solve the above technical problems, the utility model provides a chip deformation prevention tool, comprising:
[0006] A first side plate, wherein the bottom surface has a first supporting surface and a first pressing surface, the first supporting surface and the first pressing surface are arranged in a stepped manner, the first supporting surface is located outside the first pressing surface and is lower than the first pressing surface, and the height difference between the first supporting surface and the first pressing surface matches the height of the chip on the PCB;
[0007] A second side plate is symmetrically arranged with the first side plate, the bottom surface of the second side plate has a second supporting surface and a second pressing surface, the second supporting surface and the second pressing surface are arranged in a stepped manner, the second supporting surface is located outside the second pressing surface and is lower than the second pressing surface, and the height difference between the second supporting surface and the second pressing surface matches the height of the chip on the PCB board; the first supporting surface is flush with the second supporting surface, and the first pressing surface is flush with the second pressing surface;
[0008] A connecting plate is connected to the top of the first side plate and the second side plate.
[0009] Optionally, a heat conduction cavity is formed between the connecting plate and the first side plate and the second side plate.
[0010] Optionally, a heat conduction hole is provided on the connecting plate.
[0011] Optionally, there are a plurality of heat conducting holes which are symmetrically arranged.
[0012] Optionally, an inner side surface of the bottom of the first side plate has a first heat conduction groove.
[0013] Optionally, the inner side surface of the bottom of the second side plate has a second heat conduction groove.
[0014] Optionally, a first avoidance groove is provided on the outer side surface of the bottom of the first side plate.
[0015] Optionally, a second avoidance groove is provided on the outer side surface of the bottom of the second side plate.
[0016] Optionally, two symmetrical sides of the connecting plate are respectively provided with a pick-up and placement handle.
[0017] Optionally, two symmetrical sides of the connecting plate are respectively provided with balancing wings.
[0018] The technical solution of the utility model has the following advantages:
[0019] 1. The chip deformation prevention tool provided by the utility model, when in use, is pressed on the PCB board on both sides of the chip through the first supporting surface and the second supporting surface, and the first pressing surface and the second pressing surface located inside the first supporting surface and the second supporting surface cover the upper surface of the two symmetrical sides of the chip, so that when the chip is heated and soldered, the chip can be prevented from being deformed and warped due to heat through the restriction of the first pressing surface and the second pressing surface. When in use, after placing the chip on the PCB board, the first supporting surface and the second supporting surface of the chip deformation prevention tool are pressed on the PCB board, so that the chip is located below the first pressing surface and the second pressing surface of the chip deformation prevention tool, because the height difference between the first supporting surface and the first pressing surface, and the height difference between the second supporting surface and the second pressing surface, are matched with the height of the chip on the PCB board, therefore, when the chip is not deformed due to heat, the chip deformation prevention tool will not generate pressure on the chip, nor will it affect the solder space between the chip and the PCB board, so that the welding effect can be guaranteed.
[0020] 2. The anti-chip deformation tool provided by the utility model has a heat-conducting cavity formed between the connecting plate and the first side plate and the second side plate, which can facilitate the entry of hot air, so that the top of the chip can be well heated; further, the setting of the heat-conducting holes on the connecting plate can facilitate hot air to reach the top of the chip from the heat-conducting holes, thereby not affecting the heating of the chip.
[0021] 3. The chip deformation prevention tool provided by the present invention has heat conduction grooves on the first side plate and the second side plate, which can facilitate hot air to reach the welding area above the chip edge from the heat conduction grooves, thereby not affecting the heating and welding of the chip edge. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0023] Figure 1 A three-dimensional diagram of a specific implementation of a chip deformation prevention tool provided in an embodiment of the utility model;
[0024] Figure 2 for Figure 1 A three-dimensional image of the anti-chip deformation tool from an upward angle;
[0025] Figure 3 A three-dimensional diagram of a second specific implementation of the chip deformation prevention tool provided in an embodiment of the utility model;
[0026] Figure 4 for Figure 3 A three-dimensional image of the anti-chip deformation tool from an upward angle;
[0027] Figure 5 A three-dimensional diagram of a third specific implementation of the chip deformation prevention tool provided in the embodiment of the utility model;
[0028] Figure 6 A three-dimensional diagram of a fourth specific implementation of the chip deformation prevention tool provided in the embodiment of the present utility model;
[0029] Figure 7 A three-dimensional diagram of a fifth specific implementation of the chip deformation prevention tool provided in an embodiment of the present utility model when in use;
[0030] Figure 8 for Figure 7 main view.
[0031] Description of reference numerals:
[0032] 1. First side panel; 2. Second side panel; 3. Connecting plate; 4. First supporting surface; 5. First pressing surface; 6. Second supporting surface; 7. Second pressing surface; 8. Heat conducting hole; 9. First heat conducting groove; 10. Second heat conducting groove; 11. First avoidance groove; 12. Second avoidance groove; 13. Pick-up and drop handle; 14. Balance wing; 15. Chip; 16. PCB board. DETAILED DESCRIPTION
[0033] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0034] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.
[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0036] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0037] like Figure 1 , Figure 2As shown, a specific implementation of the chip deformation prevention tool provided in this embodiment includes: a first side plate 1, a second side plate 2 and a connecting plate 3, the bottom surface of the first side plate 1 has a first supporting surface 4 and a first pressing surface 5, the first supporting surface 4 and the first pressing surface 5 are arranged in a stepped manner, the first supporting surface 4 is located outside the first pressing surface 5 and is lower than the first pressing surface 5, and the height difference between the first supporting surface 4 and the first pressing surface 5 matches the height of the chip 15 on the PCB board; that is, after the chip 15 is arranged on the PCB board and a solder space is arranged between the chip 15 and the PCB board, the height of the chip 15 should be equal to the height difference between the first supporting surface 4 and the first pressing surface 5. Of course, considering the manufacturing error, the height difference between the first supporting surface 4 and the first pressing surface 5 and the height of the above-mentioned chip 15 can have an error of ±0.1mm. The second side plate 2 is symmetrically arranged with the first side plate 1. The bottom surface of the second side plate 2 has a second supporting surface 6 and a second pressing surface 7. The second supporting surface 6 and the second pressing surface 7 are arranged in a stepped manner. The second supporting surface 6 is located outside the second pressing surface 7 and is lower than the second pressing surface 7. The height difference between the second supporting surface 6 and the second pressing surface 7 matches the height of the chip 15 on the PCB board; that is, after the chip 15 is arranged on the PCB board and a solder space is arranged between the chip 15 and the PCB board, the height of the chip 15 should be equal to the height difference between the second supporting surface 6 and the second pressing surface 7. Of course, considering the manufacturing error, the height difference between the second supporting surface 6 and the second pressing surface 7 and the height of the above-mentioned chip 15 may have an error of ±0.1mm. The first supporting surface 4 is flush with the second supporting surface 6, and the first pressing surface 5 is flush with the second pressing surface 7; the connecting plate 3 is connected to the top of the first side plate 1 and the second side plate 2 so that the chip deformation prevention tool forms a whole. When in use, the first supporting surface 4 and the second supporting surface 6 are pressed on the PCB board 16 on both sides of the chip 15 , and the first pressing surface 5 and the second pressing surface 7 are symmetrically pressed on the upper surfaces of the two symmetrical sides of the chip 15 .
[0038] When the chip is hot-pressed and welded, the chip can be prevented from being deformed when heated by limiting the first pressing surface 5 and the second pressing surface 7. In addition, since the height difference between the first supporting surface and the second supporting surface and the first pressing surface and the second pressing surface, respectively, matches the height of the chip on the PCB board, after the chip deformation prevention tool is set on the PCB board, before the chip is deformed by heat, the first pressing surface and the second pressing surface do not exert pressure on the chip, thereby not affecting the solder space between the chip and the PCB board, thereby ensuring the welding effect.
[0039] like Figure 1 , Figure 2As shown, in this embodiment, a heat-conducting cavity is formed between the connecting plate 3 and the first side plate 1 and the second side plate 2, so that hot air can heat the top surface of the chip 15 and prevent the anti-chip deformation tool from affecting the heating and welding quality of the chip 15.
[0040] like Figure 1 , Figure 2 As shown, in this embodiment, the connecting plate 3 is provided with a heat conducting hole 8. The heat conducting hole 8 facilitates hot air to enter the area between the connecting plate 3 and the chip 15 from the area directly above the connecting plate 3, thereby facilitating direct heating of the chip 15.
[0041] like Figure 1 , Figure 2 As shown, in this embodiment, the heat conducting holes 8 are arranged symmetrically in a plurality of ways. By arranging a plurality of ways, the amount of hot air entering can be increased; by symmetrical arrangement, the center of gravity of the tool can be kept in the middle position, and the problem of deflection of the chip 15 can be avoided.
[0042] like Figure 1 , Figure 2 As shown, in this embodiment, the inner side surface of the bottom of the first side plate 1 has a first heat conducting groove 9. The provision of the first heat conducting groove 9 can facilitate hot air to reach the upper welding area of the edge of the chip 15 from the heat conducting groove, thereby not affecting the heating and welding of the edge of the chip 15.
[0043] like Figure 1 , Figure 2 As shown, in this embodiment, the inner side surface of the bottom of the second side plate 2 has a second heat conducting groove 10. The second heat conducting groove 10 is provided to facilitate hot air to reach the welding area above the edge of the chip 15 from the heat conducting groove, thereby not affecting the heating and welding of the edge of the chip 15.
[0044] like Figure 3 , Figure 4 As shown, in some alternative implementations of this embodiment, a first avoidance groove 11 is provided on the outer side surface of the bottom of the first side plate 1, and specifically, the first avoidance groove 11 is located at the bottom area of the outer side surface of the first side plate 1. Through the provision of the first avoidance groove 11, when other components on the PCB board 16 are close to the chip 15, when the tool is pressed onto the chip 15, the first avoidance groove 11 can prevent the tool from interfering with other components on the PCB board 16.
[0045] like Figure 3 , Figure 4 As shown, further, in this embodiment, the outer side surface of the bottom of the second side plate 2 is provided with a second avoidance groove 12. The function of the second avoidance groove 12 is the same as that of the first avoidance groove 11, and both are used to avoid other components on the PCB board 16.
[0046] like Figure 5 As shown, in some alternative implementations of this embodiment, two symmetrical sides of the connecting plate 3 are respectively provided with pick-up and placement handles 13, and specifically, the pick-up and placement handles 13 are symmetrically arranged on the upper surface of the connecting plate 3. The arrangement of the pick-up and placement handles 13 can facilitate personnel or a robot to operate the tool to press the chip 15 or remove it from the chip 15.
[0047] like Figure 6 As shown, in some alternative implementations of this embodiment, two symmetrical sides of the connecting plate 3 are respectively provided with balancing wings 14, specifically, one of the balancing wings 14 is horizontally arranged on the first side plate 1, and the other is horizontally arranged on the second side plate 2, and extends horizontally outwards respectively. By setting the balancing wings 14, the weight of the tool can be increased, so that the chip 15 can be pressed more stably to prevent movement.
[0048] like Figure 7 , Figure 8 As shown, in some alternative implementations of this embodiment, the pick-up and placement handle 13 and the balance wing 14 may be included at the same time, wherein the specific structure of the pick-up and placement handle 13 is not specifically limited, and may be in the shape of a plate as shown in the figure, or may be in the shape of a door handle, etc.
[0049] like Figure 7 , Figure 8As shown, when in use, the two supporting surfaces of the chip deformation prevention tool of this embodiment are pressed on the PCB board 16 on both sides of the chip 15, and the two pressing surfaces of the chip deformation prevention tool cover the top of the two opposite sides of the chip 15. Specifically, the first supporting surface 4 and the second supporting surface 6 are symmetrically pressed on the PCB board 16 on both sides of the chip 15, and the first pressing surface 5 and the second pressing surface 7 are symmetrically covered on the top of the two symmetrical sides of the chip 15. The restriction of the first pressing surface 5 and the second pressing surface 7 prevents the chip 15 from being excessively deformed during the heating process. In addition, since the height difference between the first supporting surface and the second supporting surface and the first pressing surface and the second pressing surface, respectively, matches the height of the chip on the PCB board, after the first supporting surface 4 and the second supporting surface 6 are symmetrically pressed on the PCB board 16 on both sides of the chip 15, before the chip is deformed by heat, the first pressing surface 5 and the second pressing surface 7 only play a limiting role above the two symmetrical sides of the chip 15. When the chip 15 is heated, the chip 15 can be prevented from being deformed by the restriction of the first pressing surface 5 and the second pressing surface 7; that is, before the chip is deformed by heat, the first pressing surface and the second pressing surface do not cause pressure on the chip, so as not to affect the solder space between the chip and the PCB board, thereby ensuring the welding effect. Specifically, there is a certain gap between the bottom surface of the chip 15 and the PCB board 16, which becomes a solder space for accommodating solder. Through this setting, it is convenient for the solder to connect the chip 15 and the PCB board 16, thereby ensuring the firmness of the welding.
[0050] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from these are still within the scope of protection of the present utility model.
Claims
1. A chip deformation prevention tool, characterized in that: include: A first side plate (1), the bottom surface of which has a first supporting surface (4) and a first pressing surface (5), the first supporting surface (4) and the first pressing surface (5) being arranged in a stepped manner, the first supporting surface (4) being located outside the first pressing surface (5) and lower than the first pressing surface (5), and the height difference between the first supporting surface (4) and the first pressing surface (5) matching the height of the chip (15) on the PCB; The second side plate (2) is symmetrically arranged with the first side plate (1); the bottom surface of the second side plate (2) comprises a second supporting surface (6) and a second pressing surface (7); the second supporting surface (6) and the second pressing surface (7) are arranged in a stepped manner; the second supporting surface (6) is located outside the second pressing surface (7) and is lower than the second pressing surface (7); the height difference between the second supporting surface (6) and the second pressing surface (7) matches the height of the chip (15) on the PCB; the first supporting surface (4) and the second supporting surface (6) are flush with each other; and the first pressing surface (5) and the second pressing surface (7) are flush with each other; A connecting plate (3) is connected to the top of the first side plate (1) and the second side plate (2).
2. The chip deformation prevention tool according to claim 1, characterized in that: A heat-conducting cavity is formed between the connecting plate (3) and the first side plate (1) and the second side plate (2).
3. The chip deformation prevention tool according to claim 2, characterized in that: The connecting plate (3) is provided with a heat conducting hole (8).
4. The chip deformation prevention tool according to claim 3, characterized in that: The heat conducting holes (8) are multiple and symmetrically arranged.
5. The chip deformation prevention tool according to any one of claims 1 to 4, characterized in that: The inner side surface of the bottom of the first side plate (1) is provided with a first heat conduction groove (9).
6. The chip deformation prevention tool according to claim 5, characterized in that: The inner side surface of the bottom of the second side plate (2) is provided with a second heat conduction groove (10).
7. The chip deformation prevention tool according to any one of claims 1 to 4, characterized in that: A first avoidance groove (11) is provided on the outer side surface of the bottom of the first side plate (1).
8. The chip deformation prevention tool according to claim 7, characterized in that: A second avoidance groove (12) is provided on the outer side surface of the bottom of the second side plate (2).
9. The chip deformation prevention tool according to any one of claims 1 to 4, characterized in that: Two symmetrical sides of the connecting plate (3) are respectively provided with pick-up and drop-down handles (13).
10. The chip deformation prevention tool according to any one of claims 1 to 4, characterized in that: Balancing wings (14) are respectively provided on two symmetrical sides of the connecting plate (3).