Chip mounting mechanism capable of avoiding overflow

Abstract

The utility model relates to the technical field of chip mounting, and discloses a chip mounting mechanism capable of avoiding overflow, which comprises a base, the top of the base is fixedly connected with a portal frame, the top of the portal frame is fixedly connected with a solder paste cylinder, the surface of the solder paste cylinder is sleeved with a sleeve, one side of the sleeve is fixedly connected with two restraining plates, and the tops of the two restraining plates are provided with sliding chutes. The bottom of the sliding rod is fixedly connected with a stirring rod, an output shaft of the first motor is fixedly connected with a first lead screw, the surface of the first lead screw is sleeved with a transverse plate, the bottom of the side, close to the solder paste barrel, of the transverse plate is provided with an extruding mechanism used for extruding solder paste, and the bottom of the side, away from the solder paste barrel, of the transverse plate is fixedly connected with a rack; a chip mounting mechanism used for chip mounting is arranged on the surface of the rack, a supporting plate is slidably connected to the top of the base, and a moving mechanism used for moving the supporting plate is arranged on one side of the base. Through the arrangement of the stirring rod, solder paste can be stirred, so that the solder paste can be uniformly smeared.

Description

Technical Field

[0001] The utility model relates to the technical field of chip mounting, in particular to a chip mounting mechanism for avoiding overflow. Background Art

[0002] Chip placement is an automated device used to accurately place electronic components on printed circuit boards. It is one of the key tools in the electronics manufacturing process. Chip placement usually consists of multiple work heads, each of which can handle multiple components at the same time. They use suction cups or vacuum to pick up electronic components and then place them accurately at the predetermined position on the PCB. The placement mechanism has the characteristics of high speed, high precision and high efficiency. It can complete the placement of a large number of components in a very short time. It plays a vital role in the electronics manufacturing industry and can greatly improve production efficiency and product quality.

[0003] When some existing chip mounting mechanisms are performing chip mounting, solder paste is first applied on the circuit board, and then the chip is placed on the surface of the solder paste, and then soldered. However, when the solder paste is applied, it is generally applied directly below the chip, so the amount of solder paste applied cannot be accurately controlled, resulting in solder paste overflow during welding. Therefore, this problem needs to be solved. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a chip mounting mechanism that avoids overflow.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A chip mounting mechanism for avoiding overflow comprises a base, wherein a gantry is fixedly connected to the top of the base, a solder paste cylinder is fixedly connected to the top of the gantry, a sleeve is sleeved on the surface of the solder paste cylinder, two constraint plates are fixedly connected to one side of the sleeve, a slide groove is provided on the top of the two constraint plates, the same slide rod is slidably connected inside the two slide grooves, a stirring rod is fixedly connected to the bottom of the slide rod, an adjustment mechanism for adjusting the stirring rod is provided on the top of the slide rod, a support frame is fixedly connected to the top of the support frame, a first motor is fixedly connected to the top of the support frame, a first screw rod is fixedly connected to the output shaft of the first motor, a cross plate is sleeved on the surface of the first screw rod, an extrusion mechanism for extruding solder paste is provided at the bottom of the cross plate close to the solder paste cylinder, a rack is fixedly connected to the bottom of the cross plate away from the solder paste cylinder, a mounting mechanism for mounting a chip is provided on the surface of the rack, a support plate is slidably connected to the top of the base, and a moving mechanism for moving the support plate is provided on one side of the base, and the solder paste can be stirred by setting the stirring rod so that it can be evenly applied.

[0007] As a further solution of the utility model, the adjustment mechanism includes an adjusting disk, which is fixedly connected to the bottom of the gantry, and an adjustment groove is opened at the bottom of the adjusting disk. A limit disk is slidably connected inside the adjustment groove, and the limit disk is fixedly connected to the top of the slide rod. A gear ring is sleeved on the top of the sleeve, and a gear is sleeved on the surface of the first screw rod close to the gear ring. The gear and the gear ring cooperate with each other, and the stirring rod can be adjusted by setting the adjustment groove.

[0008] As a further solution of the utility model, the extrusion mechanism includes a connecting rod, which is fixedly connected to the bottom of the horizontal plate, and the bottom of the connecting rod is fixedly connected to a piston plate, which slides inside the solder paste tube, and the surface of the solder paste tube away from the first motor is fixedly connected to a guide tube, and the solder paste can be squeezed by setting the piston plate.

[0009] As a further solution of the utility model, the patch mechanism includes two side panels, both of which are fixedly connected to the bottom of the gantry, and the two side panels are rotatably connected to the same rotating shaft, and a plurality of teeth are fixedly connected to the surface of the rotating shaft, and the plurality of teeth cooperate with the rack, and a suction block is fixedly connected to the surface of the rotating shaft away from the first motor, and patching can be performed by setting the suction block.

[0010] As a further solution of the utility model, the moving mechanism includes a second motor, the second motor is fixedly connected to one side of the base, the second motor output shaft is fixedly connected to a second screw rod, the second screw rod is rotatably connected to one side of the base, the surface of the base away from the second screw rod is fixedly connected to a limiting rod, the surfaces of the second screw rod and the limiting rod are both sleeved with sliders, the two sliders are fixedly connected to the bottom of the support plate, and the circuit board can be moved by setting the support plate.

[0011] The beneficial effects of the utility model are:

[0012] 1. Through the setting of the stirring rod, the solder paste can be stirred so that it can be evenly applied. A stirring rod is installed at the bottom of the sliding rod, and the stirring rod is in contact with the solder paste. Therefore, when the sliding rod moves with the adjustment groove, the stirring rod can be mobilized to stir the solder paste so that it can be evenly applied to avoid overflow.

[0013] 2. Through the setting of teeth, the chip can be mounted after the solder paste is applied. A rack is installed on the other side of the support frame, and the rack cooperates with the teeth on the surface of the shaft, so that when the rack moves down, the shaft can be rotated to enable it to turn the suction block upwards. When the suction block is turned upwards, the chip can be placed on top of it, and the chip can be mounted while waiting for the solder paste cylinder to extract the solder paste. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the overall structure of a chip mounting mechanism for avoiding overflow proposed by the utility model;

[0015] Figure 2 A schematic diagram of an adjustment mechanism of a chip mounting mechanism for avoiding overflow proposed by the utility model;

[0016] Figure 3 A schematic diagram of an extrusion mechanism of a chip mounting mechanism for avoiding overflow proposed by the utility model;

[0017] Figure 4 The utility model is a schematic diagram of a moving mechanism of a chip mounting mechanism for avoiding overflow.

[0018] In the figure: 1. base; 2. gantry; 3. first motor; 4. support plate; 201. solder paste tube; 202. guide tube; 203. sleeve; 204. gear ring; 205. constraint plate; 206. slide groove; 207. slide rod; 208. stirring rod; 209. limit plate; 210. adjustment plate; 211. adjustment groove; 301. support frame; 302. cross plate; 303. first screw rod; 304. connecting rod; 305. piston plate; 306. gear; 307. rack; 308. side plate; 309. rotating shaft; 310. teeth; 311. suction block; 401. second motor; 402. slider; 403. second screw rod; 404. limit rod. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0020] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present utility model will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0021] Reference Figure 1-Figure 4A chip mounting mechanism for avoiding overflow includes a base 1, a gantry 2 is fixedly connected to the top of the base 1, a solder paste cylinder 201 is fixedly connected to the top of the gantry 2, a sleeve 203 is sleeved on the surface of the solder paste cylinder 201, one side of the sleeve 203 is fixedly connected to two constraint plates 205, the tops of the two constraint plates 205 are both provided with slide grooves 206, the two slide grooves 206 are slidably connected with the same slide rod 207, the bottom of the slide rod 207 is fixedly connected to a stirring rod 208, the top of the slide rod 207 is provided with an adjustment mechanism for adjusting the stirring rod 208, the top of the gantry 2 is fixedly connected to a support frame 301, the support frame 301 A first motor 3 is fixedly connected to the top, and a first screw rod 303 is fixedly connected to the output shaft of the first motor 3. A cross plate 302 is sleeved on the surface of the first screw rod 303. The bottom of the cross plate 302 close to the solder paste tube 201 is provided with an extrusion mechanism for extruding solder paste. The bottom of the cross plate 302 away from the solder paste tube 201 is fixedly connected to a rack 307, and the surface of the rack 307 is provided with a patch mechanism for patch chips. A support plate 4 is slidably connected to the top of the base 1, and a moving mechanism for moving the support plate 4 is provided on one side of the base 1. The solder paste can be stirred by setting a stirring rod 208 so that it can be evenly applied.

[0022] Reference Figure 1 and Figure 2 In a preferred embodiment, the adjustment mechanism includes an adjustment disk 210, which is fixedly connected to the bottom of the gantry 2. An adjustment groove 211 is provided at the bottom of the adjustment disk 210. A limit disk 209 is slidably connected inside the adjustment groove 211. The limit disk 209 is fixedly connected to the top of the slide rod 207. A gear ring 204 is sleeved on the top of the sleeve 203. A gear 306 is sleeved on the surface of the first screw rod 303 close to the gear ring 204. The gear 306 cooperates with the gear ring 204. The stirring rod 208 can be adjusted by setting the adjustment groove 211.

[0023] Reference Figure 1 and Figure 3 In a preferred embodiment, the extrusion mechanism includes a connecting rod 304, which is fixedly connected to the bottom of the horizontal plate 302. The bottom of the connecting rod 304 is fixedly connected to a piston plate 305, which slides inside the solder paste cylinder 201. The surface of the solder paste cylinder 201 away from the first motor 3 is fixedly connected to a guide tube 202. The solder paste can be squeezed by setting the piston plate 305.

[0024] Reference Figure 1 and Figure 3In a preferred embodiment, the patch mechanism includes two side panels 308, and the two side panels 308 are fixedly connected to the bottom of the gantry 2. The two side panels 308 are rotatably connected to the same rotating shaft 309, and a plurality of teeth 310 are fixedly connected to the surface of the rotating shaft 309. The plurality of teeth 310 cooperate with the rack 307. A suction block 311 is fixedly connected to the surface of the rotating shaft 309 away from the first motor 3. The patch can be performed by setting the suction block 311.

[0025] Reference Figure 1 and Figure 4 In a preferred embodiment, the moving mechanism includes a second motor 401, the second motor 401 is fixedly connected to one side of the base 1, the output shaft of the second motor 401 is fixedly connected to a second screw rod 403, the second screw rod 403 is rotatably connected to one side of the base 1, and the surface of the base 1 away from the second screw rod 403 is fixedly connected to a limiting rod 404, and the surfaces of the second screw rod 403 and the limiting rod 404 are both sleeved with sliders 402, and the two sliders 402 are fixedly connected to the bottom of the support plate 4. By setting the support plate 4, the circuit board can be moved.

[0026] From the above description, it can be seen that the above embodiment of the utility model achieves the following technical effects: when in use, the circuit board is first placed on the top of the support plate 4, and then the second motor 401 is started to drive the support plate 4 to move, and the circuit board can be moved to the bottom of the solder paste cylinder 201 by moving. When the circuit board is moved into place, the first motor 3 will be started, and a first screw rod 303 is installed at the bottom of the first motor 3, and a horizontal plate 302 is sleeved on the surface of the first screw rod 303, and the horizontal plate 30 2 is slidable inside the support frame 301, so that under the restriction of the support frame 301, when the first motor 3 is started, the horizontal plate 302 can be moved downward, a piston plate 305 is installed on one side of the horizontal plate 302, and the piston plate 305 is slidable inside the solder paste cylinder 201, so that when the piston plate 305 moves downward, the solder paste can be applied to the circuit board, and a gear 306 is installed at the bottom of the first screw rod 303, and the gear 306 cooperates with the toothed ring 204 on the surface of the sleeve 203, so that when the first screw rod 3 When the sleeve 203 rotates, the sleeve 203 will also rotate synchronously. A slide bar 207 is installed on one side of the sleeve 203, and the top of the slide bar 207 slides inside the adjustment groove 211. Due to the shape of the adjustment groove 211, when the slide bar 207 rotates inside the adjustment groove 211, it can move in a vortex shape. A stirring rod 208 is installed at the bottom of the slide bar 207, and the stirring rod 208 is in contact with the solder paste, so that when the slide bar 207 moves with the adjustment groove 211, the stirring rod can be mobilized. 208 stirs the solder paste so that it can be evenly applied to avoid overflow. A rack 307 is installed on the other side of the support frame 301, and the rack 307 cooperates with the teeth 310 on the surface of the shaft 309, so that when the rack 307 moves downward, the shaft 309 can be rotated to enable it to turn the suction block 311 upward. When the suction block 311 turns upward, the chip can be placed on top of it to wait for the solder paste tube 201 to extract the solder paste, and then the chip can be mounted.

[0027] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0028] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0029] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0030] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A chip mounting mechanism for avoiding overflow, comprising a base (1), characterized in that: The top of the base (1) is fixedly connected to a gantry (2), the top of the gantry (2) is fixedly connected to a solder paste tube (201), the surface of the solder paste tube (201) is sleeved with a sleeve (203), one side of the sleeve (203) is fixedly connected to two constraint plates (205), the tops of the two constraint plates (205) are each provided with a slide groove (206), the two slide grooves (206) are slidably connected to the same slide rod (207), the bottom of the slide rod (207) is fixedly connected to a stirring rod (208), the top of the slide rod (207) is provided with an adjustment mechanism for adjusting the stirring rod (208), the top of the gantry (2) is fixedly connected to a support frame (3 01), the top of the support frame (301) is fixedly connected to a first motor (3), the output shaft of the first motor (3) is fixedly connected to a first screw rod (303), the surface of the first screw rod (303) is sleeved with a horizontal plate (302), the bottom of the horizontal plate (302) close to the solder paste tube (201) is provided with an extrusion mechanism for extruding solder paste, the bottom of the horizontal plate (302) away from the solder paste tube (201) is fixedly connected to a rack (307), the surface of the rack (307) is provided with a patch mechanism for patching chips, the top of the base (1) is slidably connected to a support plate (4), and one side of the base (1) is provided with a moving mechanism for moving the support plate (4).

2. The chip mounting mechanism for avoiding overflow according to claim 1, characterized in that: The adjusting mechanism comprises an adjusting disk (210), wherein the adjusting disk (210) is fixedly connected to the bottom of the gantry (2), an adjusting groove (211) is provided at the bottom of the adjusting disk (210), a limiting disk (209) is slidably connected inside the adjusting groove (211), and the limiting disk (209) is fixedly connected to the top of the sliding rod (207).

3. The chip mounting mechanism for avoiding overflow according to claim 2, characterized in that: A gear ring (204) is sleeved on the top of the sleeve (203), and a gear (306) is sleeved on the surface of the first screw rod (303) on one side close to the gear ring (204), and the gear (306) cooperates with the gear ring (204).

4. The chip mounting mechanism for avoiding overflow according to claim 3, characterized in that: The extrusion mechanism comprises a connecting rod (304), wherein the connecting rod (304) is fixedly connected to the bottom of the horizontal plate (302), and the bottom of the connecting rod (304) is fixedly connected to a piston plate (305), and the piston plate (305) slides inside the solder paste cylinder (201), and the surface of the solder paste cylinder (201) away from the first motor (3) is fixedly connected to a guide tube (202).

5. The chip mounting mechanism for avoiding overflow according to claim 4, characterized in that: The patch mechanism comprises two side plates (308), the two side plates (308) are fixedly connected to the bottom of the gantry (2), the two side plates (308) are rotatably connected to a same rotating shaft (309), a plurality of teeth (310) are fixedly connected to the surface of the rotating shaft (309), the plurality of teeth (310) are mutually matched with the rack (307), and a suction block (311) is fixedly connected to the surface of the rotating shaft (309) away from the first motor (3).

6. The chip mounting mechanism for avoiding overflow according to claim 5, characterized in that: The moving mechanism comprises a second motor (401), the second motor (401) is fixedly connected to one side of the base (1), the output shaft of the second motor (401) is fixedly connected to a second screw rod (403), the second screw rod (403) is rotatably connected to one side of the base (1), a limit rod (404) is fixedly connected to the surface of the base (1) away from the second screw rod (403), the surfaces of the second screw rod (403) and the limit rod (404) are both sleeved with sliders (402), and the two sliders (402) are fixedly connected to the bottom of the support plate (4).

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