Heat dissipation device and electronic equipment

Abstract

The utility model provides a heat dissipation device and electronic equipment, and relates to the technical field of electronic equipment. The heat dissipation device comprises a first plate body and a second plate body which are oppositely arranged in the first direction, the first plate body and the second plate body form a containing cavity, a working medium is arranged in the containing cavity, and the working medium can generate phase change between a first form and a second form. The outer side face, opposite to the containing cavity, of the second plate body can be installed corresponding to a heat source, so that the side of the second plate body forms an evaporation end, and the side of the first plate body forms a condensation end. The inner side face, opposite to the containing cavity, of the first plate body comprises a first area corresponding to the heat source in the first direction and a second area except the first area. Wherein the affinity of the first area to the working medium is superior to that of the second area to the working medium.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a heat dissipation device and electronic equipment. Background Art

[0002] At present, heat pipes and heat spreaders are widely used in consumer electronic devices such as mobile phones, tablets, and laptops. However, as the performance of processors of electronic devices becomes stronger and stronger, the heat generated is also increasing, and the requirements for the heat dissipation capacity of heat dissipation components are also getting higher and higher, and the requirements for the temperature uniformity of heat spreaders are also higher.

[0003] In order to improve the temperature-averaging performance of the heat spreader, the current solution is to increase the area of ​​the heat spreader to reduce the hot spot temperature. However, this solution will increase costs and increase the volume and weight of the entire machine. Therefore, new methods need to be developed to further reduce the hot spot temperature. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a vapor chamber and an electronic device, which mainly provide the following technical solutions:

[0005] A first aspect of the present application provides a heat dissipation device, the heat dissipation device comprising: a first plate body and a second plate body arranged opposite to each other in a first direction, the first plate body and the second plate body forming a receiving cavity, a working medium being arranged in the receiving cavity, the working medium being able to undergo a phase change between a first state and a second state, the second plate body being able to be installed corresponding to a heat source on an outer side of the receiving cavity, so that a side of the second plate body constitutes an evaporation end, and a side of the first plate body constitutes a condensation end;

[0006] The inner side surface of the first plate relative to the accommodating cavity includes a first area corresponding to the heat source in the first direction and a second area other than the first area;

[0007] The affinity of the first region to the working fluid is greater than the affinity of the second region to the working fluid.

[0008] In some modified implementations of the first aspect of the present application, after the first region is magnified to a set multiple, its appearance has a first roughness, the second region has a second roughness, and the first roughness is greater than the second roughness.

[0009] In some modified implementations of the first aspect of the present application, the working medium is water; the first region is a superhydrophilic surface, and the second region is a smooth surface or a hydrophobic surface;

[0010] or,

[0011] The first area is a smooth surface, and the second area is a super hydrophobic surface.

[0012] In some modified embodiments of the first aspect of the present application, the first region is provided with a first porous structure, and the first porous structure can form a working fluid layer by absorbing at least part of the working fluid that is in a phase transition from the second form to the first form, so as to increase the thermal resistance from the heat source to the first plate body.

[0013] In some modified implementations of the first aspect of the present application, the first porous structure is composed of a capillary copper mesh; or,

[0014] The first porous structure is formed by sintering copper powder.

[0015] In some modified embodiments of the first aspect of the present application, the first porous structure is a micro-nano structure formed by etching; or,

[0016] The first porous structure is a micro-nano structure formed by laser processing.

[0017] In some modified embodiments of the first aspect of the present application, the accommodating chamber includes a capillary structure arranged on the inner side of the second plate body to guide the working fluid in the first form to flow in the accommodating chamber, and when the second plate body obtains heat from the heat source, the working fluid absorbs heat and changes from the first form to the second form and separates from the capillary structure.

[0018] In some modified implementations of the first aspect of the present application, the area of ​​the first region is greater than or equal to the projection area of ​​the heat source in the first direction.

[0019] In some modified implementations of the first aspect of the present application, the area of ​​the first region is larger than the projection area of ​​the heat source in the first direction;

[0020] The first region includes a central portion corresponding to the heat source and matching in area, and the affinity of the first region to the working fluid gradually decreases from the central portion to the edge of the first region.

[0021] A second aspect of the present application provides an electronic device, the electronic device comprising: the above-mentioned heat dissipation device;

[0022] At least one heating element can form a heat source. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present application will become easy to understand. In the accompanying drawings, several embodiments of the present application are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0024] Figure 1The schematic diagram of the structure of the heat dissipation device provided in the embodiment of the present application is schematically shown;

[0025] Figure 2 The structure diagram of another heat dissipation device provided in an embodiment of the present application is schematically shown;

[0026] Figure 3 The schematic diagram of the structure of the inner side surface of the first plate body of the heat dissipation device provided in the embodiment of the present application is schematically shown;

[0027] Figure 4 The structural diagram of the electronic device provided in the embodiment of the present application is schematically shown.

[0028] Description of Figure Numbers:

[0029] Heat dissipation device 1, first plate body 11, first area 11a, second area 11b, second plate body 12, accommodating cavity 101, first porous structure 2, capillary structure 3, working medium layer 4, heating element 5, housing 6, first direction x. DETAILED DESCRIPTION

[0030] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0031] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by technicians in the field to which this application belongs.

[0032] Embodiment 1

[0033] Reference Figure 1 , Attachment Figure 2 and attached Figure 3Embodiment 1 of the present application proposes a heat dissipation device 1, which includes: a first plate body 11 and a second plate body 12 arranged opposite to each other in a first direction x, the first plate body 11 and the second plate body 12 forming a receiving chamber 101, a working medium is arranged in the receiving chamber 101, and the working medium can produce a phase change between a first form and a second form in the receiving chamber 101, and the outer side surface of the second plate body 12 relative to the receiving chamber 101 can be installed corresponding to a heat source, so that the second plate body 12 side constitutes an evaporation end, and the first plate body 11 side constitutes a condensation end; the inner side surface of the first plate body 11 relative to the receiving chamber 101 includes a first area 11a corresponding to the heat source in the first direction x and a second area 11b other than the first area 11a; wherein the affinity of the first area 11a to the working medium is better than the affinity of the second area 11b to the working medium.

[0034] Specifically, the heat dissipation device 1 provided in this embodiment may be, but is not limited to, a heat spreader, which includes a heat sink in a first direction x (the first direction x is the adjacent Figure 1 and attached Figure 2 The first plate body 11 and the second plate body 12 are relatively arranged on the direction indicated by the double-headed arrow x in the figure, and a closed accommodating chamber 101 can be formed between the two by setting a side wall. The accommodating chamber 101 is used to accommodate a working medium. The working medium here refers to a medium material that can realize a form transformation under the action of thermal energy and can produce a phase change between a first form and a second form in the accommodating chamber 101; wherein, taking water as the working medium as an example, the first form and the second form can be liquid and vapor respectively, refer to the attached Figure 1 and attached Figure 2 The direction indicated by the dotted arrow in the accompanying drawings is the flow direction of water vapor, and the direction indicated by the arrow is the flow direction of liquid water. When forming the heat dissipation device 1, a small amount of working fluid is injected into the accommodating cavity 101, and a semi-vacuum is drawn to lower the boiling point of water, which can usually be controlled between 35-60 degrees.

[0035] A heat source may be installed on the outer side of the second plate body 12 , where the heat source is formed by a heating element 5 , and the heating element 5 may be, but is not limited to, a processor inside an electronic device. The heat source generates heat during operation and heats the second plate 12, so that the side where the second plate 12 is located forms an evaporation end, and the side where the first plate 11 is located forms a condensation end. The area of ​​the first plate 11 away from the heat source is the condensation area, and the area of ​​the second plate 12 corresponding to the heat source is the evaporation area. A capillary structure 3 can be set on the inner side of the second plate 12. When the heat source generates heat during operation, it heats the second plate 12, that is, the evaporation end. The working fluid in the evaporation area of ​​the evaporation end absorbs a large amount of heat and undergoes a phase change, from a first form to a second form with a higher temperature. The working fluid in the second form is pushed to the condensation area by the micro-pressure in the accommodating chamber 101, and is transformed into the first form through condensation and falls and flows into the capillary structure 3 of the second plate 12. The capillary force of the capillary structure 3 is used to pull the liquid back to the evaporation area to realize the reflux of the working fluid. In this way, the heat is diffused from the heat source to various parts of the heat dissipation device 1 in a reciprocating manner to achieve the purpose of uniform heating.

[0036] Below, the area corresponding to the heat source on the inner side surface of the first plate body 11 relative to the accommodating cavity 101 in the first direction x is set as the first area 11a, and the remaining areas are set as the second area 11b. In order to avoid the temperature of the first area 11a of the first plate body 11 being significantly higher than that of the remaining areas, which affects the heat equalization effect, in the technical solution adopted by the present application, the affinity of the first area 11a to the working fluid is set due to the affinity of the second area 11b to the working fluid. Such a design can be formed in a variety of ways, which will be described in detail below; when working, within the heat dissipation power range set by the heat dissipation device 1, according to the inner side surface of the first plate body 11 Due to the limitation of affinity for the working fluid, a liquid working fluid layer 4 is formed in the first region 11a. Compared with the inner wall directly contacting the vapor-state working fluid, since the steam comes from the liquid working fluid in the capillary structure 3 heated by the heat source, the temperature of the working fluid layer 4 is lower than the steam with a higher temperature, which is equivalent to increasing the thermal resistance from the heat source to the first plate body 11 in the first direction x, avoiding direct contact between the first region 11a of the first plate body 11 and the vapor-state working fluid, and can effectively reduce the temperature of the first region 11a of the first plate body 11, thereby improving the temperature uniformity performance of the heat dissipation device 1 and reducing the maximum temperature of the entire outer surface.

[0037] According to the above, an embodiment of the present application proposes a heat dissipation device 1, which includes a first plate body 11 and a second plate body 12 relative to each other. The outer side surface of the second plate body 12 can be installed with a heat source so that the side where the second plate body 12 is located forms an evaporation end, and the side where the first plate body 11 is located forms a condensation end. The inner side surface of the first plate body 11 includes a first area 11a corresponding to the heat source in the first direction x and a second area 11b other than the first area 11a. By setting the affinity of the first area 11a to the working fluid to be better than the affinity of the second area 11b to the working fluid, it can be achieved that during operation, a working fluid layer 4 will be formed in the first area 11a. Since the temperature of the working fluid layer 4 is lower than the vapor-state working fluid with a higher temperature, it is equivalent to increasing the thermal resistance from the heat source to the first plate body 11 in the first direction x, which can effectively reduce the temperature of the first area 11a of the first plate body 11, thereby achieving the purpose of uniform heat distribution.

[0038] For further information, see Attachment Figure 1 and attached Figure 3 In a specific implementation, in order to achieve the difference in affinity between the first area 11a and the second area 11b on the inner side of the second plate body 12 to the working fluid, a surface treatment can be used. After the treatment, after being magnified to a set multiple, its appearance has a first roughness, the second area has a second roughness, and the first roughness is greater than the second roughness; taking water as the working fluid as an example, the first area and the second area are specifically configured in the following two ways. The first way is to set the first area 11a as a super-working fluid-friendly surface and the second area 11b as a smooth surface or a hydrophobic surface. The second way is to set the first area 11a as a smooth surface and the second area as a super-hydrophobic surface. Both of the above methods can achieve the difference in hydrophilicity between the first area and the second area 11b, thereby forming a water film in the first area 11a during operation.

[0039] For further information, see Attachment Figure 2 and attached Figure 3 In the specific implementation, in order to further realize the difference in affinity between the first area 11a and the second area 11b of the inner side of the second plate body 12 to the working medium, the technical solution adopted by the present application is as follows: Figure 1 and attached Figure 2, the first region 11a is provided with a first porous structure 2, and the first porous structure 2 can form a working fluid layer 4 by absorbing at least part of the working fluid that is in the phase change from the second form to the first form, so as to increase the thermal resistance from the heat source to the first plate body 11; below, taking the first form as liquid and the second form as vapor as an example, the first porous structure 2 provided in the first region 11a can increase the roughness of the surface of the region, thereby forming a super-philic working fluid surface. During operation, the affinity of the region for the working fluid can be used to form a layer of liquid working fluid on the surface of the first region 11a. If the first porous structure 2 is not provided in the region, the surface of the region should be in direct contact with the vapor working fluid. The working fluid layer 4 has a lower temperature than the vapor working fluid, which can effectively increase the thermal resistance from the heat source to the first plate body 11, thereby effectively reducing the temperature of the first region 11a corresponding to the first plate body 11 and the heat source, that is, reducing the temperature of the highest temperature position of the first plate body 11, which is beneficial to the homogenization of the overall temperature of the heat dissipation device 1.

[0040] Specifically, in a specific implementation, the first porous structure 2 can be formed of a copper material, mainly in two ways. The first way is that the first porous structure 2 is composed of a capillary copper mesh. The second way is that the first porous structure 2 is formed by sintering copper powder; or the first porous structure 2 can also be formed by a micron-nano material, mainly in two ways. The first way is that the first porous structure 2 is a micro-nano structure formed by etching, and the second way is that the first porous structure 2 is a micro-nano structure formed by laser processing. The first porous structure 2 can be formed by any one of the above four ways, but is not limited to the above four ways.

[0041] For further information, see Attachment Figure 1 and attached Figure 2 In a specific implementation, the accommodating chamber 101 includes a capillary structure 3 arranged on the inner side of the second plate body 12 to guide the working medium in the first form to flow in the accommodating chamber 101. When the second plate body 12 obtains heat from the heat source, the working medium absorbs heat and changes from the first form to the second form and separates from the capillary structure 3.

[0042] Specifically, in order to achieve a phase change between the first form and the second form of the working fluid in the accommodating chamber 101 while realizing the reflux circulation of the working fluid, in the technical solution adopted in the present application, the capillary structure 3 on the inner side of the second plate body 12 can guide the working fluid in the first form falling from the condensation area of ​​the first plate body 11, and the capillary force of the capillary structure 3 can pull the working fluid in the first form to the evaporation area of ​​the second plate body 12 to achieve liquid reflux; the design of the capillary structure 3 can achieve efficient liquid reflux and improve the effect and efficiency of heat equalization.

[0043] For further information, see Attachment Figure 1 and attached Figure 2 In a specific implementation, the area of ​​the first region 11a can be substantially equal to the projection area of ​​the heat source in the first direction x, or can be larger than the projection area of ​​the heat source in the first direction x, so as to ensure that the area of ​​the first region 11a can at least fully cover the area occupied by the heat source, so as to minimize the temperature of the portion of the first plate 11 corresponding to the heat source; wherein, when the area of ​​the first region 11a is set to be larger than the projection area of ​​the heat source in the first direction x, the first region 11a can be set to have equal affinity for the working fluid at all locations, or can be set to have a gradual or certain gradient change in affinity for the working fluid, for example: the affinity of the first region 11a to the working fluid gradually decreases from the center to the edge of the first region 11a. Since the center is the part directly opposite to the heat source and has the highest temperature, such a design meets the temperature conditions of the first region 11a and can meet the uniform temperature requirements.

[0044] Embodiment 2

[0045] Reference Figure 4 , Embodiment 2 of the present application proposes an electronic device, which includes: the above-mentioned heat dissipation device 1; and at least one heating element 5, which can form a heat source.

[0046] Specifically, the electronic device provided in this embodiment can be, but is not limited to, a mobile phone, a tablet computer, etc., which includes a housing 6 and a heat dissipation device 1 and a heating element 5 arranged in the housing 6. The heat dissipation device 1 can absorb the heat of the heat source formed by the heating element 5, dissipate the heat, and achieve heat uniformity, so as to achieve the effect of uniform temperature outside the heat dissipation device 1; wherein the heat source here can be formed by the heating element 5 as a whole, or can also be formed by a part of the heating element 5, or can also be formed by multiple heating elements 5 together.

[0047] It should be noted that in the description of this specification, the terms "upper", "lower", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application; the terms "connect", "install", "fixed", etc. should be understood in a broad sense, for example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0048] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0049] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A heat dissipation device, characterized in that: include: A first plate body and a second plate body are arranged opposite to each other in a first direction, the first plate body and the second plate body form a containing cavity, a working medium is arranged in the containing cavity, the working medium can produce a phase change between a first state and a second state, and the outer side of the second plate body relative to the containing cavity can be installed corresponding to a heat source, so that the second plate body side constitutes an evaporation end, and the first plate body side constitutes a condensation end; The inner side surface of the first plate relative to the accommodating cavity includes a first area corresponding to the heat source in the first direction and a second area other than the first area; The affinity of the first region to the working fluid is greater than the affinity of the second region to the working fluid.

2. The heat dissipation device according to claim 1, characterized in that: After the first region is magnified to a set multiple, its appearance has a first roughness, and the second region has a second roughness, and the first roughness is greater than the second roughness.

3. The heat dissipation device according to claim 2, characterized in that: The working fluid is water; The first region is a superhydrophilic surface, and the second region is a smooth surface or a hydrophobic surface; or, The first area is a smooth surface, and the second area is a super hydrophobic surface.

4. The heat dissipation device according to claim 1, characterized in that: The first region is provided with a first porous structure, and the first porous structure can form a working medium layer by absorbing at least part of the working medium that is in a phase change from the second state to the first state, so as to increase the thermal resistance from the heat source to the first plate body.

5. The heat dissipation device according to claim 4, characterized in that: The first porous structure is composed of a capillary copper mesh; or, The first porous structure is formed by sintering copper powder.

6. The heat dissipation device according to claim 4, characterized in that: The first porous structure is a micro-nano structure formed by etching; or, The first porous structure is a micro-nano structure formed by laser processing.

7. The heat dissipation device according to claim 1, characterized in that: The accommodating chamber includes a capillary structure arranged on the inner side of the second plate body to guide the working medium in the first form to flow in the accommodating chamber. When the second plate body obtains heat from the heat source, the working medium absorbs heat and changes from the first form to the second form and separates from the capillary structure.

8. The heat dissipation device according to claim 1, characterized in that: The area of ​​the first region is greater than or equal to the projection area of ​​the heat source in the first direction.

9. The heat dissipation device according to claim 8, characterized in that: The area of ​​the first region is larger than the projection area of ​​the heat source in the first direction; The first region includes a central portion corresponding to the heat source and matching in area, and the affinity of the first region to the working fluid gradually decreases from the central portion to the edge of the first region.

10. An electronic device, characterized in that: include: The heat dissipation device as claimed in any one of claims 1 to 9; At least one heating element can form a heat source.

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