Liquid cooling heat dissipation plate

Abstract

The utility model provides a liquid cooling heat dissipation plate, which comprises a first substrate, a plurality of rows and columns of pin fins are formed on the first surface of the first substrate, a liquid inlet end and a liquid outlet end which are longitudinally arranged at intervals and are provided for cooling liquid to flow are further formed on the first surface of the first substrate, and a plurality of mounting areas are formed on the second surface of the first substrate. The plurality of mounting areas are arranged at intervals along the transverse direction; each group of baffle plates is inserted into gaps between the pin fins corresponding to the spacer regions, the spacer regions are regions between the adjacent mounting regions, each group of baffle plates comprises a plurality of baffle plates which are spaced along the longitudinal direction, and each baffle plate forms a notch facing the liquid outlet end so as to prevent cooling liquid from entering the gaps between the pin fins in the notch; the second substrate is connected with the first surface of the first substrate, a groove is formed in the second substrate, and a liquid inlet hole and a liquid outlet hole are formed in the groove. According to the liquid cooling heat dissipation plate, the heat dissipation efficiency can be improved, and the reusability is improved.

Description

Technical Field

[0001] The utility model relates to the field of radiators, in particular to a liquid cooling radiator plate. Background Art

[0002] Liquid cooling heat sinks are widely used to dissipate heat from objects to be cooled (chips, power devices / modules, etc.).

[0003] When a liquid-cooled radiator cools multiple objects to be cooled, the pin fins of the liquid-cooled radiator are usually evenly distributed, and the coolant flows through areas not corresponding to the objects to be cooled and does not participate in the heat dissipation, thereby reducing the cooling efficiency. Utility Model Content

[0004] In view of the above problems in the prior art, the purpose of the present invention is to provide a liquid cooling heat sink that can improve heat dissipation efficiency and increase reusability.

[0005] In order to solve the above problems, the utility model provides a liquid cooling heat sink, the liquid cooling heat sink comprising:

[0006] A first substrate, the first substrate comprises a first surface and a second surface facing each other, a plurality of rows and columns of pin fins are formed on the first surface of the first substrate, each column of the pin fins comprises a plurality of the pin fins arranged spaced apart in the longitudinal direction, and the plurality of columns of the pin fins are arranged spaced apart in the transverse direction, a liquid inlet and a liquid outlet arranged spaced apart in the longitudinal direction and provided for the flow of cooling liquid are also formed on the first surface of the first substrate, a plurality of mounting areas are formed on the second surface of the first substrate, the plurality of the mounting areas are spaced apart in the transverse direction, and the mounting areas are used to place objects to be cooled;

[0007] At least one group of baffles, each group of baffles is inserted into the gaps between the pin fins corresponding to the spacing area, the spacing area is the area between the adjacent mounting areas, each group of baffles includes a plurality of baffles spaced apart in the longitudinal direction, each baffle is formed with a notch toward the liquid outlet end to prevent the coolant from entering the gaps between the pin fins in the notch;

[0008] A second substrate is connected to the first surface of the first substrate, a groove is formed on the second substrate, the groove can cover the pin fin, the groove forms a liquid inlet hole corresponding to the liquid inlet end of the first substrate, and the groove forms a liquid outlet hole corresponding to the liquid outlet end of the first substrate.

[0009] Furthermore, the gaps between the pin fins are formed by saw blade cutting or wire cutting.

[0010] Furthermore, the width of the gap between adjacent pin fins is 0.5-0.8 mm.

[0011] Furthermore, the pin fins between adjacent rows are staggered.

[0012] Furthermore, the shape of the end surface of the pin fin is a rhombus, and the shape of the end surface of the baffle is a triangle.

[0013] Furthermore, among the two adjacent baffles in each group of baffles, the baffle adjacent to the liquid inlet end at least partially blocks the first gap channel and the second gap channel corresponding to the baffle adjacent to the liquid outlet end, the first gap channel is a gap channel formed by extending the gap between the first pin wing and the second pin wing toward the liquid inlet end, the second gap channel is a gap channel formed by extending the gap between the first pin wing and the third pin wing toward the liquid inlet end, the first pin wing is the pin wing corresponding to the top corner of the baffle located on one side of the liquid inlet end, and the second pin wing and the third pin wing are two pin wings located close to this baffle and on both sides of the first pin wing in the lateral direction.

[0014] Furthermore, a protrusion is formed in the middle of both sides of the baffle in the transverse direction, the protrusion is located on the side of the baffle close to the liquid inlet end, and the protrusion is inserted into the gap between two adjacent pin wings in the middle of the longitudinal direction adjacent to the baffle.

[0015] Furthermore, the height of the pin fin is not lower than the height of the baffle.

[0016] Furthermore, the first substrate and the second substrate are connected by welding via a solder plate.

[0017] Further, two positioning holes are formed at two opposite corners of the second substrate respectively, and a positioning pin capable of being inserted into the positioning hole is disposed on the first surface of the first substrate.

[0018] Due to the above technical solution, the utility model has the following beneficial effects:

[0019] According to the utility model, the liquid cooling heat sink comprises a first substrate, at least one group of baffles and a second substrate. The cooling liquid flows from the liquid inlet hole of the second substrate into the liquid inlet end of the first substrate, flows through the pin fins, and flows from the liquid outlet end of the first substrate into the liquid outlet hole of the second substrate, and then flows out of the liquid cooling heat sink, so as to dissipate heat for multiple objects to be cooled arranged in multiple installation areas on the second surface of the first substrate. The first surface of the first substrate forms multiple rows of pin fins spaced apart laterally, and a baffle is inserted into the gap of the pin fin corresponding to the spacing area between the adjacent installation areas, and the baffle forms a notch toward the liquid outlet end. The baffle can block the cooling liquid and concentrate the cooling liquid into the gap of the pin fin corresponding to the installation area, so as to avoid the cooling liquid directly flowing out of the liquid cooling heat sink from the pin fin corresponding to the spacing area without participating in the heat exchange with the object to be cooled, and the heat dissipation efficiency can be improved. Moreover, baffles of different sizes can be inserted according to the objects to be cooled of different sizes and the size of the spacing area, so that the liquid cooling heat sink meets the needs of a variety of different objects to be cooled and increases reusability. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solution of the utility model, the following is a brief introduction to the drawings required for use in the embodiments or prior art descriptions. Obviously, the drawings described below are only some embodiments of the utility model, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 This is a structural diagram of a liquid cooling heat sink and an object to be cooled according to an embodiment of the utility model;

[0022] Figure 2 is a structural diagram of a first substrate and a baffle according to an embodiment of the utility model;

[0023] Figure 3 yes Figure 2 A magnified image of area A;

[0024] Figure 4 yes Figure 2 A magnified view of area B in FIG.

[0025] Figure 5 It is a structural diagram of a second substrate according to an embodiment of the utility model.

[0026] Reference numerals:

[0027] 100, first substrate; 110, pin fin; 111, first pin fin; 112, second pin fin; 113, third pin fin; 120, positioning pin; 200, second substrate; 210, groove; 221, liquid outlet; 222, liquid inlet; 230, positioning hole; 300, object to be cooled; 400, baffle; 410, baffle body; 420, bump. DETAILED DESCRIPTION

[0028] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described here can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0030] Next, a liquid cooling heat sink according to an embodiment of the present invention is described.

[0031] like Figures 1 to 5 As shown, the liquid cooling heat sink of the embodiment of the utility model comprises: a first substrate 100 , at least one set of baffles 400 and a second substrate 200 .

[0032] First, the first substrate 100 is described. The first substrate 100 includes a first surface and a second surface facing each other, and a plurality of rows and columns of pin fins 110 are formed on the first surface of the first substrate 100, each column of pin fins 110 includes a plurality of pin fins 110 spaced apart in the longitudinal direction, and the plurality of rows of pin fins 110 are spaced apart in the transverse direction, and a liquid inlet and a liquid outlet are also formed on the first surface of the first substrate 100, which are spaced apart in the longitudinal direction and provided for the flow of cooling liquid, and a plurality of installation areas are formed on the second surface of the first substrate 100, and the plurality of installation areas are spaced apart in the transverse direction, and the installation areas are used to place the object 300 to be cooled.

[0033] like Figure 1 and Figure 2As shown, the second surface of the first substrate 100 is provided with three installation areas spaced apart in a transverse direction, and three objects to be cooled 300 are respectively provided in the three installation areas. The first surface of the first substrate 100 is formed with multiple rows of pin fins 110 spaced apart in a transverse direction. The cooling liquid flows into the pin fins 110 from the liquid inlet end of the first substrate 100, and flows out of the pin fins 110 from the liquid outlet end of the first substrate 100.

[0034] It should be noted that the number of installation areas is not limited here, and it can also be four, five, etc., which should be understood to be within the scope of the present utility model.

[0035] Next, the baffles 400 are described. Each set of baffles 400 is inserted into the gaps between the pin fins 110 corresponding to the spacing area, the spacing area is the area between adjacent installation areas, each set of baffles 400 includes a plurality of baffles 400 spaced apart in the longitudinal direction, and each baffle 400 is formed with a notch toward the liquid outlet end to prevent the coolant from entering the gaps between the pin fins 110 in the notch.

[0036] like Figure 2 and Figure 3 As shown, the liquid cooling radiator includes two groups of baffles 400, which are respectively arranged in the pin fins 110 corresponding to the two spacing areas, and each group of baffles 400 includes four baffles 400 arranged at four longitudinal intervals. Each baffle 400 is formed with a "V"-shaped notch toward the liquid outlet end. Due to the obstruction of the baffle 400, the coolant cannot flow into the pin fins 110 in the notch. The coolant is blocked by the baffle 400 and will flow back to the gap in the pin fin 110 corresponding to the installation area, avoiding the coolant directly flowing out of the gap of the pin fin 110 in the spacing area without heat exchange, which can improve the cooling efficiency of the liquid cooling radiator.

[0037] It should be noted that the above are only optional examples, and the shape of the baffle 400 depends on the shape and distribution of the pin fins 110, and may also be a "U" shape, which should all be understood within the scope of the present invention.

[0038] Finally, the second substrate 200 is described. The second substrate 200 is connected to the first surface of the first substrate 100, and a groove 210 is formed on the second substrate 200. The groove 210 can cover the pin fin 110, and the groove 210 forms a liquid inlet hole 222 corresponding to the liquid inlet end of the first substrate 100, and the groove 210 forms a liquid outlet hole 221 corresponding to the liquid outlet end of the first substrate 100.

[0039] like Figure 1 and Figure 5 As shown, the second substrate 200 is formed with a groove 210 capable of covering the pin fin 110 of the first substrate 100 , and the groove 210 can accommodate cooling liquid. The cooling liquid flows into the groove 210 from the liquid inlet hole 222 and flows out of the groove 210 from the liquid outlet hole 221 .

[0040] The above liquid-cooled heat sink comprises a first substrate 100, at least one set of baffles 400 and a second substrate 200. The cooling liquid flows into the liquid inlet end of the first substrate 100 from the liquid inlet hole 222 of the second substrate 200, flows through the pin fins 110, and flows into the liquid outlet hole 221 of the second substrate 200 from the liquid outlet end of the first substrate 100, and then flows out of the liquid-cooled heat sink, thereby dissipating heat for a plurality of objects to be cooled 300 arranged in a plurality of mounting areas on the second surface of the first substrate 100. The first surface of the first substrate 100 forms a plurality of rows of pin fins 110 spaced apart laterally, and a baffle 400 is inserted into the gap of the pin fins 110 corresponding to the spacing area between the adjacent installation areas. The baffle 400 forms a notch toward the liquid outlet end, and the baffle 400 can block the coolant and concentrate the coolant into the gap of the pin fins 110 corresponding to the installation area, thereby preventing the coolant from directly flowing out of the liquid cooling radiator from the pin fins 110 corresponding to the spacing area without participating in the heat exchange with the object to be cooled 300, thereby improving the heat dissipation efficiency. Moreover, baffles 400 of different sizes can be inserted according to the different sizes of the objects to be cooled 300 and the size of the spacing area, so that the liquid cooling radiator meets the needs of a variety of different objects to be cooled 300, thereby increasing reusability.

[0041] In some embodiments of the present invention, the gaps between the pin fins 110 are formed by saw blade cutting or wire cutting.

[0042] Compared with conventional cold forging methods, the pin fins 110 formed by saw blade cutting or wire cutting have narrower gaps between them. In the case of the same area, narrower gaps can allow more pin fins 110 and / or larger pin fins 110, thereby increasing the heat exchange area and further improving the heat exchange efficiency.

[0043] Moreover, it is relatively easy to form uniformly distributed pin fins 110 by saw blade cutting or wire cutting, while it is complicated to form unevenly distributed pin fins 110. The baffle 400 is inserted into the pin fins 110 corresponding to the spacing area, and is more used for uniformly distributed pin fins 110 to redistribute the flow channels of the coolant, so that the coolant is concentrated in the gaps between the pin fins 110 corresponding to the installation area.

[0044] Furthermore, the width of the gap between adjacent pin fins 110 is 0.5-0.8 mm.

[0045] The pin fins 110 on the first surface of the first substrate 100 have a gap width of 0.5-0.8 mm, which can have a large heat exchange area and can effectively avoid gap clogging. This gap width cannot be achieved by conventional cold forging, but can be achieved better by saw blade cutting or wire cutting of the utility model.

[0046] In some embodiments of the present invention, the pin fins 110 between adjacent rows are staggered.

[0047] The pin fins 110 between adjacent rows are staggered. When the coolant gradually flows into each row of pin fins 110, the staggered pin fins 110 can make the coolant flowing through the gaps of the pin fins 110 in the previous row hit the pin fins 110 in the next row, so that the coolant can be fully mixed, the uniformity of the coolant temperature is increased, and the heat exchange effect is improved.

[0048] Furthermore, the shape of the end surface of the pin fin 110 is a rhombus, and the shape of the end surface of the baffle 400 is a triangle.

[0049] like Figure 3 As shown, the end surface of the pin fin 110 is in a rhombus shape, and the end surface of the baffle 400 is in a triangular shape. The coolant flows more smoothly through the gap of the pin fin 110 with a rhombus end surface, and is easy to mix, reducing the flow resistance of the coolant and increasing the uniformity of the coolant temperature.

[0050] The baffle 400 with a triangular end face is relatively simple, and can not only form a barrier in the area of ​​the pin fins 110 corresponding to the spacing area, but also form a wave shape on both sides of the flow channel of the pin fins 110 corresponding to the installation area, so that the edge area of ​​the object to be cooled 300 can also have better heat dissipation. Compared with the two lateral sides of the flow channel of the coolant corresponding to the installation area formed as straight lines, it is necessary to just coincide with the edge of the object to be cooled 300, and the object to be cooled and the installation area can be slightly offset, as long as the position of the edge of the object to be cooled 300 corresponds to the wave-shaped area of ​​the coolant flow channel, reducing the need for alignment accuracy. Moreover, the wavy flow channel can concentrate the heat exchange of the coolant in the central area of ​​the object to be cooled.

[0051] Furthermore, among the two adjacent baffles 400 in each group of baffles 400, the baffle 400 adjacent to the liquid inlet end at least partially blocks the first gap channel and the second gap channel corresponding to the baffle 400 adjacent to the liquid outlet end, the first gap channel is a gap channel formed by extending the gap between the first pin wing 111 and the second pin wing 112 toward the liquid inlet end, the second gap channel is a gap channel formed by extending the gap between the first pin wing 111 and the third pin wing 113 toward the liquid inlet end, the first pin wing 111 is the pin wing 110 corresponding to the top corner of the baffle 400 located on one side of the liquid inlet end, and the second pin wing 112 and the third pin wing 113 are two pin wings 110 located near this baffle 400 and on both sides of the first pin wing 111 in the horizontal direction.

[0052] like Figure 2 and Figure 3As shown, the baffle 400 adjacent to the liquid inlet end blocks the first slit channel and the second slit channel corresponding to the baffle 400 adjacent to the liquid outlet end, thereby preventing the coolant from laterally passing through the slits of the pin fins 110 corresponding to the spacer area, thereby increasing the barrier to the coolant flowing toward the pin fins 110 corresponding to the spacer area.

[0053] It should be noted that the above are only optional examples. The baffle 400 adjacent to the liquid inlet end may also partially block the first slit channel and the second slit channel corresponding to the baffle 400 adjacent to the liquid outlet end, as long as the coolant is not allowed to transversely pass through the slits of the pin fins 110 corresponding to the spacing area. However, the blocking effect on the coolant is relatively weak. These should all be understood to be within the scope of the present utility model.

[0054] Furthermore, a protrusion 420 is formed in the middle of both sides of the baffle 400 in the horizontal direction. The protrusion 420 is located on the side of the baffle 400 close to the liquid inlet end. The protrusion 420 is inserted into the gap between two adjacent pin wings 110 in the middle of the longitudinal direction of the adjacent baffle.

[0055] like Figure 4 As shown, the baffle 400 includes a baffle body 410 and a protrusion 420. The baffle body 410 is formed in a triangle shape, and protrusions 420 are formed in the middle of both sides of the baffle 400 in the horizontal direction (protrusions 420 are arranged on both sides of the baffle body 410), that is, two protrusions 420 are formed on one baffle 400. The protrusions 420 can further reduce the flow of the coolant flowing into the pin fins 110 corresponding to the spacing area, so that the depth and width of the wavy waves at the edge of the flow channel where the coolant flows into the pin fin 110 area corresponding to the single installation area are reduced, which is better adapted to the heat dissipation of the object 300 to be cooled with lower edge heat generation, and increases the barrier capacity for the coolant flowing into the pin fin 110 area corresponding to the spacing area.

[0056] In some embodiments of the present invention, the height of the pin fin 110 is not less than the height of the baffle 400 .

[0057] That is to say, when the baffle 400 is inserted into the gap of the pin fin 110 , it will not be higher than the pin fin 110 , and will not affect the connection between the top of the pin fin 110 and the second substrate 200 .

[0058] In some embodiments of the present invention, the first substrate 100 and the second substrate 200 are connected by welding through solder plates.

[0059] The soldering of the first substrate 100 and the second substrate 200 can ensure that the first substrate 100 and the second substrate 200 are tightly connected and have good connection stability.

[0060] Furthermore, two positioning holes 230 are respectively formed at two opposite corners of the second substrate 200 , and the first surface of the first substrate 100 is provided with positioning pins 120 that can be inserted into the positioning holes 230 .

[0061] The positioning pins 120 of the first substrate 100 are inserted into the positioning holes 230 of the second substrate 200, so that the first substrate 100 and the second substrate 200 can be initially positioned, and then the first substrate 100 and the second substrate 200 after the initial positioning are placed in a brazing furnace, so as to braze the first substrate 100 and the second substrate 200. In this way, the first substrate 100 and the second clamping plate can be prevented from being offset during the brazing connection process, so that the first substrate 100 and the second substrate 200 are accurately aligned.

[0062] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A liquid cooling heat sink, characterized in that: The liquid cooling heat sink comprises: A first substrate, the first substrate comprises a first surface and a second surface facing each other, a plurality of rows and columns of pin fins are formed on the first surface of the first substrate, each column of the pin fins comprises a plurality of the pin fins arranged spaced apart in the longitudinal direction, and the plurality of columns of the pin fins are arranged spaced apart in the transverse direction, a liquid inlet and a liquid outlet arranged spaced apart in the longitudinal direction and provided for the flow of cooling liquid are also formed on the first surface of the first substrate, a plurality of mounting areas are formed on the second surface of the first substrate, the plurality of the mounting areas are spaced apart in the transverse direction, and the mounting areas are used to place objects to be cooled; At least one group of baffles, each group of baffles is inserted into the gaps between the pin fins corresponding to the spacing area, the spacing area is the area between the adjacent mounting areas, each group of baffles includes a plurality of baffles spaced apart in the longitudinal direction, each baffle is formed with a notch toward the liquid outlet end to prevent the coolant from entering the gaps between the pin fins in the notch; A second substrate is connected to the first surface of the first substrate, a groove is formed on the second substrate, the groove can cover the pin fin, the groove forms a liquid inlet hole corresponding to the liquid inlet end of the first substrate, and the groove forms a liquid outlet hole corresponding to the liquid outlet end of the first substrate.

2. The liquid cooling heat sink according to claim 1, characterized in that: The gaps between the pin fins are formed by saw blade cutting or wire cutting.

3. The liquid cooling heat sink according to claim 2, characterized in that: The width of the gap between adjacent pin fins is 0.5-0.8 mm.

4. The liquid cooling heat sink according to claim 1, characterized in that: The needle wings between adjacent rows are staggered.

5. The liquid cooling heat sink according to claim 4, characterized in that: The shape of the end surface of the pin fin is rhombus, and the shape of the end surface of the baffle is triangle.

6. The liquid cooling heat sink according to claim 5, characterized in that: In each group of baffles, two adjacent baffles, the baffle adjacent to the liquid inlet end at least partially blocks the first gap channel and the second gap channel corresponding to the baffle adjacent to the liquid outlet end, the first gap channel is a gap channel formed by extending the gap between the first pin wing and the second pin wing toward the liquid inlet end, the second gap channel is a gap channel formed by extending the gap between the first pin wing and the third pin wing toward the liquid inlet end, the first pin wing is the pin wing corresponding to the top corner of the baffle located on one side of the liquid inlet end, the second pin wing and the third pin wing are two pin wing located close to this baffle and on both sides of the first pin wing in the lateral direction.

7. The liquid cooling heat sink according to claim 6, characterized in that: The middle parts of both sides of the baffle are formed with protrusions, the protrusions are located on the side of the baffle close to the liquid inlet end, and the protrusions are inserted into the gaps of two adjacent pin wings in the middle part of the longitudinal direction of the baffle.

8. The liquid cooling heat sink according to claim 1, characterized in that: The height of the pin fin is not less than the height of the baffle.

9. The liquid cooling heat sink according to claim 1, characterized in that: The first substrate and the second substrate are connected by welding through a solder plate.

10. The liquid cooling heat sink according to claim 9, characterized in that: Two positioning holes are respectively formed at two opposite corners of the second substrate, and a positioning pin capable of being inserted into the positioning hole is disposed on the first surface of the first substrate.

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