Water cooling plate device with jet flow and micro-channel

Abstract

A water cooling plate device with jet flow and micro-channels comprises a substrate, a plurality of flow channel fins and a semi-open shell, the flow channel fins are arranged on the upper surface of the substrate at intervals to form the micro-channels, meanwhile, the flow channel fins surround the upper surface of an upper cover to form an opening, the opening is communicated with the micro-channels, and the semi-open shell is arranged on the substrate. The semi-open shell is coupled to the substrate to form a heat exchange cavity and comprises a spraying head, an input port and an output port, the input port is used for inputting cooling liquid, and the spraying head is connected to the input port and used for spraying the cooling liquid to the upper surface of the substrate through the opening, then flowing through the heat exchange cavity and outputting the cooling liquid through the output port; therefore, compared with the prior art, the water cooling plate device has the advantages that the cooling liquid can be directly splashed at the highest-temperature position, and the overall heat dissipation efficiency is greatly improved.

Description

Technical Field

[0001] The utility model relates to a water cooling plate device, in particular to a water cooling plate device with jets and micro channels, on which a shovel-tooth micro channel heat dissipation technology and a jet flow heat dissipation technology are further integrated. Background Art

[0002] As the thermal design power (TDP) and power density of high-computing chips and communication chips in servers and communication switches gradually increase, the temperature of the chips also gradually increases. The 3D stacked IC packaging also makes it more difficult to dissipate the heat generated by the bottom chip. Traditional air cooling technology has faced bottlenecks, and liquid cooling technology has emerged. Among them, cold plate liquid cooling technology has gradually become the mainstream heat dissipation technology on the market.

[0003] See also Figure 1 , Figure 1 Schematic diagram of a conventional water cooling plate device E is shown. Figure 1 As shown, the conventional water cooling plate device E includes a water cooling plate 80 and a semi-open shell 30. The conventional water cooling plate is a plate-shaped material. As the chip power exceeds 1,000W, the power density exceeds 100W / cm2, and the packaging structure is 3D stacked, the conventional water cooling plate device E can no longer dissipate heat for high-wattage, high-power density chips. In addition, as Figure 1 As shown, the input port 303 of the conventional semi-open shell 30 is disposed on the right side of the conventional water-cooling plate device E. When the coolant flows in from the input port, heat exchange is performed from the position of the water-cooling plate 80 closest to the input port, rather than the hot spot closest to the wafer (i.e., the heat source 90) with the highest temperature. As the power of the wafer soars, the conventional water-cooling plate device E still causes a large temperature difference across the wafer during heat dissipation and cannot effectively evenly distribute the temperature of the entire wafer.

[0004] Therefore, in order to solve the heat dissipation and cooling challenges brought about by the current gradual increase in chip power and power density, it is necessary to provide a more efficient chip cooling and heat equalization water cooling plate device. Utility Model Content

[0005] In view of this, the purpose of the utility model is to provide a water-cooled plate device with jets and microchannels, which has a simple structure and is easy to operate and maintain, and can solve the heat dissipation and heat dissipation challenges brought about by the current gradual increase in chip power and power density, and provide a more efficient water-cooled plate device for chip heat dissipation and heat equalization.

[0006] To achieve the above-mentioned purpose, the utility model discloses a water-cooling plate device with jets and microchannels, which is characterized by comprising:

[0007] a substrate having an upper surface;

[0008] A plurality of flow channel fins are disposed at intervals on the upper surface of the substrate to form a plurality of micro flow channels and are simultaneously surrounded to form an opening, and the opening and the micro flow channels are interconnected; and

[0009] A semi-open shell is coupled to the substrate to form a heat exchange cavity. The semi-open shell includes a spray head and has an input port for inputting cooling liquid and an output port. The spray head is connected to the input port to spray the cooling liquid through the opening onto the upper surface of the substrate first, and then flows through the heat exchange cavity and outputs the cooling liquid through the output port.

[0010] The flow channel fins are integrally formed and spaced apart on the upper surface of the substrate to form the micro flow channels.

[0011] Wherein, the channel width of the microchannels is less than or equal to 1 mm.

[0012] The semi-open shell further has a top plate and a side plate, the input port is arranged on the top plate, and the output port is arranged on the top plate or the side plate.

[0013] Wherein, the shower head is arranged on the top plate and located in the heat exchange cavity.

[0014] The shower head has a shower port, which is located in the opening so as to spray the cooling liquid to the upper surface of the substrate located in the opening.

[0015] Among them, the semi-open shell also has a top plate and a side plate, the top plate is provided with a top plate flow channel and has a top plate side end, the input port is arranged at the top plate side end, the top plate flow channel connects the input port and the sprinkler head, and the output port is arranged on the side plate.

[0016] The flow channel fins are additionally surrounded by a micro-channel buffer area, and the micro-channel buffer area is formed between the upper surface of the substrate and the micro-channels.

[0017] The substrate further has a lower surface for contacting a heat source.

[0018] In summary, the utility model provides a water-cooled plate device with jets and microchannels, which is integrally formed on the upper surface of the substrate through the flow channel fins, and the middle of the flow channel fins is further ring-shaped to form an opening and a microchannel buffer zone. When the water-cooled plate device of the utility model is used for liquid cooling and heat dissipation, this opening can be used to accommodate a shower head. By arranging the shower head in a semi-open shell, and the spray port of the shower head is vertically arranged at the hot spot with the highest temperature for the heat source (i.e., the chip), the coolant can be directly splashed along the shower head and impact the opening surface on the substrate close to the hot spot of the heat source for forced heat exchange. Furthermore, in addition to increasing the heat dissipation surface area through each flow channel fin, after the coolant impacts the opening surface, the coolant can also be diverted and flow through the large-area heat dissipation fins along the direction of the microchannel setting and further forced heat exchange is performed, so that the coolant takes the heat energy away from the radiator. Thereby, the heat energy generated by the power chip is effectively dissipated and the overall heat dissipation efficiency is greatly increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of a conventional water cooling plate arrangement is shown.

[0020] Figure 2 A schematic diagram of a water cooling plate device with jets and microchannels according to a specific embodiment of the present invention is shown.

[0021] Figure 3 Shows the Figure 2 Schematic diagram of the substrate and flow channel fins from another perspective.

[0022] Figure 4 A schematic diagram of a water cooling plate device with jets and microchannels according to another specific embodiment of the present invention is shown.

[0023] Figure 5 A schematic diagram of a water cooling plate device with jets and microchannels according to another specific embodiment of the present invention is shown.

[0024] Figure 6 A schematic diagram of a water cooling plate device with jets and microchannels according to another specific embodiment of the present invention is shown.

[0025] Figure 7 A schematic diagram of a water cooling plate device with jets and microchannels according to another specific embodiment of the present invention is shown.

[0026] Figure 8 A schematic diagram of a water cooling plate device with jets and microchannels according to another specific embodiment of the present invention is shown.

[0027] Fig. 9 A schematic diagram of a water cooling plate device with jets and microchannels according to another specific embodiment of the present invention is shown. DETAILED DESCRIPTION

[0028] In order to make the advantages, spirit and features of the present invention easier and clearer to understand, the following will be described and discussed in detail with reference to the attached drawings and specific embodiments. It should be noted that these specific embodiments are only representative embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. exemplified therein are not intended to limit the present invention or the corresponding specific embodiments. In addition, the components in the figure are only used to express their relative positions and are not drawn according to their actual proportions. The step numbers of the present invention are only used to separate different steps and do not represent the order of the steps, so it is necessary to explain them first.

[0029] Please also read Figure 2 as well as Figure 3 , Figure 2 A schematic diagram of a water cooling plate device 1 with jets and microchannels according to a specific embodiment of the utility model is shown. Figure 3 Shows the Figure 2 Schematic diagram of the substrate 10 and the flow channel fin 20 at another viewing angle. Figure 2 as well as Figure 3 As shown, the water-cooled plate device 1 with jets and microchannels of this specific embodiment includes a substrate 10, a plurality of channel fins 20, and a semi-open shell 30. The substrate 10 has an upper surface 101 and a lower surface 102; the plurality of channel fins 20 are arranged at intervals on the upper surface 101 of the substrate 10 to form a plurality of microchannels 201, and the plurality of channel fins 20 are arranged on the upper surface 101 of the substrate 10 to form an opening 202, and the opening 202 is mutually connected with each microchannel 201. The semi-open shell 30 is coupled to the substrate 10 to form a heat exchange chamber 301 inside thereof, and the semi-open shell 30 includes a shower head 302, a top plate 305, and a side plate 306, and has an input port 303 and an output port 304. The spray head 302 is disposed on the top plate 305 and is located in the heat exchange chamber 301; the input port 303 is disposed on the top plate 305 and is used to input the cooling liquid and is connected to the spray head 302; the output port 304 is disposed on the side plate 306. The spray head 302 is used to first spray the cooling liquid onto the upper surface 101 of the substrate 10 through the opening 202, and then flow through the heat exchange chamber 301 and output the cooling liquid through the output port 304.

[0030] In practice, when the chip (i.e., the heat source 90) generates a large amount of heat energy during operation, the lower surface 102 of the substrate 10 of the water-cooled plate device 1 with jets and micro-channels contacts the heat source 90 and acts as a heat absorption area to preferentially absorb the heat energy of the heat source 90, and then the heat energy is transferred from the substrate 10 to the flow channel fins 20 by heat conduction. Figure 2 As shown, Figure 2The arrows shown in FIG. 2 are the coolant flow direction F. The coolant flows in from the input port 303 on the top plate 305 and flows along the top plate flow channel 3051 through the spray port of the spray head 302. Then, the coolant can be directly sprayed from the spray port onto the upper surface 101 of the substrate 10 corresponding to the opening 202 for heat exchange. Figure 3 ,like Figure 3 As shown, after the coolant impacts the upper surface 101 of the substrate 10 corresponding to the opening 202, the coolant will be guided and flow through the large-area channel fins 20 along the direction in which the microchannel 201 is set and further forced heat exchange is performed, so that the coolant takes away the heat energy from the water-cooled plate device with jets and microchannels of this specific embodiment. Finally, the coolant is discharged from the output port 304 of the side plate 306 of the semi-open shell 30, completing a liquid cooling cycle of heat exchange.

[0031] In practice, the flow channel fins 20 of the water cooling plate device 1 with jet and micro-channels of the present embodiment can be processed by a tooth-cutting process so that the flow channel fins 20 are integrally formed on the substrate 10, and the spray head 302 has a spray port (not shown) located in the opening 202 to spray the cooling liquid on the upper surface 101 of the substrate 10 located in the opening 202. It is worth noting that Figure 2 As shown, the position of the opening 202 of the water-cooled plate device 1 with jets and microchannels in this specific embodiment corresponds to the position of the heat source 90. In other words, the positions of the opening 202 and the heat source 90 are at the shortest vertical distance. Therefore, after the coolant flows in from the input port 303 of the semi-open shell 30, the coolant can flow out directly from the spray port of the spray head 302 and directly splash onto the upper surface with the shortest distance from the heat source 90, so that the coolant can directly perform forced heat exchange and dissipate heat at the place with the highest temperature.

[0032] Furthermore, after the coolant impacts the upper surface 101 corresponding to the opening 202, the coolant will be adjusted in flow rate by the microchannel buffer zone 203 formed by the channel fins 20 between the upper surface 101 of the substrate 10 and the microchannel 201, and the coolant closest to both sides can also be forced to exchange heat through the channel formed with the semi-open shell, thereby greatly increasing the overall heat dissipation efficiency. In practice, the coolant can be one of water, acetone, ammonia, methanol, tetrachloroethane and hydrofluorocarbon chemical refrigerants, but is not limited to this, and the coolant can also be other fluids that absorb heat and take away heat energy. Please note that considering the heat exchange area of ​​the microchannel and the flow rate of the coolant flowing through, the flow channel width of the microchannel 201 of the water-cooled plate device 1 with jets and microchannels of the utility model is less than or equal to 1 mm. In practice, the flow channel width of the microchannel, the thickness of the flow channel fins, the microchannel buffer area and the number of output ports are not limited to this and can be adjusted according to the design.

[0033] The present invention further provides other embodiments. Figure 4 , Figure 4 FIG. 2 is a schematic diagram showing a water cooling plate device 2 with jets and microchannels according to another specific embodiment of the present invention. Figure 4 As shown, since there are electronic components higher than the heat source 90 near the heat source 90, the substrate 11 of this embodiment can avoid the electronic components with higher height. The other devices of this embodiment are substantially the same as those of the above embodiments, so they are not described here.

[0034] See also Figure 5 , Figure 5 FIG. 2 shows a schematic diagram of a water cooling plate device 3 with jets and microchannels according to another specific embodiment of the present invention. Figure 5 As shown, the substrate 12 of the water cooling plate device 3 with jets and microchannels of this specific embodiment is provided with a recessed opening 103, and this recessed opening 103 can be processed by milling or using a mold. When the coolant flows out from the spray port, the coolant can directly splash the opening surface of the recessed opening 103, thereby increasing the heat dissipation efficiency. The other devices of this specific embodiment are substantially the same as the corresponding devices of the previous specific embodiment, so they are not repeated here.

[0035] See also Figure 6 , Figure 6 FIG. 4 is a schematic diagram showing another specific embodiment of the present invention, which is a water cooling plate device 4 with jets and microchannels. Figure 6 As shown, the water cooling plate device 4 with jet and micro-channel of this specific embodiment includes a substrate 13, so that the cooling liquid can directly splash the opening surface of the recessed opening 103 of the substrate 10, thereby increasing the heat dissipation efficiency. The substrate 13 can also avoid the electronic components with higher height. The other devices of this specific embodiment are substantially the same as the corresponding devices of the above-mentioned specific embodiments, so they are not repeated here.

[0036] Furthermore, if the space of the electronic product has a height limit, due to the height limit, the input port cannot directly correspond to the position vertically set to the heat source, and the utility model further provides other embodiments. Figure 7 , Figure 7 FIG. 2 shows a schematic diagram of a water cooling plate device 5 with jets and microchannels according to another specific embodiment of the present invention. Figure 7As shown, the semi-open shell 31 of the water-cooled plate device 5 with jets and microchannels of this specific embodiment further includes a top plate 305 and a side plate 306, and the top plate 305 is provided with a top plate channel 3051, and the top plate channel 3051 is used to connect the input port 303 and the spray head 302. Among them, the input port 303 is arranged on the top plate side end 3052 of the top plate 305 and is connected to the top plate channel 3051. After the coolant flows in from the input port 303 on the top plate side end 3052, it flows along the top plate channel 3051 to the spray head 302, and further the coolant directly splashes and impacts the surface of the opening 202 on the substrate 10 and absorbs the heat energy of the power chip therefrom, and then the coolant further exchanges heat with each flow channel fin 20 along the microchannel 201 structure to take away the remaining heat energy again and flow through the heat exchange cavity 301, and finally flows out from the output port 304 of the side plate 306 to complete a heat exchange liquid cooling cycle. Please note that Figure 7 The input port is shown to be disposed on the right side of the top plate, but the location is not limited thereto, and the output port may also be disposed in the top plate. Other devices of this embodiment are substantially the same as those corresponding to the aforementioned embodiments, and therefore will not be described in detail here.

[0037] Next, the number of spray ports on the spray head is not limited to one group, and the present invention further provides other types of water cooling plate devices. Figure 8 , Figure 8 FIG. 2 shows a schematic diagram of a water cooling plate device 6 with jets and microchannels according to another specific embodiment of the present invention. Figure 8 As shown, the spray head 302 of the water-cooled plate device 6 with jets and microchannels of this specific embodiment is further provided with a plurality of spray ports 3021. In practice, the spray ports can be drilled into the semi-open shell by a computer numerical control (CNC) processing machine, and the number of spray ports in this specific embodiment is 4, but the number and aperture can be designed according to actual needs. In actual applications, after the coolant flows in from the input port 303, the coolant is splashed from the plurality of spray ports 3021 and impacts the surface of the opening 202. The other devices of this specific embodiment are substantially the same as the corresponding devices of the aforementioned specific embodiments, so they are not repeated here.

[0038] Furthermore, the water cooling plate device with jets and microchannels of the present invention can also be installed on electronic products with multiple heat sources at the same time, please refer to Fig. 9 , Fig. 9 FIG. 2 shows a schematic diagram of a water cooling plate device 7 with jets and microchannels according to another specific embodiment of the present invention. Fig. 9As shown, the substrate 14 of the water cooling plate device 7 with jet and micro-channels of this specific embodiment is provided with three sets of channel fins 20 at the same time, and the three sets of channel fins 20 all have openings 202, and can be connected to three heat sources 90 at the same time. In practice, the number and arrangement of the channel fins 20 can be optimized and designed according to actual needs. The other devices of this specific embodiment are substantially the same as the corresponding devices of the above-mentioned specific embodiments, so they are not repeated here.

[0039] In summary, the utility model provides a water-cooled plate device with jets and microchannels, which is integrally formed on the upper surface of the substrate through the flow channel fins, and the middle of the flow channel fins is further ring-shaped to form an opening and a microchannel buffer zone. When the water-cooled plate device of the utility model is used for liquid cooling and heat dissipation, this opening can be used to accommodate a shower head. By arranging the shower head in a semi-open shell, and the spray port of the shower head is vertically arranged at the hot spot with the highest temperature for the heat source (i.e., the chip), the coolant can be directly splashed along the shower head and impact the opening surface on the substrate close to the hot spot of the heat source for forced heat exchange. Furthermore, in addition to increasing the heat dissipation surface area through each flow channel fin, after the coolant impacts the opening surface, the coolant can also be diverted and flow through the large-area heat dissipation fins along the direction of the microchannel setting and further forced heat exchange is performed, so that the coolant takes the heat energy away from the radiator. Thereby, the heat energy generated by the power chip is effectively dissipated and the overall heat dissipation efficiency is greatly increased.

[0040] The above detailed description of the preferred embodiments is intended to more clearly describe the features and spirit of the present invention, but is not intended to limit the scope of the present invention by the preferred embodiments disclosed above. On the contrary, the purpose is to cover various changes and arrangements with equivalents within the scope of the patent scope to be applied for by the present invention. Therefore, the scope of the patent scope applied for by the present invention should be interpreted in the broadest sense based on the above description, so as to cover all possible changes and arrangements with equivalents.

Claims

1. A water-cooled plate device with jets and microchannels, characterized in that Contains: a substrate having an upper surface; A plurality of flow channel fins are disposed at intervals on the upper surface of the substrate to form a plurality of micro flow channels and are simultaneously surrounded to form an opening, and the opening and the micro flow channels are interconnected; and A semi-open shell is coupled to the substrate to form a heat exchange cavity. The semi-open shell includes a spray head and has an input port for inputting cooling liquid and an output port. The spray head is connected to the input port to spray the cooling liquid through the opening onto the upper surface of the substrate first, and then flows through the heat exchange cavity and outputs the cooling liquid through the output port.

2. The water-cooled plate device with jets and microchannels according to claim 1, characterized in that: The flow channel fins are integrally formed and spaced apart on the upper surface of the substrate to form the micro flow channels.

3. The water-cooled plate device with jets and microchannels according to claim 2, characterized in that: The channel width of the micro channels is less than or equal to 1 mm.

4. The water-cooled plate device with jets and microchannels according to claim 1, characterized in that: The semi-open shell further has a top plate and a side plate. The input port is arranged on the top plate, and the output port is arranged on the top plate or the side plate.

5. The water-cooled plate device with jets and microchannels according to claim 4, characterized in that: The shower head is arranged on the top plate and is located in the heat exchange cavity.

6. The water-cooled plate device with jets and microchannels according to claim 1, characterized in that: The shower head has a shower port, and the shower port is located in the opening so as to spray the cooling liquid close to the upper surface of the substrate located in the opening.

7. The water-cooled plate device with jets and microchannels according to claim 1, characterized in that: The semi-open shell further has a top plate and a side plate, the top plate is provided with a top plate flow channel and has a top plate side end, the input port is provided at the top plate side end, the top plate flow channel connects the input port and the sprinkler head, and the output port is provided at the side plate.

8. The water-cooled plate device with jets and microchannels according to claim 1, characterized in that: The flow channel fins are additionally surrounded by a micro-flow channel buffer area, and the micro-flow channel buffer area is formed between the upper surface of the substrate and the micro-flow channels.

9. The water-cooled plate device with jets and microchannels according to claim 1, characterized in that: The substrate also has a lower surface for contacting a heat source.

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