Efficient die bonder

Abstract

The utility model relates to the field of die bonders, and discloses an efficient die bonder which comprises a die bonder, a placement frame is fixedly mounted at the bottom of the front end face of the die bonder, a movable support is movably mounted in the middle of the front end face of the die bonder and located above the placement frame, a supporting rod is fixedly mounted at the bottom of the front end face of the movable support, and a connecting disc is hinged to the bottom end of the supporting rod. Fixed insertion holes are formed in the edge of the upper surface of the connecting disc at equal intervals, fixed sleeves are fixedly installed at the positions, close to the fixed insertion holes, of the bottom end of the connecting disc, and movable rods are movably installed in the fixed sleeves; the dipping heads for dipping the electronic components are adjusted to move by rotating the connecting disc, so that the effect of quickly dipping and bonding different electronic components is achieved, the overall bonding efficiency of a circuit board is improved, the problem that the process of repeatedly dipping the electronic components is tedious when the bonding equipment is used is solved, and the bonding efficiency of the circuit board is improved. And the labor intensity when people manually adjust and dip the adhesive sheet is reduced.

Description

Technical Field

[0001] The present application relates to the field of wafer bonding machines, and in particular to a high-efficiency wafer bonding machine. Background Art

[0002] A die bonder is a device used to bond or encapsulate electronic components. It is commonly used in the electronics manufacturing industry to bond electronic components (such as chips, resistors, capacitors, etc.) to printed circuit boards (PCBs). Die bonders use special glue or adhesives to bond electronic components to designated locations on the PCB and ensure that they have good soldering contact with the PCB.

[0003] The manual-automatic die bonding machine is a die bonding machine that integrates manual and automatic functions. In manual mode, the operator can manually control the machine to make adjustments, load components and PCB boards, etc. In automatic mode, the machine can automatically perform the die bonding and packaging process according to the preset program, including automatic material picking, component pasting, detection and correction, etc.

[0004] Due to the large number of electronic components on the circuit board, when people manually operate the dipping head to dip the electronic components, they need to dip the electronic components one by one and repeatedly adjust the position of the dipping head on the circuit board. Multiple operations increase the labor intensity when people are gluing the components and also have a certain impact on the gluing efficiency of the circuit board (PCB).

[0005] In view of the above-mentioned related technologies, the inventor believes that the dipping head of the wafer bonding machine has the defect of multiple and repeated dipping operations which is inconvenient. Therefore, an efficient wafer bonding machine is proposed to solve the above-mentioned problem. Utility Model Content

[0006] In order to solve the problem of inconvenient operation of the dipping head of a wafer bonding machine due to repeated dipping, the present application provides a high-efficiency wafer bonding machine.

[0007] The present application provides a high-efficiency die bonding machine adopting the following technical solution:

[0008] A high-efficiency wafer bonding machine comprises a wafer bonding device, a placement rack is fixedly installed at the bottom of the front end surface, a movable bracket is movably installed in the middle of the front end surface of the wafer bonding device and located above the placement rack, a support rod is fixedly installed at the bottom of the front end surface of the movable bracket, a connecting disk is hinged at the bottom end of the support rod, and fixed sockets are equidistantly provided on the edge of the upper surface of the connecting disk, a fixed sleeve is fixedly installed at the bottom end of the connecting disk near the fixed socket, a movable rod is movably installed inside the fixed sleeve, a dipping head is fixedly connected to the bottom end of the movable rod extending to the outside of the fixed sleeve, a No. 1 spring is sleeved on one side of the outer surface of the movable rod and a sliding mechanism is also provided above the connecting disk for adjusting the dipping head at different positions to dip electronic components.

[0009] Preferably, the sliding mechanism includes a movable sleeve, which is movably sleeved on the outer surface of the support rod, a No. 2 spring is sleeved on one side of the outer surface of the support rod and located below the movable sleeve, a connecting plate is welded on one side of the outer surface of the movable sleeve, and a fixed plug rod is fixedly installed on the bottom edge of the connecting plate.

[0010] Preferably, the outer diameter of the movable rod is smaller than the inner diameter of the bottom opening of the fixed sleeve, a limiting clamp is welded to the middle of the top end of the movable rod, the inner diameter of the bottom opening of the fixed sleeve is smaller than the outer diameter of the limiting clamp, and the fixed sleeve and the limiting clamp are engaged with each other.

[0011] Preferably, the outer diameter of the fixed rod is smaller than the inner diameter of the fixed hole and the fixed sleeve, the bottom of one side of the fixed rod passes through the fixed hole and extends into the fixed sleeve, and the fixed hole and the fixed sleeve are both interlocked with the fixed rod.

[0012] Preferably, a fixed baffle is integrally formed at the bottom end of the movable sleeve, the outer diameter of the fixed baffle is smaller than the outer diameter of the No. 2 spring, and the No. 2 spring is located between the connecting disc and the fixed baffle.

[0013] In summary, this application includes the following beneficial technical effects:

[0014] Different electronic components are dipped at the bottom ends of multiple dipping heads under the connecting disc. When in use, the movable sleeve is rotated to adjust the fixed plug rod to the sticking position, and the connecting disc is rotated at the same time to adjust the single dipping head of the required electronic component to the sticking position, so that the fixed plug rod is inserted into the fixed socket, and the movable rod is driven to move, and the electronic component is pasted to the corresponding position of the circuit board. Compared with the prior art, this solution has the effect of facilitating the rapid dipping of different electronic components into the sticking film, improves the overall sticking efficiency of the circuit board, solves the problem of cumbersome repeated dipping of electronic components by the sticking equipment when in use, and reduces the labor intensity of people manually adjusting the dipping of the sticking film. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the embodiment of the application;

[0016] Figure 2 It is a schematic diagram of the structure of the connecting disc in the embodiment of the application;

[0017] Figure 3 It is a structural schematic diagram of the movable rod in the embodiment of the application;

[0018] Figure 4 is a schematic diagram of the cross-sectional structure of a fixed sleeve in an embodiment of the application;

[0019] Explanation of the reference numerals: 1. Sheet bonding equipment; 2. Placement rack; 3. Movable bracket; 4. Support rod; 5. Connecting disc; 6. Fixed socket; 7. Fixed sleeve; 8. Movable rod; 9. Dipping head; 10. No. 1 spring; 11. No. 2 spring; 12. Movable sleeve; 13. Connecting plate; 14. Fixed plug rod; 15. Fixed baffle. DETAILED DESCRIPTION

[0020] The following is combined with Figure 1-4 This application is described in further detail.

[0021] The present application embodiment discloses a high-efficiency die bonding machine. Figure 1-4 The movable bracket 3 is movably installed on the middle part of the front end surface of the wafer bonding device 1, and a supporting rod 4 is fixedly installed on the bottom of the front end surface of the movable bracket 3. A connecting disc 5 is hinged on the bottom end of the supporting rod 4. Fixed sockets 6 are equidistantly provided on the edge of the upper surface of the connecting disc 5. A fixed sleeve 7 is fixedly installed near the fixed socket 6 at the bottom end of the connecting disc 5. A movable rod 8 is movably installed inside the fixed sleeve 7. The outer diameter of the movable rod 8 is smaller than the inner diameter of the opening at the bottom end of the fixed sleeve 7. A limiting card is welded in the middle part of the top of the movable rod 8. The inner diameter of the opening at the bottom end of the fixed sleeve 7 is smaller than the outer diameter of the limiting card. The fixed sleeve 7 and the limiting card are engaged with each other. A dipping head 9 is fixedly connected to the bottom end of the movable rod 8 extending to the outside of the fixed sleeve 7. A spring 10 is sleeved on one side of the outer surface of the movable rod 8 inside the fixed sleeve 7. A sliding mechanism is also provided above the connecting disc 5 for adjusting the dipping head 9 at different positions to dip electronic components.

[0022] By dipping different electronic components at the bottom ends of multiple dipping heads 9 under the connecting disc 5, when in use, the movable sleeve 12 is rotated to adjust the fixed insertion rod 14 to the sticking position, and at the same time, the connecting disc 5 is rotated to adjust the single dipping head 9 of the required electronic component to the sticking position, so that the electronic component dipped at the bottom end of the dipping head 9 slides down and sticks to the corresponding position of the circuit board, and the movable movable rod 8 drives the No. 1 spring 10 to be compressed. After the sticking is completed, the movable rod 8 is reset and raised to the inside of the fixed sleeve 7 under the action of the No. 1 spring 10, and the connecting disc 5 is rotated to adjust the dipping heads 9 at other positions again to perform the sticking operation, which reflects the reset effect of the dipping head 9 after the movable sticking.

[0023] Reference Figure 3 and Figure 4The sliding mechanism includes a movable sleeve 12, which is movably sleeved on the outer surface of the support rod 4. A No. 2 spring 11 is sleeved on one side of the outer surface of the support rod 4 and located below the movable sleeve 12. A connecting plate 13 is welded on one side of the outer surface of the movable sleeve 12. A fixed plug rod 14 is fixedly installed on the bottom edge of the connecting plate 13. The outer diameter of the fixed plug rod 14 is smaller than the inner diameter of the fixed socket 6 and the fixed sleeve 7. The bottom of one side of the fixed plug rod 14 passes through the fixed socket 6 and extends to the inside of the fixed sleeve 7. The fixed socket 6 and the fixed sleeve 7 are both engaged with the fixed plug rod 14. A fixed baffle 15 is integrally formed at the bottom end of the movable sleeve 12. The outer diameter of the fixed baffle 15 is smaller than the outer diameter of the No. 2 spring 11. The No. 2 spring 11 is located between the connecting disc 5 and the fixed baffle 15.

[0024] By pulling the connecting plate 13 downward along the outer surface of the support rod 4, the movable sleeve 12 pushes the No. 2 spring 11 to be compressed, and the fixed plug rod 14 is inserted into the fixed socket 6, so that the fixed plug rod 14 pushes the movable rod 8 inside the fixed sleeve 7 to move downward. After the bonding is completed, the connecting plate 13 is released, so that the movable sleeve 12 is reset and movable under the action of the No. 2 spring 11, and the fixed plug rod 14 is movable and slides out of the fixed socket 6, which reflects the reset effect of the fixed plug rod 14 after adjusting the movable rod 8.

[0025] The implementation principle of an efficient wafer bonding machine in the embodiment of the present application is as follows: different electronic components are dipped at the bottom ends of multiple dipping heads 9 under the connecting disc 5. When in use, the movable sleeve 12 is rotated to adjust the fixed plug rod 14 to the wafer bonding position, and the connecting disc 5 is rotated to adjust the single dipping head 9 of the required electronic component to the wafer bonding position, and the connecting plate 13 is pulled downward along the outer surface of the support rod 4, so that the movable sleeve 12 pushes the second spring 11 to be compressed, and the fixed plug rod 14 is inserted into the fixed plug hole 6, so that the fixed plug rod 14 pushes the movable rod 8 inside the fixed sleeve 7 to move downward, thereby making the electronic components dipped at the bottom end of the dipping head 9 The component slides down and sticks to the corresponding position of the circuit board, and the movable movable rod 8 drives the No. 1 spring 10 to be compressed, and the connecting plate 13 is loosened, so that the movable rod 8 is reset and rises to the inside of the fixed sleeve 7, and at the same time, the fixed plug rod 14 is reset and movable to slide out of the fixed socket 6, and the connecting disc 5 is rotated to adjust the dipping head 9 in other positions again to perform the sticking operation; compared with the prior art, this solution has the effect of facilitating the rapid dipping of sticky films for different electronic components, improves the overall sticking efficiency of the circuit board, solves the problem that it is cumbersome to repeatedly dip the electronic components in the sticking device 1 when in use, and reduces the labor intensity of people manually adjusting the dipping of sticky films.

[0026] Finally, a few points should be explained: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, which may refer to mechanical connection or electrical connection, or internal communication between two components, or direct connection. "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may change;

[0027] Secondly: In the drawings of the embodiments disclosed in the present utility model, only the structures related to the embodiments disclosed in the present utility model are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present utility model can be combined with each other;

[0028] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.

[0029] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A high-efficiency wafer bonding machine, comprising a wafer bonding device (1), a placement rack (2) fixedly mounted at the bottom of the front end surface, and a movable bracket (3) movably mounted above the placement rack (2) in the middle of the front end surface of the wafer bonding device (1), characterized in that: A support rod (4) is fixedly installed at the bottom of the front end surface of the movable bracket (3), and a connecting disc (5) is hinged at the bottom end of the support rod (4). Fixed sockets (6) are equidistantly provided on the edge of the upper surface of the connecting disc (5). A fixed sleeve (7) is fixedly installed at the bottom end of the connecting disc (5) near the fixed socket (6). A movable rod (8) is movably installed inside the fixed sleeve (7). A dipping head (9) is fixedly connected to the bottom end of the movable rod (8) extending to the outside of the fixed sleeve (7). A spring (10) is sleeved on one side of the outer surface of the movable rod (8) inside the fixed sleeve (7). A sliding mechanism is also provided above the connecting disc (5) for adjusting the dipping head (9) at different positions to dip electronic components.

2. A high-efficiency die bonding machine according to claim 1, characterized in that: The sliding mechanism comprises a movable sleeve (12), the movable sleeve (12) being movably sleeved on the outer surface of the support rod (4), a second spring (11) being sleeved on one side of the outer surface of the support rod (4) and located below the movable sleeve (12), a connecting plate (13) being welded on one side of the outer surface of the movable sleeve (12), and a fixed plug rod (14) being fixedly mounted on the bottom edge of the connecting plate (13).

3. The high-efficiency die bonding machine according to claim 1, characterized in that: The outer diameter of the movable rod (8) is smaller than the inner diameter of the bottom opening of the fixed sleeve (7); a limiting clamping plate is welded to the middle of the top end of the movable rod (8); the inner diameter of the bottom opening of the fixed sleeve (7) is smaller than the outer diameter of the limiting clamping plate; the fixed sleeve (7) and the limiting clamping plate are mutually engaged.

4. The high-efficiency die bonding machine according to claim 2, characterized in that: The outer diameter of the fixed plug rod (14) is smaller than the inner diameters of the fixed plug hole (6) and the fixed sleeve (7); the bottom of one side of the fixed plug rod (14) passes through the fixed plug hole (6) and extends into the interior of the fixed sleeve (7); the fixed plug hole (6) and the fixed sleeve (7) are both interlocked with the fixed plug rod (14).

5. The high-efficiency die bonding machine according to claim 2, characterized in that: A fixed baffle (15) is integrally formed at the bottom end of the movable sleeve (12); the outer diameter of the fixed baffle (15) is smaller than the outer diameter of the No. 2 spring (11); and the No. 2 spring (11) is located between the connecting disc (5) and the fixed baffle (15).

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