Thermocompression bonding equipment

Abstract

The utility model provides a thermocompression bonding device. The thermocompression bonding device comprises a working chamber; the pressurizing device is arranged in the working chamber and is provided with an upper pressurizing part and a lower pressurizing part, and each of the upper pressurizing part and the lower pressurizing part is provided with a water cooling device and a heating block abutted against the water cooling device; the heating block of the upper pressurizing part and the heating block of the lower pressurizing part are opposite to each other so as to be combined to carry out hot pressing operation on a workpiece group to form a finished product; the two bidirectional water-cooling conveying platforms are arranged on two sides of the working chamber and are used for feeding the workpiece group into the pressurizing device or receiving the finished product sent out from the pressurizing device and cooling the finished product; and the control module is used for controlling the temperature of the heating block of the upper pressurizing part and the heating block of the lower pressurizing part and the pressure between the heating blocks of the upper pressurizing part and the heating block of the lower pressurizing part.

Description

Technical Field

[0001] The utility model relates to a thermocompression bonding device, in particular to a thermocompression bonding device capable of optimizing the thermocompression bonding effect. Background Art

[0002] Thermocompression bonding technology is to heat and pressurize two workpieces to form a module, wherein the two workpieces can be electronic components, circuit substrates, metal substrates or wafers.

[0003] However, existing thermocompression bonding technology has the problem of excessive temperature or pressure. For 3D (three-dimensional) packaging, if excessive pressure and / or high temperature are applied to the two workpieces during the bonding process, the thermal stress inside the bonded module will be significantly increased, thereby reducing the performance and service life of the module.

[0004] In order to solve the above problems, a novel thermal compression bonding device is urgently needed in the art. Utility Model Content

[0005] The main purpose of the utility model is to provide a hot pressing bonding device, which can accurately control the compression amount of a workpiece group by regulating the temperature and pressure of the hot pressing operation, so that the hot pressing operation is performed along a compression curve and the effect of the hot pressing operation is optimized.

[0006] Another object of the present invention is to provide a hot pressing bonding device, which can provide an insulation effect by arranging a water cooling device on the outer surface of the hot pressing device, so that other devices of the hot pressing bonding device will not be subjected to high temperature and workers can be prevented from being scalded.

[0007] Another object of the present invention is to provide a thermal compression bonding device, which can optimize the thermal compression bonding effect of a workpiece group by forming an anti-oxidation atmosphere in a working chamber.

[0008] Another object of the present invention is to provide a hot compression bonding device, which can deliver a workpiece group into a pressurizing device or receive finished products delivered from the pressurizing device and cool the finished products to improve production efficiency through a two-way water-cooling conveying platform.

[0009] To achieve the above object, a thermal compression bonding device is proposed, which has:

[0010] A working chamber having an anti-oxidation atmosphere;

[0011] A pressurizing device is disposed in the working chamber and has an upper pressurizing portion and a lower pressurizing portion. The upper pressurizing portion and the lower pressurizing portion each have a water cooling device and a heating block abutting against the water cooling device. The heating block of the upper pressurizing portion and the heating block of the lower pressurizing portion are opposite to each other to perform a hot pressing operation on a workpiece group to form a finished product.

[0012] A first bidirectional water-cooling conveying platform is disposed on one side of the working chamber and is used to convey the workpiece group into the pressurizing device or to receive the finished product conveyed from the pressurizing device and cool the finished product;

[0013] a second bidirectional water-cooling conveying platform, disposed at the other side of the working chamber, for conveying the workpiece set into the pressurizing device or receiving the finished product conveyed from the pressurizing device and cooling the finished product; and

[0014] A control module is electrically coupled to the pressurizing device and is used to control the temperature of the heating block of the upper pressurizing portion and the heating block of the lower pressurizing portion and the pressure therebetween.

[0015] In one embodiment, the pressurizing device has a pressure detector, which is disposed on the upper pressurizing portion or the lower pressurizing portion and is electrically coupled to the control module to provide a pressure sensing value to the control module.

[0016] In one embodiment, the pressure detector is a load cell.

[0017] In one embodiment, the pressurizing device has a temperature detector, which is disposed on the upper pressurizing portion or the lower pressurizing portion and is electrically coupled to the control module to provide a temperature sensing value to the control module.

[0018] In one embodiment, the control module adjusts the hot pressing operation through the temperature sensing value and the pressure sensing value to precisely control the compression amount of the workpiece set, so that the hot pressing operation is performed along a compression curve.

[0019] In one embodiment, the thermal compression bonding equipment has a gas supply device for evacuating the working chamber and then supplying a gas into the working chamber to form the anti-oxidation atmosphere.

[0020] In possible embodiments, the gas may be nitrogen or hydrogen.

[0021] In one embodiment, the workpiece set includes a first workpiece and a second workpiece, and the first workpiece and the second workpiece can be electronic components, circuit substrates, metal substrates or wafers respectively.

[0022] To facilitate a further understanding of the structure, features, purpose, and advantages of the present invention, the accompanying drawings and detailed description of preferred embodiments are provided below. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of an embodiment of the thermal compression bonding device of the utility model;

[0024] Figure 2 for Figure 1A schematic diagram of an embodiment of a pressurizing device of a thermocompression bonding device;

[0025] Figure 3a~Figure 3d is an operation schematic diagram of the thermal compression bonding device of the present invention; and

[0026] Figure 4a~Figure 4d Another operation schematic diagram of the thermal compression bonding device of the present invention.

[0027] [Explanation of Reference Numerals]

[0028] 11: The first workpiece

[0029] 12: Second Workpiece

[0030] 100: Thermocompression bonding equipment

[0031] 110: Working chamber

[0032] 120: Pressurization device

[0033] 121: Upper pressure part

[0034] 121a: Heating block

[0035] 121b: Water cooling device

[0036] 122: Lower pressure part

[0037] 122a: Heating block

[0038] 122b: Water cooling device

[0039] 130: The first two-way water-cooling transport platform

[0040] 140: Second two-way water-cooling transport platform

[0041] 150: Control module

[0042] 160: Air supply device DETAILED DESCRIPTION

[0043] Please refer to Figure 1 and Figure 2 ,in, Figure 1 It is a schematic diagram of an embodiment of the thermal compression bonding device of the utility model; Figure 2 for Figure 1 A schematic diagram of an embodiment of a pressurizing device of a thermocompression bonding device.

[0044] like Figure 1 and Figure 2As shown, a thermal compression bonding device 100 has a working chamber 110 , a pressurizing device 120 , a first bidirectional water-cooling conveying platform 130 , a second bidirectional water-cooling conveying platform 140 , a control module 150 and an air supply device 160 .

[0045] The working chamber 110 has an anti-oxidation atmosphere.

[0046] The pressurizing device 120 is disposed in the working chamber 110 and has an upper pressurizing portion 121 and a lower pressurizing portion 122, wherein the upper pressurizing portion 121 has a heating block 121a and a water cooling device 121b, and the water cooling device 121b is abutted against the heating block 121a; the lower pressurizing portion 122 has a heating block 122a and a water cooling device 122b, and the water cooling device 122b is abutted against the heating block 122a; and the heating block 121a of the upper pressurizing portion 121 and the heating block 122a of the lower pressurizing portion 122 are opposite to each other to perform a hot pressing operation on a workpiece group to form a finished product.

[0047] In addition, the pressurizing device 120 has a pressure detector (not shown in the figure), which can be disposed on the upper pressurizing portion 121 or the lower pressurizing portion 122, and is electrically coupled to the control module 150 to provide a pressure sensing value to the control module 150. In addition, the pressure detector can be a load cell to generate a voltage signal proportional to the vertical force when subjected to the vertical force to provide to the control module 150.

[0048] In addition, the pressurizing device 120 has a temperature detector (not shown in the figure), which can be disposed at the upper pressurizing portion 121 or the lower pressurizing portion 122 and electrically coupled to the control module 150 to provide a temperature sensing value to the control module 150. Since the temperature detector is an existing device, its principle is not intended to be repeated here.

[0049] The first bidirectional water-cooling conveying platform 130 is disposed at one side of the working chamber 110 to convey the workpiece group into the pressurizing device 120 or to receive the finished product conveyed from the pressurizing device 120 and cool the finished product.

[0050] The second bidirectional water-cooling conveying platform 140 is disposed at the other side of the working chamber 110 , and is used to convey the workpiece set into the pressurizing device 120 or to receive the finished product conveyed from the pressurizing device 120 and cool the finished product.

[0051] The control module 150 is electrically coupled to the pressurizing device 120 to control the temperature of the heating block 121a of the upper pressurizing portion 121 and the heating block 122a of the lower pressurizing portion 122 and the pressure therebetween. Specifically, the control module 150 adjusts the hot pressing operation through the temperature sensing value and the pressure sensing value to precisely control the compression amount of the workpiece group, so that the hot pressing operation is performed along a compression curve.

[0052] The gas supply device 160 is used to evacuate the working chamber 110 and then provide a gas into the working chamber 110 to form the anti-oxidation atmosphere, wherein the gas may be nitrogen or hydrogen.

[0053] In addition, the workpiece set includes a first workpiece and a second workpiece, and the first workpiece and the second workpiece can be electronic components, circuit substrates, metal substrates or wafers respectively.

[0054] During operation, the workpiece group can be sent into the pressurizing device 120 by the first two-way water-cooled conveying platform 130, and then the finished product can be sent out and cooled by the second two-way water-cooled conveying platform 140; or sent into the pressurizing device 120 by the second two-way water-cooled conveying platform 140, and then the finished product can be sent out and cooled by the first two-way water-cooled conveying platform 130.

[0055] Please refer to Figure 3a~Figure 3d , which is an operation diagram of the thermal compression bonding device of the utility model. Figure 3a As shown, a workpiece group to be processed (including a first workpiece 11 and a second workpiece 12) is first placed on the first bidirectional water-cooling conveying platform 130; then, as shown in Figure 3b As shown, the workpiece group is sent into the press device 120 to undergo a hot pressing operation; then, as shown in FIG. Figure 3c As shown, the workpiece group is hot-pressed and bonded into a module in the pressurizing device 120; then, as shown in Figure 3d As shown, the module is sent out by the second two-way water-cooling conveying platform 140 and is cooled on the second two-way water-cooling conveying platform 140 .

[0056] Please refer to Figure 4a~Figure 4d , which is another operation schematic diagram of the thermal compression bonding device of the utility model. Figure 4a As shown, a workpiece group to be processed (including a first workpiece 11 and a second workpiece 12) is first placed on the second bidirectional water-cooling conveying platform 140; then, as shown in FIG. Figure 4b As shown, the workpiece group is sent into the press device 120 to undergo a hot pressing operation; then, as shown in FIG. Figure 4c As shown, the workpiece group is hot-pressed and bonded into a module in the pressurizing device 120; then, as shown in Figure 4d As shown, the module is transported from the first bidirectional water-cooling transport platform 130 and is cooled on the first bidirectional water-cooling transport platform 130 .

[0057] As can be seen from the above description, the utility model discloses a hot pressing bonding device, which comprises: a working chamber having an anti-oxidation atmosphere; a pressurizing device, which is arranged in the working chamber and has an upper pressurizing part and a lower pressurizing part, the upper pressurizing part and the lower pressurizing part both have a water cooling device and a heating block abutting against the water cooling device, and the heating block of the upper pressurizing part and the heating block of the lower pressurizing part are opposite to each other to perform a hot pressing operation on a workpiece group to form a finished product; a first bidirectional water-cooling conveying platform, which is arranged at One side of the working chamber is used to deliver the workpiece group into the pressurizing device or receive the finished product sent from the pressurizing device and cool the finished product; a second two-way water-cooling conveying platform is arranged on the other side of the working chamber, which is used to deliver the workpiece group into the pressurizing device or receive the finished product sent from the pressurizing device and cool the finished product; and a control module is electrically coupled to the pressurizing device, which is used to control the temperature of the heating block of the upper pressurizing part and the heating block of the lower pressurizing part and the pressure therebetween.

[0058] In addition, the pressurizing device has a pressure detector, which is disposed on the upper pressurizing portion or the lower pressurizing portion and is electrically coupled to the control module to provide a pressure sensing value to the control module, wherein the pressure detector can be a load cell.

[0059] In addition, the pressurizing device has a temperature detector, which is disposed on the upper pressurizing portion or the lower pressurizing portion and is electrically coupled to the control module to provide a temperature sensing value to the control module.

[0060] It is worth mentioning that the control module adjusts the hot pressing operation through the temperature sensing value and the pressure sensing value to accurately control the compression amount of the workpiece group, so that the hot pressing operation is performed along a compression curve.

[0061] In addition, the thermal compression bonding equipment may further include a gas supply device to evacuate the working chamber and then provide a gas into the working chamber to form the anti-oxidation atmosphere, wherein the gas may be nitrogen or hydrogen.

[0062] In addition, the workpiece set includes a first workpiece and a second workpiece, and the first workpiece and the second workpiece can be electronic components, circuit substrates, metal substrates or wafers respectively.

[0063] According to the above design, the utility model has the following advantages:

[0064] 1. The hot pressing bonding equipment of the present invention can precisely control the compression amount of the workpiece group by regulating the temperature and pressure of the hot pressing operation, so that the hot pressing operation is performed along a compression curve and the effect of the hot pressing operation is optimized;

[0065] 2. The thermocompression bonding device of the utility model can provide a heat insulation effect by arranging a water cooling device on the outer surface of the thermocompression device, so that other devices of the thermocompression bonding device will not be subjected to high temperature, and workers can be prevented from being scalded; and

[0066] 3. The thermal compression bonding device of the present invention can optimize the thermal compression bonding effect of the workpiece group by forming an anti-oxidation atmosphere in the working chamber.

[0067] Fourth, the hot-compression bonding equipment of the present invention can deliver the workpiece group into the pressurizing device or receive the finished product delivered from the pressurizing device and cool the finished product through a two-way water-cooling conveying platform to improve production efficiency.

[0068] What is disclosed in the present utility model is a preferred embodiment. Any local changes or modifications derived from the technical idea of ​​the present invention are easily inferred by those skilled in the art and do not depart from the protection scope of the claims of the present utility model.

Claims

1. A thermal compression bonding device, characterized in that: have: A working chamber having an anti-oxidation atmosphere; A pressurizing device is disposed in the working chamber and has an upper pressurizing portion and a lower pressurizing portion. Both the upper pressurizing portion and the lower pressurizing portion have a water cooling device and a heating block abutting against the water cooling device. The heating block of the upper pressurizing portion is opposite to the heating block of the lower pressurizing portion to perform a hot pressing operation on a workpiece group to form a finished product. A first bidirectional water-cooling conveying platform is disposed on one side of the working chamber and is used to convey the workpiece group into the pressurizing device or to receive the finished product conveyed from the pressurizing device and cool the finished product; A second bidirectional water-cooling conveying platform is provided at the other side of the working chamber, and is used to convey the workpiece group into the pressurizing device or to receive the finished product conveyed from the pressurizing device and cool the finished product; as well as A control module is electrically coupled to the pressurizing device and is used to control the temperature of the heating block of the upper pressurizing portion and the heating block of the lower pressurizing portion and the pressure therebetween.

2. The thermal compression bonding device according to claim 1, characterized in that: The pressurizing device has a pressure detector, which is arranged on the upper pressurizing part or the lower pressurizing part and is electrically coupled to the control module to provide a pressure sensing value to the control module.

3. The thermal compression bonding device according to claim 2, characterized in that: The pressure sensor is a load cell.

4. The thermal compression bonding device according to claim 2, characterized in that: The pressurizing device has a temperature detector, which is arranged on the upper pressurizing part or the lower pressurizing part and is electrically coupled to the control module to provide a temperature sensing value to the control module.

5. The thermocompression bonding device according to claim 4, characterized in that: The control module adjusts the hot pressing operation through the temperature sensing value and the pressure sensing value to accurately control the compression amount of the workpiece group, so that the hot pressing operation is performed along a compression curve.

6. The thermal compression bonding device according to claim 1, characterized in that: A gas supply device is provided for evacuating the working chamber and then providing a gas into the working chamber to form the anti-oxidation atmosphere.

7. The thermocompression bonding device according to claim 6, characterized in that: The gas is nitrogen or hydrogen.

8. The thermocompression bonding device according to claim 1, characterized in that: The workpiece set includes a first workpiece and a second workpiece, and the first workpiece and the second workpiece are respectively selected from the group consisting of electronic components, circuit substrates, metal substrates and wafers.

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