Deposition assembly and vacuum coating equipment

Abstract

The utility model is suitable for the technical field of coating equipment, and provides a deposition assembly and vacuum coating equipment. The feeding hole is communicated with the deposition cavity; the discharge hole is communicated with the deposition cavity; the splitter plate is arranged in the deposition cavity and is opposite to the feed port at an interval, a plurality of splitter holes are formed in the splitter plate in an array mode, and the splitter holes and the feed port are arranged in a staggered mode; the discharging baffle is arranged on the inner wall of the deposition cavity and is opposite to the discharging opening in a spaced mode, the projection of the discharging baffle in the direction of the discharging opening completely covers the discharging opening, and an air outlet gap communicated with the deposition cavity and the discharging opening is formed between the discharging baffle and the inner wall of the deposition cavity. According to the deposition assembly provided by the utility model, the reaction gas can be more uniformly distributed in the deposition cavity, and the reaction gas in the deposition cavity can fully participate in film coating, so that the waste of materials is avoided, and the film coating quality is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of coating equipment, in particular to a deposition component and vacuum coating equipment. Background Art

[0002] Vacuum coating equipment is a kind of equipment used to deposit a film layer on the surface of a workpiece to prevent oxidation, waterproofing, corrosion and other problems on the surface of the workpiece. Vacuum coating equipment generally includes a sublimation chamber, a cracking chamber, a deposition chamber, a cold trap and a vacuum pump; the process of preparing a film layer using vacuum coating equipment is as follows: first, under vacuum conditions, the coating material is heated to about 150°C in the sublimation chamber and sublimated into a gas state, and the gaseous coating material enters the cracking chamber. When heated to about 600°C, the molecular bonds of the gaseous coating material are broken and cracked into reactive gas with reactive activity. The reactive gas enters the deposition chamber from the cracking chamber and deposits and polymerizes on the surface of the workpiece to be plated in the deposition chamber to form a film layer. The vacuum pump continuously evacuates the deposition chamber. During the vacuuming process, the unreacted reactive gas in the deposition chamber is collected in the cold trap under the action of the vacuum pump.

[0003] In the prior art, the deposition chamber of the vacuum coating equipment is connected to the cracking chamber through a feed port, and the reaction gas after cracking in the cracking chamber directly enters the deposition chamber from the feed port. The reaction gas entering the deposition chamber is deposited on the surface of the workpiece to be plated in the deposition chamber to form a film layer, and part of the reaction gas is discharged through the discharge port to be collected in the cold trap. However, the reaction gas directly entering the deposition chamber from the feed port will cause uneven diffusion of the reaction gas, and the reaction gas is easy to concentrate in the middle of the deposition chamber to form a high-temperature zone, reducing the deposition rate and affecting the coating quality. In addition, the reaction gas is easy to directly enter the cold trap from the discharge port, resulting in a waste of raw materials and also affecting the coating quality. Utility Model Content

[0004] The utility model provides a deposition component, aiming to solve the problems of vacuum coating equipment in the prior art that reaction gas directly enters the deposition chamber from the feed inlet and the reaction gas is easily discharged directly from the discharge port, which affects the coating quality.

[0005] The utility model is implemented by providing a deposition component for vacuum coating equipment, comprising:

[0006] A sedimentation chamber provided with a sedimentation chamber;

[0007] a feed port communicated with the deposition chamber;

[0008] a discharge port communicated with the deposition chamber;

[0009] a diverter plate disposed in the deposition chamber and spaced relatively from the feed port, wherein the diverter plate array is provided with a plurality of diverter holes, and the diverter holes are staggered with the feed port; and

[0010] A discharge baffle is arranged on the inner wall of the deposition chamber and is spaced relative to the discharge port. The projection of the discharge baffle in the direction of the discharge port completely covers the discharge port, and an air outlet gap connecting the deposition chamber and the discharge port is formed between the discharge baffle and the inner wall of the deposition chamber.

[0011] Preferably, the deposition assembly comprises a feed pipe communicating with the deposition chamber, and the feed port is provided at one end of the feed pipe connected to the deposition chamber.

[0012] Preferably, the feed pipeline comprises a main pipeline and at least two sub-pipelines respectively connected to the main pipe, each of the sub-pipelines is provided with a feed port, and the feed port on each sub-pipeline is connected to the deposition chamber.

[0013] Preferably, the feed pipeline further comprises a connecting pipeline, the connecting pipeline is vertically connected to the main pipeline, and the sub-pipelines are arranged in parallel and spaced apart and vertically connected to the connecting pipeline.

[0014] Preferably, the diverter plate includes an opening area provided with a plurality of the diverter holes, and a non-opening area corresponding to the position of the feed port and without the diverter holes, and the area of ​​each non-opening area is 1.5 to 3 times the area of ​​the corresponding feed port.

[0015] Preferably, the area of ​​the discharge baffle is 3 to 4 times the area of ​​the discharge port.

[0016] Preferably, a supporting portion is provided on the inner wall of the deposition chamber, and the baffle is fixed to the inner wall of the deposition chamber through the supporting portion.

[0017] Preferably, the deposition chamber is a square deposition chamber.

[0018] The utility model also provides a vacuum coating device, comprising the above-mentioned deposition component.

[0019] The utility model provides a deposition component by arranging a diverter plate relatively spaced from a feed port in a deposition chamber, and the diverter holes on the diverter plate are staggered from the feed port, and the diverter plate is used to block the reaction gas coming out of the feed port, to prevent the reaction gas coming out of the discharge port from entering a certain area of ​​the deposition chamber in a straight line, so that the reaction gas coming out of the feed port is dispersed into the deposition chamber through a plurality of diverter holes on the diverter plate, thereby increasing the deposition rate, making the reaction gas more evenly distributed in the deposition chamber, and improving the coating quality; at the same time, by arranging a discharge baffle relatively spaced from the discharge port in the deposition chamber, the reaction gas in the deposition chamber is prevented from being directly discharged from the discharge port, and the residence time of the reaction gas in the deposition chamber can be increased, so that the reaction gas in the deposition chamber can fully participate in the coating, thus avoiding the waste of materials and further improving the coating quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A three-dimensional diagram of a deposition assembly provided by an embodiment of the utility model;

[0021] Figure 2 A three-dimensional diagram of a deposition assembly provided by an embodiment of the utility model with the door panel removed;

[0022] Figure 3 Another stereoscopic view of a deposition assembly provided by an embodiment of the utility model with the door panel removed;

[0023] Figure 4 A three-dimensional diagram of a deposition assembly provided by an embodiment of the utility model after removing the door plate and the discharge baffle;

[0024] Figure 5 A three-dimensional diagram of a feed pipe of a deposition assembly provided in an embodiment of the utility model;

[0025] Figure 6 A three-dimensional diagram of a diverter plate of a deposition assembly provided in an embodiment of the utility model. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0027] A deposition component provided by an embodiment of the utility model is provided with a diverter plate relatively spaced from a feed port in a deposition chamber, and the diverter holes on the diverter plate are staggered from the feed port. The diverter plate is used to block the reaction gas coming out of the feed port, and the reaction gas coming out of the outlet is prevented from entering a certain area of ​​the deposition chamber in a straight line, so that the reaction gas coming out of the feed port is dispersed into the deposition chamber through a plurality of diverter holes on the diverter plate, thereby increasing the deposition rate, making the reaction gas more evenly distributed in the deposition chamber, and improving the coating quality. At the same time, a discharge baffle plate relatively spaced from the outlet is provided in the deposition chamber to prevent the reaction gas in the deposition chamber from being directly discharged from the outlet, thereby increasing the residence time of the reaction gas in the deposition chamber, allowing the reaction gas in the deposition chamber to fully participate in the coating, thereby avoiding waste of materials and further improving the coating quality.

[0028] Please refer to Figure 1-Figure 6 The present invention provides a deposition assembly 2 for vacuum coating equipment, comprising:

[0029] A deposition chamber 21 is provided with a deposition chamber 20;

[0030] a feed port 22 communicating with the deposition chamber 20;

[0031] a discharge port 23 communicating with the deposition chamber 20;

[0032] A flow divider plate 24 is disposed in the deposition chamber 20 and is spaced apart from the feed port 22. The flow divider plate 24 is provided with a plurality of flow divider holes 241 in an array, and the flow divider holes 241 are staggered with the feed port 22; and

[0033] A discharge baffle 25 is arranged on the inner wall of the deposition chamber 20 and is spaced relative to the discharge port 22. The projection of the discharge baffle 25 in the direction of the discharge port 22 completely covers the discharge port 23, and an air outlet gap 26 connecting the deposition chamber 20 and the discharge port 22 is formed between the discharge baffle 25 and the inner wall of the deposition chamber 20.

[0034] In an embodiment of the utility model, a deposition component for a vacuum coating device is provided by arranging a diverter plate 24 relatively spaced from a feed port 22 in a deposition chamber 20, and a plurality of diverter holes 241 are arranged in an array of the diverter plate 24. The diverter holes 241 on the diverter plate 24 are staggered from the feed port 22, that is, the diverter holes 241 are not arranged at the position of the diverter plate 24 corresponding to the feed port 22. The diverter plate 24 is used to block the reaction gas coming out of the feed port 22, so that the reaction gas coming out of the outlet 23 can be prevented from being concentrated in a straight line into a certain area of ​​the deposition chamber 20 to cause uneven distribution. The reaction gas is evenly diffused from the feed port 22 to the deposition chamber 20 through the plurality of diverter holes 241 on the diverter plate 24, so that the reaction gas is evenly distributed in the deposition chamber 20, which can improve the deposition rate and improve The coating quality is improved; at the same time, by setting a discharge baffle 25 relatively spaced from the discharge port 23, the projection of the discharge baffle 25 in the direction of the discharge port 22 completely covers the discharge port 23, so that the reaction gas in the deposition chamber 20 cannot be discharged from the discharge port 23 in a straight line. The discharge baffle 25 can block the reaction gas from directly entering the discharge port 23, thereby preventing the reaction gas in the deposition chamber 20 from being directly discharged from the discharge port 23. The reaction gas in the deposition chamber 20 can only enter the discharge port 23 from the gas outlet gap 26 between the discharge baffle 25 and the inner wall of the deposition chamber 20, thereby increasing the reaction time of the reaction gas in the deposition chamber 20, allowing the reaction gas in the deposition chamber 20 to fully participate in the coating, thereby improving the coating quality, and preventing excessive reaction gas from being directly discharged from the discharge port 23, thereby avoiding waste of materials.

[0035] As an embodiment of the present invention, the discharge baffle 25 may be a circular hole, a square hole or a hole of other shapes, and the number of the diverter holes 241 on the diverter plate 24 is not limited.

[0036] As an embodiment of the present invention, the deposition assembly 2 includes a feed pipe 27 communicating with the deposition chamber 20 , and the feed port 22 is provided at one end of the feed pipe 27 connected to the deposition chamber 20 .

[0037] In this embodiment, the reaction gas enters through the feed pipe 27, passes through the feed port 22, and then diffuses into the deposition chamber 20 through the plurality of diversion holes 241 on the diversion plate 24. In addition, the feed port 22 can also be directly disposed on the inner wall of the deposition chamber 20.

[0038] In the embodiment of the utility model, the deposition assembly 2 further includes a door panel 28 for opening or closing the deposition chamber 20. The door panel 28 is hinged to the deposition chamber 21. When the door panel 28 is opened, it is convenient for personnel to place the workpiece to be plated into the deposition chamber 20 or take out the workpiece that has been plated in the deposition chamber 20; when the door panel 28 is closed, the deposition chamber 20 can be closed so that the deposition chamber 20 can perform the vacuum coating process.

[0039] As an embodiment of the present utility model, the discharge port 23 is connected to a discharge pipe 29, and the discharge pipe 29 is used to connect to a cold trap of a vacuum coating device.

[0040] As an embodiment of the present invention, the deposition chamber 20 is a square deposition chamber, which can improve the space utilization by 30% compared with the circular rotary deposition chamber, increase the number of workpieces to be placed, and improve the coating efficiency.

[0041] In the embodiment of the utility model, one end of the feed pipe 27 is used to connect with the cracking chamber of the vacuum coating equipment, and the other end of the feed pipe 27 is connected with the deposition chamber 20. The feed port 22 is arranged at one end of the feed pipe 27 connected with the deposition chamber 20.

[0042] As an embodiment of the present invention, the feed pipe 27 includes a main pipe 271 and at least two sub-pipes 272 respectively connected to the main pipe 271 . Each sub-pipe 272 is provided with a feed port 22 . The feed port 22 on each sub-pipe 272 is connected to the deposition chamber 20 .

[0043] In this embodiment, the number of the sub-pipelines 272 may be two, three or more. Figure 5 The number of sub-pipes 272 shown in the figure is two. The reaction gas in the cracking chamber enters from the main pipe 271, and then diffuses from the feed port 22 of each sub-pipe 272 through the multiple diversion holes 241 on the diversion plate 24 to the deposition chamber 20. Since the reaction gas diffuses into the deposition chamber 20 through multiple sub-pipes 272 at the same time, the reaction gas diffuses more evenly in the deposition chamber 20, thereby improving the uniformity of the coating.

[0044] As an embodiment of the present utility model, the feed pipeline 27 further includes a connecting pipeline 273 , the connecting pipeline 273 is vertically connected to the main pipeline 271 , and the sub-pipelines 272 are arranged in parallel and spaced apart and vertically connected to the connecting pipeline 273 .

[0045] In this embodiment, the connecting pipe 273 is connected to the main pipe 271 in a T shape, and the sub-pipes 272 are arranged in parallel and spaced apart to achieve uniform air intake up and down. Each sub-pipe 272 is arranged in parallel with the main pipe 271, which is convenient for processing the feed pipe 27. The feed pipe 27 can be integrally formed or assembled in parts. Of course, the specific structure of the feed pipe 27 is not limited thereto, and the feed pipe 27 can also be a straight pipe or a pipe of other shapes.

[0046] As an embodiment of the present invention, the diverter plate 24 includes an opening area 242 with a diverter hole 241, and a non-opening area 243 corresponding to the position of the feed port 22 and without the diverter hole 241. The area of ​​each non-opening area 243 is 1.5 to 3 times the area of ​​the corresponding feed port 22.

[0047] In this embodiment, the number and position of the non-perforated area 243 correspond to the feed port 22. For example, the number of the feed ports 22 is two, and the non-perforated area 243 is also set to two accordingly. Among them, the non-perforated area 243 can be circular or square, etc. Among them, the area of ​​the non-perforated area 243 is 1.5 to 3 times the area of ​​the corresponding feed port 22, which can ensure that the reaction gas coming out of the feed port 22 can smoothly enter the deposition chamber 20 from the diverter hole 241 on the diverter plate 24, and also avoid the reaction gas coming out of the feed port 22 directly entering the deposition chamber 20, so as to better achieve uniform distribution of the reaction gas.

[0048] As an embodiment of the utility model, an electric heating plate (not shown) is provided on the outer wall of the feed pipe 27. The feed pipe 27 is heated by the electric heating plate, so as to prevent the reaction gas from condensing and depositing in the feed pipe 27 and blocking the feed pipe 27. The electric heating plate is provided on the main pipe 271. Of course, it can also be provided on the connecting pipe 273 or the sub-pipeline 272.

[0049] As an embodiment of the utility model, the electric heating plate can be wrapped around the feed pipe 27 to achieve uniform heating of the feed pipe 27 and better prevent the feed pipe 27 from condensation and blockage.

[0050] As an embodiment of the present invention, the area of ​​the discharge baffle 25 is 3 to 4 times the area of ​​the discharge port 23. The discharge baffle 25 can be circular or square. Preferably, the discharge baffle 25 is circular. The area of ​​the discharge baffle 25 is 3 to 4 times the area of ​​the discharge port 23, which can ensure that the reaction gas in the deposition chamber 20 can be discharged from the discharge port 23 at a suitable rate, and also ensure that sufficient reaction gas participates in the coating, ensuring good coating quality.

[0051] As an embodiment of the present invention, a support portion 230 is provided on the inner wall of the deposition chamber 20 , and the discharge baffle 25 is fixed to the inner wall of the deposition chamber 20 through 230 .

[0052] In this embodiment, the discharge baffle 25 is fixed to the inner wall of the deposition chamber 20 through the support portion 230, so that the discharge baffle 25 is spaced apart from the inner wall of the deposition chamber 20, so that a gas outlet gap 26 is formed between the discharge baffle 25 and the inner wall of the deposition chamber 20. The discharge baffle 25 can be fixed to the inner wall of the deposition chamber 20 by welding through the support portion 230, or can be fixed to the inner wall of the deposition chamber 20 by fasteners.

[0053] The embodiment of the utility model further provides a vacuum coating device, comprising the deposition assembly 2 of the above embodiment.

[0054] The vacuum coating equipment provided by the embodiment of the utility model uses the above-mentioned deposition component, and the reaction gas can be evenly diffused from the feed port 22 to the deposition chamber 20, thereby increasing the deposition rate and improving the coating quality of the vacuum coating equipment. At the same time, the reaction gas is prevented from being directly discharged from the discharge port 23, which can increase the reaction time of the reaction gas in the deposition chamber 20, avoid material waste, and improve the coating quality.

[0055] A deposition component provided by an embodiment of the utility model is provided with a diverter plate 24 which is relatively spaced from a feed port 22 in a deposition chamber 20. By utilizing the blocking effect of the diverter plate 24, the reaction gas coming out of the outlet 23 of the feed pipe 27 can only diffuse into the deposition chamber 20 through a plurality of diverter holes 241 on the diverter plate 24. The diverter holes 241 are staggered with the feed port 22, which can prevent the reaction gas coming out of the outlet 23 from being concentrated into the middle of the deposition chamber 20 to form a high-temperature zone, so that the reaction gas is evenly diffused from the outlet 23 to the deposition chamber 20, thereby increasing the deposition rate and improving the coating quality. At the same time, by providing a discharge baffle plate 25 which is relatively spaced from the discharge port 23, the reaction gas in the deposition chamber 20 can only enter the discharge port 23 and be discharged from the gas outlet gap 26 between the discharge baffle plate 25 and the inner wall of the deposition chamber 20, thereby increasing the reaction time of the reaction gas in the deposition chamber 20, ensuring that the reaction gas in the deposition chamber 20 fully participates in the reaction, avoiding material waste, and improving the coating quality.

[0056] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A deposition component for vacuum coating equipment, characterized in that: include: A sedimentation chamber provided with a sedimentation chamber; a feed port communicated with the deposition chamber; a discharge port communicated with the deposition chamber; a diverter plate disposed in the deposition chamber and spaced relatively from the feed port, wherein the diverter plate array is provided with a plurality of diverter holes, and the diverter holes are staggered with the feed port; and A discharge baffle is arranged on the inner wall of the deposition chamber and is spaced relative to the discharge port. The projection of the discharge baffle in the direction of the discharge port completely covers the discharge port, and an air outlet gap connecting the deposition chamber and the discharge port is formed between the discharge baffle and the inner wall of the deposition chamber.

2. The deposition assembly according to claim 1, characterized in that The deposition assembly comprises a feed pipe communicating with the deposition chamber, and the feed port is arranged at one end of the feed pipe connected to the deposition chamber.

3. The deposition assembly according to claim 2, characterized in that: The feed pipeline comprises a main pipeline and at least two sub-pipelines respectively connected to the main pipe, each of the sub-pipelines is provided with a feed port, and the feed port on each sub-pipeline is connected to the deposition chamber.

4. The deposition assembly according to claim 3, characterized in that: The feed pipeline also includes a connecting pipeline, which is vertically connected to the main pipeline. The sub-pipelines are arranged in parallel and spaced apart and vertically connected to the connecting pipeline.

5. The deposition assembly according to claim 1, characterized in that: The diverter plate includes an opening area with a plurality of diverter holes, and a non-opening area corresponding to the feed port and without the diverter holes. The area of ​​each non-opening area is 1.5 to 3 times the area of ​​the corresponding feed port.

6. The deposition assembly according to claim 1, characterized in that The area of ​​the discharge baffle is 3 to 4 times the area of ​​the discharge port.

7. The deposition assembly according to claim 1, characterized in that A supporting portion is provided on the inner wall of the deposition chamber, and the baffle is fixed on the inner wall of the deposition chamber through the supporting portion.

8. The deposition assembly according to claim 1, characterized in that The deposition chamber is a square deposition chamber.

9. A vacuum coating device, characterized in that: It comprises a deposition assembly as claimed in any one of claims 1 to 8.

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