Turnover device for semiconductor detection

Abstract

The utility model discloses a turnover device for semiconductor detection, which comprises a base and a turnover table, a mounting bin is arranged in the base, an electric telescopic rod is arranged in the mounting bin, four groups of guide rods are uniformly distributed at the four corners of the base, the bottom of the turnover table is connected with the free end of the electric telescopic rod, and the bottom of the turnover table is connected with the free end of the electric telescopic rod. Guide holes corresponding to the guide rods are formed in the four corners of the overturning table, and an overturning structure is arranged on the overturning table. The utility model relates to the technical field of semiconductor detection, and specifically provides a turnover device for semiconductor detection.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor detection, in particular to a flip device for semiconductor detection. Background Art

[0002] A semiconductor is a material with an electrical conductivity between that of an insulator and that of a conductor. Its electrical conductivity is easily controlled and it can be used as a component material for information processing. It is widely used in integrated circuits, electronic products, communication systems and other fields.

[0003] Semiconductor materials need to be tested and analyzed to ensure their quality, performance and reliability. A flipping device is needed to help the semiconductor complete the inspection. However, the sizes of semiconductors in different production batches are different, and the existing flipping device cannot be quickly adjusted to accommodate fixed inspections of semiconductors of different sizes. Utility Model Content

[0004] The technical problem to be solved by the utility model is that the existing flipping device is not convenient to quickly adjust, clamp and fix according to the size of the semiconductor, and has general applicability.

[0005] In order to solve the above technical problems, the utility model provides the following technical solutions: the utility model proposes a flipping device for semiconductor detection, including a base and a flipping table, the base is provided with an installation bin, the installation bin is provided with an electric telescopic rod, four groups of guide rods are evenly distributed at the four corners of the base, the bottom of the flipping table is connected to the free end of the electric telescopic rod, the four corners of the flipping table are provided with guide holes corresponding to the guide rod, and the flipping table is provided with a flipping structure.

[0006] Preferred technical solution one: the flipping structure includes a driving motor, a driving screw, a driving block and a flipping assembly, an installation cavity is provided inside the flipping table, a guide groove is provided on the top of the flipping table, both ends of the driving screw are rotatably arranged on opposite side walls in the installation cavity, the driving motor is arranged on one side of the flipping table and the power output shaft is connected to the driving screw, the driving screw is provided with two groups of thread groups with opposite thread directions, the driving block is provided with two groups, the two groups of driving screws are arranged on the two groups of thread groups with opposite thread directions through threaded connection and are slid through the guide groove, and the flipping assembly is arranged on the top of the driving block.

[0007] Preferred technical solution two: the flipping assembly includes a supporting side plate, an L-shaped supporting frame, a driving assembly and a buffer pressing assembly, the supporting side plate is arranged on the top of the driving block, the L-shaped supporting frame is rotatably arranged on the side wall of the supporting side plate, the L-shaped supporting frame is provided with a sliding groove, the buffer pressing assembly is slidably arranged inside the sliding groove, a group of the supporting side plates are provided with a driving cavity, and the driving assembly is installed inside the driving cavity.

[0008] Preferred technical solution three: The buffer pressing assembly includes a mounting frame and a pressing push rod. The mounting frame is a C-shaped structure. The bottom of the mounting frame is slidably arranged in a sliding groove. The pressing push rod is arranged on the mounting frame and the free end extends into the interior of the mounting frame. A pressing block is provided on the free end of the pressing push rod. A buffer spring is connected between the L-shaped support frame and the mounting frame.

[0009] Preferred technical solution four: The flipping assembly includes a flipping motor, a driving shaft, a driving gear and a driven gear. The flipping motor is arranged on a group of supporting side plates, and both ends of the driving shaft are rotatably arranged in the driving cavity and connected to a group of L-shaped support frames. The power output shaft of the flipping motor extends to the inside of the driving cavity, the driving gear is arranged on the power output shaft of the flipping motor, and the driven gear is arranged on the driving shaft, and the driving gear and the driven gear are meshed.

[0010] Preferred technical solution five: anti-slip pads are provided inside the mounting frame and on the holding block.

[0011] The utility model proposes a semiconductor testing flip device, which adopts the above structure to achieve the following beneficial effects:

[0012] (1) The semiconductor is quickly centered and clamped by the driving motor, driving screw and driving block. The buffer spring is flexibly pressed during centering without damaging the semiconductor. The two ends of the semiconductor are pressed by the buffer holding component. The flipping component is driven to flip. The operation is simple and suitable for flipping detection of semiconductors of different sizes.

[0013] (2) The base, electric telescopic rod and four sets of guide rods enable the flip table to be adjusted to a flexible height and has greater applicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0015] Figure 1 The overall structure of a semiconductor testing flip device proposed by the utility model is shown in FIG. Figure 1 ;

[0016] Figure 2 The overall structure of a semiconductor testing flip device proposed by the utility model is shown in FIG. Figure 2 ;

[0017] Figure 3 This is a schematic cross-sectional view of a semiconductor testing flip device proposed by the utility model;

[0018] Figure 4for Figure 3 A partial enlarged schematic diagram of part A.

[0019] Among them, 1. base, 2. flip table, 3. electric telescopic rod, 4. guide rod, 5. flip structure, 6. drive motor, 7. drive screw, 8. drive block, 9. flip assembly, 10. installation cavity, 11. guide groove, 12. support side plate, 13. L-shaped support frame, 14. installation frame, 15. holding push rod, 16. holding block, 17. buffer spring, 18. flip motor, 19. drive shaft, 20. drive gear, 21. driven gear, 22. anti-slip foot pad. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments; based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0021] It should be noted that the words "front", "rear", "left", "right", "up" and "down" used in the following description refer to directions in the drawings, and the words "inside" and "outside" refer to directions toward or away from the geometric center of a specific component, respectively.

[0022] like Figures 1 to 4 As shown, the technical solution adopted by the utility model is as follows: a flip device for semiconductor detection, including a base 1 and a flip table 2, a mounting bin is provided in the base 1, an electric telescopic rod 3 is provided in the mounting bin, four groups of guide rods 4 are evenly distributed at the four corners of the base 1, the bottom of the flip table 2 is connected to the free end of the electric telescopic rod 3, guide holes corresponding to the guide rod 4 are provided at the four corners of the flip table 2, and a flip structure 5 is provided on the flip table 2.

[0023] like Figure 3 and Figure 4As shown, the flip structure 5 includes a driving motor 6, a driving screw 7, a driving block 8 and a flip assembly 9. A mounting cavity 10 is provided inside the flip table 2. A guide groove 11 is provided on the top of the flip table 2. Both ends of the driving screw 7 are rotatably arranged on opposite side walls in the mounting cavity 10. The driving motor 6 is arranged on one side of the flip table 2 and the power output shaft is connected to the driving screw 7. Two groups of thread groups with opposite thread directions are provided on the driving screw 7. The driving block 8 has two groups. The two groups of driving screws 7 are arranged on the two groups of thread groups with opposite thread directions through threaded connection and penetrate and slide in the guide groove 11. The flip assembly 9 is arranged on the top of the driving block 8. The flip assembly 9 includes a supporting side plate 12, an L-shaped supporting frame 13, a driving assembly and a buffer pressing assembly. The supporting side plate 12 is arranged on the top of the driving block 8. The L-shaped supporting frame 13 is rotatably arranged on the side wall of the supporting side plate 12. The L-shaped supporting frame 13 is provided with a sliding groove. The buffer pressing assembly is slidably arranged inside the sliding groove. A group of supporting side plates 12 are provided with a driving The driving chamber is provided with a driving assembly installed inside the driving chamber, the buffer pressing assembly includes a mounting frame 14 and a pressing push rod 15, the mounting frame 14 is a C-shaped structure, the bottom of the mounting frame 14 is slidably arranged in the sliding groove, the pressing push rod 15 is arranged on the mounting frame 14 and the free end extends to the inside of the mounting frame 14, and a pressing block 16 is arranged on the free end of the pressing push rod 15, a buffer spring 17 is connected between the L-shaped support frame 13 and the mounting frame 14, and the driving assembly includes a flip motor 18, a driving shaft 19, a driving shaft 20, a driving shaft 21, a driving shaft 22, a driving shaft 23, a driving shaft 24, a driving shaft 25, a driving shaft 26, a driving shaft 27, a driving shaft 28, a driving shaft 29, a driving shaft 30, a driving shaft 31, a driving shaft 32, a driving shaft 33, a driving shaft 34, a driving shaft 35, a driving shaft 36, a driving shaft 37, a driving shaft 38, a driving shaft 39, a driving shaft 31, a driving shaft 34, a driving shaft 35, a driving shaft 36, a driving shaft 37, a driving shaft 38, a driving shaft 39, a driving shaft 31, a driving shaft 32, a driving shaft 33, a driving shaft 34, a driving shaft 35, a driving shaft 36, a driving shaft 38, a driving shaft 39, a driving shaft 39, a driving shaft 30 ... The driving gear 20 and the driven gear 21, the flip motor 18 are arranged on a group of supporting side plates 12, the two ends of the driving shaft 19 are rotatably arranged in the driving cavity and are connected to a group of L-shaped support frames 13, the power output shaft of the flip motor 18 extends to the inside of the driving cavity, the driving gear 20 is arranged on the power output shaft of the flip motor 18, the driven gear 21 is arranged on the driving shaft 19, the driving gear 20 and the driven gear 21 are meshed, and anti-slip foot pads 22 are provided in the mounting frame 14 and on the holding block 16.

[0024] During specific use, the driving block 8 is adjusted according to the size of the semiconductor, and the driving motor 6 is started. The driving motor 6 drives the driving screw 7 to rotate, so that the two groups of buffer pressing components move relative to each other, and the two ends of the semiconductor are placed on the mounting frame 14. The pressing push rod 15 is started to make the pressing block 16 press the semiconductor to achieve centering clamping of the semiconductor. During clamping, the buffer spring 17 is used for flexible pressing to prevent damage to the semiconductor during clamping. The flipping motor 18 drives the driving gear 20 to rotate, and then drives the driven gear 21 to rotate, thereby driving the supporting side plate 12 to rotate through the driving shaft 19, thereby driving the semiconductor to flip, and the electric telescopic rod 3 drives the flipping table 2 to rise and fall to adjust the detection height, and the conditions are flexible and convenient.

[0025] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, material or apparatus including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, material or apparatus.

[0026] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor inspection flip device, characterized in that: It comprises a base and a turning platform, wherein the base is provided with an installation compartment, wherein the installation compartment is provided with an electric telescopic rod, wherein four groups of guide rods are evenly arranged at the four corners of the base, wherein the bottom of the turning platform is connected to the free end of the electric telescopic rod, wherein the four corners of the turning platform are provided with guide holes corresponding to the guide rods, and wherein the turning platform is provided with a turning structure; The flip structure includes a driving motor, a driving screw, a driving block and a flip assembly. A mounting cavity is provided inside the flip table, a guide groove is provided on the top of the flip table, two ends of the driving screw are rotatably arranged on opposite side walls in the mounting cavity, the driving motor is arranged on one side of the flip table and the power output shaft is connected to the driving screw, two groups of thread groups with opposite thread directions are provided on the driving screw, the driving block is provided with two groups, the two groups of driving screws are arranged on the two groups of thread groups with opposite thread directions through thread connection and penetrate and slide in the guide groove, and the flip assembly is arranged on the top of the driving block; The flip assembly includes a supporting side plate, an L-shaped supporting frame, a driving assembly and a buffer pressing assembly. The supporting side plate is arranged on the top of the driving block, the L-shaped supporting frame is rotatably arranged on the side wall of the supporting side plate, the L-shaped supporting frame is provided with a sliding groove, the buffer pressing assembly is slidably arranged inside the sliding groove, a group of the supporting side plates are provided with a driving cavity, and the driving assembly is installed inside the driving cavity.

2. A semiconductor testing flip device according to claim 1, characterized in that: The buffer pressing assembly includes a mounting frame and a pressing push rod. The mounting frame is a C-shaped structure. The bottom of the mounting frame is slidably arranged in a sliding groove. The pressing push rod is arranged on the mounting frame and the free end extends into the interior of the mounting frame. A pressing block is provided on the free end of the pressing push rod. A buffer spring is connected between the L-shaped support frame and the mounting frame.

3. A semiconductor testing flipping device according to claim 2, characterized in that: The flipping assembly includes a flipping motor, a driving shaft, a driving gear and a driven gear. The flipping motor is arranged on a group of supporting side plates. Both ends of the driving shaft are rotatably arranged in a driving cavity and are connected to a group of L-shaped support frames. The power output shaft of the flipping motor extends to the interior of the driving cavity. The driving gear is arranged on the power output shaft of the flipping motor. The driven gear is arranged on the driving shaft. The driving gear and the driven gear are meshed.

4. A semiconductor testing flipping device according to claim 3, characterized in that: Anti-skid pads are arranged inside the mounting frame and on the holding block.

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