Clamping and conveying device for semiconductor packaging

Abstract

The utility model discloses a clamping and conveying device for semiconductor packaging. The clamping and conveying device comprises a first packaging cabinet and a second packaging cabinet which are the same in structure. A first packaging table is arranged in the first packaging cabinet, and a second packaging table is arranged in the second packaging cabinet; a base plate is arranged at the lower end, close to one side of the second packaging cabinet, in the first packaging cabinet, and a mechanical arm assembly is arranged on the base plate; the mechanical arm assembly comprises a grabbing assembly used for clamping the chip containing disc. Wherein the grabbing assembly is used for clamping and transporting the chip placing disc from the first packaging table to the second packaging table. According to the invention, multiple groups of chips are integrally embedded in the chip placing disc, and the whole chip placing disc is clamped by the mechanical arm and is transported and displaced, so that a single chip does not need to be grabbed, direct contact between the claw part and the chip is avoided, and the completeness of the chip is protected.

Description

Technical Field

[0001] The present application belongs to the field of mechanical technology, and specifically relates to a clamping and conveying device for semiconductor packaging. Background Art

[0002] As the labor cost of manufacturing industry continues to rise, all walks of life in society are improving the level of automation. Robotic arms are indispensable in automated production equipment. The manufacturing cost of existing robotic arms is high, which easily increases the burden on enterprises. At the same time, the movable space or range of existing robotic arms is greatly limited, and the gripping force is small, which cannot adapt to the handling of heavy objects.

[0003] For example, patent CN220762219U-A semiconductor crystal rod automatic centering and loading and unloading device, which determines the center point position of the target size crystal rod through an optical scanning mechanism, and then overlaps the center point of the mechanical claw's gripping with the center point of the crystal rod's designated path to clamp it, can accurately identify the center position of the target size crystal rod, perform automatic loading and unloading operations, and realize automatic operation of the equipment. However, the above-mentioned mechanical arm's inappropriate gripping force is easy to cause damage to the semiconductor chip, which has high requirements for the mechanical arm and increases the production cost. Utility Model Content

[0004] The present application provides a gripping and conveying device for semiconductor packaging to solve the above-mentioned technical problems.

[0005] In order to solve the above technical problems, a technical solution adopted in the present application is: a clamping and conveying device for semiconductor packaging, comprising a first packaging cabinet and a second packaging cabinet with the same structure; a first packaging table is provided in the first packaging cabinet, and a second packaging table is provided in the second packaging cabinet; a base plate is provided at the lower end of the first packaging cabinet close to the second packaging cabinet, and a robotic arm assembly is provided on the base plate; the robotic arm assembly includes a grasping assembly for grasping a chip placement tray; wherein the grasping assembly grasps and transports the chip placement tray from the first packaging station to the second packaging station.

[0006] Furthermore, the first packaging cabinet includes a base and a shield with windows on four sides, the shield is mounted above the base and connected by multiple groups of support rods; the first packaging table is fixed to the surface of the base and located in the shield, and the base plate is located below the side end of the base.

[0007] Furthermore, a limiting platform is provided on one side of the pedestal adjacent to the base plate, and the limiting platform is flush with the upper edge of the pedestal.

[0008] Furthermore, an opening is provided on one side of the protective cover on the same side as the limiting platform, and slide rails for installing the lifting door panel are provided on both sides of the opening, and the limiting platform is located below the slide rails.

[0009] Furthermore, the robotic arm assembly also includes a first transverse seat, a first longitudinal seat, a first curved arm, a second longitudinal seat, a second transverse seat and a second curved arm. The first transverse seat is fixedly connected to the base plate, the rotating portion at the top of the first transverse seat is fixedly connected to the bottom of the first longitudinal seat, the rotating portion of the first longitudinal seat is fixedly connected to one end of the first curved arm, the other end of the first curved arm is connected to the rotating portion of the second longitudinal seat, the second longitudinal seat is connected to the rotating portion of the second transverse seat, the side end of the second transverse seat is connected to one end of the second curved arm through a side rotating portion, and the other end of the second curved arm is connected to the grasping assembly.

[0010] Furthermore, the grabbing assembly includes a grabbing rotating seat and a claw part for clamping the chip placement plate, the rotating seat is connected to the second curved arm, and the rotating part of the rotating seat is fixedly connected to the claw part.

[0011] Furthermore, a clamping plate corresponding to the claw portion is fixedly connected to one side of the chip placement plate.

[0012] The beneficial effect of the present application is that the present application embeds multiple groups of chips as a whole on a chip placement tray, and uses a robotic arm to clamp the entire chip placement tray and transport and move it, without grabbing a single chip, thereby avoiding direct contact between the claws and the chip and protecting the integrity of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural schematic diagram of an embodiment of a gripping and conveying device for semiconductor packaging of the present application;

[0014] Figure 2 yes Figure 1 A schematic structural diagram of an embodiment of a first packaging cabinet;

[0015] Figure 3 yes Figure 1 A schematic structural diagram of an embodiment of a mechanical arm assembly in FIG.

[0016] Figure 4 yes Figure 1 A schematic structural diagram of an embodiment of a chip placement tray in FIG. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0018] like Figure 1-4As shown, the present application provides a gripping and conveying device for semiconductor packaging, comprising a first packaging cabinet 1 and a second packaging cabinet 2 of the same structure; a first packaging station 11 is provided in the first packaging cabinet 1, and a second packaging station 21 is provided in the second packaging cabinet 2; a base plate 3 is provided at the lower end of the first packaging cabinet 1 close to the second packaging cabinet 2, and a mechanical arm assembly 4 is provided on the base plate 3; the mechanical arm assembly 4 includes a gripping assembly 41 for gripping a chip placement tray 5; wherein the gripping assembly 41 grips and transports the chip placement tray 5 from the first packaging station 11 to the second packaging station 21. The chip placement tray 5 in the above-mentioned design can be embedded with multiple groups of chips and packaged as a whole on the packaging station. The first packaging station 11 can perform preliminary packaging on the chips in the chip placement tray 5, and the mechanical arm assembly 4 can grip the chip placement tray 5 and transport it to the second packaging station 21.

[0019] The first packaging cabinet 1 includes a base 12 and a shield 13 with windows on four sides. The shield 13 is mounted above the base 12 and connected by multiple groups of support rods 14. The first packaging table 11 is fixed to the surface of the base 12 and located in the shield 13. The base plate 3 is located below the side end of the base 12. The shield 13 in the above design covers the packaging table as a whole, thereby preventing external dust from contaminating the packaging process.

[0020] A limiting platform 6 is provided on one side of the pedestal 12 adjacent to the base plate 3, and the limiting platform 6 is flush with the upper edge of the pedestal 12. The limiting platform 6 in the above design is used to limit the descending height of the lifting door.

[0021] An opening 15 is provided on one side of the shield 13 and the limiting platform 6, and slide rails 7 for installing the lifting door plate are provided on both sides of the opening 15, and the limiting platform 6 is located below the slide rails 7. The opening 15 in the above design can facilitate the robot arm to clamp or prevent the chip placement tray 5 from the packaging platform.

[0022] The robot arm assembly 4 further includes a first transverse seat 42, a first longitudinal seat 43, a first curved arm 44, a second longitudinal seat 45, a second transverse seat 46 and a second curved arm 47. The first transverse seat 42 is fixedly connected to the base plate 3. The rotating part at the top of the first transverse seat 42 is fixedly connected to the bottom of the first longitudinal seat 43. The rotating part of the first longitudinal seat 43 is fixedly connected to one end of the first curved arm 44. The other end of the first curved arm 44 is connected to the rotating part of the second longitudinal seat 45. The second longitudinal seat 45 is connected to the rotating part of the second transverse seat 46. The side end of the second transverse seat 46 is connected to one end of the second curved arm 47 through the side rotating part. The other end of the second curved arm 47 is connected to the grabbing assembly 41. The rotational coordination of each rotating seat in the above design will adjust the position of the grabbing assembly 41 of the robot arm, thereby transporting the chip placement tray 5.

[0023] The grab assembly 41 includes a grabbing rotating seat 411 and a claw 412 for clamping the chip placement tray 5. The rotating seat 411 is connected to the second curved arm 47, and the rotating part of the rotating seat 411 is fixed to the claw 412. The claw 412 in the above design can rotate freely, so that the front side of the chip on the chip placement tray 5 is placed upward.

[0024] A clamping plate 51 corresponding to the claw portion 412 is fixedly connected to one side of the chip placement plate 5. The clamping plate 51 in the above design is convenient for the claw portion 412 to clamp.

[0025] In a specific working method, multiple groups of chips are embedded in the chip placement tray 5 and transported to the first packaging station 11 through other transportation devices for initial packaging. After completion, the lifting door plate of the opening 15 of the shield 13 is opened, and then the robot arm is controlled to rotate to enter the shield 13 and clamp the chip placement tray 5 through the claw 412. Then, the mechanical arm is rotated to send the chip placement tray 5 into the opening 15 of the second packaging cabinet 2 and place it on the second packaging station 21. Then, the opening of the second packaging cabinet 2 is closed, and the internal chips are packaged.

[0026] The present application embeds multiple groups of chips as a whole on the chip placement tray 5, and uses a mechanical arm to clamp the entire chip placement tray 5 and transport and move it, without grabbing a single chip, thereby avoiding direct contact between the claw and the chip and protecting the integrity of the chip.

[0027] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A semiconductor packaging gripping and conveying device, characterized in that: include: A first packaging cabinet and a second packaging cabinet having the same structure; A first packaging station is provided in the first packaging cabinet, and a second packaging station is provided in the second packaging cabinet; a base plate is provided at the lower end of the first packaging cabinet close to the second packaging cabinet, and a robotic arm assembly is provided on the base plate; the robotic arm assembly includes a grasping assembly for grasping a chip placement tray; wherein the grasping assembly grasps and transports the chip placement tray from the first packaging station to the second packaging station.

2. A semiconductor packaging gripping and conveying device according to claim 1, characterized in that: The first packaging cabinet includes a pedestal and a shield with windows on four sides, the shield is mounted above the pedestal and connected by multiple groups of support rods; the first packaging table is fixedly connected to the surface of the pedestal and located in the shield, and the base plate is located below the side end of the pedestal.

3. A semiconductor packaging gripping and conveying device according to claim 2, characterized in that: A limiting platform is provided on one side of the pedestal adjacent to the base plate, and the limiting platform is flush with the upper edge of the pedestal.

4. A semiconductor packaging gripping and conveying device according to claim 3, characterized in that: An opening is provided on one side of the protective cover which is on the same side as the limiting platform, and slide rails for installing a lifting door panel are provided on both sides of the opening, and the limiting platform is located below the slide rails.

5. The semiconductor packaging gripping and conveying device according to claim 1, characterized in that: The robotic arm assembly also includes a first transverse seat, a first longitudinal seat, a first curved arm, a second longitudinal seat, a second transverse seat and a second curved arm. The first transverse seat is fixedly connected to the base plate, the rotating part at the top of the first transverse seat is fixedly connected to the bottom of the first longitudinal seat, the rotating part of the first longitudinal seat is fixedly connected to one end of the first curved arm, the other end of the first curved arm is connected to the rotating part of the second longitudinal seat, the second longitudinal seat is connected to the rotating part of the second transverse seat, the side end of the second transverse seat is connected to one end of the second curved arm through a side rotating part, and the other end of the second curved arm is connected to the grasping assembly.

6. The semiconductor packaging gripping and conveying device according to claim 5, characterized in that: The grabbing assembly comprises a grabbing rotating seat and a claw part for clamping the chip placement plate. The rotating seat is connected to the second curved arm, and the rotating part of the rotating seat is fixedly connected to the claw part.

7. A semiconductor packaging gripping and conveying device according to claim 6, characterized in that: A clamping plate corresponding to the claw portion is fixedly connected to one side of the chip placement plate.

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