Temperature-controllable bearing device for semiconductor device preparation

Abstract

The utility model relates to the field of semiconductor device preparation, and particularly provides a temperature-controllable bearing device for semiconductor device preparation. The utility model aims to solve the problems of small controllable temperature range, small application range, large device size and poor temperature uniformity of the existing temperature changing device. Therefore, the heat conduction device comprises a first heat conduction component and a Peltier temperature change element, the first heat conduction component is connected with the Peltier temperature change element in an attached mode to achieve heat conduction, the first heat conduction component is provided with at least one containing groove, the containing groove can contain at least one part of a vessel to be treated, and the vessel to be treated is used for bearing a sample. The Peltier temperature changing element is arranged to expand the temperature control range and ensure the accuracy and uniformity of temperature changing, heat or cold generated by the Peltier temperature changing element is better guided out by means of the first heat conduction component, and different containing grooves can be formed in the first heat conduction component to be matched with different vessels to be treated. And the application range of the device is effectively enlarged.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor device preparation, and specifically provides a temperature-controllable carrying device used for semiconductor device preparation. Background Art

[0002] In the field of semiconductor device preparation, especially in the field of highly integrated and automated high-throughput full-device preparation, solution temperature change is a pain point that cannot be avoided. The solution temperature change in the existing high-throughput full-device preparation field is usually achieved with the help of heating and cooling devices (collectively referred to as temperature change devices) in the medical and biological fields. However, these temperature change devices have many problems when applied to semiconductor device preparation: First, the existing temperature change devices are mainly set to meet the heating needs of synthetic organic polymer drugs in terms of heating requirements. The heating temperature is usually between 50℃-60℃, and the lowest cooling temperature is only around 0℃. Although this temperature range can meet almost all the needs in the biological and medical fields, this temperature range is far from enough in the field of semiconductor device preparation. In the field of semiconductor device preparation, there is still a wide application range below 0℃ and above 60℃, that is, the controllable temperature range of existing equipment is small and the application range is low. Secondly, in order to ensure uniform heating, most of the existing temperature-changing devices use water baths, oil baths and other methods. Therefore, when a porous plate is needed, the porous plate needs to be fixed on a base, which will lead to the problem that the porous plate cannot be moved by a robotic arm. Therefore, the use of the above-mentioned temperature-changing device cannot meet the temperature-changing requirements of the porous plate during high-throughput full-device preparation; furthermore, when dealing with large-capacity heating needs, the existing temperature-changing device can only meet the heating of centrifuge tubes at most, and the capacity of centrifuge tubes cannot meet the needs of the semiconductor device preparation field. For the large-capacity heating needs in the semiconductor device preparation field, it is often necessary to use glass bottles to load the solution, but the existing temperature-changing device cannot heat the glass bottles well. In addition, not only does high-throughput full-device preparation have almost stringent requirements for solution temperature control, but high-throughput device characterization also has variable temperature requirements for devices or films. However, the existing variable temperature devices are too large to be embedded in the high-throughput device characterization system, and therefore cannot detect the performance response of devices and films under different temperature conditions. The single temperature condition to evaluate device and film performance can no longer meet the growing testing needs, let alone be associated with actual conditions, that is, it is impossible to simulate a variety of application scenarios. The above problems are the core problems encountered in the preparation and characterization of high-throughput liquid phase semiconductor devices. In summary, since the controllable temperature range of existing variable temperature devices is generally small and the heating flux is small, it is difficult to achieve uniform heating, and therefore cannot meet the experimental requirements; and the existing variable temperature devices are large in size, which makes it impossible to embed them into high-throughput device preparation and characterization platforms.

[0003] Accordingly, the art needs a new temperature-controllable carrier device for semiconductor device preparation to solve or alleviate the above technical problems to a certain extent. Utility Model Content

[0004] The utility model aims to solve or alleviate the above technical problems to a certain extent, namely, the problems that the existing temperature-changing devices have a small controllable temperature range, a small application range, a large device volume, and poor temperature uniformity.

[0005] The utility model provides a temperature-controllable carrying device for preparing semiconductor devices, the temperature-controllable carrying device comprising a first heat-conducting component and a Peltier temperature-changing element.

[0006] The first heat-conducting component is attached and connected to the Peltier temperature-changing element to achieve heat conduction. The first heat-conducting component is provided with at least one receiving groove, which can receive at least a part of the vessel to be processed, and the vessel to be processed is used to carry the sample.

[0007] In a preferred embodiment of the above temperature-controllable carrying device, the temperature-controllable carrying device further includes a second heat-conducting member,

[0008] The second heat-conducting component is connected to the first heat-conducting component and a mounting cavity is formed between the first heat-conducting component and the second heat-conducting component. The mounting cavity is used to accommodate the Peltier temperature-changing element.

[0009] In a preferred embodiment of the above-mentioned temperature-controllable carrying device, a heat exchange cavity is provided on the second heat conducting component, and the heat exchange cavity is filled with a heat exchange liquid.

[0010] In a preferred embodiment of the above temperature-controllable carrying device, the first heat-conducting component is an aluminum alloy part; and / or

[0011] The second heat conducting component is an aluminum alloy member.

[0012] In a preferred embodiment of the above temperature-controllable carrying device, at least one temperature sensor is provided in the first heat-conducting member, and the temperature sensor is provided close to the supporting surface of the containing groove; and / or

[0013] The first heat conducting component and the second heat conducting component are connected in a detachable manner.

[0014] In a preferred embodiment of the temperature-controllable carrying device, the shape of the receiving groove matches at least a part of the shape of the vessel to be processed, so that the inner wall of the receiving groove can cover the outside of the vessel to be processed, wherein the vessel to be processed is a bottle-shaped structure.

[0015] In a preferred embodiment of the above-mentioned temperature-controllable carrying device, the first heat-conducting component includes a bottom plate and a baffle plate arranged on the bottom plate, the bottom plate and the baffle plate jointly form the accommodating groove, the bottom plate is used to support the vessel to be processed, and the height of the baffle plate protruding from the bottom plate is greater than the thickness of the vessel to be processed, wherein the vessel to be processed is a porous plate.

[0016] In a preferred embodiment of the above-mentioned temperature-controllable bearing device, a plurality of vertical notches are arranged around the baffle plate, and the vertical notches extend from the top of the baffle plate to below the supporting surface of the bottom plate.

[0017] In a preferred embodiment of the temperature-controllable carrying device, a portion of the accommodating groove is arranged through the first heat-conducting component, the vessel to be processed is arranged in the accommodating groove, and the second heat-conducting component is correspondingly provided with a through hole, and the projection of the through hole on the second heat-conducting component is completely located at the projection of the vessel to be processed on the second heat-conducting component, wherein the vessel to be processed is a substrate.

[0018] In a preferred embodiment of the above temperature-controllable carrying device, there are multiple accommodating grooves, and the multiple accommodating grooves are distributed in an array on the first heat-conducting component; and / or

[0019] The first heat conducting component is also provided with an avoidance groove, and the avoidance groove is communicated with the accommodating groove.

[0020] The temperature-controllable carrying device of the present invention includes a first heat-conducting component and a Peltier temperature-changing element. The first heat-conducting component is attached and connected to the Peltier temperature-changing element to achieve heat conduction. The first heat-conducting component is provided with at least one receiving groove, which can accommodate at least a part of the vessel to be processed, and the vessel to be processed is used to carry the sample. The present invention expands the temperature control range and ensures the accuracy and uniformity of temperature change by providing the Peltier temperature-changing element, and better guides out the heat or cold generated by the Peltier temperature-changing element with the help of the first heat-conducting component. Different receiving grooves can also be provided on the first heat-conducting component to adapt to different vessels to be processed, thereby effectively increasing the application range of the present device. In addition, the present invention can achieve temperature change only through the first heat-conducting component and the Peltier temperature-changing element, which effectively reduces the occupied space of the temperature-controllable carrying device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The disclosure of the present invention will become easier to understand with reference to the accompanying drawings. It is easy for those skilled in the art to understand that these drawings are only for illustrative purposes and are not intended to limit the scope of protection of the present invention. In addition, similar numbers in the drawings are used to represent similar components, among which:

[0022] Figure 1The overall structural schematic diagram of the first embodiment of the first heat-conducting component of the utility model is shown;

[0023] Figure 2 A bottom view of a first embodiment of the first heat conducting member of the utility model is shown;

[0024] Figure 3 The overall structural schematic diagram of the first embodiment of the second heat-conducting component of the utility model is shown;

[0025] Figure 4 The overall structural schematic diagram of the second embodiment of the first heat-conducting component of the utility model is shown;

[0026] Figure 5 The overall structural schematic diagram of the third embodiment of the first heat-conducting component of the utility model is shown;

[0027] Figure 6 The overall structural schematic diagram of the second embodiment of the second heat-conducting component of the utility model is shown;

[0028] Reference numerals:

[0029] 11. first heat-conducting member; 111. containing groove; 112. first mounting groove; 113. first connecting hole; 114. bottom plate; 115. baffle plate; 1151. vertical notch; 116. first avoidance groove; 117. second avoidance groove; 118. first grabbing hole;

[0030] 12. Second heat-conducting component; 121. Second mounting groove; 122. Second connecting hole; 123. Through hole; 124. Second grabbing hole. DETAILED DESCRIPTION

[0031] The following describes the optional implementation modes of the present invention with reference to the accompanying drawings. It should be understood by those skilled in the art that these implementation modes are only used to explain the technical principles of the present invention and are not intended to limit the scope of protection of the present invention. Those skilled in the art can make adjustments to them as needed to adapt to specific applications. For example, the temperature-controllable carrier device of the present invention can be used for the preparation of perovskite solar cells, and can also be used for the preparation of other high-throughput devices, which are not restrictive. Such changes in specific application objects do not deviate from the basic principles of the present invention and therefore fall within the scope of protection of the present invention.

[0032] It should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be a connection between the two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0033] In addition, in the description of the present invention, terms such as "center", "upper", "lower", "left", "right", "inside", and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. This is merely for the convenience of description and does not indicate or imply that the structure must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0034] Based on the problems of the existing temperature-changing devices mentioned in the background technology, such as the small controllable temperature range, small application range, large device volume, and poor temperature uniformity. The utility model provides a temperature-controllable carrying device for semiconductor device preparation, the temperature-controllable carrying device includes a first heat-conducting component and a Peltier temperature-changing element, the first heat-conducting component is attached and connected to the Peltier temperature-changing element to achieve heat conduction, and at least one receiving groove is provided on the first heat-conducting component, the receiving groove can accommodate at least a part of the vessel to be processed, and the vessel to be processed is used to carry the sample. The utility model expands the temperature control range and ensures the accuracy and uniformity of temperature change by setting the Peltier temperature-changing element, and better guides the heat or cold generated by the Peltier temperature-changing element with the help of the first heat-conducting component, and can also set different receiving grooves on the first heat-conducting component to adapt to different vessels to be processed, thereby effectively increasing the application range of the device. In addition, the utility model can achieve temperature change only through the first heat-conducting component and the Peltier temperature-changing element, which effectively reduces the volume of the device.

[0035] The Peltier temperature variable element is an element that changes temperature using the Peltier effect. The Peltier effect refers to the phenomenon that when an electric current is applied through the contact surface of two materials with different conductivity (usually semiconductor materials), a temperature difference will be generated on both sides of the contact surface, one side becomes colder and the other side becomes hotter. The Peltier temperature variable element utilizes this effect and can realize the functions of a heater and a cooler in the same device by controlling the direction of the current. The specific principle is as follows: when the current passes through one side of the Peltier temperature variable element, the side will absorb heat and cause the temperature of this side to drop, while the other side will release heat and cause the temperature of this side to rise. By controlling the direction of the current, the heat transfer direction of the Peltier temperature variable element can be changed, thereby achieving the effect of heating or cooling. The utility model realizes the functions of heating and cooling with the help of the Peltier temperature variable element, has the advantages of fast response, high efficiency, and precise temperature control, and can be effectively applied to the field of semiconductor device preparation that requires precise temperature control.

[0036] See also Figures 1 to 6 ,like Figures 1 to 6 As shown, the temperature-controllable carrying device of the utility model includes a first heat-conducting component 11 and a Peltier temperature-changing element (not shown in the figure). The first heat-conducting component 11 is attached and connected to the Peltier temperature-changing element to achieve heat conduction. Attachment refers to at least one surface of the first heat-conducting component 11 abutting against a temperature-changing surface of the Peltier temperature-changing element. Of course, this abutment can be direct abutment or abutment with the help of other heat-conducting components. The specific connection method of the attachment connection is not limited, as long as heat conduction can be achieved. Based on this, when the side of the Peltier temperature-changing element attached to the first heat-conducting component 11 releases heat, the first heat-conducting component 11 can be heated, and when the side of the Peltier temperature-changing element attached to the first heat-conducting component 11 absorbs heat, the first heat-conducting component 11 can be cooled, thereby achieving temperature change. At least one receiving groove 111 is provided on the first heat-conducting component 11, and the receiving groove 111 can accommodate at least a part of the vessel to be processed, and the vessel to be processed is used to carry the sample. Based on the Peltier temperature-changing element, the utility model can achieve a wide range of controllable temperature ranges, from below zero to above 100 degrees, and can accurately control the temperature, and can also be used for a long time. It should be noted that the utility model does not limit the specific structure and shape of the first heat-conducting component 11, as long as the first heat-conducting component 11 is provided with at least one receiving groove 111 capable of accommodating the vessel to be processed, and the specific shape of the receiving groove 111 can be determined according to the specific type of the vessel to be processed, so as to be able to accommodate different types of vessels and realize the temperature-changing function. The vessel to be processed can be a glass bottle, a glass plate, a porous plate, etc., which is not restrictive. The utility model does not impose any restrictions on the specific form and composition of the sample carried by the vessel to be processed. For example, it can be solid or liquid, which can be set according to the preparation requirements.

[0037] As a preferred embodiment, the temperature-controllable bearing device of the utility model further includes a second heat-conducting member 12, which is connected to the first heat-conducting member 11 and forms an installation cavity between the first heat-conducting member 11 and the second heat-conducting member 12, and the installation cavity is used to accommodate the Peltier temperature-changing element. Specifically, a first installation groove 112 is provided on the first heat-conducting member 11, and a second installation groove 121 is correspondingly provided on the second heat-conducting member 12. When the first heat-conducting member 11 and the second heat-conducting member 12 are connected in place, the first installation groove 112 and the second installation groove 121 are butted to form a mounting cavity together, and the Peltier temperature-changing element is respectively attached to the first heat-conducting member 11 and the second heat-conducting member 12 through the groove walls of the first installation groove 112 and the second installation groove 121 to achieve heat conduction.

[0038] It is understandable that the specific shapes and sizes of the first mounting groove 112 and the second mounting groove 121 can be determined according to the specific conditions of the Peltier temperature-changing element, and the first mounting groove 112 and the second mounting groove 121 can also be set selectively, or the Peltier temperature-changing element can also be directly sandwiched between the first heat-conducting member 11 and the second heat-conducting member 12. In addition, the number of Peltier temperature-changing elements can be set according to the number of receiving grooves 111, that is, a Peltier temperature-changing element is correspondingly arranged under each receiving groove 111, so as to achieve temperature change more efficiently and accurately; of course, one Peltier temperature-changing element can also directly cover the bottom of all receiving grooves 111.

[0039] Furthermore, as a preferred embodiment, a heat exchange cavity is provided on the second heat conducting component 12, and the heat exchange cavity is filled with a heat exchange liquid. The specific structure of the heat exchange cavity is not limited, for example, it can be a pipe-type structure that bends back and forth and is provided on the second heat conducting component 12; the type of heat exchange liquid can be selected according to actual needs, for example, the heat exchange liquid can be water, so that the second heat conducting component 12 becomes a structure similar to a water cooling plate. This setting can better achieve heat conduction, thereby effectively coping with the problem that the controllable temperature range of the existing temperature changing device is too small, ensuring the working efficiency of the Peltier temperature changing element, and effectively meeting the heat exchange requirements of high and low temperatures.

[0040] In addition, the materials of the first heat-conducting member 11 and the second heat-conducting member 12 can also be selected according to actual use requirements, as long as they can meet the heat conduction requirements. As a preferred material, the first heat-conducting member 11 and the second heat-conducting member 12 are both made of aluminum alloy, so that the Peltier temperature-changing element is sandwiched between two aluminum alloy parts to better achieve heat conduction; and the aluminum alloy parts are light in weight, which can improve the portability of the device, and the aluminum oxide film formed on the surface is dense and stable, and is not easy to react with organic solvents at room temperature, which can enhance the durability of the device.

[0041] Furthermore, the first heat-conducting component 11 and the second heat-conducting component 12 are preferably connected in a detachable manner. For example, a first connecting hole 113 is provided on the first heat-conducting component 11, and a second connecting hole 122 is correspondingly provided on the second heat-conducting component 12. The first connecting hole 113 and the second connecting hole 122 are then connected by fasteners to achieve the connection between the first heat-conducting component 11 and the second heat-conducting component 12. Of course, a detachable connection method such as snap-on connection may also be used.

[0042] Furthermore, at least one temperature sensor is provided in the first heat-conducting component 11, and the temperature sensor is provided close to the supporting surface of the receiving tank 111, so that the temperature sensor can be as close to the sample as possible, so as to better achieve temperature measurement. The specific number and position of the temperature sensor can be set according to actual needs. Preferably, two to four temperature sensors are provided in each first heat-conducting component 11, and these temperature sensors are dispersedly arranged in various places in the first heat-conducting component 11 to perform multi-point temperature sampling and reduce accidental errors. The temperature sensor is deeply arranged inside the first heat-conducting component 11 and as close to the supporting surface of the receiving tank 111 as possible, so as to detect the temperature more accurately and reduce the error between the actual temperature and the set temperature.

[0043] This specific implementation provides three embodiments related to the first heat-conducting component 11 and two embodiments related to the second heat-conducting component 12, wherein the first embodiment of the second heat-conducting component 12 can be adapted to the first embodiment and the second embodiment of the first heat-conducting component 11 at the same time, that is, the first embodiment and the second embodiment of the first heat-conducting component 11 can be used in conjunction with the first embodiment of the second heat-conducting component 12. The details are as follows:

[0044] In a first embodiment of the first heat conducting member 11, that is, Figure 1 and 2In the structure shown in , the shape of the receiving groove 111 matches the shape of at least a part of the vessel to be processed, so that the inner wall of the receiving groove 111 can be coated on the outside of the vessel to be processed, wherein the vessel to be processed is a bottle-shaped structure. This embodiment is for heating a large volume of solution, and the shape of the receiving groove 111 is set to match the shape of at least a part of the vessel to be processed, so that the receiving groove 111 has a certain depth, and the embedded wrapping heating method is effectively realized. Specifically, in this embodiment, the shape of the first heat-conducting member 11 is a rectangular parallelepiped, and the shape of the receiving groove 111 is a cylinder. The vessel to be processed contained therein is a cylindrical bottle-shaped structure. Taking the heating of a 20ml glass bottle as an example, the sample solution carried in the glass bottle is not limited, and the depth of the receiving groove 111 can be set to 4.5cm, so that the inner wall of the receiving groove 111 can completely wrap the outer wall of the glass bottle, thereby achieving uniform heating and ensuring the heating effect. In this embodiment, the number of the receiving grooves 111 is set to six, and the six receiving grooves 111 are distributed in an array on the first heat conducting member 11, and a Peltier temperature changing element is correspondingly arranged under each receiving groove 111 to better achieve temperature change and temperature control. Figure 2 and 3 As shown, after the first heat conducting component 11 and the second heat conducting component 12 are connected in place, six installation cavities can be formed. The six installation cavities are respectively arranged under the six receiving grooves 111 so as to respectively arrange six Peltier temperature changing elements.

[0045] In the second embodiment of the first heat conducting member 11, that is, Figure 4In the structure shown in , the first heat-conducting member 11 includes a bottom plate 114 and a baffle plate 115 disposed on the bottom plate 114. The bottom plate 114 is a rectangular plate, and the cross-sectional shape of the baffle plate 115 is a rectangle. The bottom plate 114 and the baffle plate 115 together form a receiving groove 111, that is, the top surface of the bottom plate 114 located inside the baffle plate 115 and the inner side surface of the baffle plate 115 together enclose a rectangular receiving groove 111. The bottom plate 114 is used to support the vessel to be processed. The height of the baffle plate 115 protruding from the bottom plate 114 is greater than the thickness of the vessel to be processed, wherein the vessel to be processed is a porous plate. The porous plate is attached to the top surface of the bottom plate 114 to better ensure the temperature change effect. Of course, the specific shapes of the bottom plate 114 and the baffle plate 115 can be set according to the needs, and the baffle plate 115 can also be set in multiple, multiple baffle plates 115 and the bottom plate 114 form multiple receiving grooves 111, and each baffle plate 115 surrounds a receiving groove 111. The temperature change requirements of various solutions can be achieved by heating and cooling the porous plate. However, when the existing porous plate is subjected to temperature change treatment, the heat loss of the holes on the outside is often much greater than that of the holes on the inside. Based on this, this embodiment effectively blocks the loss of heat by setting a baffle plate 115 higher than the porous plate, which can not only effectively increase the types of solutions that can be changed in a single temperature, but also effectively ensure the temperature uniformity, and control its error within 2°C. In addition, a plurality of vertical notches 1151 are arranged around the baffle plate 115, and the vertical notches 1151 extend from the top of the baffle plate 115 to the bottom of the support surface of the bottom plate 114, that is, extend to the bottom of the top surface of the bottom plate 114. Based on the setting of the vertical notch 1151, during the preparation process, the robot arm normally grabs and moves the porous plate through the vertical notch 1151, effectively meeting the requirements of the existing high-throughput device preparation for the type and flux of the solution. The setting method of the second heat-conducting member 12 used in this embodiment is similar to that of the previous embodiment, and will not be repeated here.

[0046] In the third embodiment of the first heat conducting member 11, that is, Figure 5 In the structure shown in FIG. 1 , a portion of the receiving groove 111 is arranged through the first heat-conducting member 11, the vessel to be processed is arranged in the receiving groove 111, and the second heat-conducting member 12 is correspondingly provided with a through hole 123, and the projection of the through hole 123 on the second heat-conducting member 12 is completely located at the projection of the vessel to be processed on the second heat-conducting member 12, wherein the vessel to be processed is a substrate. Specifically, as Figure 5 and 6As shown, the first heat-conducting member 11 is a plate-like structure, and the receiving groove 111 is formed by a part of the first heat-conducting member 11 being recessed downward, which can not only effectively ensure the support effect, but also enable the substrate to be in full contact with the first heat-conducting member 11, effectively improving the temperature uniformity. In this embodiment, the middle part of the receiving groove 111 passes through the first heat-conducting member 11 and is aligned and connected with the through hole 123 provided on the second heat-conducting member 12. When the substrate is arranged in the receiving groove 111, the surrounding of the substrate is in contact with the groove wall of the receiving groove 111 to ensure the temperature change effect. The through hole 123 can achieve light transmission and irradiate the light source onto the substrate, so that while performing the temperature change, relevant optical and photoelectric tests can also be performed. The shapes and areas of the through hole 123 and the portion of the receiving groove 111 that passes through the first heat-conducting member 11 can be set to be the same, and the projections in the vertical direction overlap, as long as both the temperature-changing effect and the light-transmitting effect can be taken into account at the same time. It can be set according to actual needs. For example, the through hole 123 can be set to a rectangular through hole structure with a cross-sectional area of ​​1.76 square centimeters. Correspondingly, the cross-sectional area of ​​the portion of the middle of the receiving groove 111 that passes through the first heat-conducting member 11 is also a rectangle with an area of ​​1.76 square centimeters. In this embodiment, the number of the receiving grooves 111 is eight, and the eight receiving grooves 111 are distributed in an array on the first heat-conducting member 11. Each receiving groove 111 can carry a glass substrate, thereby effectively ensuring the temperature-changing effect. The first heat-conducting component 11 is also provided with an avoidance groove connected to the accommodating groove 111. In the present embodiment, each accommodating groove 111 is correspondingly provided with six avoidance grooves, including two first avoidance grooves 116 and four second avoidance grooves 117. The two first avoidance grooves 116 are respectively located on both sides of the accommodating groove 111 and are extended in the longitudinal direction. The four second avoidance grooves 117 are respectively located at the four corners of the accommodating groove 111 and are extended in the oblique direction. Of course, the present invention does not limit the specific shape, setting quantity and distribution method of the first avoidance groove 116 and the second avoidance groove 117. Those skilled in the art can set the avoidance grooves according to actual needs as long as the normal grasping work of the robot arm can be guaranteed. In addition, two first grabbing holes 118 are provided in the middle of the first heat-conducting component 11, and two second grabbing holes 124 are correspondingly provided in the middle of the second heat-conducting component 12. When the first heat-conducting component 11 and the second heat-conducting component 12 are connected in place, the first grabbing holes 118 and the second grabbing holes 124 are aligned to form a through-hole structure, so that the robot arm can grab the entire temperature-controllable carrying device through the two through-hole structures, thereby realizing the operation of multiple substrates at the same time.

[0047] So far, the technical solution of the utility model has been described in conjunction with the optional implementation modes shown in the accompanying drawings, but it is easy for those skilled in the art to understand that the protection scope of the utility model is obviously not limited to these specific implementation modes. Without departing from the principle of the utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the utility model.

Claims

1. A temperature-controllable carrier device for semiconductor device preparation, characterized in that: The temperature-controllable carrying device comprises a first heat-conducting member and a Peltier temperature-changing element. The first heat-conducting member is attached and connected to the Peltier temperature-changing element to achieve heat conduction, and the first heat-conducting member is provided with at least one receiving groove, and the receiving groove can receive at least a part of the vessel to be processed, and the vessel to be processed is used to carry the sample; The first heat-conducting member includes a bottom plate and a baffle plate disposed on the bottom plate, the bottom plate and the baffle plate together form the receiving groove, the bottom plate is used to support the vessel to be processed, the height of the baffle plate protruding from the bottom plate is greater than the thickness of the vessel to be processed, wherein the vessel to be processed is a porous plate; A plurality of vertical notches are arranged around the baffle plate, and the vertical notches extend from the top of the baffle plate to below the supporting surface of the bottom plate.

2. The temperature-controllable carrying device according to claim 1, characterized in that: The temperature-controllable carrying device further comprises a second heat-conducting member, The second heat-conducting component is connected to the first heat-conducting component and a mounting cavity is formed between the first heat-conducting component and the second heat-conducting component. The mounting cavity is used to accommodate the Peltier temperature-changing element.

3. The temperature-controllable carrying device according to claim 2, characterized in that: The second heat-conducting component is provided with a heat-exchange cavity, and the heat-exchange cavity is filled with a heat-exchange liquid.

4. The temperature-controllable carrying device according to claim 2, characterized in that: The first heat-conducting component is an aluminum alloy; and / or The second heat conducting component is an aluminum alloy member.

5. The temperature-controllable carrying device according to claim 2, characterized in that: At least one temperature sensor is disposed in the first heat-conducting member, and the temperature sensor is disposed close to the supporting surface of the containing groove; and / or The first heat conducting component and the second heat conducting component are connected in a detachable manner.

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