Heat dissipation structure

Abstract

The utility model provides a heat radiation structure, comprising a substrate, a power module installed on the substrate, a first liquid inlet channel and a first liquid outlet channel arranged on the substrate at an interval, the first liquid inlet channel and the first liquid outlet channel penetrating through the substrate; the heat dissipation assembly is provided with a second circulation cavity used for containing heat dissipation fluid, and the second circulation cavity communicates with the first liquid inlet channel and the first liquid outlet channel; the heat dissipation assembly is provided with a heat dissipation part connected with the second circulation cavity, and the heat dissipation part is used for dissipating heat of the heat dissipation fluid; the shell is connected with the base plate to define a first circulating cavity, and the first circulating cavity communicates with the first liquid inlet channel and the first liquid outlet channel; and the driving module is used for driving the heat dissipation fluid to flow in the second circulating cavity and the first circulating cavity. The technical problem of low heat dissipation efficiency of the power module in the prior art is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of power module heat dissipation, in particular to a heat dissipation structure. Background Art

[0002] At present, there are two main mainstream packaging structures for power modules. One is a packaging structure that is chip, solder, liner, solder, and substrate from top to bottom; the other is a double-sided heat dissipation structure, that is, a heat dissipation structure that is substrate, solder, liner, solder, chip, solder, liner, solder, and substrate from top to bottom. Among them, the heat dissipation capacity of the first solution is limited. With the popularization of SiC chips and the increase in the power of Si-based modules, the first heat dissipation structure can no longer meet the increasingly high heat dissipation needs. At the same time, the second double-sided heat dissipation structure has the disadvantages of high process technology difficulty and high material cost.

[0003] Therefore, the prior art needs to be further developed. Utility Model Content

[0004] The purpose of the utility model is to overcome the above technical deficiencies and provide a heat dissipation structure to solve the technical problem of low heat dissipation efficiency of power modules in related technologies.

[0005] In order to achieve the above technical objectives, the utility model adopts the following technical solutions: a heat dissipation structure is provided, including: a substrate, a power module is installed on the substrate, a first liquid inlet channel and a first liquid outlet channel are arranged at intervals on the substrate, the first liquid inlet channel and the first liquid outlet channel are both arranged through the substrate, a first circulation cavity for accommodating the power module is arranged on one side of the substrate, the first circulation cavity is connected with the first liquid inlet channel and the first liquid outlet channel; a heat dissipation component, the heat dissipation component has a second circulation cavity for accommodating a heat dissipation fluid, and a heat dissipation component connected to the second circulation cavity, the heat dissipation component is used to dissipate the heat of the heat dissipation fluid; the second circulation cavity is connected with the first liquid inlet channel and the first liquid outlet channel; a driving module, the driving module is used to drive the heat dissipation fluid to flow in the second circulation cavity and the first circulation cavity.

[0006] Furthermore, the second circulation chamber includes a second liquid inlet channel and a second liquid outlet channel; the driving module includes a water pump, which is connected to the second liquid inlet channel to input the heat dissipation fluid into the second circulation chamber through the second liquid inlet channel.

[0007] Furthermore, the second liquid inlet channel is located on a side of the first liquid inlet channel away from the first liquid outlet channel; the second liquid outlet channel of the second circulation chamber is located on a side of the first liquid outlet channel away from the first liquid inlet channel.

[0008] Furthermore, the heat dissipation assembly includes: a heat dissipation shell, a second circulation chamber is located in the heat dissipation shell, and the heat dissipation shell is detachably connected to the substrate; a first heat dissipation plate, a plurality of first heat dissipation plates, the plurality of first heat dissipation plates are arranged in the second circulation chamber at intervals, and the plurality of first heat dissipation plates are all connected to the heat dissipation shell; a second heat dissipation plate, the second heat dissipation plate is arranged opposite to the second liquid inlet channel, the second heat dissipation plate is arranged between the second liquid inlet channel and the first heat dissipation plate, the second heat dissipation plate is connected to the heat dissipation shell, and the maximum distance between the second heat dissipation plate and the inner wall of the heat dissipation shell is less than the maximum distance between the first heat dissipation plate and the inner wall of the heat dissipation shell.

[0009] Furthermore, the heat dissipation structure also includes a control module, which is signal-connected to the driving module and is used to adjust the flow rate of the heat dissipation fluid.

[0010] Furthermore, the heat dissipation structure also includes an adjustment plate, which and the heat dissipation component form a second circulation cavity. The adjustment plate is movably arranged to adjust the size of the second circulation cavity, and the adjustment plate is connected to the control module signal.

[0011] Furthermore, the driving module also includes: a first blade, which is rotatably arranged in the first liquid inlet channel to drive the heat dissipation fluid to enter the first circulation chamber, and the first blade is connected to the control module signal to adjust the rotation speed of the first blade; a second blade, which is rotatably arranged in the first liquid outlet channel to drive the heat dissipation fluid to flow out of the first circulation chamber, and the second blade is connected to the control module signal to adjust the rotation speed of the second blade.

[0012] Furthermore, the heat dissipation structure also includes: a first movable baffle, the first movable baffle is movably set on the substrate, the first movable baffle is connected to the control module signal, and the first movable baffle is used to block the first liquid inlet channel; a second movable baffle, the second movable baffle is movably set on the substrate, the second movable baffle is connected to the control module signal, and the second movable baffle is used to block the first liquid outlet channel.

[0013] Furthermore, the heat dissipation structure also includes: a first temperature sensor, which is arranged in the second circulation chamber, and is used to detect the temperature of the heat dissipation fluid in the second circulation chamber, and the first temperature sensor is connected to the control module signal; a second temperature sensor, which is arranged in the first circulation chamber, and is used to detect the temperature of the heat dissipation fluid in the first circulation chamber, and the first temperature sensor is connected to the control module signal.

[0014] Furthermore, the heat dissipation structure also includes a shell, which is connected to the substrate to enclose a first circulation cavity; the power modules are connected to terminals one by one, and the ends of the terminals are arranged to pass through the shell.

[0015] Furthermore, a sealing component is provided in the first circulation cavity, the sealing component is provided between the terminal and the power module, and a mounting hole for the terminal to pass through is provided on the sealing component.

[0016] Beneficial effects:

[0017] 1. The heat dissipation structure of the utility model uses liquid insulating medium as circulating fluid, which solves the problem of heat dissipation capacity limitation of the power module and achieves the technical effect of improving power density.

[0018] 2. The liquid insulating medium in the heat dissipation structure of the utility model has extremely low water absorption and good insulation, which solves the technical requirements of the insulation withstand voltage requirements of the power module, achieves the technical effect of ensuring the insulation withstand voltage and high heat conductivity between lines, and reduces the external force on the bonding wire and reduces the risk of wire punching.

[0019] 3. The heat dissipation structure of the utility model solves the technical problem of the hazard of residual moisture in the circulating insulating liquid by adding a layer of PI film base on the surface of the liner, solder, chip, and bonding wire, and achieves the technical requirements of meeting environmental testing.

[0020] 4. The heat dissipation structure of the utility model provides a means for detecting and adjusting the performance status of the module by regularly detecting the state of the insulating liquid, such as water content, dielectric constant, etc., and timely replacing or maintaining the circulating liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of a heat dissipation structure adopted in one embodiment of the utility model;

[0022] Figure 2 It is a structural schematic diagram of a heat dissipation structure adopted in another embodiment of the utility model;

[0023] Figure 3 It is a structural schematic diagram of a substrate of a heat dissipation structure adopted in an embodiment of the utility model.

[0024] The above drawings include the following reference numerals:

[0025] 1. Substrate; 11. First liquid inlet channel; 12. First liquid outlet channel; 13. Power module; 14. First movable baffle; 15. Second movable baffle; 2. Heat dissipation assembly; 21. Second circulation chamber; 22. Heat dissipation component; 221. First heat dissipation plate; 222. Second heat dissipation plate; 23. Heat dissipation shell; 24. Second liquid inlet channel; 25. Second liquid outlet channel; 26. Adjustment plate; 3. Shell; 31. First circulation chamber; 32. Terminal; 34. Sealing component; 4. Drive module; 41. Water pump; 42. First blade; 43. Second blade. DETAILED DESCRIPTION

[0026] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0027] According to an embodiment of the utility model, a heat dissipation structure is provided. Figures 1 to 3 , comprising: a substrate 1, on which a power module 13 is mounted, a first liquid inlet channel 11 and a first liquid outlet channel 12 are arranged at intervals on the substrate 1, the first liquid inlet channel 11 and the first liquid outlet channel 12 are both arranged through the substrate 1, a first circulation chamber 31 for accommodating the power module 13 is arranged on one side of the substrate, and the first circulation chamber 31 is communicated with the first liquid inlet channel 11 and the first liquid outlet channel 12; a heat dissipation component 2, the heat dissipation component 2 has a second circulation chamber 21 for accommodating a heat dissipation fluid, and a heat dissipation component 22 connected to the second circulation chamber 21, and the heat dissipation component 22 is used to dissipate the heat of the heat dissipation fluid; the second circulation chamber 21 is communicated with the first liquid inlet channel 11 and the first liquid outlet channel 12; a driving module 4, the driving module 4 is used to drive the heat dissipation fluid to flow in the second circulation chamber 21 and the first circulation chamber 31.

[0028] With the above arrangement, after the heat dissipation fluid enters the second circulation chamber 21, it is driven by the driving module 4 to first flow to the first circulation chamber 31, and performs heat exchange with the power module 13 in the first circulation chamber 31, taking away the heat generated by the power module 13, returning to the second circulation chamber 21, and dissipating the heat to the external environment in the second circulation chamber 21 and the first circulation chamber 31, thereby completing the heat dissipation of the power module 13. The heat dissipation effect of the heat dissipation fluid on the power module 13 is enhanced by the continuous flow of the heat dissipation fluid in the first circulation chamber 31, thereby improving the heat dissipation efficiency of the power module 13, and solving the technical problem of low heat dissipation efficiency of the power module in the related technology.

[0029] Specifically, mineral insulating oil can be used as the heat dissipation fluid, and synthetic insulating oil and vegetable oil can also be used, including but not limited to:

[0030] Natural insulating oil: vegetable oil (castor oil, linseed oil, tung oil, etc.); mineral oil (transformer oil, capacitor oil, etc.);

[0031] Artificial synthetic insulating oil: aromatic hydrocarbon insulating oil; ether insulating oil; ester insulating oil; silicone oil.

[0032] In some embodiments, the opening sizes of the first liquid inlet channel 11 and the first liquid outlet channel 12 on the substrate may be adjusted to adjust the flow rate of the heat dissipation fluid.

[0033] In the heat dissipation structure of this embodiment, see Figure 2 The second circulation chamber 21 includes a second liquid inlet channel 24 and a second liquid outlet channel 25; the driving module 4 includes a water pump 41, which is connected to the second liquid inlet channel 24 to input the heat dissipation fluid into the second circulation chamber 21 through the second liquid inlet channel 24. In this way, the heat dissipation fluid enters the second circulation chamber 21 through the second liquid inlet channel 24, and the water pump 41 is arranged on the second liquid inlet channel 24, which can accelerate the heat dissipation fluid to enter the second circulation chamber 21 and improve the heat dissipation efficiency of the heat dissipation structure.

[0034] In the heat dissipation structure of this embodiment, see Figure 2 , the second liquid inlet channel 24 is located on the side of the first liquid inlet channel 11 away from the first liquid outlet channel 12; the second liquid outlet channel 25 of the second circulation chamber is located on the side of the first liquid outlet channel 12 away from the first liquid inlet channel 11. In this way, the heat dissipation fluid enters the second circulation chamber 21 from the second liquid inlet channel 24, and flows from the second circulation chamber 21 to the first circulation chamber 31 through the first liquid inlet channel 11. After completing the heat exchange with the power module 13 in the first circulation chamber 31, it flows out of the first circulation chamber 31 from the first liquid outlet channel 12 and enters the second circulation chamber 21, and finally flows out of the second circulation chamber 21 from the second liquid outlet channel 25, completing a heat dissipation cycle.

[0035] In the heat dissipation structure of this embodiment, see Figure 2 The heat dissipation assembly 2 includes: a heat dissipation housing 23, the second circulation chamber 21 is located in the heat dissipation housing 23, and the heat dissipation housing 23 is detachably connected to the substrate 1; a first heat dissipation plate 221, there are multiple first heat dissipation plates 221, the multiple first heat dissipation plates 221 are arranged in the second circulation chamber 21 at intervals, and the multiple first heat dissipation plates 221 are connected to the heat dissipation housing 23; a second heat dissipation plate 222, the second heat dissipation plate 222 is arranged opposite to the second liquid inlet channel 24, the second heat dissipation plate 222 is arranged between the second liquid inlet channel 24 and the first heat dissipation plate 221, the second heat dissipation plate 222 is connected to the heat dissipation housing 23, and the maximum distance between the second heat dissipation plate 222 and the inner wall of the heat dissipation housing 23 is less than the maximum distance between the first heat dissipation plate 221 and the inner wall of the heat dissipation housing 23. In this way, after the heat dissipation fluid enters the second circulation chamber 21 from the second liquid inlet channel 24, it is blocked by the second heat dissipation plate 222, so that the heat dissipation fluid flows to the first liquid inlet channel 11 and then enters the first circulation chamber 31.

[0036] In some embodiments, the heat dissipation component 2 is not in contact with the substrate 1, and the second circulation chamber 21 and the first circulation chamber 31 are connected by a pipeline. The heat dissipation fluid flows from the second circulation chamber 21 through the pipeline and enters the first liquid inlet channel 11. After heat exchange in the first circulation chamber 31, it flows from the first liquid outlet channel 12 through the pipeline and enters the second circulation chamber 21.

[0037] In the heat dissipation structure of this embodiment, see Figure 2 The heat dissipation structure further includes a control module, which is connected to the drive module 4 by signal, and the control module is used to adjust the flow rate of the heat dissipation fluid. In this way, the control module adjusts the flow rate of the heat dissipation fluid by adjusting the switch of the drive module.

[0038] In the heat dissipation structure of this embodiment, see Figure 2 The heat dissipation structure further includes an adjustment plate 26. The adjustment plate 26 and the heat dissipation component 22 form a second circulation cavity 21. The adjustment plate 26 is movably arranged to adjust the size of the second circulation cavity 21. The adjustment plate 26 is connected to the control module signal. In this way, when the heat dissipation efficiency reaches the target, the control module adjusts the adjustment plate 26 to move toward the substrate to reduce the space of the second circulation cavity 21 and reduce the flow of the heat dissipation fluid in the heat dissipation structure; when the heat dissipation efficiency does not reach the target, the control module adjusts the adjustment plate 26 to move away from the substrate to increase the space of the second circulation cavity 21 and increase the flow of the heat dissipation fluid in the heat dissipation structure, thereby improving the heat dissipation efficiency of the heat dissipation structure.

[0039] In some embodiments, the uniformity of the flow rate of the heat dissipation fluid on the upper and lower sides of the substrate can be adjusted by changing the volumes of the first circulation chamber and the second circulation chamber.

[0040] In the heat dissipation structure of this embodiment, see Figure 2 The driving module 4 further includes: a first blade 42, which is rotatably disposed in the first liquid inlet channel 11 to drive the heat dissipation fluid to enter the first circulation chamber 31, and the first blade 42 is connected to the control module signal to adjust the rotation speed of the first blade 42; a second blade 43, which is rotatably disposed in the first liquid outlet channel 12 to drive the heat dissipation fluid to flow out of the first circulation chamber 31, and the second blade 43 is connected to the control module signal to adjust the rotation speed of the second blade 43. In this way, when the heat dissipation efficiency of the heat dissipation structure is too low, the control module controls the first blade 42 and the second blade 43 to rotate to speed up the flow of the heat dissipation fluid between the second circulation chamber 21 and the first circulation chamber 31, thereby increasing the heat dissipation efficiency of the heat dissipation structure.

[0041] In the heat dissipation structure of this embodiment, see Figure 3The heat dissipation structure further includes: a first movable baffle 14, which is movably arranged on the substrate 1, the first movable baffle 14 is connected to the control module signal, and the first movable baffle 14 is used to block the first liquid inlet channel 11; a second movable baffle 15, which is movably arranged on the substrate 1, the second movable baffle 15 is connected to the control module signal, and the second movable baffle 15 is used to block the first liquid outlet channel 12. In this way, the first movable baffle 14 can control the flow rate of the heat dissipation fluid flowing from the second circulation chamber 21 to the first circulation chamber 31, and the second movable baffle 15 can control the flow rate of the heat dissipation fluid flowing from the first circulation chamber 31 to the second circulation chamber 21. When the heat dissipation efficiency of the heat dissipation structure is too high, the control module controls the first movable baffle 14 to block part of the first liquid inlet channel 11, and the control module controls the second movable baffle 15 to block part of the first liquid outlet channel 12, so as to reduce the flow rate of the heat dissipation fluid entering the first circulation chamber 31 from the second circulation chamber 21, so as to adjust the heat dissipation efficiency of the heat dissipation structure.

[0042] In the heat dissipation structure of the present embodiment, the heat dissipation structure further includes: a first temperature sensor, which is arranged in the second circulation chamber 21, and is used to detect the temperature of the heat dissipation fluid in the second circulation chamber 21, and the first temperature sensor is connected to the control module signal; a second temperature sensor, which is arranged in the first circulation chamber 31, and is used to detect the temperature of the heat dissipation fluid in the first circulation chamber 31, and the first temperature sensor is connected to the control module signal. In this way, the heat dissipation efficiency of the heat dissipation structure can be intuitively obtained through the temperature difference between the heat dissipation fluid in the second circulation chamber 21 and the first circulation chamber 31, and then the heat dissipation structure can be adjusted through the control module.

[0043] In the heat dissipation structure of this embodiment, see Figure 2 The heat dissipation structure further includes a shell 3, which is connected to the substrate 1 to enclose a first circulation cavity 31; the power modules are connected with terminals one by one, and the ends of the terminals are arranged outside the shell.

[0044] In the heat dissipation structure of this embodiment, see Figure 2 A sealing component 34 is provided in the first circulation cavity 31, and the sealing component 34 is provided between the terminal 32 and the power module 13. The sealing component 34 is provided with a mounting hole for the power module to pass through. In this way, the sealing component 34 can enhance the sealing performance of the heat dissipation structure, and avoid the reduction of the sealing performance of the first circulation cavity 31 due to the connection component 33 passing through the housing 3.

[0045] The heat dissipation structure adjustment process of this embodiment is as follows:

[0046] Obtain the temperature difference ΔT between the heat dissipation fluid in the second circulation chamber 21 and the first circulation chamber 31, and set the temperature threshold W; if ΔT>W, turn on the driving module to drive the heat dissipation fluid to flow in the second circulation chamber 21 and the first circulation chamber 31; if ΔT≤W, turn off the driving module.

[0047] Specifically, if the temperature difference ΔT between the heat dissipation fluid in the second circulation chamber 21 and the first circulation chamber 31 is greater than the temperature threshold W, it means that the heat dissipation efficiency of the heat dissipation structure is insufficient. The control module accelerates the circulation of the heat dissipation fluid in the heat dissipation structure by turning on the driving module to improve the heat dissipation efficiency of the heat dissipation structure.

[0048] Specifically, the control module can also be used to control the adjustment plate 26 to move away from the substrate 1, so that the space of the second circulation cavity 21 is increased, and the flow rate of the heat dissipation fluid is increased, thereby improving the heat dissipation efficiency of the heat dissipation structure.

[0049] Specifically, the control module may be used to control the first blade 42 and the second blade 43 to open, thereby increasing the flow speed of the heat dissipation fluid in the heat dissipation structure and improving the heat dissipation efficiency of the heat dissipation structure.

[0050] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0051] Optionally, the specific examples in this embodiment may refer to the examples described in the above embodiments, and this embodiment will not be described in detail here.

[0052] The serial numbers of the above-mentioned embodiments of the present application are for description only and do not represent the advantages or disadvantages of the embodiments.

[0053] In the above embodiments of the present application, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the relevant description of other embodiments.

[0054] The above is only a preferred implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A heat dissipation structure, characterized in that: include: A substrate (1), a power module (13) being mounted on the substrate (1), a first liquid inlet channel (11) and a first liquid outlet channel (12) being arranged at intervals on the substrate (1), the first liquid inlet channel (11) and the first liquid outlet channel (12) both being arranged through the substrate (1), a first circulation cavity (31) accommodating the power module (13) being arranged on one side of the substrate, the first circulation cavity (31) being in communication with the first liquid inlet channel (11) and the first liquid outlet channel (12); A heat dissipation component (2), the heat dissipation component (2) comprising a second circulation chamber (21) for accommodating a heat dissipation fluid, and a heat dissipation component (22) connected to the second circulation chamber (21), the heat dissipation component (22) being used to dissipate heat of the heat dissipation fluid; the second circulation chamber (21) is in communication with both the first liquid inlet channel (11) and the first liquid outlet channel (12); A driving module (4), the driving module (4) being used to drive the heat dissipation fluid to flow in the second circulation chamber (21) and the first circulation chamber (31).

2. The heat dissipation structure according to claim 1, characterized in that: The second circulation chamber (21) comprises a second liquid inlet channel (24) and a second liquid outlet channel (25); the driving module (4) comprises a water pump (41), the water pump (41) being in communication with the second liquid inlet channel (24) so ​​as to input the heat dissipation fluid into the second circulation chamber (21) through the second liquid inlet channel (24).

3. The heat dissipation structure according to claim 2, characterized in that: The second liquid inlet channel (24) is located on a side of the first liquid inlet channel (11) away from the first liquid outlet channel (12); and the second liquid outlet channel (25) is located on a side of the first liquid outlet channel (12) away from the first liquid inlet channel (11).

4. The heat dissipation structure according to claim 2, characterized in that: The heat dissipation component (2) comprises: A heat dissipation shell (23), wherein the second circulation chamber (21) is located in the heat dissipation shell (23), and the heat dissipation shell (23) is detachably connected to the substrate (1); a first heat dissipation plate (221), wherein the first heat dissipation plates (221) are multiple, the multiple first heat dissipation plates (221) are arranged in the second circulation chamber (21) at intervals, and the multiple first heat dissipation plates (221) are all connected to the heat dissipation housing (23); a second heat sink (222), the second heat sink (222) being arranged opposite to the second liquid inlet channel (24), the second heat sink (222) being arranged between the second liquid inlet channel (24) and the first heat sink (221), the second heat sink (222) being connected to the heat sink housing (23), and the maximum distance between the second heat sink (222) and the inner wall of the heat sink housing (23) being smaller than the maximum distance between the first heat sink (221) and the inner wall of the heat sink housing (23).

5. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation structure further comprises a control module, the control module being signal-connected to the drive module (4), and the control module being used to adjust the flow rate of the heat dissipation fluid.

6. The heat dissipation structure according to claim 5, characterized in that: The heat dissipation structure further comprises an adjustment plate (26), wherein the adjustment plate (26) and the heat dissipation component (22) enclose the second circulation cavity (21), and the adjustment plate (26) is movably arranged to adjust the size of the second circulation cavity (21), and the adjustment plate (26) is signal-connected to the control module.

7. The heat dissipation structure according to claim 5, characterized in that: The driving module (4) further comprises: a first blade (42), the first blade (42) being rotatably disposed in the first liquid inlet channel (11) to drive the heat dissipation fluid into the first circulation chamber (31), the first blade (42) being connected to the control module by signal to adjust the rotation speed of the first blade (42); A second blade (43), the second blade (43) being rotatably disposed in the first liquid outlet channel (12) to drive the heat dissipation fluid to flow out of the first circulation chamber (31), the second blade (43) being connected to the control module signal to adjust the rotation speed of the second blade (43).

8. The heat dissipation structure according to claim 5, characterized in that: The heat dissipation structure further includes: a first movable baffle (14), the first movable baffle (14) being movably arranged on the substrate (1), the first movable baffle (14) being connected to the control module by signal, and the first movable baffle (14) being used to shield the first liquid inlet channel (11); A second movable baffle (15), the second movable baffle (15) being movably arranged on the substrate (1), the second movable baffle (15) being connected to the control module signal, and the second movable baffle (15) being used to shield the first liquid outlet channel (12).

9. The heat dissipation structure according to claim 5, characterized in that: The heat dissipation structure further includes: a first temperature sensor, the first temperature sensor being arranged in the second circulation chamber (21), the first temperature sensor being used to detect the temperature of the heat dissipation fluid in the second circulation chamber (21), the first temperature sensor being signal-connected to the control module; A second temperature sensor, the second temperature sensor is arranged in the first circulation chamber (31), the second temperature sensor is used to detect the temperature of the heat dissipation fluid in the first circulation chamber (31), and the first temperature sensor is connected to the control module signal.

10. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation structure further comprises a shell (3), wherein the shell (3) is connected to the substrate (1) to enclose a first circulation cavity (31); The power modules (13) are connected to terminals (32) in a one-to-one correspondence, and the ends of the terminals (32) are arranged to pass through the housing (3).

11. The heat dissipation structure according to claim 10, characterized in that: A sealing component (34) is provided in the first circulation chamber (31), the sealing component (34) is provided between the terminal (32) and the power module (13), and a mounting hole for the terminal (32) to pass through is provided on the sealing component (34).

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