Pin header cap structure

Abstract

The utility model provides a pin header cap structure. The pin header cap structure comprises a top plate; the first bulge protrudes out of the surface of the top plate; the second bulge protrudes out of the surface of the top plate; the third protrusion protrudes out of the surface of the top plate, the third protrusion is arranged between the first protrusion and the second protrusion, a first installation groove is formed between the third protrusion and the first protrusion, and a second installation groove is formed between the third protrusion and the second protrusion; the first clamping part protrudes out of the surface of the third bulge, so that a first clamping channel for clamping the pin header is formed between the first clamping part and the first bulge; the second clamping part protrudes out of the surface of the third protrusion, so that a second clamping channel used for clamping the pin header is formed between the second clamping part and the second protrusion, and the technical problem that in the related technology, the pin header cap assembly is prone to falling off or not easy to pull out when heated is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of pin headers, in particular to a pin header cap structure. Background Art

[0002] The SMT production line reported that when the SMD pin socket was used on the production controller motherboard, the existing pin header caps would fall off during reflow soldering. It was verified that there was a defect in the structural design of the pin header caps, which caused the pin header caps to deform due to heat when the temperature was too high, resulting in insufficient holding force and the pin header caps falling off.

[0003] At the same time, when the SMT production line produces motherboards using patch pin holders, the existing pin header caps are still difficult to pull out, which makes it quite difficult for employees to operate, and there is a risk of pulling out the pin headers. The highest initial test of the motherboard after wave soldering is 36.5N, which requires a large force to pull out, and the secondary insertion test is within 10N. The test without wave soldering is basically within 10N. The above two structural cap tests are one in which the cap falls off during reflow soldering in production, and the cap bonding force is less than 7N; the other is that it is difficult to pull out during reflow soldering in production, and the cap bonding force is greater than 30N. Both are common problems in the industry.

[0004] Considering the two extreme failure modes, it is analyzed that the cause is the design defect of the cap structure. The cap structure is optimized to solve the failure phenomenon caused by improper design from the design source, ensure the reliability of assembly, and improve the reliability of the product cap bonding force.

[0005] Therefore, the prior art needs to be further developed. Utility Model Content

[0006] The purpose of the utility model is to overcome the above technical deficiencies and provide a pin header cap structure to solve the technical problem in the related art that the pin header cap assembly is easy to fall off or difficult to be removed due to heat.

[0007] In order to achieve the above technical objectives, the utility model adopts the following technical solutions: a pin header cap structure is provided, comprising: a top plate; a first protrusion, the first protrusion is protruding from the surface of the top plate; a second protrusion, the second protrusion is protruding from the surface of the top plate; a third protrusion, the third protrusion is protruding from the surface of the top plate, the third protrusion is arranged between the first protrusion and the second protrusion, a first mounting groove is provided between the third protrusion and the first protrusion, and a second mounting groove is provided between the third protrusion and the second protrusion; a first clamping portion, the first clamping portion is protruding from the surface of the third protrusion, so as to form a first clamping channel for clamping the pin header between the first clamping portion and the first protrusion; a second clamping portion, the second clamping portion is protruding from the surface of the third protrusion, so as to form a second clamping channel for clamping the pin header between the second clamping portion and the second protrusion.

[0008] Further, the third protrusion includes: a first connecting part, the first connecting part is connected to the top plate, a first mounting groove is provided between the first connecting part and the first protrusion, and a second mounting groove is provided between the first connecting part and the second protrusion; a second connecting part, the second connecting part is connected to an end of the first connecting part away from the top plate, and the first clamping part and the second clamping part are arranged on opposite sides of the second connecting part.

[0009] Furthermore, the distance between the two opposite side walls of the first mounting groove is greater than the distance between the two opposite side walls of the first clamping channel; and / or the distance between the two opposite side walls of the second mounting groove is greater than the distance between the two opposite side walls of the second clamping channel.

[0010] Furthermore, a first end face is provided at one end of the second connecting portion away from the first connecting portion; a first clamping surface is provided at one end of the first clamping portion close to the first protrusion, and a first chamfer is provided between the first clamping surface and the first end face to connect the first clamping surface and the first end face; and / or, a second clamping surface is provided at one end of the second clamping portion close to the second protrusion, and a second chamfer is provided between the second clamping surface and the first end face to connect the second clamping surface and the first end face.

[0011] Further, a first groove is provided on a side of the first protrusion away from the third protrusion, and a second groove is provided on a side of the second protrusion away from the third protrusion.

[0012] Further, the length L1 of the first groove along the extension direction of the first protrusion is greater than the length I1 of the first clamping channel along the extension direction of the first protrusion, and the length L1 of the first groove along the extension direction of the first protrusion is less than the sum of the lengths I2 of the first clamping channel and the first mounting groove along the extension direction of the first protrusion; and / or, the length L2 of the second groove along the extension direction of the first protrusion is greater than the length I3 of the second clamping channel along the extension direction of the first protrusion, and the length L2 of the second groove along the extension direction of the first protrusion is less than the sum of the lengths I4 of the second clamping channel and the second mounting groove along the extension direction of the first protrusion.

[0013] Further, the distance between two opposite side walls of the first clamping channel is 0.65 mm; and / or the distance between two opposite side walls of the second clamping channel is 0.65 mm.

[0014] Further, the distance between the surface of the first protrusion close to the third protrusion and the surface of the first protrusion away from the third protrusion is 0.7 mm; and / or the distance between the surface of the second protrusion close to the third protrusion and the surface of the second protrusion away from the third protrusion is 0.7 mm.

[0015] A pin header cap assembly comprises a plurality of the above-mentioned pin header cap structures, wherein the plurality of pin header cap structures extend along a preset direction to form the pin header cap assembly.

[0016] A pin header structure comprises a pin header and a pin header cap assembly. The extension direction of the pin header is the same as a preset direction, and the pin header is inserted into the pin header cap assembly.

[0017] Beneficial effects:

[0018] 1. The pin header cap structure of the utility model optimizes the structural design of the patch pin header cap. By optimizing and adjusting the structure of the patch pin header cap, the problem of too little or too much friction caused by the injection molded parts on both sides clamping the pin header core in the previous design is solved.

[0019] 2. The pin header cap structure of the utility model is adjusted to increase the thickness of the injection molded parts on both sides to improve the holding force of the pin header cap assembly, so that it is not easily deformed due to high temperature. At the same time, the structural design of the internal supporting injection molded parts is adjusted to reduce the friction of the internal supporting injection molded parts by digging grooves to ensure that the holding force of the pin header cap is maintained within a reasonable range.

[0020] 3. The pin header cap structure of the utility model can effectively solve the problem that the holding force of the pin header cap is too large or too small due to the structural design defects of the patch pin header cap, thereby affecting the reliability of the pin header cap assembly, thereby improving the reliability of the patch pin header cap assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the internal structure of the pin header cap structure adopted in the embodiment of the utility model;

[0022] Figure 2 It is a cross-sectional view of the pin header cap assembly used in the embodiment of the utility model;

[0023] Figure 3 It is a structural schematic diagram of the pin header structure adopted in the embodiment of the utility model;

[0024] Figure 4 It is a top view of the pin header structure used in the embodiment of the utility model.

[0025] The above drawings include the following reference numerals:

[0026] 1. Top plate; 10. Pin row; 11. First protrusion; 12. Second protrusion; 13. Third protrusion; 131. First connecting portion; 132. Second connecting portion; 1321. First end face; 21. First mounting groove; 22. Second mounting groove; 23. First clamping channel; 24. Second clamping channel; 31. First clamping portion; 311. First clamping surface; 312. First chamfer; 313. Second chamfer; 32. Second clamping portion; 321. Second clamping surface; 41. First groove; 42. Second groove. DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0028] According to an embodiment of the utility model, a pin header structure is provided. Figures 1 to 4 , including: a top plate 1; a first protrusion 11, the first protrusion 11 is protruding from the surface of the top plate 1; a second protrusion 12, the second protrusion 12 is protruding from the surface of the top plate 1; a third protrusion 13, the third protrusion 13 is protruding from the surface of the top plate 1, the third protrusion 13 is arranged between the first protrusion 11 and the second protrusion 12, a first mounting groove 21 is provided between the third protrusion 13 and the first protrusion 11, and a second mounting groove 22 is provided between the third protrusion 13 and the second protrusion 12; a first clamping portion 31, the first clamping portion 31 is protruding from the surface of the third protrusion 13, so as to form a first clamping channel 23 for clamping a row of pins between the first clamping portion 31 and the first protrusion 11; a second clamping portion 32, the second clamping portion 32 is protruding from the surface of the third protrusion 13, so as to form a second clamping channel 24 for clamping a row of pins between the second clamping portion 32 and the second protrusion 12.

[0029] With the above arrangement, a first clamping portion 31 is provided between the first protrusion 11 and the third protrusion 13, and a second clamping portion 32 is provided between the second protrusion 12 and the third protrusion 13. The first clamping portion 31 and the second clamping portion 32 are used to clamp the pin header inserted in the pin header cap. A first mounting groove 21 is provided on a side of the first clamping portion 31 close to the top plate 1, and a second mounting groove 22 is provided on a side of the second clamping portion 32 close to the top plate 1. The first mounting groove 21 and the second mounting groove 22 are recessed toward the third protrusion 13, which reduces the friction between the first protrusion 11, the second protrusion 12 and the third protrusion 13 and the pin header without changing the structure of the first protrusion 11 and the second protrusion 12. In this way, the first protrusion 11 and the second protrusion 12 are not easily deformed after the pin header cap is heated, and the reliability of the pin header cap assembly is higher, which solves the technical problem that the cap assembly is easy to fall off or difficult to be removed due to heat.

[0030] In the pin header structure of this embodiment, see Figure 1The third protrusion 13 includes: a first connecting portion 131, the first connecting portion 131 is connected to the top plate 1, a first mounting groove 21 is provided between the first connecting portion 131 and the first protrusion 11, and a second mounting groove 22 is provided between the first connecting portion 131 and the second protrusion; a second connecting portion 132, the second connecting portion 132 is connected to an end of the first connecting portion 131 away from the top plate 1, and the first clamping portion 31 and the second clamping portion 32 are arranged on opposite sides of the second connecting portion 132. In this way, the first connecting portion 131 is arranged between the second connecting portion 132 and the top plate 1, and is used to connect the second connecting portion 132 and the top plate 1. The first clamping portion 31 and the second clamping portion 32 are arranged on both sides of the second connecting portion 132. The first clamping portion 31 and the second clamping portion 32 are used to clamp the row of pins inserted into the first clamping channel 23 and the second clamping channel 24. The clamping force of the first clamping portion 31 and the second clamping portion 32 is related to the length of the first clamping portion 31 and the second clamping portion 32. By adjusting the length of the first clamping portion 31 and the second clamping portion 32, the bonding force between the row of pins cap structure and the row of pins can meet the requirements.

[0031] Specifically, the binding force between the pin header cap structure and the pin header is the pressure between the pin header cap structure and the pin header when the pin header is inserted into the first clamping channel 23 and the second clamping channel 24 .

[0032] Preferably, the bonding force between the pin header cap structure and the pin header is greater than or equal to 7N and less than or equal to 15N. In this way, the reliability of the pin header cap assembly is higher, and the pin header cap will not fall off or be difficult to pull out when the pin header undergoes reflow soldering.

[0033] Specifically, when the binding force between the pin header and the pin header cap is less than 7N, the pin header cap will expand outward due to the high temperature when it undergoes reflow soldering during production, causing the pin header cap to easily fall off the pin header. When the binding force between the pin header and the pin header cap is greater than 30N, the pin header cap will be difficult to pull out when it undergoes reflow soldering during production.

[0034] In the pin header structure of this embodiment, see Figure 1 , the distance between the two opposite side walls of the first mounting groove 21 is greater than the distance between the two opposite side walls of the first clamping channel 23; and / or, the distance between the two opposite side walls of the second mounting groove 22 is greater than the distance between the two opposite side walls of the second clamping channel 24. In this way, by providing the first mounting groove 21 and the second mounting groove 22, when the pin header is inserted into the first clamping channel 23 and the second clamping channel 24, the surface of the part extending into the first mounting groove 21 and the second mounting groove 22 does not contact the first clamping part 31 and the second clamping part 32, thereby reducing the bonding force between the pin header and the first clamping part 31 and the second clamping part 32, and avoiding the phenomenon that the pin header cap is difficult to remove when the pin header undergoes reflow soldering.

[0035] In the pin header structure of this embodiment, see Figure 1 , a first end surface 1321 is provided at one end of the second connection portion 132 away from the first connection portion 131; a first clamping surface 311 is provided at one end of the first clamping portion 31 close to the first protrusion 11, and a first chamfer 312 is provided between the first clamping surface 311 and the first end surface 1321 to connect the first clamping surface 311 and the first end surface 1321; and / or, a second clamping surface 321 is provided at one end of the second clamping portion 32 close to the second protrusion 12, and a second chamfer 313 is provided between the second clamping surface 321 and the first end surface 1321 to connect the second clamping surface 321 and the first end surface 1321. In this way, the first chamfer 312 and the second chamfer 313 are provided at the entrance of the first clamping channel 23 and the second clamping channel 24, so that the width of the entrance of the first clamping channel 23 and the second clamping channel 24 is widened, and the pin header is more easily inserted into the first clamping channel 23 and the second clamping channel 24.

[0036] Specifically, if the binding force of the pin header cap structure exceeds 30N after wave soldering, it will be inconvenient to remove it in the subsequent process. Excessive force when removing the pin header cap can easily cause other mechanical damages, leading to damage to PCB board components and the risk of pin header welding falling off.

[0037] Specifically, the lengths of the first clamping surface 311 and the second clamping surface 321 can be adjusted to control the cap bonding force to meet the requirements, so that the bonding force between the pin header cap structure and the pin header is greater than or equal to 7N and less than or equal to 15N.

[0038] In the pin header structure of this embodiment, see Figure 1 , a first groove 41 is provided on the side of the first protrusion 11 away from the third protrusion 13, and a second groove 42 is provided on the side of the second protrusion 12 away from the third protrusion 13. In this way, the first groove 41 and the second groove 42 are provided on the outer sides of the first protrusion 11 and the second protrusion 12, which reduces the thickness of the first protrusion 11 and the second protrusion 12, makes the first protrusion 11 and the second protrusion 12 more elastic when the pin header is inserted, makes it easier for the pin header to be inserted into the first clamping channel 23 and the second clamping channel 24, and makes the pin header cap not easy to fall off.

[0039] Preferably, the distance between the surface of the first groove 41 close to the top plate 1 and the surface of the top plate 1 away from the first groove 41 is 2.0 mm.

[0040] In the pin header structure of this embodiment, see Figure 2, the length L1 of the first groove 41 along the extension direction of the first protrusion 11 is greater than the length I1 of the first clamping channel 23 along the extension direction of the first protrusion 11, and the length L1 of the first groove 41 along the extension direction of the first protrusion 11 is less than the sum of the lengths I2 of the first clamping channel 23 and the first mounting groove 21 along the extension direction of the first protrusion 11; and / or, the length L2 of the second groove 42 along the extension direction of the first protrusion 11 is greater than the length I3 of the second clamping channel 24 along the extension direction of the first protrusion 11, and the length L2 of the second groove along the extension direction of the first protrusion 11 is less than the sum of the lengths I4 of the second clamping channel 24 and the second mounting groove 22 along the extension direction of the first protrusion 11. In this way, the length L1 of the first groove 41 is between the length I1 of the first clamping channel 23 and the sum I2 of the lengths of the first clamping channel 23 and the first mounting groove 21. The outer side of the first protrusion 11 is thicker at one end close to the top plate 1, which can effectively insulate heat and reduce the deformation caused by heat at the connection between the first protrusion 11 and the top plate 1. The length L2 of the second groove 42 is between the length I3 of the second clamping channel 24 and the sum I4 of the lengths of the second clamping channel 24 and the second mounting groove 22. The outer side of the second protrusion 12 is thicker at one end close to the top plate 1, which can effectively insulate heat and reduce the deformation caused by heat at the connection between the second protrusion 12 and the top plate 1, and reduce the phenomenon that the L5 injection molding part expands outward due to the heat of the pin header during reflow soldering, resulting in a decrease in bonding strength and the pin header cap falling off.

[0041] In order to make the binding force between the pin header cap structure and the pin header greater than or equal to 7N and less than or equal to 15N, in the pin header cap structure of this embodiment, see Figure 1 , the distance between the two opposite side walls of the first clamping channel 23 is 0.65 mm; and / or, the distance between the two opposite side walls of the second clamping channel 24 is 0.65 mm. In this way, the distance between the two side walls of the first clamping channel 23 and the second clamping channel 24 is smaller than the distance between the two side walls of the first mounting groove 21 and the second mounting groove 22, and the pin header only contacts the two side walls of the first clamping channel 23 and the second clamping channel 24, which reduces the contact area between the cap and the pin header, thereby reducing the friction between the pin header and the pin header cap. At the same time, the effect of controlling the cap bonding force can be achieved by controlling the distance between the two side walls of the first clamping channel 23 and the second clamping channel 24.

[0042] In order to make the binding force between the pin header cap structure and the pin header greater than or equal to 7N and less than or equal to 15N, in the pin header cap structure of this embodiment, see Figure 1, the distance between the surface of the first protrusion 11 close to the third protrusion and the surface of the first protrusion away from the third protrusion is 0.7mm; and / or, the distance between the surface of the second protrusion 12 close to the third protrusion and the surface of the second protrusion away from the third protrusion is 0.7mm. In this way, the thickness of the first protrusion 11 and the second protrusion in the direction where the first protrusion 11 is close to the second protrusion is 0.7mm, and no groove is dug inside the first protrusion 11 and the second protrusion 12, which improves the deformation resistance of the first protrusion 11 and the second protrusion 12, and avoids the phenomenon of outward expansion deformation caused by insufficient thickness of the injection molded part at the connection between the first protrusion 11 and the second protrusion 12 and the top plate 1 when exposed to high temperature.

[0043] This embodiment provides a pin header assembly. Figure 3 It comprises a plurality of the above-mentioned pin header cap structures, and the plurality of pin header cap structures extend along a preset direction to form a pin header cap assembly.

[0044] Specifically, the pin header cap assembly is made of insulating materials including PA6T and 30% GF UL94V-0.

[0045] This embodiment provides a pin arrangement structure. Figure 4 , including a pin header 10 and a pin header cap assembly, the extension direction of the pin header 10 is the same as the preset direction, and the pin header 10 is inserted in the pin header cap assembly.

[0046] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0047] Optionally, the specific examples in this embodiment may refer to the examples described in the above embodiments, and this embodiment will not be described in detail here.

[0048] The serial numbers of the above-mentioned embodiments of the present application are for description only and do not represent the advantages or disadvantages of the embodiments.

[0049] In the above embodiments of the present application, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the relevant description of other embodiments.

[0050] The above are only preferred implementations of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A pin header cap structure, characterized in that: include: Top plate (1); A first protrusion (11), the first protrusion (11) being arranged protruding from the surface of the top plate (1); a second protrusion (12), the second protrusion (12) being arranged protruding from the surface of the top plate (1); a third protrusion (13), the third protrusion (13) being arranged protruding from the surface of the top plate (1), the third protrusion (13) being arranged between the first protrusion (11) and the second protrusion (12), a first mounting groove (21) being provided between the third protrusion (13) and the first protrusion (11), and a second mounting groove (22) being provided between the third protrusion (13) and the second protrusion (12); A first clamping portion (31), the first clamping portion (31) being arranged to protrude from the surface of the third protrusion (13) so as to form a first clamping channel (23) for clamping the pin header between the first clamping portion (31) and the first protrusion (11); A second clamping portion (32), the second clamping portion (32) protruding from the surface of the third protrusion (13) to form a second clamping channel (24) for clamping the pin header between the second clamping portion (32) and the second protrusion (12).

2. The pin header cap structure according to claim 1, characterized in that: The third protrusion (13) comprises: a first connecting portion (131), the first connecting portion (131) being connected to the top plate (1), a first mounting groove (21) being provided between the first connecting portion (131) and the first protrusion (11), and a second mounting groove (22) being provided between the first connecting portion (131) and the second protrusion; A second connecting portion (132), the second connecting portion (132) being connected to an end of the first connecting portion (131) away from the top plate (1), and the first clamping portion (31) and the second clamping portion (32) being arranged on opposite sides of the second connecting portion (132).

3. The pin header cap structure according to claim 2, characterized in that: The distance between the two opposite side walls of the first mounting groove (21) is greater than the distance between the two opposite side walls of the first clamping channel (23); and / or, The distance between the two opposite side walls of the second mounting groove (22) is greater than the distance between the two opposite side walls of the second clamping channel (24).

4. The pin header cap structure according to claim 3, characterized in that: An end of the second connecting portion (132) away from the first connecting portion (131) is provided with a first end surface (1321); A first clamping surface (311) is provided at one end of the first clamping portion (31) close to the first protrusion (11), and a first chamfer (312) is provided between the first clamping surface (311) and the first end surface (1321) to connect the first clamping surface (311) and the first end surface (1321); and / or, A second clamping surface (321) is provided at one end of the second clamping portion (32) close to the second protrusion (12), and a second chamfer (313) is provided between the second clamping surface (321) and the first end surface (1321) to connect the second clamping surface (321) and the first end surface (1321).

5. The pin header cap structure according to claim 1, characterized in that: A first groove (41) is provided on a side of the first protrusion (11) away from the third protrusion (13), and a second groove (42) is provided on a side of the second protrusion (12) away from the third protrusion (13).

6. The pin header cap structure according to claim 5, characterized in that: A length L1 of the first groove (41) along the extension direction of the first protrusion (11) is greater than a length I1 of the first clamping channel (23) along the extension direction of the first protrusion (11); a length L1 of the first groove along the extension direction of the first protrusion (11) is less than a sum of lengths I2 of the first clamping channel (23) and the first mounting groove (21) along the extension direction of the first protrusion (11); and / or, A length L2 of the second groove (42) along the extension direction of the first protrusion (11) is greater than a length I3 of the second clamping channel (24) along the extension direction of the first protrusion (11), and a length L2 of the second groove along the extension direction of the first protrusion (11) is less than a sum of lengths I4 of the second clamping channel (24) and the second mounting groove (22) along the extension direction of the first protrusion (11).

7. The pin header cap structure according to claim 1, characterized in that: The distance between the two opposite side walls of the first clamping channel (23) is 0.65 mm; and / or, The distance between the two opposite side walls of the second clamping channel (24) is 0.65 mm.

8. The pin header cap structure according to claim 1, characterized in that: The distance between the surface of the first protrusion (11) close to the third protrusion and the surface of the first protrusion away from the third protrusion is 0.7 mm; and / or, The distance between the surface of the second protrusion (12) close to the third protrusion and the surface of the second protrusion away from the third protrusion is 0.7 mm.

Images