Edge computing gateway
By adopting a structure of guided heat dissipation plate and heat exchange chamber in the edge computing gateway, an effective airflow circulation and an expansion of heat exchange area is solved, and a more efficient heat dissipation effect is achieved without increasing the operating load.
Patent Information
- Application Number
- CN202420791165.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-17
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2034-04-17
AI Technical Summary
The existing edge computing gateways have poor heat dissipation effects, and the installation of a cooling fan will increase the operating load, and the heat dissipation effect will be limited.
An edge computing gateway is designed, adopting the structure of a guide heat dissipation plate and a heat exchange chamber. Through the arc-shaped design of the guide heat dissipation plate and the layout of the air outlet and air inlet, an effective airflow circulation is formed to enhance the heat dissipation effect; at the same time, the heat exchange area between the gas and the guide heat dissipation plate is expanded through the setting of the heat exchange chamber, air inlet and air outlet.
Without the installation of a cooling fan, the better airflow circulation and smoother airflow movement within the edge computing gateway are achieved, breaking the traditional airflow retention layer, significantly enhancing the heat dissipation effect, and avoiding the increase in operating load.
Smart Images

Figure CN222691742U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of computing gateways, and in particular to an edge computing gateway. Background Art
[0002] The edge computing gateway is an edge device that extends cloud functions to local devices, providing low-latency, privacy-secure local computing services. It can connect to various devices, collect, process, and store data, and provide multiple security guarantees and remote management functions. It can also adapt to different environments and application scenarios, and provide application programming interfaces for developers to customize and develop applications.
[0003] Edge computing gateways can connect to various sensors, controllers and other devices, collect device data in real time, and perform preliminary data processing, such as PLC remote monitoring, PLC remote control, PLC remote debugging programming, PLC data collection, etc. The application of edge computing gateways in industrial automation can improve the intelligence level of equipment, reduce production costs, and improve production efficiency.
[0004] Most edge computing gateways used in industrial automation need to be connected to multiple devices. The heat generated during data processing and calculation is relatively large. Although existing edge computing gateways have heat dissipation structures (such as heat dissipation grid holes), their heat dissipation effect is not good. There are also devices such as cooling fans installed in edge computing gateways for heat dissipation, but this increases the operating load (power consumption) of the edge computing gateway, and the enhancement of the heat dissipation effect is limited. Therefore, an edge computing gateway is needed. Utility Model Content
[0005] The purpose of this application is to provide an edge computing gateway to solve the problems raised in the above background technology.
[0006] To achieve the above-mentioned purpose, the present application provides the following technical solutions: an edge computing gateway, comprising a base and an upper shell, the base and the upper shell are detachably connected by fasteners to form an integral shell, the front and rear ends of the base are provided with data interfaces of different models, the upper end of the upper shell is integrally formed with a top heat dissipation fin, and the two sides of the upper shell are integrally formed with side heat dissipation fins;
[0007] Air outlets and air inlets are provided on both sides of the upper shell, and the air outlets and air inlets are located at the upper and lower ends respectively;
[0008] A guiding heat dissipation plate is fixed to the top wall of the upper shell, and the guiding heat dissipation plate is a plate-shaped structure with a middle portion protruding downward;
[0009] A first arc-shaped guiding arc surface is formed at the lower end of the guiding heat dissipation plate. The width of the middle section of the first guiding arc surface is the largest and protrudes downward. The width of the two ends of the section of the first guiding arc surface gradually decreases and extends toward the two ends of the guiding heat dissipation plate. The corners at both ends of the first guiding arc surface are located in the same horizontal plane at the upper end of the air outlet.
[0010] Preferably, a second guiding arc surface is formed at both ends of the guiding heat dissipation plate. The second guiding arc surface is an upwardly concave arc surface. The width of the cross section of the second guiding arc surface is the largest at both ends and the smallest in the middle and is consistent with the minimum width of the first guiding arc surface.
[0011] Preferably, a heat exchange cavity is provided in the guiding heat dissipation plate; an air inlet hole penetrating the lower end of the guiding heat dissipation plate is provided in the middle of the guiding heat dissipation plate, and the air inlet hole connects the inner cavity of the shell composed of the base and the upper shell with the heat exchange cavity;
[0012] Air outlet holes are provided at both ends of the guiding heat dissipation plate, and the air outlet holes are connected with the heat exchange cavity and the air outlet.
[0013] Preferably, the inner walls on both sides of the air inlet hole form an air guiding slope that is inclined from both sides to the middle, and the opening area at the lower end of the air guiding slope is larger than the opening area at the upper end of the air guiding slope.
[0014] Preferably, the air outlet is an upwardly inclined oblique opening, and a first baffle is fixed on both sides of the upper shell. The first baffle is arranged to be inclined downward, and the connection between the first baffle and the upper shell is located above the air outlet. The first baffle is also provided with a through hole that vertically penetrates the first baffle and is close to the air outlet opening.
[0015] Preferably, the air inlet is also an upwardly inclined incline, and second baffles are fixed on both sides of the upper shell. The second baffles are located above the outer opening of the air inlet, and a downwardly inclined slope is formed at the bottom of the second baffle.
[0016] In summary, the technical effects and advantages of the utility model are:
[0017] 1. In the utility model, by setting the guiding heat dissipation plate, the mainboard in the shell formed by the base and the upper shell generates heat when working, so that the air inside the base and the upper shell is heated up, the hot air rises, and is guided by the first guiding arc surface at the lower end of the guiding heat dissipation plate to move to the air outlets on both sides. After the guidance, the air flow is smoother and it is not easy to form a top retention layer; at the same time, the air outlet and the air inlet opened on both sides of the upper shell are combined, so that the external air enters from the lower end and is discharged from the upper end, and is divided into two parts of air flow along the middle part of the first guiding arc surface, thereby forming two left and right circulating airflows in the internal space of the base and the upper shell, thereby enhancing the airflow effect, and at the same time guiding the kinetic potential energy generated by the gas itself, so that a better airflow circulation can be formed inside the edge computing gateway without carrying a heat dissipation fan, and the movement is smoother, which can break the airflow retention layer inside the traditional edge computing gateway, form a practical and effective heat dissipation airflow circulation, enhance the heat dissipation effect, and avoid the operating load that may be caused by carrying a heat dissipation fan.
[0018] 2. In the utility model, by setting the heat exchange cavity, air inlet and air outlet, part of the air can enter the heat exchange cavity from the air inlet and be discharged from the air outlet, thereby expanding the heat exchange area between the gas and the guide heat sink, enhancing the heat exchange rate per unit time, and thus enhancing the heat dissipation efficiency of the edge computing gateway. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.
[0020] Figure 1 Schematic diagram of the three-dimensional structure in this embodiment;
[0021] Figure 2 It is an exploded view in this embodiment;
[0022] Figure 3 is a cross-sectional view of the upper shell in this embodiment;
[0023] Figure 4 is a side cross-sectional view of the guide heat dissipation plate in this embodiment;
[0024] Figure 5 for Figure 4 A magnified view of the structure at center;
[0025] Figure 6 It is a side view of the guiding heat dissipation plate in this embodiment.
[0026] In the figure: 1. base; 11. data interface; 2. upper shell; 21. top heat sink fins; 22. side heat sink fins; 23. air outlet; 24. air inlet; 25. first baffle; 26. second baffle; 3. guide heat sink; 31. first guide arc surface; 32. heat exchange cavity; 33. air inlet; 331. air guide slope; 34. air outlet; 35. second guide arc surface; 4. main board. DETAILED DESCRIPTION
[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0028] Example: Reference Figure 1-6 An edge computing gateway shown includes a base 1 and an upper shell 2, the base 1 and the upper shell 2 are detachably connected by fasteners to form an integral shell, the front and rear ends of the base 1 are provided with data interfaces 11 of different models, the upper end of the upper shell 2 is integrally formed with a top heat dissipation fin 21, and the two sides of the upper shell 2 are integrally formed with side heat dissipation fins 22;
[0029] An air outlet 23 and an air inlet 24 are provided on both sides of the upper shell 2, and the air outlet 23 and the air inlet 24 are located at the upper and lower ends respectively;
[0030] A mainboard 4 electrically connected to the data interface 11 is fixedly mounted on the base 1 and is used for data collection, data processing, feedback, recording and storage, etc.;
[0031] A guiding heat dissipation plate 3 is fixed to the top wall of the upper shell 2, and the guiding heat dissipation plate 3 is a plate-shaped structure with a middle portion protruding downward;
[0032] A first arc-shaped guiding arc surface 31 is formed at the lower end of the guiding heat dissipation plate 3. The width of the middle section of the first guiding arc surface 31 is the largest and protrudes downward. The width of the two ends of the section of the first guiding arc surface 31 gradually decreases and extends toward the two ends of the guiding heat dissipation plate 3. The corners at both ends of the first guiding arc surface 31 are located in the same horizontal plane as the upper end of the air outlet 23.
[0033] Based on the above structure, the mainboard 4 in the shell formed by the base 1 and the upper shell 2 generates heat during operation, so that the air inside the base 1 and the upper shell 2 heats up, the hot air rises, and is guided by the first guide arc surface 31 at the lower end of the heat sink 3 to move to the air outlets 23 on both sides. After guidance, the air flow is smoother and it is not easy to form a top retention layer; at the same time, the air outlet 23 and the air inlet 24 opened on both sides of the upper shell 2 allow the external air to enter from the lower end and be discharged from the upper end, and be divided into two parts of air flow along the middle part of the first guide arc surface 31, thereby forming two left and right circulating airflows in the internal space of the base 1 and the upper shell 2, thereby enhancing the airflow effect, and at the same time guiding the kinetic potential energy generated by the gas itself, so that a better airflow circulation can be formed inside the edge computing gateway without a heat dissipation fan, and the movement is smoother, which can break the airflow retention layer inside the traditional edge computing gateway, form a practical and effective heat dissipation airflow circulation, enhance the heat dissipation effect, and avoid the operating load that may be caused by the heat dissipation fan.
[0034] Furthermore, a second guiding arc surface 35 is formed at both ends of the guiding heat dissipation plate 3. The second guiding arc surface 35 is an upwardly concave arc surface. The width of the cross section of the second guiding arc surface 35 is the largest at both ends and the smallest in the middle and is consistent with the minimum width of the first guiding arc surface 31.
[0035] By setting the second guide arc surface 35, the left and right airflows separated along the first guide arc surface 31 are further gathered to a certain extent, so that the gas discharge is more concentrated and the gas diffusion along the front and rear sides is avoided, thereby further ensuring the smoothness of gas movement and improving the heat dissipation effect.
[0036] Furthermore, a heat exchange cavity 32 is provided in the guiding heat dissipation plate 3; an air inlet 33 penetrating the lower end of the guiding heat dissipation plate 3 is provided in the middle of the guiding heat dissipation plate 3, and the air inlet 33 connects the inner cavity of the shell composed of the base 1 and the upper shell 2 with the heat exchange cavity 32;
[0037] Air outlet holes 34 are formed at both ends of the guiding heat dissipation plate 3 , and the air outlet holes 34 communicate with the heat exchange cavity 32 and the air outlet 23 .
[0038] By setting the heat exchange cavity 32, the air inlet 33 and the air outlet 34, part of the air can enter the heat exchange cavity 32 through the air inlet 33 and be discharged from the air outlet 34, thereby expanding the heat exchange area between the gas and the guide heat sink 3, enhancing the heat exchange rate per unit time, and thus enhancing the heat dissipation efficiency of the edge computing gateway.
[0039] Furthermore, the inner walls on both sides of the air inlet 33 form an air guiding slope 331 which is inclined from both sides to the middle, and the opening area of the lower end of the air guiding slope 331 is larger than the opening area of the upper end of the air guiding slope 331 .
[0040] Furthermore, the air outlet 23 is an oblique opening inclined upward, and first baffles 25 are fixed on both sides of the upper shell 2. The first baffles 25 are arranged to be inclined downward, and the connection between the first baffle 25 and the upper shell 2 is located above the air outlet 23. The first baffle 25 is also provided with a through hole that vertically penetrates the first baffle 25 and is close to the opening of the air outlet 23.
[0041] The air outlet 23 is arranged as an oblique opening inclined upward, so that the hot air can be discharged easily, thus facilitating the flow of airflow.
[0042] Furthermore, the air inlet 24 is also an inclined opening inclined upward, and second baffles 26 are fixed on both sides of the upper shell 2. The second baffles 26 are located above the outer opening of the air inlet 24, and a downward inclined slope is formed at the bottom of the second baffle 26;
[0043] By setting the air inlet 24 as an upwardly inclined oblique opening, the external cold air can form downward-moving gas when entering, so that the cold air can move inward along the inner bottom of the base 1 and be evenly distributed in the bottom area of the base 1, so that the cold air can evenly absorb more heat after entering, thereby improving the heat dissipation effect of the airflow.
[0044] Working principle of the utility model: during daily use, external cold air enters the base 1 and the upper shell 2 through the air inlet 24 and forms gas moving downward, so that the cold air can move inward along the inner bottom of the base 1 and be evenly distributed in the bottom area of the base 1; the air that absorbs heat rises and is guided by the first guiding arc surface 31 at the lower end of the guide heat sink 3 to move to the air outlets 23 on both sides. After guidance, the air flow is smoother and it is not easy to form a top retention layer. The airflow is divided into left and right parts along the middle part of the first guiding arc surface 31, thereby forming two left and right circulating airflows in the internal space of the base 1 and the upper shell 2, thereby enhancing the airflow effect and guiding the kinetic potential energy generated by the gas itself, so that a better airflow circulation can be formed inside the edge computing gateway without a cooling fan, and the movement is smoother, which can The airflow retention layer inside the traditional edge computing gateway is broken to form an effective heat dissipation airflow circulation, enhance the heat dissipation effect, and avoid the operating load that may be caused by the installation of a heat dissipation fan; the second guide arc surface 35 further plays a certain gathering effect on the left and right parts of the airflow separated along the first guide arc surface 31, so that the gas discharge is more concentrated, avoiding the gas from diffusing along the front and back sides, thereby further ensuring the smoothness of gas movement and ensuring the improvement of the heat dissipation effect; part of the air enters the heat exchange chamber 32 from the air inlet 33 and is discharged from the air outlet 34, thereby expanding the heat exchange area between the gas and the guide heat dissipation plate 3, enhancing the heat exchange rate per unit time, and thus enhancing the heat dissipation efficiency of the edge computing gateway; the air outlet 23 is set to be an inclined port inclined upward, which can facilitate the discharge of hot air, thereby facilitating the flow of airflow.
[0045] Finally, it should be noted that the above is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model shall be included in the protection scope of the present utility model.
Claims
1. An edge computing gateway, comprising a base (1) and an upper shell (2), wherein the base (1) and the upper shell (2) are detachably connected by fasteners to form an integral shell, the front and rear ends of the base (1) are both provided with data interfaces (11) of different models, the upper end of the upper shell (2) is integrally formed with a top heat dissipation fin (21), and the two sides of the upper shell (2) are integrally formed with side heat dissipation fins (22), characterized in that: An air outlet (23) and an air inlet (24) are provided on both sides of the upper shell (2), and the air outlet (23) and the air inlet (24) are located at the upper and lower ends respectively; A guiding heat dissipation plate (3) is fixed to the inner top wall of the upper shell (2), and the guiding heat dissipation plate (3) is a plate-shaped structure with a middle portion protruding downward; The lower end of the guiding heat dissipation plate (3) forms an arc-shaped first guiding arc surface (31), the width of the middle section of the first guiding arc surface (31) is the largest and protrudes downward, the width of the two ends of the section of the first guiding arc surface (31) gradually decreases and extends to the two ends of the guiding heat dissipation plate (3), and the corners at the two ends of the first guiding arc surface (31) are located in the same horizontal plane as the upper end of the air outlet (23).
2. An edge computing gateway according to claim 1, characterized in that: The guiding heat dissipation plate (3) is provided with a second guiding arc surface (35) at both left and right ends. The second guiding arc surface (35) is an upwardly concave arc surface. The width of the cross section of the second guiding arc surface (35) is the largest at both ends and the smallest in the middle, which is consistent with the minimum width of the first guiding arc surface (31).
3. An edge computing gateway according to claim 2, characterized in that: A heat exchange cavity (32) is provided in the guiding heat dissipation plate (3); an air inlet hole (33) penetrating the lower end of the guiding heat dissipation plate (3) is provided in the middle of the guiding heat dissipation plate (3); the air inlet hole (33) is connected to the inner cavity of the shell composed of the base (1) and the upper shell (2) and the heat exchange cavity (32); Air outlet holes (34) are provided at both ends of the guide heat dissipation plate (3), and the air outlet holes (34) are connected to the heat exchange cavity (32) and the air outlet (23).
4. An edge computing gateway according to claim 3, characterized in that: The inner walls on both sides of the air inlet hole (33) form an air guiding inclined surface (331) which is inclined from both sides to the middle, and the opening area of the lower end of the air guiding inclined surface (331) is larger than the opening area of the upper end of the air guiding inclined surface (331).
5. The edge computing gateway according to claim 1, characterized in that: The air outlet (23) is an oblique opening inclined upward, and first baffles (25) are fixed on both sides of the upper shell (2). The first baffles (25) are arranged to be inclined downward, and the connection between the first baffle (25) and the upper shell (2) is located above the air outlet (23). The first baffle (25) is also provided with a through hole which vertically penetrates the first baffle (25) and is close to the opening of the air outlet (23).
6. An edge computing gateway according to claim 5, characterized in that: The air inlet (24) is also an inclined opening inclined upward, and second baffles (26) are fixed on both sides of the upper shell (2), the second baffles (26) are located above the outer opening of the air inlet (24), and the bottom of the second baffle (26) is formed with an inclined surface inclined downward.