Liquid cooling switch with zero-backplane CLOS orthogonal architecture

Abstract

The utility model discloses a liquid-cooled switch of a zero-backplane CLOS orthogonal architecture, and the switch comprises a switch frame body, and a front panel of the switch frame body is provided with a main control board card module and a service board card module; a power supply module is arranged at the bottom of the switch frame body; a rear panel of the switch frame body is connected with the liquid cooling module and the switch board card module, and the liquid cooling module comprises a cooling capacity distribution unit, a cooling liquid pipeline and cooling liquid arranged in the cooling liquid pipeline; the cooling capacity distribution unit is arranged in a convex shape, and a cold water supply port and a hot water return port are formed in the side face of the cooling capacity distribution unit. The convex surface of the cooling capacity distribution unit is embedded into a middle shaft of a rear panel of the switch frame body, and a water inlet and a water outlet are formed in the convex surface; and the cooling liquid pipeline is connected with the cooling capacity distribution unit, the exchange board card module and the business board card module. And by adopting a mode of combining liquid cooling and natural cooling, high-energy-efficiency and low-noise operation is realized.

Description

Technical Field

[0001] The present application relates to the field of switches, and in particular to a liquid-cooled switch with a zero-backplane CLOS orthogonal architecture. Background Art

[0002] CLOS architecture switches have the advantages of large capacity, high density, and low loss, and have gradually become the mainstream architecture of core switches in large-scale networks such as campus networks and data center networks. Among them, zero-backplane CLOS architecture switches have gradually become the first choice for ultra-large capacity core switches due to the lack of backplane bandwidth limitations and the advantage of shorter signal routing. As the capacity of the switching chip gradually increases to 51.2T, the performance of the switch has achieved a breakthrough in supporting ultra-high density and ultra-high speed ports. However, this is accompanied by a sharp increase in the heat dissipation load of a single frame. At present, the power consumption of the Broadcom Tomahawk 5 chip when running at full speed is close to 500W. The huge heat dissipation load has brought great challenges to the traditional forced air cooling method.

[0003] Existing CLOS zero-backplane orthogonal architecture switches generally use air cooling, which has the disadvantages of low power density and insufficient heat dissipation capacity. The frame performance is difficult to meet the needs of future 400G / 800G high-speed optical module high-density deployment scenarios. In addition, the ultra-high noise and heat dissipation power consumption caused by the high-speed operation of the fan during forced air cooling are difficult to meet the increasingly stringent operating environment and energy efficiency requirements of data centers. Utility Model Content

[0004] In order to solve the above problems, the present application proposes a liquid-cooled switch with a zero-backplane CLOS orthogonal architecture, comprising:

[0005] A switch frame, wherein a main control board module and a business board module are arranged on the front panel of the switch frame; a power supply module is arranged at the bottom of the switch frame; a rear panel of the switch frame is connected to a liquid cooling module and a switch board module, wherein the liquid cooling module comprises a cooling distribution unit, a cooling liquid pipeline and a cooling liquid arranged in the cooling liquid pipeline; the cooling distribution unit is in a convex layout, and a cold water supply port and a hot water return port are arranged on the side of the cooling distribution unit; a convex surface of the cooling distribution unit is embedded in the central axis of the rear panel of the switch frame, and a water inlet and a water outlet are arranged on the convex surface; the cooling liquid pipeline is connected to the cooling distribution unit, the switch board module and the business board module.

[0006] In one example, a plurality of heat dissipation holes are provided on the front panel and the rear panel of the switch frame.

[0007] In one example, the main control board module includes a main main control board and a backup main control board; the business board module includes multiple business boards; the switch board module includes multiple switch boards; the power supply module includes a power supply compartment and multiple power supplies arranged in the power supply compartment.

[0008] In one example, the switch boards are symmetrically distributed on both sides of the cooling distribution unit, the service boards are connected through the switch boards, and the service boards are connected to the switch boards through orthogonal connectors.

[0009] In one example, the power supply compartment is provided with an independent strict front-to-back straight air duct.

[0010] In one example, the hot and cold connectors of the service board are located in the middle of the board, and the hot and cold connectors of the switch board are located at both ends of the board.

[0011] In one example, the hot and cold connectors of the service board are provided with blind-plug hot and cold connectors with a liquid non-return function.

[0012] In one example, a plurality of hot and cold joints are provided on a flat surface of the cooling distribution unit opposite to the raised surface, for supporting cooling of the service slots on the front panel.

[0013] In an example, the external dimensions of the switch frame are 440 mm*520 mm*442 mm.

[0014] In one example, the cooling distribution unit is provided with temperature sensors at the water inlet and each hot water return port.

[0015] The method proposed in this application can bring the following beneficial effects: adopt liquid cooling / air cooling dual channels, where the core switching chip, CPU chip, high-speed and high-density optical module, etc. adopt liquid cooling heat dissipation channels, and the heat is exported through the cooling distribution unit located inside the switch frame; the remaining low-power devices adopt natural heat dissipation to dissipate heat. A high-density distribution of ultra-high-speed ports is achieved in a compact frame, and at the same time, a combination of liquid cooling and natural cooling is adopted to achieve high energy efficiency and low noise operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0017] Figure 1 It is a three-dimensional schematic diagram of a liquid-cooled switch with a zero-backplane CLOS orthogonal architecture in an embodiment of the present application;

[0018] Figure 2A front view schematic diagram of a liquid-cooled switch with a zero-backplane CLOS orthogonal architecture is provided in the embodiments of the present application;

[0019] Figure 3 It is a rear view schematic diagram of a liquid-cooled switch with a zero-backplane CLOS orthogonal architecture in an embodiment of the present application;

[0020] Figure 4 This is a schematic diagram of the layout of the raised surface ports of a cooling distribution unit in an embodiment of the present application;

[0021] Figure 5 This is a schematic diagram of the layout of flat surface ports of a cooling distribution unit in an embodiment of the present application;

[0022] Figure 6 This is a schematic diagram of the side port layout of a cooling distribution unit in an embodiment of the present application;

[0023] Figure 7 This is a schematic diagram of the internal rear view of the liquid cooling switch in the embodiment of the present application;

[0024] Figure 8 This is a schematic diagram of the left side view of the interior of the liquid cooling switch in the embodiment of the present application;

[0025] Fig. 9 This is a schematic diagram of a top view of the interior of a liquid-cooled switch in an embodiment of the present application;

[0026] Fig.10 This is a schematic diagram of the pipeline layout of the internal liquid cooling heat dissipation architecture of a switch in an embodiment of the present application;

[0027] Fig.11 This is a schematic diagram of the layout of service boards in a liquid-cooled switch in an embodiment of the present application;

[0028] Fig.12 This is a schematic diagram of the layout of a switch board in a liquid-cooled switch in an embodiment of the present application;

[0029] Among them, 1. switch frame, 2. front panel, 3. main control board module, 4. business board module, 5. power module, 6. rear panel, 7. cooling distribution unit, 8. coolant pipeline, 9. cold water supply port, 10. hot water return port, 11. water inlet, 12. water outlet, 13. heat dissipation hole, 14. switch board, 15. hot and cold connectors, 16. handle. DETAILED DESCRIPTION

[0030] In order to more clearly illustrate the overall concept of the present application, a detailed description is given below in an illustrative manner in conjunction with the accompanying drawings.

[0031] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the order used in this way can be interchanged where appropriate, so that the embodiments of the utility model described herein can be implemented in an order other than those illustrated or described herein.

[0032] In addition, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus that includes a series of steps or elements is not necessarily limited to those steps or elements explicitly listed, but may include other steps or elements not explicitly listed or inherent to such process, method, product, or apparatus.

[0033] In order to clearly illustrate the technical features of the present invention, the present invention is described in detail below through specific implementation methods and in conjunction with the accompanying drawings.

[0034] In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present application is not limited to the specific embodiments disclosed below.

[0035] In addition, in the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0036] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0037] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0038] In the present application, unless otherwise clearly specified and limited, a first feature "above" or "below" a second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in an appropriate manner in any one or more embodiments or examples.

[0039] In order to have a clearer understanding of the technical features, purposes and effects of the utility model, the specific implementation methods of the utility model are now described with reference to the accompanying drawings. The same reference numerals in the drawings represent components with the same structure or similar structures but the same functions.

[0040] In order to make the drawings concise, each figure only schematically shows the parts related to the utility model, and they do not represent the actual structure of the product.

[0041] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0042] Figure 1 A three-dimensional diagram of a liquid-cooled switch with a zero-backplane CLOS orthogonal architecture is provided for an embodiment of the present application, including:

[0043] The switch frame 1 is a cubic structure, including six panels at the front, back, left, right, top and bottom. Among them, the left and right panels of the switch frame 1 are provided with embedded handles 16 to facilitate the movement or transportation of the switch frame 1.

[0044] Figure 2 A front view of a liquid-cooled switch with a zero-backplane CLOS orthogonal architecture is provided for an embodiment of the present application. The front panel 2 of the switch frame 1 is provided with a main control board module 3, a business board module 4 and a switch board 14 module, and a power supply module 5 is provided on the bottom of the switch frame 1, i.e., the bottom panel.

[0045] Figure 3 A rear view of a liquid-cooled switch with a zero-backplane CLOS orthogonal architecture is provided for an embodiment of the present application. The rear panel 6 of the switch frame 1 is connected to the liquid cooling module, and the liquid cooling module here includes a cooling distribution unit 7, a cooling liquid pipeline 8, and a cooling liquid arranged in the cooling liquid pipeline 8. Among them, the cooling distribution unit 7 is in a convex layout, and a cold water supply port 9 and a hot water return port 10 are arranged on the side of the cooling distribution unit 7; the convex surface of the cooling distribution unit 7 is embedded in the central axis of the rear panel 6 of the switch frame 1, and a water inlet 11 and a water outlet 12 are arranged on the convex surface. Since the convex surface and the rear panel 6 of the switch frame 1 are in the same plane, water can be directly injected and discharged through the liquid cooling module of the rear panel 6 of the switch frame 1. The cooling liquid pipeline 8 is connected to the cooling distribution unit 7, the switch board 14 module, and the business board module 4. The cooling liquid for liquid cooling heat dissipation is connected to the cooling distribution unit 7 inside the switch from the rear interface of the frame to provide cooling for the switching chips and other devices with high heat dissipation requirements in the frame.

[0046] Figure 4-Figure 6 The port layout of the cold distribution unit 7 used inside the liquid-cooled switch of the present application is shown. The cold distribution unit 7 is in a "convex" shape as a whole. The water inlet 11 and the water outlet 12 of the whole machine are located on the small surface on the back, and are connected to the coolant pipeline 8 on the liquid cooling rack. There are six connection ports arranged on the surfaces on both sides of the "convex" shape, of which the upper three are hot water return ports 10, and the lower three are cold water supply ports 9. Two columns and six rows of hot and cold connectors 15 are arranged on the flat front panel 2 of the cold distribution unit 7. The hot and cold connectors 15 are used to support the cooling of the six business slots on the front panel 2. When the business board is aligned with the alignment pin from the front panel 2 and inserted into the business slot, the hot and cold connectors 15 of the business board are automatically connected to the hot and cold connectors 15 on the flat surface of the cold distribution unit 7 connector to perform liquid cooling on the business board. Here, the hot and cold joint 15 includes a hot water return port 10 and a cold water supply port 9 in the cold distribution unit 7, and the positions of the hot water return port 10 and the cold water supply port 9 can be adjusted as needed.

[0047] Among them, the main control board module 3 includes a main main control board and a spare main control board, the business board module 4 includes multiple business boards; the switch board 14 module includes multiple switch boards 14; the power supply module 5 includes a power supply compartment and multiple power supplies arranged in the power supply compartment. The dual main control design provides real-time online backup for the system control plane, and can quickly switch when a fault occurs, thereby improving the stability of the control plane. In addition, the spare main control board can be hot-swapped for maintenance or online maintenance when a fault occurs. Multiple business boards can select different combinations of port rates and port densities according to business requirements. In one embodiment, the number of business boards is six. The backplane-free design avoids the limitation of the backplane bandwidth on future upgrades, and a smooth upgrade can be achieved by upgrading the business board and the corresponding switch board 14. Multiple pluggable high-performance power supplies are located at the bottom of the frame, providing N+1 power redundancy for the switch. The power supply compartment adopts an independent and strict front-to-back straight air duct, and the pluggable power supply can choose natural heat dissipation or forced air cooling according to the heat dissipation requirements.

[0048] The front panel 2 of the switch frame 1 and the rear panel 6 of the frame are provided with large-area heat dissipation holes 13 for natural heat dissipation of components with low heat dissipation requirements.

[0049] In one embodiment, the structural layout inside the liquid cooling switch frame 1 of the present application is as follows: Figure 7-Figure 9 As shown, the switch frame 1 adopts a zero backplane design, and the service board and the switch board 14 are directly connected by an orthogonal connector for data transmission. The cooling distribution unit 7 inside the frame is located at the central axis at the rear of the frame, and multiple switch boards 14 are vertically arranged on both sides of the cooling distribution unit 7, with the same slots on each side. Figure 5 There are 3 slots on each side.

[0050] Fig.10 The figure shows the detailed layout of the internal liquid cooling architecture of the switch. The quick-connect hot and cold joints 15 on the service board and the quick-connect hot and cold joints 15 on the front panel 2 of the cold distribution unit 7 are blindly plugged inside the frame. The switch board 14 is connected to the cold water supply port 9 and the hot water return port 10 on both sides of the cold distribution unit 7. The specific pipe connections are as follows: Figure 8 Here, the number of exchange blades is six, and the exchange slots are respectively the left first, the left second, and the left third (and the right first, the right second, and the right third) according to the distance from the cold distribution unit 7 from near to far. The exchange board 14 needs to be installed strictly according to the requirements of first one, then the second, and finally the third during the installation process. If the exchange board 14 is not fully equipped, it is required to be installed in the same number slots on the left and right, and follow the method of first one, then the second, and finally the third.

[0051] Fig.11 , Fig.12The typical layout of the business board and the switching board 14 in the liquid-cooled switch of the present application is shown, in which only the liquid cooling plate cooling liquid pipeline system of the switching chip is shown. The hot and cold joints 15 of the business board are located in the middle part of the board, and the hot and cold joints 15 of the switching board 14 are located at both ends of the board. In order to facilitate the design of the system heat dissipation architecture and the upgrade of the board, the liquid cooling board adopts a hierarchical design. The board-level liquid cooling layout is designed and implemented inside the board to keep the external hot and cold joints 15 of the board consistent. The schematic diagram of this application only shows the design of a single-chip liquid-cooled cold plate. More complex board-level liquid cooling requires further addition of a board-level cooling capacity distribution unit 7 between the board-level hot and cold joints 15 and the heat dissipation device. In the design of the heat dissipation architecture of the whole machine, taking into account the business characteristics of the switch, the hot and cold joints 15 of the business board adopt blind-plug hot and cold joints 15 with liquid non-return function, which can support hot-swap upgrades of business boards. When the service board is aligned with the alignment pin in the front panel 2 and inserted into the service slot, the hot and cold connectors 15 of the service board and the hot and cold connectors 15 on the flat surface of the connector of the cooling distribution unit 7 are automatically connected to perform liquid cooling on the service board. After the service board is pulled out, the hot and cold connectors 15 with a check function will automatically close to prevent cooling liquid leakage from affecting the safety of the switch.

[0052] In one embodiment, in order to further improve the liquid cooling efficiency and improve the energy efficiency of the switch, the cooling distribution unit 7 is equipped with temperature sensors at the water inlet 11 and the hot water return port 10 of each group of cooling water, and can dynamically adjust the cooling liquid supply flow of each group of boards according to the rack water temperature and the return water temperature of each service / switch board 14 to maintain the best cooling effect. In addition, after the temperature of the cooled chip is uploaded to the central controller, the flow of the cooling distribution unit 7 can also be globally regulated by the central controller.

[0053] It should be noted that the directional terms such as left, right, up, down, front and back in the embodiments of the present invention are merely relative concepts or are based on the normal use state of the product, that is, the direction of movement of the product, and should not be considered as limiting.

[0054] Secondly, it should be noted that when a component is referred to as being "located" or "set on" another component, it can be on the other component or there can be a central component at the same time. When a component is referred to as being "connected to" another component, it can be directly connected to the other component or there can be a central component at the same time.

[0055] The above is only an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

[0056] The above-mentioned specific implementation manner cannot be used as a limitation on the protection scope of the present utility model. For those skilled in the art, any replacement, improvement or change made to the implementation manner of the present utility model falls within the protection scope of the present utility model.

[0057] The matters not described in detail in the present invention are all known technologies to those skilled in the art.

Claims

1. A liquid-cooled switch with zero backplane CLOS orthogonal architecture, characterized in that: include: A switch frame, wherein a main control board module and a service board module are provided on the front panel of the switch frame; A power module is provided at the bottom of the switch frame; The rear panel of the switch frame is connected to the liquid cooling module and the switch card module, and the liquid cooling module includes a cooling distribution unit, a cooling liquid pipeline, and a cooling liquid arranged in the cooling liquid pipeline; The cold distribution unit is convex in layout, and a cold water supply port and a hot water return port are arranged on the side of the cold distribution unit; the convex surface of the cold distribution unit is embedded in the central axis of the rear panel of the switch frame, and a water inlet and a water outlet are arranged on the convex surface; The cooling liquid pipeline is connected to the cooling capacity distribution unit, the switching board module and the service board module.

2. The liquid-cooled switch with zero backplane CLOS orthogonal architecture according to claim 1, characterized in that: The front panel and the rear panel of the switch frame are provided with a plurality of heat dissipation holes.

3. The liquid-cooled switch with zero backplane CLOS orthogonal architecture according to claim 1, characterized in that: The main control board module includes a main main control board and a standby main control board; The business card module includes a plurality of business cards; the switch card module includes a plurality of switch cards; the power module includes a power supply compartment and a plurality of power supplies arranged in the power supply compartment.

4. The liquid-cooled switch with zero backplane CLOS orthogonal architecture according to claim 3, characterized in that: The switching boards are symmetrically distributed on both sides of the cooling distribution unit, the service boards are connected through the switching boards, and the service boards are connected to the switching boards through orthogonal connectors.

5. The liquid-cooled switch with zero backplane CLOS orthogonal architecture according to claim 3, characterized in that: The power supply compartment is provided with an independent strict front-to-back straight air duct.

6. The liquid-cooled switch with zero backplane CLOS orthogonal architecture according to claim 3, characterized in that: The hot and cold connectors of the service board are located in the middle of the board, and the hot and cold connectors of the switch board are located at both ends of the board.

7. The liquid-cooled switch with zero backplane CLOS orthogonal architecture according to claim 6, characterized in that: The hot and cold joints of the service board are provided with blind plug hot and cold joints with liquid non-return function.

8. The liquid-cooled switch with zero backplane CLOS orthogonal architecture according to claim 1, characterized in that: A plurality of hot and cold joints are arranged on the flat surface of the cold distribution unit opposite to the raised surface, so as to support the cooling of the service slots on the front panel.

9. The liquid-cooled switch with zero backplane CLOS orthogonal architecture according to claim 1, characterized in that: The external dimensions of the switch frame are 440mm*520mm*442mm.

10. The liquid-cooled switch with zero backplane CLOS orthogonal architecture according to claim 1, characterized in that: The cooling capacity distribution unit is provided with temperature sensors at the water inlet and each hot water return port.

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