Heat dissipation assembly

Abstract

The utility model provides a heat dissipation assembly which comprises a circuit board, a radiator and at least one electronic component, the circuit board is provided with a first surface and a second surface which are opposite to each other, and the circuit board further comprises a mounting hole extending from the first surface of the circuit board to the second surface and at least one metal via hole; the radiator comprises a protruding part and a main body which are connected, the protruding part extends through the mounting hole, the main body is attached to the second surface of the circuit board, and the main body covers at least one metal through hole; the at least one electronic component is disposed on the first surface of the circuit board, and the at least one electronic component covers at least a part of the mounting hole. In the application, heat generated by the electronic component on the circuit board can be dissipated through the surface of the circuit board, and can also penetrate through the circuit board and be dissipated by the radiator, so that the heat dissipation efficiency is greatly improved.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of electronic components, and in particular to a heat dissipation assembly. Background Art

[0002] As electronic devices develop towards miniaturization, lightness and thinness, their size continues to decrease and their power density continues to increase. In this process, temperature has become an important factor affecting the performance of electronic devices.

[0003] Generally speaking, electronic devices include circuit boards and various electronic components, which are arranged on the surface of the circuit boards and electrically connected through the circuit boards. These electronic components often generate a lot of heat when working, so timely dissipation of the heat generated by the electronic components has a great impact on the performance of the electronic devices.

[0004] In order to solve the heat dissipation problem of electronic components, the prior art often uses a heat sink installed under the circuit board to dissipate heat. However, the miniaturization requirement of electronic equipment means that the size of the heat sink cannot be too large. Therefore, the heat dissipation design of the prior art can dissipate the heat generated by electronic components that are closer to the heat sink in a timely manner, but the heat generated by electronic components that are farther away from the heat sink cannot be dissipated in time. The accumulation of this heat inside the device will also affect the performance of the electronic equipment and may even cause the device to malfunction.

[0005] Therefore, it is necessary to design a new type of heat dissipation component to solve the problems in the technology. It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to ordinary technicians in the field. Utility Model Content

[0006] The heat dissipation assembly provided in the embodiment of the present application is used to solve the problem of low heat dissipation efficiency of electronic equipment or even damage to the electronic equipment due to overheating.

[0007] The present application provides a heat dissipation assembly, including:

[0008] A circuit board having a first surface and a second surface opposite to each other, wherein the circuit board further comprises a mounting hole and at least one metal via extending from the first surface to the second surface of the circuit board;

[0009] A heat sink, comprising a protrusion and a main body connected to each other, wherein the protrusion extends through the mounting hole, the main body is attached to the second surface of the circuit board, and the main body covers at least one metal via;

[0010] At least one electronic component is disposed on the first surface of the circuit board, wherein the at least one electronic component covers at least a portion of the mounting hole.

[0011] In some possible implementations, at least one electronic component covers at least one metal via.

[0012] In some possible implementations, at least one electronic component covers at least one metal via and at least a portion of the mounting hole.

[0013] In some possible implementations, the subject includes:

[0014] A connecting portion, wherein a first surface of the connecting portion is attached to the second surface of the circuit board and is connected to the protruding portion;

[0015] At least one extending portion is disposed on the second surface of the connecting portion and extends in a direction away from the circuit board.

[0016] In some possible implementations, the protrusion covers a portion or the entirety of the connecting portion.

[0017] In some possible implementations, the extension portion includes at least one of a columnar extension portion, an oblique tooth extension portion, and a wavy extension portion.

[0018] In some possible implementations, the number of the extension portions is set to be multiple;

[0019] The plurality of extension parts are arranged in sequence and at intervals;

[0020] Alternatively, the plurality of extensions are arranged in a plurality of rows and columns;

[0021] Alternatively, the plurality of extension portions include a first portion and a second portion, and the first portion of the extension portion and the second portion of the extension portion are symmetrically arranged.

[0022] In some possible implementations, the plurality of extension portions cover a portion of the connecting portion.

[0023] In some possible implementations, the circuit board further includes at least one core board, and a conductive layer disposed on at least one side of the at least one core board.

[0024] In some possible embodiments, the conductive layer includes a first conductive layer and a second conductive layer, the first conductive layer forms at least a portion of the first surface of the circuit board and is electrically connected to at least one electronic component, the second conductive layer forms at least a portion of the second surface of the circuit board, the first end of the metal via is electrically connected to the first conductive layer, the second end of the metal via is electrically connected to the second conductive layer, and at least a portion of the second conductive layer is adhered to the main body.

[0025] In some possible implementations, a heat-conducting medium is disposed in the mounting hole, and the protrusion is connected to at least one electronic component via the heat-conducting medium.

[0026] In some possible implementations, a heat-conducting medium is disposed in the metal via, and the heat-conducting medium extends from the first surface of the circuit board to the second surface of the circuit board.

[0027] In some possible implementations, the main body is connected to the second conductive layer via a heat conductive medium.

[0028] In some possible implementations, the thermally conductive medium includes thermally conductive glue or solder.

[0029] In some possible implementations, the protrusion is integrally formed with the main body.

[0030] In some possible implementations, the connecting portion and the extending portion are integrally formed.

[0031] In some possible implementations, the area of ​​the mounting hole is larger than the area of ​​the metal via.

[0032] The heat dissipation assembly of the present application sets a heat sink and metal vias on the circuit board, so that the heat generated by the electronic components on the circuit board can be transferred through the heat sink and dissipated through the metal vias, thereby improving the heat dissipation efficiency of the circuit board and effectively reducing the risk of overheating of the electronic equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0034] Figure 1 A schematic diagram of the structure of a heat dissipation assembly with a single-layer circuit board provided in an embodiment of the present application;

[0035] Figure 2 A schematic diagram of the structure of a heat dissipation assembly with a multi-layer circuit board provided in an embodiment of the present application;

[0036] Figure 3 A schematic structural diagram of a first embodiment of a heat dissipation component with a heat-conducting medium provided in an embodiment of the present application;

[0037] Figure 4 A schematic structural diagram of a second embodiment of a heat dissipation component with a heat-conducting medium provided in an embodiment of the present application;

[0038] Figure 5 A schematic diagram of the structure of a heat dissipation assembly having multiple electronic components provided in an embodiment of the present application;

[0039] Figure 6 A schematic diagram of the structure of a first extension portion provided in an embodiment of the present application;

[0040] Figure 7A schematic diagram of the structure of a second extension portion provided in an embodiment of the present application;

[0041] Figure 8 A schematic structural diagram of a third extension portion provided in an embodiment of the present application.

[0042] Description of reference numerals:

[0043] 100. Circuit board;

[0044] 110, metal via; 120, mounting hole; 130, core board; 140, first conductive layer; 150, second conductive layer; 160, thermal conductive medium;

[0045] 200. Electronic components;

[0046] 300, radiator;

[0047] 310. Main body; 311. Connecting portion; 312. Extending portion; 320. Protruding portion.

[0048] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0049] As described in the background technology, as the size of electronic devices continues to decrease and the power density continues to increase, temperature has become an important factor affecting the performance of electronic devices. In addition, since electronic components are usually electrically connected through circuit boards, and circuit boards are often placed in a closed environment to avoid problems such as short circuits on the circuit boards. For the heat dissipation design of traditional circuit boards, that is, installing a radiator under the circuit board, the volume and spatial layout of the radiator are greatly restricted due to the miniaturization development requirements of electronic devices. This makes it difficult for the heat of some electronic components to dissipate, and leads to low heat dissipation efficiency of the entire electronic device, making the electronic device prone to failure due to overheating.

[0050] In order to solve the above technical problems, an embodiment of the present application provides a heat dissipation component, which arranges a heat sink and metal vias on the circuit board so that the heat generated by the electronic components on the circuit board can be transferred through the heat sink and dissipated through the metal vias, thereby improving the heat dissipation efficiency of the circuit board and effectively reducing the risk of overheating of the electronic equipment.

[0051] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0052] The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0053] Reference Figures 1 to 5 The embodiment of the present application provides a heat dissipation assembly, including a circuit board 100, a heat sink 300 and at least one electronic component 200, wherein the circuit board 100 may have a first surface and a second surface relative to each other, and the circuit board 100 also includes a mounting hole 120 extending from the first surface of the circuit board 100 to the second surface and at least one metal via 110; the heat sink 300 includes a protrusion 320 and a main body 310 connected to each other, wherein the protrusion 320 extends through the mounting hole 120, the main body 310 is attached to the second surface of the circuit board 100, and the main body 310 covers the at least one metal via 110; at least one electronic component 200 is arranged on the first surface of the circuit board 100, various electronic components 200 realize electrical connection and various functions through the circuit board 100, and at least one electronic component 200 covers at least part of the mounting hole 120, so that at least one electronic component 200 is in thermal contact with the protrusion 320 of the heat sink 300.

[0054] Furthermore, the protrusion 320 extending through the mounting hole 120 means that: the height of the protrusion 320 can be less than or equal to the depth of the mounting hole 120, that is, the protrusion 120 is located inside the mounting hole 120; or, the height of the protrusion 320 is greater than the depth of the mounting hole 120, that is, the protrusion 120 extends through the mounting hole 120.

[0055] Further, the first surface and the second surface of the circuit board 100 may be arranged along the thickness direction of the circuit board 100. In addition, the circuit board 100 may be arranged as a printed circuit board 100, and the circuit board 100 may be arranged as a single-layer circuit board 100 or a multi-layer circuit board 100. For example, Figure 1 A schematic diagram of the structure of a heat dissipation assembly with a single-layer circuit board provided in an embodiment of the present application, Figure 2 A schematic structural diagram of a heat dissipation assembly with a multi-layer circuit board provided in an embodiment of the present application.

[0056] Furthermore, the heat generated by the electronic component 200 can be transferred to the main body 310 of the heat sink 300 through the protrusion 320, thereby timely transferring the heat generated by the electronic component 200 to the outside of the circuit board, thereby improving the heat dissipation effect. Figure 3 The mounting hole 120 may be filled with a heat-conducting medium 160 , and the protrusion 320 may be connected to the electronic component 200 through the heat-conducting medium 160 .

[0057] In some embodiments, the circuit board 100 may further include at least one core board and a conductive layer disposed on at least one side of the at least one core board, wherein the conductive layer includes a first conductive layer 140 and a second conductive layer 150. Figure 1 The circuit board 100 includes a core board 130, and the first conductive layer 140 and the second conductive layer 150 are arranged on two opposite surfaces of the core board 130, wherein the surface of the first conductive layer 140 away from the second conductive layer 150 can form at least part of the first surface of the circuit board 100, and the surface of the second conductive layer 150 away from the first conductive layer 140 can form at least part of the second surface of the circuit board 100. The first end of the metal via 110 can be electrically connected to the first conductive layer 140, and the second end of the metal via 110 can be electrically connected to the second conductive layer 150, so that the first conductive layer 140 and the second conductive layer 150 can be electrically connected through the metal via 110. In addition, the first conductive layer 140 and the second conductive layer 150 can be metal layers, and the heat generated by the electronic component 200 can be dissipated through the first conductive layer 140 and through the metal via 110 to the second conductive layer 150, which further improves the heat dissipation efficiency of the electronic component 200. Specifically, the first conductive layer 140 is electrically connected to the electronic component 200, so that the heat generated by the electronic component 200 is dispersed in the first conductive layer 140, and then the heat is transferred to the second conductive layer 150 through at least one metal via 110, and then dissipated to the outside of the circuit board. For multiple electronic components 200, multiple first conductive layers 140 can be respectively provided on the first surface of the circuit board 100. Of course, multiple electronic components 200 with the same potential can be provided with the same first conductive layer.

[0058] Reference Figure 2 The multilayer circuit board 100 may include a plurality of core boards, and the plurality of core boards may be stacked in sequence along the thickness direction. Each layer of the multilayer core boards may be used to form a circuit, so that the multilayer circuit board 100 has more functions.

[0059] In some embodiments, reference Figure 5, at least one electronic component 200 covers at least one metal via 110, so that the electronic component 200 can dissipate heat through the metal via 110. The number of metal vias 110 electrically connected to each electronic component 200 can be set to one or more, and the number of metal vias 110 can be adjusted according to the type of electronic component 200, the connection method between the electronic component 200 and the circuit board 100, or the heat generated by the electronic component 200. For example, for an electronic component 200 with a large heat generation, multiple metal vias 110 can be set to dissipate heat for it.

[0060] Furthermore, the metal via 110 may be filled with a heat-conducting medium 160, wherein the heat-conducting medium 160 may include a heat-conducting adhesive or solder. The heat-conducting medium 160 may extend from the first surface of the circuit board 100 to the second surface of the circuit board 100, so that the heat of the electronic component 200 can be more effectively transferred to the second surface of the circuit board 100 through the heat-conducting medium 160. At the same time, the heat-conducting medium may also play a role in fixing the connection.

[0061] In some embodiments, reference Figures 1 to 3 , the main body 310 of the heat sink 300 can cover at least one metal via 110. The first end of the metal via 110 is connected to the electronic component 200, and the second end of the metal via 110 is attached to the main body 310 of the heat sink 300, so that the heat generated by the electronic component 200 can be transferred to the main body 310 of the heat sink 300 through the metal via 110 for heat dissipation; in addition, some of the metal vias may not be covered by the main body 310 of the heat sink 300 (not shown). For the metal vias 110 not covered by the main body 310 of the heat sink 300, the heat generated by the electronic component 200 can be directly dissipated to the air through the metal vias 110, thereby further improving the heat dissipation efficiency of the electronic component 200 and reducing the risk of overheating failure of the electronic component 200.

[0062] In some embodiments, the area of ​​the mounting hole 120 is larger than the area of ​​the metal via 110 , and the contact area between the electronic component 200 and the heat sink 300 is larger than the contact area between the electronic component 200 and the metal via 110 , so that more heat is transferred through the heat sink 300 .

[0063] It should be noted that the main body 310 can be connected to the second conductive layer 150 through the heat conducting medium 160. This arrangement can improve the heat transfer efficiency between the second conductive layer 150 and the main body 310, and further improve the heat dissipation effect of the main body 310 on the circuit board 100.

[0064] It should be noted that the metal via 110 can be set as a metallized hole, that is, a through hole penetrating the circuit board 100 can be formed on the circuit board 100 by drilling or the like, and then a conductive layer can be formed on the inner wall of the through hole by deposition and electroplating or the like, thereby achieving electrical connection at different positions on the circuit board 100 through the conductive layer.

[0065] For example, when the circuit board 100 is a single-layer circuit board 100 , the metal via 110 can be used to connect the circuit on the first surface of the single-layer circuit board 100 and the circuit on the second surface of the single-layer circuit board 100 .

[0066] When the circuit board 100 is configured as a multi-layer circuit board 100, the metal vias 110 can be used to connect the circuits of the core boards of different layers in the multi-layer circuit board 100, so that the multiple core boards of the multi-layer circuit board 100 can be electrically connected through the metal vias 110.

[0067] It is worth mentioning that the concept of the first surface and the concept of the second surface of the circuit board 100 are not absolute. The first surface and the second surface of the circuit board 100 are only used to describe the position of the electronic component 200 to facilitate the understanding of the position of the electronic component 200 and other components arranged on the circuit board 100.

[0068] In some embodiments, reference Figure 1-3 At least one electronic component 200 simultaneously covers at least a portion of the mounting hole 120 and at least one metal via 110. Thus, the electronic component 200 can dissipate heat through the heat sink 300 and the metal via 110, further improving the heat dissipation efficiency of the heat dissipation component.

[0069] In some embodiments, reference Figure 5 On the first surface of the circuit board 100, the number of electronic components 200 can be set to multiple, and among the multiple electronic components 200, at least one electronic component 200 can be correspondingly arranged in the mounting hole 120, so that the protrusion 320 faces the at least one electronic component 200, so that the at least one electronic component 200 can transfer heat to the heat sink 300 through the protrusion 320. In addition, at least one electronic component 200 covers at least one metal via 100, so that the heat generated by these electronic components 200 can be transferred through the metal via 110.

[0070] In some embodiments, at least one metal via 110 is not covered by the heat sink 300 , and the heat generated by the electronic component 200 is directly dissipated into the air through the metal via 110 .

[0071] In some embodiments, the main body 310 of the heat sink 300 can be integrally formed with the protrusion 320 to improve the stability of the connection between the main body 310 of the heat sink 300 and the protrusion 320, reduce the possibility of the protrusion 320 falling off the main body 310, and improve the heat conduction efficiency between the protrusion 320 and the main body 310 of the heat sink 300, thereby further improving the heat dissipation efficiency of the electronic component 200.

[0072] Reference Figure 1-Figure 5 In some possible implementations, the main body 310 may include a connecting portion 311 and at least one extending portion 312. The connecting portion 311 may be used to connect the protruding portion 320 and the extending portion 312, the connecting portion 311 faces the second surface of the circuit board 100, and the portion of the connecting portion 311 that is not connected to the protruding portion 320 may be used to fit the second surface of the circuit board 100. Exemplarily, the connecting portion 311 may include a first surface and a second surface that are arranged opposite to each other, wherein the first surface of the connecting portion 311 may fit the second surface of the circuit board 100, and the second surface of the connecting portion 311 is used to connect the extending portion 312. Exemplarily, the extending portion 312 may extend in a direction away from the circuit board 100, and the contact area between the main body 310 and the air is increased by the extending portion 312, thereby accelerating the heat dissipation speed of the heat sink 300.

[0073] In some embodiments, the protrusion 320 covers a portion or the entirety of the connection portion 311 .

[0074] In some embodiments, the plurality of extension portions 312 cover a portion of the connection portion 311 .

[0075] Reference Figure 6-Figure 8 The extension portion 312 may include at least one of a columnar extension portion 312, an oblique tooth extension portion 312, and a wavy extension portion 312. As for the shape of the extension portion 312, it can be determined according to the shape of the connection portion 311 and the extension direction of the connection portion 311, so as to further increase the contact area between the main body 310 and the air through different extension portions 312.

[0076] The connecting portion 311 and the extending portion 312 may be integrally formed to make the structures of the connecting portion 311 and the extending portion 312 more stable and reduce the possibility of the extending portion 312 being separated from the connecting portion 311 .

[0077] On the second surface of the connecting portion 311 , the number of the extending portions 312 may be plural.

[0078] Reference Figure 6 , multiple extensions 312 can be arranged in sequence at intervals. For example, the extension 312 can be set as a wavy extension 312, the connection 311 can be set as a long strip connection 311 or a square connection 311, and the multiple extensions 312 can be arranged in sequence at intervals.

[0079] Alternatively, the plurality of extension portions 312 may also be arranged in a plurality of rows and columns.

[0080] For example, refer to Figure 7 The extension portion 312 may be a columnar extension portion 312. The connection portion 311 may be a square connection portion 311, and a plurality of extension portions 312 may be arranged on the square connection portion 311 in a plurality of rows and columns.

[0081] Alternatively, the plurality of extension portions 312 may include a first portion and a second portion, and the first portion of the extension portion 312 and the second portion of the extension portion 312 may be symmetrically disposed.

[0082] For example, refer to Figure 8 The extension portion 312 may be configured as an oblique toothed extension portion 312. The first portion of the extension portion 312 and the second portion of the extension portion 312 may be axially symmetrically distributed. The plurality of extension portions 312 of each portion may be sequentially spaced apart.

[0083] Alternatively, the first portion of the extension portion 312 and the second portion of the extension portion 312 may also be centrally distributed, and the first portion of the extension portion 312 and the second portion of the extension portion 312 may be symmetrically arranged relative to the center of the connecting portion 311 so that the first portion of the extension portion 312 and the second portion of the extension portion 312 are evenly distributed on the second surface of the connecting portion 311.

[0084] To summarize, the heat dissipation assembly of the present application arranges a heat sink and metal vias on the circuit board so that the heat generated by the electronic components on the circuit board can be transferred through the heat sink and dissipated through the metal vias, thereby improving the heat dissipation efficiency of the circuit board and effectively reducing the risk of overheating of the electronic equipment.

[0085] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0086] In the description of the present invention, it should be understood that the terms "including" and "having" and any variations thereof used herein are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0087] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be directly connected or indirectly connected through an intermediate medium, and it can make the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances. In addition, the terms "first", "second", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.

[0088] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the above embodiments describe the utility model in detail, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the above embodiments, or replace some or all of the technical features therein with equivalents. These modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the utility model.

Claims

1. A heat dissipation component, characterized in that: include: A circuit board having a first surface and a second surface opposite to each other, wherein the circuit board further comprises a mounting hole and at least one metal via extending from the first surface to the second surface of the circuit board; A heat sink, comprising a protrusion and a main body connected to each other, wherein the protrusion extends through the mounting hole, the main body is attached to the second surface of the circuit board, and the main body covers at least one of the metal vias; At least one electronic component is disposed on the first surface of the circuit board, wherein the at least one electronic component covers at least a portion of the mounting hole.

2. The heat dissipation assembly according to claim 1, characterized in that: At least one of the electronic components covers at least one of the metal vias.

3. The heat dissipation assembly according to claim 1, characterized in that: At least one of the electronic components covers at least one of the metal vias and at least a portion of the mounting hole.

4. The heat dissipation assembly according to claim 1, characterized in that: The subject includes: A connecting portion, wherein a first surface of the connecting portion is attached to the second surface of the circuit board and is connected to the protruding portion; At least one extending portion is disposed on the second surface of the connecting portion and extends in a direction away from the circuit board.

5. The heat dissipation assembly according to claim 4, characterized in that: The protrusion covers a part or the whole of the connection part.

6. The heat dissipation assembly according to claim 4, characterized in that: The extending portion includes at least one of a columnar extending portion, an oblique tooth extending portion, and a wavy extending portion.

7. The heat dissipation assembly according to claim 4 or 6, characterized in that: The number of the extension parts is set to be multiple; The plurality of extension portions are arranged in sequence and at intervals; Alternatively, the plurality of extension portions are arranged in multiple rows and columns; Alternatively, the plurality of extension portions include a first portion and a second portion, and the first portion of the extension portion and the second portion of the extension portion are symmetrically arranged.

8. The heat dissipation assembly according to claim 4, characterized in that: The plurality of extending portions cover a portion of the connecting portion.

9. The heat dissipation assembly according to claim 1, characterized in that: The circuit board includes at least one core board and a conductive layer arranged on at least one side of the at least one core board.

10. The heat dissipation assembly according to claim 9, characterized in that: The conductive layer includes a first conductive layer and a second conductive layer, the first conductive layer forms at least part of the first surface of the circuit board and is electrically connected to at least one of the electronic components, the second conductive layer forms at least part of the second surface of the circuit board, the first end of the metal via is electrically connected to the first conductive layer, the second end of the metal via is electrically connected to the second conductive layer, and at least part of the second conductive layer is attached to the body.

11. The heat dissipation assembly according to claim 1, characterized in that: A heat-conducting medium is arranged in the mounting hole, and the protrusion is connected to at least one of the electronic components through the heat-conducting medium.

12. The heat dissipation assembly according to claim 1, characterized in that: A heat-conducting medium is disposed in the metal via, and the heat-conducting medium extends from the first surface of the circuit board to the second surface of the circuit board.

13. The heat dissipation assembly according to claim 10, characterized in that: The main body is connected to the second conductive layer via a heat-conducting medium.

14. The heat dissipation assembly according to any one of claims 11 to 13, characterized in that: The heat-conducting medium includes heat-conducting glue or solder.

15. The heat dissipation assembly according to claim 1, characterized in that: The protrusion is integrally formed with the main body.

16. The heat dissipation assembly according to claim 4, characterized in that: The connecting portion and the extending portion are integrally formed.

17. The heat dissipation assembly according to claim 1, characterized in that: The area of ​​the mounting hole is larger than the area of ​​the metal via.

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