Heat dissipation device of power amplifier
By designing a heat dissipation device that does not require a housing ventilation hole in the power amplifier, and using the combination of semiconductor heat dissipation devices and thermally conductive structures, the dust problem caused by air-cooled heat dissipation methods is solved, achieving efficient heat dissipation effect.
Patent Information
- Application Number
- CN202421094792.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-20
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2034-05-20
AI Technical Summary
The air-cooled heat dissipation method of existing power amplifiers can easily cause dust to enter the equipment, affecting the heat dissipation effect and the normal operation of components.
A heat dissipation device that does not require ventilation holes to be opened on the main housing of the power amplifier is designed. A combination of a semiconductor heat dissipation device, a mainboard heat dissipation plate, an intermediate heat conduction part and a top heat conduction part is used to achieve efficient heat dissipation through capillary structure and convection pipe.
It effectively avoids dust entering the equipment, improves the heat dissipation effect, and ensures the normal operation of components.
Smart Images
Figure CN222691939U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of heat dissipation devices, and in particular relates to a heat dissipation device for a power amplifier. Background Art
[0002] Signal amplifier is a miniature repeater, also known as a mobile phone signal amplifier. From its name, we know that the function of the signal amplifier is to amplify the signal. There are many types of signal amplifiers, such as TV signal amplifiers, radio amplifiers, etc. All receivers have signal amplifiers. An amplifier that specifically amplifies mobile phone signals is called a mobile phone signal amplifier. It is mainly used to solve the problem of indoor mobile phone signal blind spots. When it is working, its motherboard chip will release a lot of heat. At present, air cooling is mostly used for heat dissipation. Usually, ventilation holes are opened on the amplifier casing to cooperate with fans. However, this method can easily cause dust to enter the amplifier casing, block the heat conductive sheet, affect heat dissipation, and affect the normal operation of internal components. Utility Model Content
[0003] In view of the above problems, the purpose of the utility model is to provide a heat dissipation device for a power amplifier. Compared with the air cooling method in the prior art, the device does not need to have ventilation holes on the outer shell of the power amplifier body, thereby preventing dust from entering the interior and affecting normal operation. The heat dissipation effect is also effectively improved through the arrangement of a semiconductor heat dissipation device and a mainboard heat sink, an intermediate heat conductive part, and a top heat conductive part.
[0004] To achieve the above purpose, the utility model provides the following technical solutions: a heat dissipation device for a power amplifier, which is installed on a power amplifier body, a heat conduction mechanism is installed inside the power amplifier body, the heat conduction mechanism includes a mainboard heat dissipation plate, an intermediate heat conduction part is installed on the top of the mainboard heat dissipation plate, a top heat conduction part is installed on the top of the intermediate heat conduction part, the top heat conduction part passes through the top plate of the power amplifier body, a screw hole is opened downward on the top of the power amplifier body, a semiconductor heat dissipation device is arranged on the top of the power amplifier body, the semiconductor heat dissipation device includes an outer frame, a ventilation groove is penetrated through the side of the outer frame, a mounting seat is installed on the inner side of the outer frame, a spring telescopic column is installed at the bottom of the mounting seat, a semiconductor refrigeration sheet is installed at the bottom of the spring telescopic column, a fan mounting frame is installed on the inner side of the outer frame, a cooling fan is installed on the fan mounting frame, an integrally formed screw seat is provided on the outer side of the outer frame, a locking screw is threadedly connected between the screw seat and the screw hole.
[0005] The beneficial effects of the utility model are as follows: compared with the air cooling method in the prior art, the device does not need to have ventilation holes on the outer shell of the power amplifier body, thereby preventing dust from entering the interior and affecting normal operation. The heat dissipation effect is also effectively improved through the arrangement of the semiconductor heat dissipation device and the mainboard heat dissipation plate, the middle heat conduction part, and the top heat conduction part.
[0006] To dissipate heat for this device:
[0007] As a further improvement of the above technical solution: a lower capillary structure is provided inside the mainboard heat sink, an upper capillary structure is provided inside the top heat conducting part, and a convection duct is provided inside the middle heat conducting part.
[0008] The heat generated by the motherboard chip is conducted to the motherboard heat sink. The coolant in the motherboard heat sink expands due to the heat and flows upward through the convection pipe to the inside of the top heat conduction part, dispersed through the upper capillary structure, and conducted to the upper capillary structure and the top heat conduction part through the large contact area with the upper capillary structure. The semiconductor refrigeration sheet directly cools the top heat conduction part, and the cooled coolant flows back to the inside of the motherboard heat sink through the convection pipe, and absorbs the heat from the lower capillary structure and the motherboard heat sink again, and so on to achieve heat dissipation.
[0009] In order to complete the disassembly and assembly of the semiconductor heat sink without the use of tools:
[0010] As a further improvement of the above technical solution: the top of the locking screw is connected to the knob.
[0011] The beneficial effect of this improvement is that the setting of the knob enables the semiconductor heat dissipation device to be disassembled and assembled without the aid of tools.
[0012] For air circulation and further sealing of the power module:
[0013] As a further improvement of the above technical solution: an air guide plate is provided inside the ventilation slot.
[0014] Air guides are used to assist in directing airflow.
[0015] To dissipate heat for the motherboard chip:
[0016] As a further improvement of the above technical solution: the bottom of the mainboard heat sink is in contact with the chip on the mainboard inside the power amplifier body.
[0017] The heat generated by the motherboard chip is conducted to the motherboard heat sink to achieve heat dissipation.
[0018] The parts not involved in the device are the same as those in the prior art or can be implemented by using the prior art. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a schematic diagram of the right front axonometric structure of the utility model;
[0020] Figure 2 It is a cutaway schematic diagram of the utility model;
[0021] Figure 3 It is a cross-sectional schematic diagram of the semiconductor heat dissipation device in the utility model;
[0022] Figure 4 It is a schematic diagram of the isometric structure of the main body of the power amplifier in the utility model;
[0023] Figure 5 This is a schematic diagram of the bottom structure of the semiconductor heat dissipation device in the utility model;
[0024] In the figure: 1. Power amplifier body; 2. Mainboard heat sink; 3. Middle heat conduction part; 4. Top heat conduction part; 5. Lower capillary structure; 6. Upper capillary structure; 7. Convection duct; 8. Screw hole; 9. Semiconductor heat dissipation device; 10. Outer frame; 11. Ventilation slot; 12. Air guide plate; 13. Mounting seat; 14. Spring telescopic column; 15. Semiconductor cooling plate; 16. Fan mounting bracket; 17. Cooling fan; 18. Screw seat; 19. Locking screw; 20. Knob. DETAILED DESCRIPTION
[0025] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings. The description in this part is only exemplary and explanatory and should not have any limiting effect on the protection scope of the present invention.
[0026] like Figure 1-5As shown, a heat dissipation device of a power amplifier is installed on a power amplifier body 1, a heat conduction mechanism is installed inside the power amplifier body 1, and the heat conduction mechanism includes a mainboard heat dissipation plate 2, an intermediate heat conduction part 3 is installed on the top of the mainboard heat dissipation plate 2, and a top heat conduction part 4 is installed on the top of the intermediate heat conduction part 3. The top heat conduction part 4 passes through the top plate of the power amplifier body 1, and a screw hole 8 is opened downward on the top of the power amplifier body 1. A semiconductor heat dissipation device 9 is provided on the top of the power amplifier body 1, and the semiconductor heat dissipation device The device 9 includes an outer frame 10, a ventilation groove 11 is penetrated through the side of the outer frame 10, a mounting seat 13 is installed on the inner side of the outer frame 10, a spring telescopic column 14 is installed at the bottom of the mounting seat 13, a semiconductor cooling plate 15 is installed at the bottom of the spring telescopic column 14, a fan mounting frame 16 is installed on the inner side of the outer frame 10, a cooling fan 17 is installed on the fan mounting frame 16, an integrally formed screw seat 18 is provided on the outer side of the outer frame 10, a locking screw 19 is threadedly connected between the screw seat 18 and the screw hole 8.
[0027] Compared with the air cooling method in the prior art, the present device does not need to open ventilation holes on the outer shell of the power amplifier body 1, so as to prevent dust from entering the interior and affecting normal operation. The heat dissipation effect is also effectively improved through the arrangement of the semiconductor heat dissipation device 9 and the mainboard heat dissipation plate 2, the middle heat conduction part 3, and the top heat conduction part 4.
[0028] A lower capillary structure 5 is provided inside the mainboard heat dissipation plate 2 , an upper capillary structure 6 is provided inside the top heat conduction part 4 , and a convection duct 7 is provided inside the middle heat conduction part 3 .
[0029] The heat generated by the motherboard chip is conducted to the motherboard heat sink 2. The coolant in the motherboard heat sink 2 expands due to the heat and flows upward to the interior of the top heat conduction part 4 through the convection pipe 7, and is dispersed through the upper capillary structure 6. The heat is conducted to the upper capillary structure 6 and the top heat conduction part 4 through the large contact area with the upper capillary structure 6. The semiconductor refrigeration sheet 15 directly cools the top heat conduction part 4. The cooled coolant flows back to the interior of the motherboard heat sink 2 through the convection pipe 7, and absorbs the heat from the lower capillary structure 5 and the motherboard heat sink 2 again, and this reciprocating process is repeated to achieve heat dissipation.
[0030] The top of the locking screw 19 is connected to the knob 20 .
[0031] The setting of the knob 20 enables the semiconductor heat dissipation device 9 to be disassembled and assembled without the aid of tools.
[0032] An air guide piece 12 is disposed inside the ventilation slot 11 .
[0033] The air guide piece 12 is used to assist in guiding the airflow.
[0034] The bottom of the mainboard heat sink 2 contacts the chip on the mainboard inside the power amplifier body 1 .
[0035] The heat generated by the motherboard chip is conducted to the motherboard heat sink 2 to achieve heat dissipation.
[0036] The working principle and use process of the utility model: the device is provided with a detachable semiconductor heat sink 9, which can be removed when not in use, and is also convenient for replacement after damage. When installing the semiconductor heat sink 9, align the screw seat 18 on the semiconductor heat sink 9 with the screw hole 8 on the top of the power amplifier body 1, and use the locking screw 19 to thread the screw hole 8 and the screw seat 18. As the locking screw 19 is tightened, the spring telescopic column 14 is compressed. Under the elastic force of the spring, the bottom of the semiconductor refrigeration plate 15 is tightly attached to the top heat conduction part 4, ensuring the cooling effect of the semiconductor refrigeration plate 15 on the top heat conduction part 4. When the power amplifier body 1 is running, the heat generated by the mainboard chip is conducted to the mainboard heat sink 2. After the coolant in the mainboard heat sink 2 is heated and expanded, it flows upward to the inside of the top heat conduction part 4 through the convection pipe 7. The heat is dispersed through the upper capillary structure 6, and the heat is conducted to the upper capillary structure 6 and the top heat conducting part 4 through the large contact area with the upper capillary structure 6. The semiconductor refrigeration sheet 15 directly cools the top heat conducting part 4, and the cooled coolant flows back to the interior of the mainboard heat sink 2 through the convection pipe 7, and absorbs the heat from the lower capillary structure 5 and the mainboard heat sink 2 again, and so on, so as to effectively dissipate the heat of the mainboard chip in the power amplifier body 1. Compared with the air cooling method in the prior art, there is no need to open ventilation holes on the outer casing of the power amplifier body 1, so as to avoid dust entering the interior and affecting normal operation. During the cooling process, the cooling fan 17 runs, draws air flow from the ventilation slot 11, takes away the heat from the semiconductor refrigeration sheet 15, and discharges it from the top of the outer frame 10, thereby dissipating the heat on the back of the semiconductor refrigeration sheet 15.
[0037] It should be noted that, in this article, the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.
[0038] This article uses specific examples to illustrate the principles and implementation methods of the utility model. The above examples are only used to help understand the method and core ideas of the utility model. The above is only the preferred implementation method of the utility model. It should be pointed out that due to the limitations of textual expression, there are objectively infinite specific structures. For ordinary technicians in this technical field, without departing from the principle of the utility model, they can make several improvements, embellishments or changes, and can also combine the above technical features in an appropriate manner; these improvements, embellishments, changes or combinations, or the direct application of the concept and technical solution of the utility model to other occasions without improvement, should be regarded as the protection scope of the utility model.
Claims
1. A heat dissipation device for a power amplifier, characterized in that: The power amplifier body (1) is installed with a heat conduction mechanism installed inside the power amplifier body (1), the heat conduction mechanism comprising a mainboard heat sink (2), an intermediate heat conduction part (3) installed on the top of the mainboard heat sink (2), a top heat conduction part (4) installed on the top of the intermediate heat conduction part (3), the top heat conduction part (4) passing through the top plate of the power amplifier body (1), a screw hole (8) is opened downward on the top of the power amplifier body (1), a semiconductor heat dissipation device (9) is provided on the top of the power amplifier body (1), and the semiconductor heat dissipation device (9) comprises an outer frame (10), A ventilation slot (11) is provided through the side of the outer frame (10); a mounting seat (13) is installed on the inner side of the outer frame (10); a spring telescopic column (14) is installed at the bottom of the mounting seat (13); a semiconductor cooling plate (15) is installed at the bottom of the spring telescopic column (14); a fan mounting frame (16) is installed on the inner side of the outer frame (10); a cooling fan (17) is installed on the fan mounting frame (16); an integrally formed screw seat (18) is provided on the outer side of the outer frame (10); a locking screw (19) is threadedly connected between the screw seat (18) and the screw hole (8).
2. The heat dissipation device for a power amplifier according to claim 1, characterized in that: A lower capillary structure (5) is provided inside the mainboard heat dissipation plate (2), an upper capillary structure (6) is provided inside the top heat conduction part (4), and a convection duct (7) is provided inside the middle heat conduction part (3).
3. The heat dissipation device for a power amplifier according to claim 1, characterized in that: The top of the locking screw (19) is connected to the knob (20).
4. The heat dissipation device for a power amplifier according to claim 1, characterized in that: An air guide plate (12) is provided inside the ventilation slot (11).
5. The heat dissipation device for a power amplifier according to claim 1, characterized in that: The bottom of the mainboard heat sink (2) contacts the chip on the mainboard inside the power amplifier body (1).