Pressure reduction flow channel of liquid cooling server

Abstract

The utility model provides a liquid cooling server pressure reduction flow channel which comprises a base and a protective cover installed at the top of the base, a plurality of cooling fin bodies are arranged at the top of the base, gaps are reserved between the cooling fin bodies for cooling liquid to pass through, and first grooves are formed in the two sides of the top of each cooling fin body. A liquid inlet cavity is formed between the liquid inlet and the first groove in one side of the cooling fin body, and a liquid outlet cavity is formed between the liquid outlet and the first groove in the other side of the cooling fin body. According to the cooling fin, through the arrangement of the first grooves, the liquid inlet cavity is formed between the liquid inlet and the first groove in one side of the cooling fin body, and the liquid outlet cavity is formed between the liquid outlet and the first groove in the other side of the cooling fin body, so that the liquid inlet and outlet area between the base and the protective cover is increased through the arrangement of the first grooves; and the flow resistance of the cooling liquid between the base and the protective cover can be effectively reduced, and the flow speed of the cooling liquid is increased, so that the heat dissipation effect is enhanced, the overall pressure drop is realized, and the problem of overlarge internal pressure is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid cooling, and in particular to a pressure reducing flow channel of a liquid cooling server. Background Art

[0002] With the rapid development of the information age, data centers have become one of the indispensable infrastructures of modern society. The servers in the data centers carry a large amount of data processing and storage tasks, and key components such as chips on the server motherboard will generate a lot of heat during operation. In order to ensure the stable operation and extend the service life of the server, these heat-generating components must be effectively cooled. Traditional heat dissipation methods mainly include air cooling and liquid cooling. Among them, liquid cooling is widely used in data centers due to its advantages such as high heat dissipation efficiency and low noise. In the liquid cooling system, the radiator is a key heat dissipation component, and its performance directly affects the heat dissipation effect of the entire system.

[0003] However, in the existing data center liquid cooling server motherboard chip heat generating components design, there are some problems to be solved. The inlet and outlet design of the radiator is often narrow, which limits the flow and velocity of the coolant. When the high-speed coolant enters the radiator, it is easy to produce a large pressure shock, which increases the overall pressure drop of the radiator and affects the service life of the radiator. Therefore, we make improvements to this and propose a liquid cooling server pressure relief channel. Summary of the invention

[0004] The purpose of the utility model is to address the problem that the existing water inlet and outlet designs inside the radiator are often narrow, which limits the flow rate and flow velocity of the coolant, making it easy to generate a large pressure shock when the high-speed flowing coolant enters the radiator, thereby increasing the overall pressure drop of the radiator.

[0005] In order to achieve the above-mentioned purpose of the invention, the utility model provides a pressure-reducing channel for a liquid-cooled server to improve the above-mentioned problem.

[0006] The specific application is as follows:

[0007] The pressure reducing channel of the liquid-cooled server includes a base and a protective cover installed on the top of the base. A plurality of heat sink bodies are arranged on the top of the base. Gaps are left between the heat sink bodies for cooling liquid to pass through. First grooves are provided on both sides of the top of the heat sink body. A liquid inlet cavity is formed between a liquid inlet and the first groove on one side of the heat sink body, and a liquid outlet cavity is formed between a liquid outlet and the first groove on the other side of the heat sink body.

[0008] As a preferred technical solution of the present application, a liquid inlet and a liquid outlet are respectively provided on both sides of the top of the protective cover, and the liquid inlet and the liquid outlet are respectively used for the entry and discharge of cooling liquid.

[0009] As a preferred technical solution of the present application, chamfers are provided at the tops of the inner walls of the liquid inlet and the liquid outlet to assist in the connection between the pipeline and the liquid inlet and the liquid outlet.

[0010] As a preferred technical solution of the present application, a sealing groove is provided on the top of the base, and the bottom of the protective cover is inserted into the sealing groove.

[0011] As a preferred technical solution of the present application, the heat sink body and the base are fixedly connected, and a side of the heat sink body away from the base is in contact with the bottom of the inner cavity of the protective cover.

[0012] As a preferred technical solution of the present application, a second groove is provided on the top of the heat sink body, and a pressure relief cavity is formed between the second groove and the top of the inner cavity of the protective cover.

[0013] As a preferred technical solution of the present application, a plurality of mounting parts are also provided on the base, and the mounting parts are used to assist the installation of the base.

[0014] As a preferred technical solution of the present application, the mounting member is a mounting hole, the mounting hole is opened on the base, and the mounting hole is used to assist the installation of the base.

[0015] As a preferred technical solution of the present application, an anti-foolproofing piece is provided at a corner of the base, and the anti-foolproofing piece is used to assist the user in distinguishing the direction of the base.

[0016] As a preferred technical solution of the present application, the anti-foolproof component is a slope, and the slope is opened at a corner of the base.

[0017] Compared with the prior art, the utility model has the following beneficial effects:

[0018] In the scheme of this application:

[0019] In order to solve the problem that the water inlet and outlet designs inside the radiator in the prior art are often narrow, which limits the flow rate and flow rate of the coolant, and makes it easy to generate a large pressure shock when the high-speed flowing coolant enters the radiator, thereby increasing the overall pressure drop of the radiator, the present application sets a first groove, forms a liquid inlet cavity between the liquid inlet and the first groove on one side of the heat sink body, and forms a liquid outlet cavity between the liquid outlet and the first groove on the other side of the heat sink body, so that the setting of the first groove increases the liquid inlet and outlet area between the base and the protective cover, can effectively reduce the flow resistance of the coolant between the base and the protective cover, and increase the flow rate of the coolant, thereby enhancing the heat dissipation effect, achieving overall pressure drop, solving the problem of excessive internal pressure, and can fully utilize the heat dissipation efficiency of the heat sink body, thereby reducing the temperature of the server chip, increasing the reliability of the whole machine, and delaying its life. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of the structure of the decompression channel of the liquid-cooled server provided in this application;

[0021] Figure 2 The explosion intention of the decompression flow channel of the liquid-cooled server provided for this application;

[0022] Figure 3 The liquid cooling server decompression flow channel provided in this application Figure 2 Schematic diagram of the structure viewed from above;

[0023] Figure 4 A schematic diagram of the structure of the heat sink body of the pressure reducing channel of the liquid cooling server provided in this application;

[0024] Figure 5 A schematic cross-sectional view of the decompression channel of a liquid-cooled server provided in this application;

[0025] Figure 6 This is a schematic diagram of the cross-sectional structure of the pressure reducing flow channel of the liquid-cooled server provided in this application.

[0026] Indicated in the figure:

[0027] 1. Base; 101. Sealing groove; 102. Mounting hole; 103. Slope; 2. Protective cover; 3. Liquid inlet; 4. Liquid outlet; 5. Heat sink body; 501. First groove; 502. Second groove. DETAILED DESCRIPTION

[0028] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0029] As recorded in the background technology, there are some problems that need to be solved in the design of radiators for heat-generating components of existing data center liquid-cooled server motherboard chips. The water inlet and outlet designs inside the radiator are often relatively narrow, which limits the flow and velocity of the coolant. When the high-speed flowing coolant enters the radiator, it is easy to generate a large pressure shock, which increases the overall pressure drop of the radiator, thereby affecting the service life of the radiator.

[0030] In order to solve this technical problem, the utility model provides a decompression flow channel for a liquid cooling server.

[0031] Specifically, please refer to Figure 1-3 , the decompression channel of the liquid cooling server specifically includes:

[0032] A base 1 and a protective cover 2 installed on the top of the base 1, a plurality of heat sink bodies 5 are arranged on the top of the base 1, gaps are left between the plurality of heat sink bodies 5 for cooling liquid to pass through, first grooves 501 are opened on both sides of the top of the heat sink body 5, a liquid inlet cavity is formed between the liquid inlet 3 and the first groove 501 on one side of the heat sink body 5, and a liquid outlet cavity is formed between the liquid outlet 4 and the first groove 501 on the other side of the heat sink body 5.

[0033] The liquid-cooled server pressure-reducing flow channel provided by the utility model has a first groove 501 set up, a liquid inlet cavity is formed between the liquid inlet 3 and the first groove 501 on one side of the heat sink body 5, and a liquid outlet cavity is formed between the liquid outlet 4 and the first groove 501 on the other side of the heat sink body 5, so that the setting of the first groove 501 increases the liquid inlet and outlet area between the base 1 and the protective cover 2, can effectively reduce the flow resistance of the coolant between the base 1 and the protective cover 2, and increase the flow speed of the coolant, thereby enhancing the heat dissipation effect, achieving an overall pressure drop, solving the problem of excessive internal pressure, and being able to fully utilize the heat dissipation efficiency of the heat sink body 5, thereby reducing the temperature of the server chip, increasing the reliability of the whole machine, and delaying its service life.

[0034] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiments of the utility model will be clearly and completely described below in conjunction with the accompanying drawings.

[0035] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0036] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0037] Example 1, please refer to Figure 1-Figure 5 The decompression channel of the liquid cooling server includes a base 1 and a protective cover 2 installed on the top of the base 1. A plurality of heat sink bodies 5 are arranged on the top of the base 1. Gaps are left between the plurality of heat sink bodies 5 for cooling liquid to pass through. First grooves 501 are provided on both sides of the top of the heat sink body 5. A liquid inlet cavity is formed between a liquid inlet 3 and the first groove 501 on one side of the heat sink body 5. A liquid outlet cavity is formed between a liquid outlet 4 and the first groove 501 on the other side of the heat sink body 5. Through the first groove 501, the liquid inlet 3 and the first groove 501 on one side of the heat sink body 5 are provided. A liquid inlet cavity is formed between the grooves 501, and a liquid outlet cavity is formed between the liquid outlet 4 and the first groove 501 on the other side of the heat sink body 5, so that the setting of the first groove 501 increases the liquid inlet and outlet area between the base 1 and the protective cover 2, which can effectively reduce the flow resistance of the coolant between the base 1 and the protective cover 2, and increase the flow speed of the coolant, thereby enhancing the heat dissipation effect, achieving an overall pressure drop, and solving the problem of excessive internal pressure. It can also make full use of the heat dissipation efficiency of the heat sink body 5, thereby reducing the temperature of the server chip, increasing the reliability of the entire machine, and delaying its life.

[0038] Further, such as Figure 1-Figure 3 As shown, a liquid inlet 3 and a liquid outlet 4 are respectively provided on both sides of the top of the protective cover 2, and the liquid inlet 3 and the liquid outlet 4 are respectively used for the entry and discharge of cooling liquid. After the liquid inlet 3 and the liquid outlet 4 are connected to the delivery pipeline, the delivery pipeline delivers the cooling liquid into the protective cover 2 through the liquid inlet 3, and the cooling liquid passes through the heat sink body 5 and is discharged from the liquid outlet 4 to achieve heat dissipation.

[0039] Furthermore, chamfers are provided at the tops of the inner walls of the liquid inlet 3 and the liquid outlet 4 to assist in the connection of the pipeline with the liquid inlet 3 and the liquid outlet 4 . The chamfers facilitate the connection of the delivery pipeline with the liquid inlet 3 and the liquid outlet 4 .

[0040] Further, such as Figure 2 As shown, a sealing groove 101 is provided at the top of the base 1 , and the bottom of the protective cover 2 is inserted into the sealing groove 101 . The provision of the sealing groove 101 can improve the sealing performance of the connection between the base 1 and the protective cover 2 .

[0041] Further, such as Figure 5-Figure 6As shown, the heat sink body 5 is fixedly connected to the base 1, and the side of the heat sink body 5 away from the base 1 is in contact with the bottom of the inner cavity of the protective cover 2. This arrangement enables the cooling liquid to flow through the gap of the heat sink body 5 to ensure the contact area between the cooling liquid and the heat sink body 5.

[0042] Example 2 further optimizes the decompression flow channel of the liquid cooling server provided in Example 1. Specifically, Figure 2 and Figure 4 As shown, a second groove 502 is provided at the top of the heat sink body 5, and a pressure-relief cavity is formed between the second groove 502 and the top of the inner cavity of the protective cover 2. When the cooling liquid between the gaps of the heat sink body 5 reaches the protective cover 2, the setting of the protective cover 2 can slow down the pressure impact of the coolant entering, reduce the overall pressure drop, and further improve the heat dissipation efficiency and service life of the radiator; specifically, the setting of the protective cover 2 can change the flow mode of the cooling liquid between the heat sink body 5, so that the coolant forms a more complex flow path when flowing through the liquid outlet 4. This flow path not only increases the contact area between the cooling liquid and the surface of the heat sink body 5, but also causes the cooling liquid to generate more turbulence during the flow process. Turbulence helps to transfer heat from the surface of the heat sink body 5 to the coolant more effectively. The protective cover 2 is provided to form a buffer zone, which helps to reduce the pressure loss of the coolant when it flows through the heat sink body 5. This is because the protective cover 2 can allow a part of the cooling liquid to form a short stay on the top of the heat sink body 5, thereby slowing down the flow rate of the cooling liquid and reducing the pressure drop. The provision of the protective cover 2 also helps to optimize the distribution of heat on the heat sink body 5. Since the base 1 can change the flow path of the cooling liquid, the cooling liquid can flow more evenly through the surface of the heat sink body 5, avoiding the problem of local overheating or uneven cooling. This helps to maintain the stability of the temperature at the bottom of the base 1 and improve the overall performance.

[0043] Embodiment 3 further optimizes the decompression channel of the liquid-cooled server provided in Embodiment 1 or 2. Specifically, a plurality of mounting parts are further provided on the base 1, and the mounting parts are used to assist the installation of the base 1.

[0044] Further, such as Figure 1 As shown, the mounting member is a mounting hole 102 , which is provided on the base 1 . The mounting hole 102 is used to assist the installation of the base 1 , that is, the base 1 can be mounted on a device requiring heat dissipation by passing a bolt through the mounting hole 102 .

[0045] Further, such as Figure 1 As shown, a foolproof part is provided at one corner of the base 1, and the foolproof part is used to assist the user to distinguish the direction of the base 1, thereby reducing the situation where the base 1 is installed upside down.

[0046] Further, such as Figure 1 As shown, the foolproof component is a slope 103 , which is provided at a corner of the base 1 , and the slope 103 can be easily identified by the user.

[0047] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] Obviously, the embodiments described above are only some embodiments of the utility model, rather than all embodiments. The preferred embodiments of the utility model are given in the accompanying drawings, but they do not limit the patent scope of the utility model. The utility model can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. Although the utility model is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to replace some of the technical features therein with equivalents. Any equivalent structure made using the contents of the utility model specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the utility model.

Claims

1. Liquid cooling server decompression channel, characterized in that: The invention comprises a base (1) and a protective cover (2) mounted on the top of the base (1); a plurality of heat sink bodies (5) are arranged on the top of the base (1); gaps are left between the plurality of heat sink bodies (5) for cooling liquid to pass through; first grooves (501) are provided on both sides of the top of the heat sink body (5); a liquid inlet cavity is formed between a liquid inlet (3) and the first groove (501) on one side of the heat sink body (5); and a liquid outlet cavity is formed between a liquid outlet (4) and the first groove (501) on the other side of the heat sink body (5).

2. The liquid cooling server decompression channel according to claim 1, characterized in that: A liquid inlet (3) and a liquid outlet (4) are respectively arranged on both sides of the top of the protective cover (2), and the liquid inlet (3) and the liquid outlet (4) are respectively used for the entry and discharge of cooling liquid.

3. The decompression channel of the liquid cooling server according to claim 2, characterized in that: Chamfers are provided at the tops of the inner walls of the liquid inlet (3) and the liquid outlet (4) to assist in the connection of the pipeline with the liquid inlet (3) and the liquid outlet (4).

4. The liquid cooling server decompression channel according to claim 3, characterized in that: A sealing groove (101) is provided on the top of the base (1), and the bottom of the protective cover (2) is inserted into the sealing groove (101).

5. The liquid cooling server decompression channel according to claim 4, characterized in that: The heat sink body (5) and the base (1) are fixedly connected, and a side of the heat sink body (5) away from the base (1) is in contact with the bottom of the inner cavity of the protective cover (2).

6. The decompression channel of the liquid cooling server according to claim 5, characterized in that: A second groove (502) is provided at the top of the heat sink body (5), and a pressure relief cavity is formed between the second groove (502) and the top of the inner cavity of the protective cover (2).

7. The decompression channel of the liquid cooling server according to claim 6, characterized in that: A plurality of mounting parts are also provided on the base (1), and the mounting parts are used to assist in the installation of the base (1).

8. The decompression channel of the liquid cooling server according to claim 7, characterized in that: The mounting piece is a mounting hole (102), the mounting hole (102) is formed on the base (1), and the mounting hole (102) is used to assist the installation of the base (1).

9. The decompression channel of the liquid cooling server according to claim 8, characterized in that: A foolproof part is provided at one corner of the base (1), and the foolproof part is used to assist a user in identifying the direction of the base (1).

10. The liquid cooling server decompression channel according to claim 9, characterized in that: The foolproof component is a slope (103), and the slope (103) is opened at a corner of the base (1).

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