Three-dimensional heat dissipation device

Abstract

The utility model relates to a three-dimensional heat dissipation device, which comprises a uniform temperature plate and a first heat pipe, the vapor chamber comprises a first cover plate, a side wall and a second cover plate, and the side wall is arranged between the first cover plate and the second cover plate in a surrounding mode to form a hollow cavity. The first heat pipe is connected to the side wall of the vapor chamber and extends outwards, and the first heat pipe is in fluid communication with the hollow cavity of the vapor chamber, so that the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The present invention relates to a heat dissipation device, and in particular to a three-dimensional heat dissipation device. Background Art

[0002] With the advancement of technology, electronic products are becoming more and more popular, and gradually changing the way many people live or work. As computer computing power increases, the temperature control of electronic components such as CPUs and graphics chips becomes more and more important.

[0003] Electronic components such as CPUs and graphics chips generate heat when running and require proper cooling to achieve optimal performance. In order to keep electronic components such as CPUs and graphics chips running at an ideal temperature, the appropriate three-dimensional heat dissipation device configuration will determine the performance of the electronic device.

[0004] In addition, as the size of current electronic devices is getting smaller and smaller, and the number of cores of their computing chips is increasing, the heat generated is also increasing.

[0005] Therefore, how to effectively improve the heat dissipation efficiency of the heat dissipation device to reduce the operating temperature of the computing chip will help improve the overall operating efficiency of the electronic device. Utility Model Content

[0006] The new content is intended to provide a simplified summary of the present disclosure so that readers can have a basic understanding of the present disclosure. This new content is not a complete overview of the present disclosure, and its intention is not to point out the important / critical elements of the present embodiment or to define the scope of the present invention.

[0007] An object of the present invention is to provide a three-dimensional heat dissipation device that can improve heat dissipation efficiency and thereby improve the overall working efficiency of the electronic device.

[0008] To achieve the above-mentioned purpose, according to one embodiment of the present disclosure, a three-dimensional heat dissipation device is provided, which includes a temperature averaging plate and a first heat pipe. The temperature averaging plate includes a first cover plate, a side wall and a second cover plate, wherein the side wall surrounds the second cover plate and the first cover plate to form a hollow chamber. The first heat pipe is connected to the side wall of the temperature averaging plate and extends outward, and the first heat pipe is in fluid communication with the hollow chamber.

[0009] In some embodiments, the three-dimensional heat dissipation device further includes a second heat pipe connected to the second cover plate of the temperature homogenizer, and the second heat pipe is in fluid communication with the hollow chamber.

[0010] In some embodiments, the second heat pipe includes a connecting portion and a heat dissipating portion, wherein the connecting portion is connected to the second cover plate of the temperature homogenizing plate, and the heat dissipating portion is connected to the connecting portion, and the heat dissipating portion is parallel to the first heat pipe.

[0011] In some embodiments, the side wall is perpendicular to the first cover plate, and the first cover plate of the temperature homogenizing plate is used to contact a heat source.

[0012] In some embodiments, the three-dimensional heat dissipation device further includes a third heat pipe connected to the second cover plate of the temperature vapor chamber.

[0013] In some embodiments, the third heat pipe includes a heat absorbing portion, a connecting portion, and a heat dissipating portion. The heat absorbing portion is connected to the second cover plate of the temperature homogenizing plate, the connecting portion is connected to the heat absorbing portion of the third heat pipe, and the heat dissipating portion is connected to the connecting portion of the third heat pipe, so that the third heat pipe forms a U-shaped heat pipe, and the opening of the U-shaped heat pipe faces the first heat pipe.

[0014] In some embodiments, the three-dimensional heat dissipation device further includes a fourth heat pipe connected to the second cover plate of the temperature vapor chamber.

[0015] In some embodiments, the fourth heat pipe includes a heat absorbing portion, a connecting portion, and a heat dissipating portion. The heat absorbing portion is connected to the second cover plate of the temperature homogenizing plate, the connecting portion is connected to the heat absorbing portion of the fourth heat pipe, and the heat dissipating portion is connected to the connecting portion of the fourth heat pipe, so that the fourth heat pipe forms a U-shaped heat pipe, and the opening of the U-shaped heat pipe formed by the fourth heat pipe faces away from the first heat pipe.

[0016] In some embodiments, the three-dimensional heat dissipation device further includes a first heat dissipation fin module, which is arranged on the second cover plate of the temperature equilibrium plate, and the connecting part of the second heat pipe, the heat absorption part of the third heat pipe and the heat dissipation part of the third heat pipe, the heat absorption part of the fourth heat pipe and the heat dissipation part of the fourth heat pipe are arranged in the first heat dissipation fin module.

[0017] In some embodiments, the three-dimensional heat dissipation device further includes a second heat dissipation fin module, which is arranged in parallel with the first heat dissipation fin module and arranged outside the temperature plate. The heat dissipation parts of the first heat pipe and the second heat pipe are arranged in the second heat dissipation fin module.

[0018] Therefore, the three-dimensional heat dissipation device can utilize a temperature evaporating plate, a heat pipe connected to the temperature evaporating plate by fluid, and a heat pipe connected to the outer surface of the temperature evaporating plate, effectively improving the heat dissipation efficiency and heat dissipation capacity of the three-dimensional heat dissipation device, reducing the operating temperature of the computing chip, and thus improving the overall working efficiency of the electronic device. In addition, the heat pipe connected to the temperature evaporating plate by fluid is preferably vertically connected to the surface of the temperature evaporating plate and the side wall of the temperature evaporating plate, and extends outward from the temperature evaporating plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to make the above and other purposes, features, advantages and embodiments of the present disclosure more clearly understood, the accompanying drawings are described as follows:

[0020] Figure 1It is a side view schematic diagram of a three-dimensional heat dissipation device according to an embodiment of the present invention.

[0021] Figure 2 It is a three-dimensional schematic diagram of a three-dimensional heat dissipation device according to an embodiment of the present invention.

[0022] Figure 3 The diagram is a three-dimensional schematic diagram of a temperature homogenizing plate and a heat pipe connected thereto of a three-dimensional heat dissipation device according to an embodiment of the present invention.

[0023] The reference numerals are described as follows:

[0024] 100: Three-dimensional heat dissipation device

[0025] 101: Heat Source

[0026] 110: First heat pipe

[0027] 120: Second heat pipe

[0028] 122: Connection

[0029] 124: Heat dissipation

[0030] 130: The third heat pipe

[0031] 132: Heat absorption part

[0032] 134: Connection

[0033] 136: Heat dissipation

[0034] 140: Fourth heat pipe

[0035] 142: Heat absorption part

[0036] 144: Connection

[0037] 146: Heat dissipation

[0038] 150: Temperature balancing board

[0039] 152: Second cover

[0040] 154: Sidewall

[0041] 156: First cover

[0042] 158: Hollow Chamber

[0043] 160: First heat sink fin module

[0044] 170: Second heat sink fin module DETAILED DESCRIPTION

[0045] The following is a detailed description of the embodiments with the accompanying drawings, but the embodiments provided are not intended to limit the scope of the present disclosure, and the description of the structural operation is not intended to limit the order of its execution. Any device with equal functions produced by the re-combination of components is within the scope of the present disclosure. In addition, the drawings are for illustrative purposes only and are not drawn in original size. For ease of understanding, the same or similar components in the following description will be described with the same symbols.

[0046] In addition, the terms used throughout the specification and claims generally have the ordinary meaning of each term used in the field, in the context of this disclosure, and in the specific context, unless otherwise noted. Certain terms used to describe the present disclosure will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in the description of the present disclosure.

[0047] In the embodiments and claims, unless otherwise specified in the context, "a", "an" and "the" may refer to a single or multiple number. The numbers used in the steps are only used to mark the steps for ease of description, and are not used to limit the order and implementation methods.

[0048] Secondly, the words "include", "including", "have", "contain" and the like used in this article are all open terms, which mean including but not limited to.

[0049] Figure 1 FIG. 2 is a side view schematic diagram of a three-dimensional heat dissipation device according to an embodiment of the present invention. Figure 2 This is a three-dimensional schematic diagram, and some of the heat sink fins are hidden to reveal the heat pipes. In addition, Figure 3 It is a three-dimensional schematic diagram of a temperature averaging plate of a three-dimensional heat dissipation device and a heat pipe connected to the temperature averaging plate by a fluid.

[0050] See also Figures 1 to 3 As shown in the figure, the three-dimensional heat dissipation device 100 includes a temperature evaporating plate 150 and a first heat pipe 110. The temperature evaporating plate 150 includes a first cover plate 156, a side wall 154 and a second cover plate 152. The side wall 154 surrounds the second cover plate 152 and the first cover plate 156 to form a hollow chamber 158. In some embodiments, the side wall 154 preferably vertically surrounds the first cover plate 156 and the second cover plate 152.

[0051] In addition, the first heat pipe 110 is connected to the side wall 154 of the temperature vapor chamber 150 and extends outward, and the first heat pipe 110 is in fluid communication with the hollow chamber 158 .

[0052] In some embodiments, the first heat pipe 110 is connected to the side wall 154 of the temperature vapor chamber 150 and extends horizontally outward.

[0053] In some embodiments, the first cover plate 156 is a heat-absorbing metal plate, such as a copper metal plate, an aluminum metal plate, a stainless steel plate or other metal plates, to directly or indirectly contact a heat source 101. The second cover plate 152 is preferably a heat-dissipating metal plate, such as a copper metal plate, an aluminum metal plate, a stainless steel plate or other metal plates, to cool the heat dissipation fluid in the temperature homogenizing plate 150, but the present invention is not limited thereto.

[0054] In addition, it is worth noting that the heat dissipation fluid in the temperature vapor chamber 150 can be guided to the outside of the temperature vapor chamber 150 through the first heat pipe 110 from the hollow chamber 158 of the temperature vapor chamber 150, so as to effectively improve the cooling efficiency and heat dissipation capacity of the three-dimensional heat dissipation device 100.

[0055] In some embodiments, the three-dimensional heat dissipation device 100 further includes a second heat pipe 120 connected to the second cover plate 152 of the temperature vapor chamber 150 , and the second heat pipe 120 and the hollow chamber 158 are also in fluid communication.

[0056] In some embodiments, the second heat pipe 120 includes a connecting portion 122 and a heat dissipation portion 124. The connecting portion 122 is directly connected to the second cover plate 152 of the temperature vaporizer 150, and the heat dissipation portion 124 is connected to the connecting portion 122 and extends outward from the temperature vaporizer 150, for example, horizontally.

[0057] In some embodiments, the heat dissipation portion 124 is preferably parallel to the first heat pipe 110 .

[0058] In some embodiments, the three-dimensional heat dissipation device 100 further includes a third heat pipe 130 connected to the second cover plate 152 of the temperature vapor chamber 150 .

[0059] In some embodiments, the third heat pipe 130 includes a heat absorbing portion 132, a connecting portion 134, and a heat dissipating portion 136. The heat absorbing portion 132 is connected to the second cover plate 152 of the temperature homogenizing plate 150, the connecting portion 134 is connected to the heat absorbing portion 132 of the third heat pipe 130, and the heat dissipating portion 136 is connected to the connecting portion 134 of the third heat pipe 130, so that the third heat pipe 130 forms a U-shaped heat pipe.

[0060] In some embodiments, the opening of the U-shaped heat pipe preferably faces the first heat pipe 110, that is, toward Figure 1 on the right side.

[0061] In some embodiments, the three-dimensional heat dissipation device 100 further includes a fourth heat pipe 140 , which is also connected to the second cover plate 152 of the temperature vapor chamber 150 .

[0062] In some embodiments, the fourth heat pipe 140 includes a heat absorbing portion 142, a connecting portion 144, and a heat dissipating portion 146. The heat absorbing portion 142 is connected to the second cover plate 152 of the temperature homogenizing plate 150, the connecting portion 144 is connected to the heat absorbing portion 142 of the fourth heat pipe 140, and the heat dissipating portion 146 is connected to the connecting portion 144 of the fourth heat pipe 140, so that the fourth heat pipe 140 forms a U-shaped heat pipe, and the opening of the U-shaped heat pipe formed by the fourth heat pipe 140 faces away from the first heat pipe 110. In other words, the third heat pipe 130 and the fourth heat pipe 140 are in opposite directions, that is, the opening of the U-shaped heat pipe formed by the fourth heat pipe 140 preferably faces away from the first heat pipe 110, that is, toward Figure 1 on the left side.

[0063] In some embodiments, the fourth heat pipe 140 is disposed between the two third heat pipes 130 to improve the cooling efficiency and heat dissipation capability of the three-dimensional heat dissipation device 100 .

[0064] In some embodiments, the three-dimensional heat dissipation device 100 further includes a first heat dissipation fin module 160, which is disposed on the second cover plate 152 of the temperature equilibrium plate 150, and the connecting portion 122 of the second heat pipe 120, the heat absorption portion 132 of the third heat pipe 130 and the heat dissipation portion 136 of the third heat pipe 130, the heat absorption portion 142 of the fourth heat pipe 140 and the heat dissipation portion 146 of the fourth heat pipe 140 are disposed in the first heat dissipation fin module 160.

[0065] In some embodiments, the three-dimensional heat dissipation device 100 further includes a second heat dissipation fin module 170, which is preferably arranged in parallel with the first heat dissipation fin module 160, and the second heat dissipation fin module 170 is arranged outside the temperature evaporating plate 150. The heat dissipation portion 124 of the first heat pipe 110 and the second heat pipe 120 is arranged in the second heat dissipation fin module 170. In other words, the first heat pipe 110 extends outward from the side wall 154 of the temperature evaporating plate 150 and is arranged in the second heat dissipation fin module 170, and the second heat pipe 120 extends vertically outward from the second cover plate 152 of the temperature evaporating plate 150, and then forms a bend angle of about 90 degrees, so that the heat dissipation portion 124 of the second heat pipe 120 is also arranged in the second heat dissipation fin module 170, and the heat dissipation portion 124 of the second heat pipe 120 is preferably parallel to the first heat pipe 110, so as to improve the cooling efficiency and heat dissipation capacity of the three-dimensional heat dissipation device 100.

[0066] Therefore, the first heat pipe 110 and the second heat pipe 120 of the three-dimensional heat dissipation device 100 of the present case are fluidly connected to the temperature vapor chamber 150. In addition, the third heat pipe 130 and the fourth heat pipe 140 of the three-dimensional heat dissipation device 100 of the present case are connected to the outer surface of the temperature vapor chamber 150 to improve the cooling efficiency and heat dissipation capacity of the three-dimensional heat dissipation device 100.

[0067] In summary, the three-dimensional heat dissipation device disclosed in the present invention can utilize a temperature evaporating plate, a heat pipe connected to the temperature evaporating plate by fluid, and a heat pipe connected to the outer surface of the temperature evaporating plate to effectively improve the heat dissipation efficiency and heat dissipation capacity of the three-dimensional heat dissipation device, reduce the operating temperature of the computing chip, and thus improve the overall working efficiency of the electronic device. In addition, the heat pipe connected to the temperature evaporating plate by fluid is preferably vertically connected to the surface of the temperature evaporating plate and the side wall of the temperature evaporating plate, and extends outward from the temperature evaporating plate.

[0068] Although the present disclosure has been disclosed in the above embodiments, it is not intended to limit the present disclosure. Anyone with ordinary knowledge in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the appended claims.

Claims

1. A three-dimensional heat dissipation device, characterized in that: Include: A temperature averaging plate, wherein the temperature averaging plate comprises a first cover plate, a side wall and a second cover plate, wherein the side wall surrounds the first cover plate and the second cover plate to form a hollow chamber; and A first heat pipe is connected to the side wall of the temperature homogenizing plate and extends outward, and the first heat pipe is in fluid communication with the hollow chamber.

2. The three-dimensional heat dissipation device according to claim 1, characterized in that: Also includes: A second heat pipe is connected to the second cover plate of the temperature homogenizing plate, and the second heat pipe is in fluid communication with the hollow chamber.

3. The three-dimensional heat dissipation device according to claim 2, characterized in that: The second heat pipe comprises: A connecting portion connected to the second cover plate of the temperature homogenizing plate; and A heat dissipation portion is connected to the connection portion, and the heat dissipation portion is parallel to the first heat pipe.

4. The three-dimensional heat dissipation device according to claim 2, characterized in that: The side wall is perpendicular to the first cover plate, and the first cover plate of the temperature homogenizing plate is used to contact a heat source.

5. The three-dimensional heat dissipation device according to claim 4, characterized in that: It further comprises a third heat pipe connected to the second cover plate of the temperature homogenizing plate.

6. The three-dimensional heat dissipation device according to claim 5, characterized in that: The third heat pipe comprises: A heat absorbing portion connected to the second cover plate of the temperature homogenizing plate; a connecting portion connected to the heat absorbing portion of the third heat pipe; and A heat dissipation portion is connected to the connection portion of the third heat pipe so that the third heat pipe forms a U-shaped heat pipe, and the opening of the U-shaped heat pipe faces the first heat pipe.

7. The three-dimensional heat dissipation device according to claim 6, characterized in that: It further includes a fourth heat pipe connected to the second cover plate of the temperature homogenizing plate.

8. The three-dimensional heat dissipation device according to claim 7, characterized in that: The fourth heat pipe comprises: A heat absorbing portion connected to the second cover plate of the temperature homogenizing plate; a connecting portion connected to the heat absorbing portion of the fourth heat pipe; and A heat dissipation portion is connected to the connection portion of the fourth heat pipe so that the fourth heat pipe forms a U-shaped heat pipe, and the opening of the U-shaped heat pipe formed by the fourth heat pipe faces away from the first heat pipe.

9. The three-dimensional heat dissipation device according to claim 8, characterized in that: It further includes a first heat dissipation fin module, which is arranged on the second cover plate of the temperature equilibrium plate, and the connecting part of the second heat pipe, the heat absorption part of the third heat pipe and the heat dissipation part of the third heat pipe, the heat absorption part of the fourth heat pipe and the heat dissipation part of the fourth heat pipe are arranged in the first heat dissipation fin module.

10. The three-dimensional heat dissipation device according to claim 9, characterized in that: It further comprises a second heat dissipation fin module which is arranged in parallel with the first heat dissipation fin module and the second heat dissipation fin module is arranged outside the temperature homogenizing plate, wherein the first heat pipe and the heat dissipation part of the second heat pipe are arranged in the second heat dissipation fin module.

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