Automatic assembling equipment for ceramic capacitor

Abstract

Automatic assembling equipment for a ceramic capacitor comprises a rack, and a bracket preparation device, a conveying mechanism, an assembling jig, a first feeding device, a dispensing device, a second feeding device and a turnover device which are sequentially arranged on the rack. By limiting the structure of the automatic assembling equipment, automatic assembling of the ceramic capacitor can be realized; the labor cost is reduced, the production efficiency is multiplied, and the requirement of batch production of ceramic capacitors is met.

Description

Technical Field

[0001] The utility model belongs to the field of ceramic capacitor preparation, and in particular relates to automatic assembly equipment for ceramic capacitors. Background Art

[0002] The industrial capacitor market mainly includes: system communication equipment, industrial control equipment, medical electronic equipment, automotive electronics, precision instruments and meters, oil exploration equipment, etc. Industrial equipment is developing towards mechatronics and intelligence, and the proportion of information technology in electronic control, data analysis, and interface display is increasing, which will provide a relatively broad market prospect for high-reliability MLCC products for industrial use.

[0003] With the rapid and continuous development of science and technology, the demand for small-size, large-capacity, and high-power capacitors in fields such as power supply, industry, automobile, military industry, and aerospace is increasing. However, the design and equipment of traditional single-chip ceramic capacitors have reached a bottleneck in order to achieve large capacity. It is difficult to achieve a technological breakthrough in the short term and cannot meet the current market demand for large capacity. Therefore, it is necessary to assemble multiple ceramic capacitors in parallel to achieve the demand for large-capacity capacitors. However, there are many disadvantages in the manual assembly method: first, the positioning accuracy is low, and the assembled products often appear skewed; second, the consistency of the products is poor. Different employees have different technical levels and techniques, so it is difficult to maintain the consistency of the products; third, the efficiency is low and the labor cost is high. The market demand for large-capacity ceramic capacitors is increasing exponentially, and the efficiency of manual assembly is low. For enterprises, more manpower must be invested, which will inevitably lead to an increase in labor costs; further improvement is needed. Utility Model Content

[0004] The utility model aims to overcome the shortcomings of the prior art and provide an automatic assembly device for ceramic capacitors.

[0005] The utility model adopts the following technical solutions:

[0006] A ceramic capacitor automatic assembly device, the ceramic capacitor comprises two brackets arranged opposite to each other, a plurality of ceramic chips stacked between the two brackets and solder paste arranged between the ends of the plurality of ceramic chips and the opposite brackets, comprising a frame and a bracket preparation device, a conveying mechanism, an assembly jig, a first feeding device, a dispensing device, a second feeding device and a flipping device sequentially arranged on the frame,

[0007] A stent preparation device is used to perform stent structure shaping and cutting on the strip frame to obtain a plurality of stents;

[0008] The conveying mechanism is arranged between the first feeding device and the turning device, and conveys the assembly jig to pass through the first feeding device, the dispensing device, the second feeding device and the turning device in sequence;

[0009] An assembly jig is used to assemble two brackets and a plurality of ceramic chips, comprising an upper mold and a lower mold that are opposite to each other and a positioning mechanism disposed between the upper mold and the lower mold, wherein an upper mounting groove for mounting the bracket is formed on the opposite surface of the upper mold and the lower mold, and a lower mounting groove for mounting another bracket is formed on the opposite surface of the lower mold and the upper mold;

[0010] A first loading device, for receiving a plurality of brackets output from the frame cutting mechanism, comprising a first material box disposed on the frame for storing the brackets and a first picker disposed on the frame for picking up the brackets from the first material box to the upper mounting groove or the lower mounting groove;

[0011] A glue dispensing device is used to apply solder paste to the inner surface of the bracket in the upper mounting groove or the lower mounting groove;

[0012] A second loading device includes a second material box disposed on the frame for storing ceramic chips and a second picker disposed on the frame on the support for picking up a plurality of ceramic chips from the second material box and stacking them in the lower mounting groove;

[0013] The flipping device is arranged on the frame, clamps the upper mold and flips it 180 degrees, so that the upper mold and the lower mold are molded together, and the assembly of the two brackets and multiple ceramic chips is completed.

[0014] Furthermore, the positioning mechanism includes two positioning pins arranged relatively on both sides of the lower installation groove, two positioning holes arranged on the upper mold for the two positioning pins to be embedded, and two positioning magnets respectively arranged in the two positioning holes and cooperating with the relative positioning pins.

[0015] Furthermore, the upper mold is provided with an upper adsorption magnet opposite to the upper mounting groove, and the lower mold is provided with a lower adsorption magnet opposite to the lower mounting groove.

[0016] Furthermore, the flipping device includes a flipping frame arranged on the frame, a moving block arranged on the flipping frame and movable up and down, a rotating disk arranged on the moving block and rotatable, a clamping mechanism arranged on the rotating disk for clamping the upper mold, a rotating mechanism arranged on the flipping frame and connected to and driving the rotating disk to rotate, and a moving mechanism arranged on the flipping frame and connected to and driving the moving block to move up and down.

[0017] Furthermore, the clamping mechanism includes a fixed block arranged on the rotating disk, a fixed clamping claw arranged on the fixed block, a movable clamping claw arranged on the fixed block and movable back and forth relative to the fixed clamping claw, and a driving member arranged on the fixed block and connected to drive the movable clamping claw to move.

[0018] Furthermore, the moving mechanism includes a rotating screw rotatably arranged on the flip frame, a moving nut seat arranged on the rotating screw, a moving motor arranged on the flip frame and connected to and driving the rotating screw to rotate, and two connecting rods relatively arranged on both sides of the moving nut seat and connected to the moving blocks respectively, and the flip frame is provided with a clearance hole for the connecting rod to pass through.

[0019] Furthermore, the support preparation device includes a frame forming mechanism and a frame cutting mechanism which are arranged in sequence. The frame forming mechanism processes the entire frame to form a support structure; the frame cutting mechanism cuts the incoming frame with the support structure formed thereon.

[0020] Furthermore, the dispensing device includes a mounting block arranged on a frame, two dispensing cylinders arranged on the mounting block at intervals, two vacuum dispensing devices arranged on the frame and connected to the two dispensing cylinders respectively, two air pipes respectively connected between the dispensing cylinders and the relative vacuum dispensing devices, and a lifting drive mechanism arranged on the frame and connected to drive the mounting block to move up and down.

[0021] Furthermore, it also includes a CCD appearance detector arranged between the dispensing device and the second feeding device.

[0022] Furthermore, it also includes a recovery tray arranged at the rear end of the conveying mechanism.

[0023] From the above description of the utility model, it can be seen that compared with the prior art, the beneficial effect of the utility model is: the present application can realize the automatic assembly of ceramic capacitors by limiting the structure of the automatic assembly equipment, which not only reduces the labor cost, but also improves the production efficiency exponentially, meeting the needs of mass production of ceramic capacitors. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of the utility model;

[0025] Figure 2 The structure diagram of the flip device Figure 1 ;

[0026] Figure 3 The structure diagram of the flip device Figure 1 ;

[0027] Figure 4 It is a structural diagram of the assembly fixture;

[0028] Figure 5 It is a schematic diagram of the structure of a ceramic capacitor;

[0029] In the figure, 1-frame, 2-bracket preparation device, 3-conveying mechanism, 4-assembly fixture, 5-first feeding device, 6-glue dispensing device, 7-CCD appearance detector, 8-second feeding device, 9-turning device, 0-recovery tray, 10-ceramic capacitor, 21-frame forming mechanism, 22-frame cutting mechanism, 41-upper mold, 411-upper mounting groove, 42-lower mold, 421-lower mounting groove, 43-positioning mechanism, 431-positioning pin, 432-positioning hole, 433-positioning magnet, 51-first pickup, 61-installation Mounting block, 62-dispensing cylinder, 63-vacuum dispenser, 64-air pipe, 65-lifting drive mechanism, 81-second picker, 91-flip frame, 911-make way hole, 92-moving block, 93-rotating disk, 94-clamping mechanism, 941-fixed block, 942-fixed clamping jaw, 943-moving clamping jaw, 944-driving member, 95-rotating mechanism, 96-moving mechanism, 961-rotating screw, 962-nut seat, 963-moving motor, 964-connecting rod, 101-bracket, 102-ceramic chip, 103-solder paste. DETAILED DESCRIPTION

[0030] The present invention is further described below through specific implementation methods.

[0031] Reference Figures 1 to 4 As shown, a ceramic capacitor automatic assembly device includes a frame 1 and a bracket preparation device 2, a conveying mechanism 3, an assembly fixture 4, a first feeding device 5, a dispensing device 6, a CCD appearance detector 7, a second feeding device 8, a turning device 9, a recovery tray 0 and a control mechanism, wherein, with reference to Figure 5 As shown, the ceramic capacitor 10 includes two brackets 101 arranged opposite to each other, a plurality of ceramic chips 102 stacked between the two brackets 101 , and solder paste 103 arranged between ends of the plurality of ceramic chips 102 and the opposite brackets 101 .

[0032] The bracket preparation device 2 performs bracket structure forming and cutting on the strip frame to obtain a plurality of brackets 101; specifically, the bracket preparation device 2 includes a frame forming mechanism 21 and a frame cutting mechanism 22 which are arranged in sequence, the frame forming mechanism 21 processes the entire frame to form a bracket structure; the frame cutting mechanism 22 cuts the incoming frame with the bracket structure formed thereon to obtain the required bracket; further, the frame forming mechanism 21 and the frame cutting mechanism 22 are commonly used equipment in the field of ceramic capacitor bracket preparation, and their specific structure and working principle will not be further described here.

[0033] The conveying mechanism 3 is arranged between the first feeding device 5 and the turning device 9, and the conveying assembly jig 4 passes through the first feeding device 5, the dispensing device 6, the CCD appearance detector 7, the second feeding device 8 and the turning device 9 in sequence; specifically, the conveying mechanism 3 is a commonly used device in the field of article transportation, and its specific structure will not be further described here.

[0034] The assembly jig 4 assembles two brackets 101 and a plurality of ceramic chips 102, and includes an upper mold 41 and a lower mold 42 that are opposite to each other, and a positioning mechanism 43 disposed between the upper mold 41 and the lower mold 42. Specifically, an upper mounting groove 411 for mounting the bracket 101 is formed on the opposite surface of the upper mold 41 and the lower mold 42; a lower mounting groove 421 for mounting another bracket is formed on the opposite surface of the lower mold 42 and the upper mold 41; the positioning mechanism 43 includes two positioning pins 431 disposed on both sides of the lower mounting groove 421, and a positioning pin 431 disposed on the upper mold 41 for two positioning pins. The two positioning holes 432 in which the positioning pin 431 is embedded and the two positioning magnets 433 respectively arranged in the two positioning holes 432 and cooperating with the relative positioning pin 431, through the adsorption of the positioning magnets 433 on the positioning pin 431, ensure the stability of the upper mold 41 and the lower mold 42 when the mold is closed; further, the upper mold 41 is provided with an upper adsorption magnet opposite to the upper mounting groove 411, and the lower mold 42 is provided with a lower adsorption magnet opposite to the lower mounting groove 421, and the upper adsorption magnet and the lower adsorption magnet are provided to adsorb and fix the bracket 101 in the upper mold 41 and the lower mold 42.

[0035] The first loading device 5 is used to receive multiple brackets 101 output from the frame cutting mechanism 22, including a first material box arranged on the frame 1 for storing the brackets 101 and a first picker 51 arranged on the frame 1 for picking up the brackets 101 from the first material box to the upper mounting groove 411 or the lower mounting groove 421; specifically, the first picker 51 is a common device in the field of object picking and transfer, and its specific structure and working principle will not be further described here.

[0036] The glue dispensing device 6 is used to apply solder paste 103 to the inner surface of the bracket 101 in the upper mounting groove 411 or the lower mounting groove 421, and includes a mounting block 61 arranged on the frame 1, two glue dispensing cylinders 62 arranged on the mounting block 61 at intervals, two vacuum glue dispensing devices 63 arranged on the frame 1 and connected to the two glue dispensing cylinders 62 respectively, two air pipes 64 respectively connected between the glue dispensing cylinders 62 and the relative vacuum glue dispensing devices 63, and a lifting drive mechanism 65 arranged on the frame 1 and connected to and driving the mounting block 61 to move up and down; when working, the upper mold 41 and the lower mold 42 are transported to the corresponding workstations through the conveying mechanism 6, and the vacuum glue dispensing device 63 controls the corresponding glue dispensing cylinder 62 to apply solder paste 103 on the bracket 101 in the upper mold 41 or the lower mold 42 to complete the paste coating work of the bracket 101.

[0037] The CCD appearance detector 7 performs appearance identification on the solder paste 103 dotted on the bracket 101, and identifies and removes solder paste with poor appearance by comparing with the internal library, such as discontinuous and uneven solder paste dots. When the upper mold 41 and the lower mold 42 are transported to the workstation corresponding to the CCD appearance detector 7 through the conveying mechanism 3, the CCD appearance detector 7 has two cameras, which simultaneously photograph and identify the bracket 101 in the upper mold 41 and the lower mold 42 to improve production efficiency. Specifically, the CCD appearance detector 7 is a commonly used device in the field of ceramic capacitor preparation, and its specific structure and working principle will not be further described here.

[0038] The second loading device 8 includes a second material box arranged on the frame 1 for storing ceramic chips 102 and a second picker 81 arranged on the frame 1 on the bracket 101 for picking up multiple ceramic chips 102 from the second material box and stacking them in the lower mounting groove 421; specifically, the second picker 81 is a common device in the field of object picking and transfer, and its specific structure and working principle will not be further described here.

[0039] The flipping device 9 is arranged on the frame 1, clamps the upper mold 41 and flips it 180°, so that the upper mold 41 and the lower mold 42 are molded together, and the assembly of the two brackets 101 and the multiple ceramic chips 102 is completed. Specifically, the flipping device 9 includes a flipping frame 91 arranged on the frame 1, a moving block 92 that can be moved up and down and arranged on the flipping frame 91, a rotating disk 93 that can be rotatably arranged on the moving block 92, a clamping mechanism 94 arranged on the rotating disk 93 for clamping the upper mold 41, a rotating mechanism 95 arranged on the flipping frame 91 and connected to drive the rotating disk 93 to rotate, and a moving mechanism 96 arranged on the flipping frame 91 and connected to drive the moving block 92 to move up and down; specifically, the rotating mechanism 95 is a rotating motor arranged on the flipping frame 91 and connected to the rotating disk 93.

[0040] The clamping mechanism 94 includes a fixed block 941 arranged on the rotating disk 93, a fixed clamping jaw 942 arranged on the fixed block 941, a mobile clamping jaw 943 arranged on the fixed block 941 and movable back and forth relative to the fixed clamping jaw 942, and a driving member 944 arranged on the fixed block 941 and connected to and driving the mobile clamping jaw 943 to move; specifically, the driving member 944 is a driving cylinder, and when working, the driving member 944 drives the mobile clamping jaw 943 to approach the fixed clamping jaw 942 to clamp the upper mold 41; when the upper mold 41 completes the mold closing with the lower mold 42, the driving member 944 drives the mobile clamping jaw 943 away from the fixed clamping jaw 942 to release the upper mold 41.

[0041] The moving mechanism 96 includes a rotating screw rod 961 rotatably arranged on the flip frame 91, a moving nut seat 962 arranged on the rotating screw rod 961, a moving motor 963 arranged on the flip frame 91 and connected to and driving the rotating screw rod 961 to rotate, and two connecting rods 964 relatively arranged on both sides of the moving nut seat 962 and respectively connected to the moving block 92. Correspondingly, the flip frame 91 is provided with a clearance hole 911 for the connecting rod 964 to pass through, and the connecting rod 964 passes through the relative clearance hole 911 to be connected to the moving block 92.

[0042] The recovery tray 0 is arranged at the rear end of the conveying mechanism 3 to recover and store the assembled finished products. When the recovery tray is full, the assembled finished products are taken out and soldered by reflow soldering to obtain ceramic capacitors.

[0043] The control mechanism is arranged on the frame 1, and is respectively connected to and controls the operation of the bracket preparation device 2, the conveying mechanism 3, the assembly fixture 4, the first feeding device 5, the dispensing device 6, the CCD appearance detector 7, the second feeding device 8, and the flipping device 9. Specifically, the control mechanism includes a power distribution control cabinet and a display screen arranged on the frame 1 and connected to the power distribution control cabinet.

[0044] The present application can realize the automated assembly of ceramic capacitors by limiting the structure of the automatic assembly equipment, which not only reduces the labor cost, but also increases the production efficiency exponentially, thus meeting the needs of mass production of ceramic capacitors.

[0045] The above description is only a preferred embodiment of the present invention, and therefore cannot be used to limit the scope of implementation of the present invention. That is, equivalent changes and modifications made according to the scope of application of the present invention and the contents of the specification should still fall within the scope covered by the present invention.

Claims

1. An automatic assembly device for ceramic capacitors, the ceramic capacitors comprising two brackets arranged opposite to each other, a plurality of ceramic chips stacked between the two brackets, and solder paste arranged between the ends of the plurality of ceramic chips and the opposite brackets, characterized in that: It includes a frame and a bracket preparation device, a conveying mechanism, an assembly jig, a first feeding device, a dispensing device, a second feeding device and a turning device which are sequentially arranged on the frame. A stent preparation device is used to perform stent structure shaping and cutting on the strip frame to obtain a plurality of stents; The conveying mechanism is arranged between the first feeding device and the turning device, and conveys the assembly jig to pass through the first feeding device, the dispensing device, the second feeding device and the turning device in sequence; An assembly jig is used to assemble two brackets and a plurality of ceramic chips, comprising an upper mold and a lower mold that are opposite to each other and a positioning mechanism disposed between the upper mold and the lower mold, wherein an upper mounting groove for mounting the bracket is formed on the opposite surface of the upper mold and the lower mold, and a lower mounting groove for mounting another bracket is formed on the opposite surface of the lower mold and the upper mold; A first loading device, for receiving a plurality of brackets output from the frame cutting mechanism, comprising a first material box disposed on the frame for storing the brackets and a first picker disposed on the frame for picking up the brackets from the first material box to the upper mounting groove or the lower mounting groove; A glue dispensing device is used to apply solder paste to the inner surface of the bracket in the upper mounting groove or the lower mounting groove; A second loading device includes a second material box disposed on the frame for storing ceramic chips and a second picker disposed on the frame on the support for picking up a plurality of ceramic chips from the second material box and stacking them in the lower mounting groove; The flipping device is arranged on the frame, clamps the upper mold and flips it 180 degrees, so that the upper mold and the lower mold are molded together, and the assembly of the two brackets and multiple ceramic chips is completed.

2. The automatic assembly equipment for ceramic capacitors according to claim 1, characterized in that: The positioning mechanism comprises two positioning pins arranged relatively on both sides of the lower installation groove, two positioning holes arranged on the upper mold for the two positioning pins to be embedded, and two positioning magnets respectively arranged in the two positioning holes and matched with the relative positioning pins.

3. The automatic assembly equipment for ceramic capacitors according to claim 1, characterized in that: An upper adsorption magnet opposite to the upper mounting groove is arranged in the upper mold, and a lower adsorption magnet opposite to the lower mounting groove is arranged in the lower mold.

4. The automatic assembly equipment for ceramic capacitors according to claim 1, characterized in that: The turning device includes a turning frame arranged on the frame, a moving block arranged on the turning frame and movable up and down, a rotating disk arranged on the moving block and rotatable, a clamping mechanism arranged on the rotating disk for clamping the upper mold, a rotating mechanism arranged on the turning frame and connected to drive the rotating disk to rotate, and a moving mechanism arranged on the turning frame and connected to drive the moving block to move up and down.

5. The automatic assembly equipment for ceramic capacitors according to claim 4, characterized in that: The clamping mechanism comprises a fixed block arranged on the rotating disk, a fixed clamping claw arranged on the fixed block, a movable clamping claw arranged on the fixed block and movable back and forth relative to the fixed clamping claw, and a driving member arranged on the fixed block and connected to drive the movable clamping claw to move.

6. The automatic assembly equipment for ceramic capacitors according to claim 4, characterized in that: The moving mechanism includes a rotating screw rotatably arranged on the flip frame, a moving nut seat arranged on the rotating screw, a moving motor arranged on the flip frame and connected to and driving the rotating screw to rotate, and two connecting rods relatively arranged on both sides of the moving nut seat and connected to the moving blocks respectively. The flip frame is provided with a clearance hole for the connecting rod to pass through.

7. The automatic assembly equipment for ceramic capacitors according to claim 1, characterized in that: The support preparation device comprises a frame forming mechanism and a frame cutting mechanism which are arranged in sequence. The frame forming mechanism processes the entire frame to form a support structure; the frame cutting mechanism cuts the incoming frame with the support structure formed thereon.

8. The automatic assembly equipment for ceramic capacitors according to claim 1, characterized in that: The glue dispensing device includes a mounting block arranged on a frame, two glue dispensing cylinders arranged on the mounting block at intervals, two vacuum glue dispensing devices arranged on the frame and connected to the two glue dispensing cylinders respectively, two air pipes respectively connected between the glue dispensing cylinders and the relative vacuum glue dispensing devices, and a lifting drive mechanism arranged on the frame and connected to drive the mounting block to move up and down.

9. The automatic ceramic capacitor assembly equipment according to claim 1, characterized in that: It also includes a CCD appearance detector arranged between the dispensing device and the second feeding device.

10. The automatic assembly equipment for ceramic capacitors according to claim 1, characterized in that: It also includes a recovery tray arranged at the rear end of the conveying mechanism.

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