A test board structure for semiconductor packaging test
By designing the clamping structure and disassembly structure on the semiconductor package test board, the complex problems of chip falling off and disassembly during the test process are solved, and the chip is stable clamped and easy to disassemble.
Patent Information
- Application Number
- CN202420789396.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-17
- Publication Date
- 2025-04-01
- Estimated Expiration
- 2034-04-17
AI Technical Summary
In the existing semiconductor packaging and testing technology, the chip is prone to loosening and falling off the snap during the test, and the disassembly process is complicated, making it difficult to remove multiple snaps at the same time.
A test board structure for semiconductor packaging testing is designed, adopting a clamping structure and a disassembly structure. The clamping structure includes threaded holes, fixing blocks, telescopic springs, connecting pins and connecting plates. The snaps are securely clamped on the chip through these components; the disassembly structure realizes the synchronous disassembly of the snaps by reserved cavity, contact blocks and contact plates.
It effectively avoids the problem of chip falling off during the test process and simplifies the chip disassembly process, so that multiple snaps can be removed at the same time, improving testing efficiency and safety.
Smart Images
Figure CN222705447U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor packaging and testing, in particular to a test board structure for semiconductor packaging and testing. Background Art
[0002] The semiconductor production process consists of wafer manufacturing, wafer testing, chip packaging and post-packaging testing. Semiconductor packaging testing is an important part of the semiconductor production process. Semiconductor packaging testing is to test the chip through a test board;
[0003] There are certain drawbacks in the semiconductor packaging test in the prior art. During the semiconductor packaging test, the chip is placed on the surface of the chip test board for testing. The semiconductor chip needs to be clamped by a buckle. After the chip is loosened, it is easy for the chip to fall off from the buckle. In particular, the buckle cannot fit tightly with the edge of the chip. The buckle needs to be further clamped by a clamping structure. In addition, after the chip is tested, the buckle needs to be removed from the edge of the chip. It is troublesome to remove each buckle from the edge of the chip at the same time. Utility Model Content
[0004] The purpose of the utility model is to provide a test board structure for semiconductor packaging testing to solve the problems raised in the above background technology.
[0005] The purpose of the utility model can be achieved through the following technical solutions:
[0006] A test board structure for semiconductor packaging testing includes a chip test board body, two fixing grooves are provided at the two side edges of the chip test board body, and a snap is connected to the inside of each fixing groove, a clamping structure is provided at the two side edges of the chip test board body and located inside the fixing groove, the clamping structure includes a threaded hole, the threaded hole is provided on both sides of the chip test board body, a fixing block is connected to the internal thread of the threaded hole, an accommodating cavity is provided inside the fixing block, a telescopic spring is placed inside the accommodating cavity of the fixing block, a connecting pin is connected to the end face of the fixing block, and a connecting plate is connected in the middle of the connecting pin and located at the end face of the fixing block, and the connecting plate is located inside the fixing groove.
[0007] As a preferred technical solution of the utility model, the outer cylindrical surface of the fixing block is provided with threads, and the fixing block is connected to the threaded hole through the threads, and the end face of the fixing block is flush with the inner wall of the fixing groove.
[0008] As a preferred technical solution of the utility model, the bottom end of the connecting plate is rotatably connected to the connecting pin, and one surface of the connecting plate is connected to the telescopic spring, and the other surface of the connecting plate is in contact with the buckle.
[0009] As a preferred technical solution of the utility model, a disassembly structure is provided on the lower surface of the chip test board body near the edges on both sides, and the disassembly structure includes a reserved cavity, which is opened inside each fixed groove, and a contact block is provided inside each reserved cavity, and a contact plate is connected between the contact blocks on the same side, and the contact blocks are slidably connected to the inside of the reserved cavity, and the buckles move to both sides of the chip test board body.
[0010] As a preferred technical solution of the utility model, the end of the contact block is in contact with the buckle, and both sides of the buckle are slidably connected to the inner wall of the fixing groove.
[0011] Compared with the prior art, the beneficial effects of the utility model are:
[0012] 1. A clamping structure is provided. When the chip is placed on the surface of the chip test board, the chip can be clamped by the clamp, and the connecting plate is pressed against the connecting plate by the telescopic spring so that the connecting plate is connected to the clamp, which can prevent the clamp from falling off the edge of the chip to be tested;
[0013] 2. A disassembly structure is provided. After testing the chip to be tested, the chip is removed. Use both hands to move the contact plate to both sides of the chip test board body, so that each clip can be taken out of the fixed slot at the same time, and the chip clamped between the clips can be easily removed. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] In order to facilitate understanding by those skilled in the art, the present invention is further described below in conjunction with the accompanying drawings.
[0015] Figure 1 This is the main structure diagram of the utility model;
[0016] Figure 2 This is a schematic diagram of the chip testing board main body clamping the chip of the utility model;
[0017] Figure 3 This is a schematic diagram of the clamping structure of the utility model;
[0018] Figure 4 It is a schematic diagram of the disassembly structure of the utility model.
[0019] In the figure: 1. Chip test board body; 2. Buckle; 3. Fixing groove; 4. Clamping structure; 5. Disassembly structure; 41. Threaded hole; 42. Fixing block; 43. Telescopic spring; 44. Connecting pin; 45. Connecting plate; 51. Contact plate; 52. Reserved cavity; 53. Contact block. DETAILED DESCRIPTION
[0020] The technical solution of the utility model will be described clearly and completely in conjunction with the embodiments below. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0021] Embodiment 1:
[0022] See also Figure 1-Figure 4 As shown, a test board structure for semiconductor packaging testing includes a chip test board body 1, the chip to be tested can be placed on the surface of the chip test board body 1, and the chip is brought into contact with the surface contact sheet of the chip test board body 1. Two fixing grooves 3 are provided at the edges of both sides of the chip test board body 1, and each fixing groove 3 is connected with a clip 2 inside. The chip can be clamped by the chip test board body 1 to ensure that the chip is clamped on the surface of the chip test board body 1 by the clip 2. A clamping structure 4 is provided at the edges of both sides of the chip test board body 1 and inside the fixing groove 3, and the clamping structure 4 includes The threaded hole 41 is provided on both sides of the chip test board body 1, and the internal thread of the threaded hole 41 is connected with a fixing block 42, and the fixing block 42 is screwed into the threaded hole 41, and a receiving cavity is provided inside the fixing block 42, and a telescopic spring 43 is placed inside the receiving cavity of the fixing block 42, and the end face of the fixing block 42 is connected with a connecting pin 44, and a connecting plate 45 is connected in the middle of the connecting pin 44 and at the end face of the fixing block 42, and the connecting plate 45 is located inside the fixing groove 3, and the telescopic spring 43 presses against one side of the connecting plate 45, so that the swinging connecting plate 45 contacts the side wall of the buckle 2.
[0023] In this embodiment, the outer cylindrical surface of the fixing block 42 is provided with a thread, and the fixing block 42 is connected to the threaded hole 41 through the thread, and the end face of the fixing block 42 is flush with the inner wall of the fixing groove 3, and the fixing block 42 can be removed from the side wall of the chip test board body 1; the bottom end of the connecting plate 45 is rotatably connected to the connecting pin 44, and one surface of the connecting plate 45 is connected to the telescopic spring 43, and the telescopic spring 43 rotates against the connecting plate 45, and the other surface of the connecting plate 45 is in contact with the buckle 2. When the chip is placed on the surface of the chip test board, the chip can be clamped by the buckle 2, and the connecting plate 45 is connected to the buckle 2 by the telescopic spring 43, which can prevent the buckle 2 from falling off the edge of the chip to be tested.
[0024] In this embodiment, a disassembly structure 5 is provided on the lower surface of the chip test board body 1 near the edges on both sides. When the chip needs to be removed from the surface of the chip test board body 1 after the detection is completed, it is troublesome to remove the buckles 2 from both sides of the chip test board body 1 one by one. The disassembly structure 5 includes a reserved cavity 52, and the reserved cavity 52 is opened inside each fixing groove 3. A contact block 53 is provided inside each reserved cavity 52, and a contact plate 51 is connected between the contact blocks 53 on the same side. The contact blocks 53 are slidably connected to the inside of the reserved cavity 52, and the buckles 2 move to both sides of the chip test board body 1. The contact plates 51 on both sides of the chip test board body 1 and the contact blocks 53 at both ends of the contact plates 51 are held with both hands. The ends of the contact blocks 53 push the buckles 2 to both sides, and each buckle 2 can be removed from the edge of the chip synchronously.
[0025] In this embodiment, the end of the contact block 53 is in contact with the buckle 2, and the two sides of the buckle 2 are slidably connected to the inner wall of the fixing groove 3. After the chip to be tested is tested, the chip is removed, and the contact plate 51 is moved to the two sides of the chip test board body 1 with both hands, so that each buckle 2 can be taken out of the fixing groove 3 at the same time, and the chip clamped between the buckles 2 can be easily removed.
[0026] When the utility model is in use, the chip to be tested is placed on the surface of the chip test board body 1, and the chip is contacted with the contact piece on the surface of the chip test board body 1. The inside of each fixing groove 3 is connected with a buckle 2, and the chip can be clamped by the chip test board body 1 to ensure that the chip is clamped on the surface of the chip test board body 1 by the buckle 2. The internal thread of the threaded hole 41 is connected with a fixing block 42, and the fixing block 42 is screwed into the threaded hole 41. The inside of the fixing block 42 is provided with a accommodating cavity, and the connecting plate 45 is located inside the fixing groove 3. The telescopic spring 43 rotates against the connecting plate 45, and the other surface of the connecting plate 45 contacts the buckle 2. When the chip is placed on the surface of the chip test board, the buckle 2 clamps the chip, and the connecting plate 45 is pressed against the connecting plate 45 by the telescopic spring 43 so that the connecting plate 45 is connected to the buckle 2, which can prevent the buckle 2 from falling off the edge of the chip to be tested. When no test is needed, the fixing block 42 can be removed from the side wall of the chip test board body 1. When the chip needs to be taken out from the surface of the chip test board body 1 after the test is completed, it is troublesome to remove the buckles 2 from both sides of the chip test board body 1 one by one. The buckles 2 move to both sides of the chip test board body 1, hold the contact plates 51 on both sides of the chip test board body 1 with both hands, and the contact blocks 53 at both ends of the contact plates 51. The ends of the contact blocks 53 push the buckles 2 to both sides, and each buckle 2 can be removed from the edge of the chip simultaneously.
[0027] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.
Claims
1. A test board structure for semiconductor packaging testing, comprising a chip test board body (1); characterized in that: Two fixing grooves (3) are provided at the two side edges of the chip test board body (1), and a buckle (2) is connected inside each fixing groove (3). A clamping structure (4) is provided at the two side edges of the chip test board body (1) and located inside the fixing groove (3). The clamping structure (4) comprises a threaded hole (41). The threaded hole (41) is provided on both sides of the chip test board body (1). A fixing block (42) is threadedly connected inside the threaded hole (41). An accommodating cavity is provided inside the fixing block (42). A telescopic spring (43) is placed inside the accommodating cavity of the fixing block (42). A connecting pin (44) is connected to the end face of the fixing block (42). A connecting plate (45) is connected in the middle of the connecting pin (44) and located at the end face of the fixing block (42). The connecting plate (45) is located inside the fixing groove (3).
2. A test board structure for semiconductor packaging testing according to claim 1, characterized in that: The outer cylindrical surface of the fixing block (42) is provided with threads, and the fixing block (42) is connected to the threaded hole (41) via the threads, and the end surface of the fixing block (42) is flush with the inner wall of the fixing groove (3).
3. A test board structure for semiconductor packaging testing according to claim 2, characterized in that: The bottom end of the connecting plate (45) is rotatably connected to the connecting pin (44), one surface of the connecting plate (45) is connected to the telescopic spring (43), and the other surface of the connecting plate (45) is in contact with the buckle (2).
4. A test board structure for semiconductor packaging testing according to claim 1, characterized in that: A disassembly structure (5) is provided on the lower surface of the chip test board body (1) near the edges on both sides. The disassembly structure (5) includes a reserved cavity (52). The reserved cavity (52) is opened inside each fixing groove (3). A contact block (53) is provided inside each reserved cavity (52). A contact plate (51) is connected between the contact blocks (53) on the same side. The contact blocks (53) are slidably connected to the inside of the reserved cavity (52). The buckle (2) moves toward both sides of the chip test board body (1).
5. A test board structure for semiconductor packaging testing according to claim 4, characterized in that: The end of the contact block (53) is in contact with the buckle (2), and both sides of the buckle (2) are slidably connected to the inner wall of the fixing groove (3).