Composite covering film

Abstract

The utility model discloses a composite covering film, comprising a first copper foil layer, a PI film and a second copper foil layer, wherein a layer of PI film is arranged on the upper surface and the lower surface of the first copper foil layer, and the second copper foil layer is arranged above the PI film on the upper surface of the first copper foil layer; the utility model has reasonable structural design and is easy to use, and can make the covering film have a good covering effect, thereby avoiding exposure of circuits on a circuit board and improving the confidentiality of the covering film, and at the same time, the utility model can also make the covering film have good insulation and signal isolation effects.

Description

Technical Field

[0001] The utility model relates to the field of covering films, in particular to a composite covering film. Background Art

[0002] With the development and progress of science and technology, the miniaturization and slimness of electronic devices such as notebooks and mobile phones are becoming increasingly prominent, requiring the integration and thinness of printed circuit substrates contained in electronic devices. Printed circuit substrates can be divided into rigid printed circuit substrates and flexible printed circuit substrates according to their physical properties. In order to protect the circuits of the circuit substrate, a layer of covering film with concealing properties is usually covered on the circuit substrate. The traditional covering film is simply provided with a layer of copper foil and an adhesive layer, so the covering film has poor shielding properties and the traditional covering film does not have insulation properties, so it still needs to be improved. Utility Model Content

[0003] In order to solve the above-mentioned problems, the utility model provides a composite covering film, including a first copper foil layer, a PI film and a second copper foil layer, wherein a layer of PI film is arranged on the upper surface and the lower surface of the first copper foil layer, the second copper foil layer is arranged above the PI film on the upper surface of the first copper foil layer, a layer of protective film is arranged on the upper surface of the second copper foil layer, the upper surface of the first copper foil layer is arranged as a frosted surface, the upper surface and the lower surface of the second copper foil layer are both arranged as textured surfaces and the textures of the upper surface and the lower surface of the second copper foil layer are different, wherein the upper surface of the second copper foil layer is arranged as a cross-shaped texture, and the lower surface of the second copper foil layer is arranged as a corrugated texture.

[0004] Preferably, an adhesive layer is provided below the PI film on the lower surface of the first copper foil layer, and the adhesive layer is a single-component UV light-cured polyurethane gel.

[0005] Preferably, the protective film is a PVC film.

[0006] The beneficial effects of the utility model are: the utility model has reasonable structural design and is easy to use, and can make the covering film have a good covering effect, thereby avoiding exposure of the circuits on the circuit board and improving the confidentiality of the covering film. At the same time, the utility model can also make the covering film have good insulation and signal isolation effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The present invention will be described by way of examples with reference to the accompanying drawings, in which:

[0008] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0009] Figure 2 It is a schematic diagram of the front structure of the copper foil of the utility model;

[0010] Figure 3 It is a schematic diagram of the reverse structure of the copper foil of the utility model;

[0011] In the figure: 1. first copper foil layer; 2. PI film layer; 3. second copper foil layer; 4. adhesive layer; 5. protective film. DETAILED DESCRIPTION

[0012] All features disclosed in this specification, or steps in all methods or processes disclosed, except mutually exclusive features and / or steps, can be combined in any manner.

[0013] Any feature of this specification, unless otherwise specified, can be replaced by other equivalent or alternative features with similar purposes. That is, unless otherwise specified, each feature is only an example of a series of equivalent or similar features.

[0014] like Figure 1 , 2 , 3 shows a composite covering film, comprising a first copper foil layer 1, a PI film 2 and a second copper foil layer 3, wherein a layer of PI film 2 is arranged on the upper surface and the lower surface of the first copper foil layer 1, the second copper foil layer 3 is arranged above the PI film 2 on the upper surface of the first copper foil layer 1, and a layer of protective film 5 is arranged on the upper surface of the second copper foil layer 3, the upper surface of the first copper foil layer 1 is arranged as a frosted surface, the upper surface and the lower surface of the second copper foil layer 3 are both arranged as textured surfaces and the textures of the upper surface and the lower surface of the second copper foil layer 3 are different, wherein the upper surface of the second copper foil layer 3 is arranged as a cross-shaped texture, and the lower surface of the second copper foil layer 3 is arranged as a corrugated texture.

[0015] An adhesive layer 4 is provided below the PI film 2 on the lower surface of the first copper foil layer 1 , and the adhesive layer 4 is a single-component UV light-cured polyurethane gel.

[0016] The protective film 5 is a PVC film.

[0017] During use, the double composite copper foil formed by the first copper foil layer 1 and the second copper foil layer 3 can make the covering film as a whole have good signal isolation properties; the PI film 2 is interspersed between the first copper foil layer 1 and the second copper foil layer 3 and is provided with multiple layers, which can make the covering film as a whole have good insulation properties; the upper surface of the first copper foil layer 1 is set as a frosted surface, which can shield the circuit board under the covering film; the upper surface and the lower surface of the second copper foil layer 3 are both set as textured surfaces and the upper surface and the lower surface of the second copper foil layer 3 have different textures, which can further improve the shielding effect of the covering film on the circuit board.

[0018] The adhesive layer 4 is a single-component UV light-cured polyurethane gel, which can further improve the shielding effect of the cover film on the circuit board.

[0019] The beneficial effects of the utility model are: the utility model has reasonable structural design and is easy to use, and can make the covering film have a good covering effect, thereby avoiding exposure of the circuits on the circuit board and improving the confidentiality of the covering film. At the same time, the utility model can also make the covering film have good insulation and signal isolation effects.

[0020] The present invention is not limited to the above-mentioned specific implementation modes, but extends to any new features or any new combination disclosed in this specification, as well as any new method or process steps or any new combination disclosed.

Claims

1. A composite covering film, characterized in that: The invention comprises a first copper foil layer (1), a PI film (2) and a second copper foil layer (3), wherein a layer of the PI film (2) is arranged on the upper surface and the lower surface of the first copper foil layer (1), the second copper foil layer (3) is arranged above the PI film (2) on the upper surface of the first copper foil layer (1), a layer of a protective film (5) is arranged on the upper surface of the second copper foil layer (3), the upper surface of the first copper foil layer (1) is arranged as a frosted surface, the upper surface and the lower surface of the second copper foil layer (3) are arranged as textured surfaces, and the textures of the upper surface and the lower surface of the second copper foil layer (3) are different, wherein the upper surface of the second copper foil layer (3) is arranged as a cross-shaped texture, and the lower surface of the second copper foil layer (3) is arranged as a corrugated texture.

2. A composite covering film according to claim 1, characterized in that: An adhesive layer (4) is provided below the PI film (2) on the lower surface of the first copper foil layer (1), and the adhesive layer (4) is a single-component UV light-cured polyurethane gel.

3. A composite covering film according to claim 1, characterized in that: The protective film (5) is a PVC film.

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