Circuit board, circuit board device and electronic equipment
By designing the main pad structure of the circuit board, the connection surface between the bottom of the pad and the side of the pad intersects, the problem of weak flow capacity between the circuit board and the electronic components is solved, and lower impedance and better heat dissipation effect are achieved.
Patent Information
- Application Number
- CN202420622144.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-28
- Publication Date
- 2025-04-01
- Estimated Expiration
- 2034-03-28
AI Technical Summary
The current circuit board and electronic components have weak flow capacity, resulting in large impedance and weak flow capacity.
A circuit board is designed, wherein the body pad includes a pad bottom and a first pad side extending from the pad bottom. The extension direction is preset so that the first connecting surface of the pad bottom intersects the second connecting surface of the first pad side, and the angle is greater than 0° and less than 180° to increase the connection area between the electronic component and the body pad.
By increasing the connection area between the electronic component and the body pad, the impedance between the electronic component and the body pad is reduced, the flow capacity between the electronic component and the circuit board is improved, and the heat dissipation of the electronic component is conducive to the electronic component.
Smart Images
Figure CN222706700U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit board design, in particular to a circuit board, a circuit board device and electronic equipment. Background Art
[0002] As the basic unit of the surface mount assembly structure, the pad is used to form the pad pattern of the circuit board. In the related art, the pad is located on the surface of the circuit board body, and the electronic component is soldered to the circuit board body through the pad. Since the electronic component is usually soldered to the upper surface of the pad, the soldering area between the electronic component and the pad is limited, which makes the impedance between the electronic component and the pad large, and further makes the current flow capacity between the circuit board and the electronic component weak. Utility Model Content
[0003] The utility model discloses a circuit board, a circuit board device and electronic equipment, so as to solve the problem of weak current flow capacity between the circuit board and the electronic components in the related technology.
[0004] In order to solve the above technical problems, the utility model is achieved as follows:
[0005] In a first aspect, the present application discloses a circuit board for mounting electronic components. The disclosed circuit board includes a circuit board body and a body solder pad arranged on the circuit board body, the body solder pad includes a solder pad bottom and a first solder pad side extending from a first end of the solder pad bottom along a preset direction, the preset extension direction is such that a first connecting surface of the solder pad bottom and a second connecting surface of the first solder pad side intersect, and an angle between the first connecting surface and the second connecting surface is greater than 0° and less than 180°; when the electronic component is mounted on the body solder pad, the first connecting surface and the second connecting surface are both connected to the pin solder pad of the electronic component.
[0006] Second aspect: The present application also discloses a circuit board device, which includes an electronic component and the circuit board described in the first aspect, wherein the electronic component is connected to the body pad, and the first connection surface and the second connection surface are both connected to the pin pad of the electronic component.
[0007] A third aspect: The present application also discloses an electronic device, and the disclosed electronic device includes the circuit board device described in the second aspect.
[0008] The technical solution adopted by the utility model can achieve the following technical effects:
[0009] The circuit board disclosed in the embodiment of the present application is configured such that a main body solder pad is provided with a structure including a solder pad bottom and a first solder pad side portion extending from a first end portion of the solder pad bottom along a preset direction, and the preset extension direction is such that a first connection surface of the solder pad bottom and a second connection surface of the first solder pad side portion intersect, and an included angle between the first connection surface and the second connection surface is greater than 0° and less than 180°, so that when the electronic component is installed on the circuit board, the pin solder pad of the electronic component is connected to the adjacent first connection surface and the second connection surface of the main body solder pad, thereby increasing the connection area between the electronic component and the main body solder pad, and further reducing the impedance between the electronic component and the main body solder pad, thereby improving the flow capacity between the electronic component and the circuit board, and since the contact area between the electronic component and the main body solder pad is increased, heat dissipation of the electronic component is facilitated. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Figure 1 This is a schematic diagram of the installation of the first circuit board and electronic components disclosed in the embodiment of the utility model;
[0011] Figure 2 A schematic diagram of an electronic component disclosed in an embodiment of the utility model;
[0012] Figure 3 A partial schematic diagram of a circuit board disclosed in an embodiment of the utility model;
[0013] Figure 4 The figure is a schematic diagram of the installation of the second circuit board and electronic components disclosed in the embodiment of the utility model.
[0014] Description of reference numerals:
[0015] 100-circuit board body, 110-protrusion, 120-circuit layer,
[0016] 200 - body pad, 200a - first body pad, 200b - second body pad, 210 - pad bottom, 211 - first connection surface, 220 - first pad side, 221 - second connection surface,
[0017] 300-electronic components, 310-pin pads,
[0018] 400-Solder paste layer. DETAILED DESCRIPTION
[0019] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in combination with the specific embodiments of the utility model and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.
[0020] The technical solutions disclosed in various embodiments of the present utility model are described in detail below in conjunction with the accompanying drawings.
[0021] Please refer to Figures 1 to 4 The present utility model embodiment discloses a circuit board, and the disclosed circuit board is used to install electronic components. It should be noted that the circuit board in the embodiment of the present application refers to an optical circuit board without installing electronic components.
[0022] The circuit board disclosed in the embodiment of the present application includes a circuit board body 100 and a body pad 200 disposed on the circuit board body 100, and the body pad 200 includes a pad bottom 210 and a first pad side 220 extending from the first end of the pad bottom 210 along a preset direction. The preset extension direction makes the first connection surface 211 of the pad bottom 210 and the second connection surface 221 of the first pad side 220 intersect, and the angle between the first connection surface 211 and the second connection surface 221 is greater than 0° and less than 180°. The preset extension direction can be set according to the required angle between the first connection surface 211 and the second connection surface 221. For example, if the angle between the first connection surface 211 and the second connection surface 221 needs to be 90°, then the preset extension direction can be an extension direction perpendicular to the first connection surface 211. Of course, when the angle between the first connection surface 211 and the second connection surface 221 is other angles, the preset extension direction is also different.
[0023] When the electronic component 300 is mounted on the body pad 200 , both the first connection surface 211 and the second connection surface 221 are connected to the pin pad 310 of the electronic component 300 .
[0024] It should be noted that the circuit board body 100 has a circuit layer 120 (ie, a copper-plated area), the body pad 200 is electrically connected to the circuit layer 120 , and the electronic component 300 is electrically connected to the circuit layer 120 via the body pad 200 .
[0025] The circuit board disclosed in the embodiment of the present application is configured such that the main body pad 200 is configured to include a pad bottom 210 and a first pad side portion 220 extending from a first end portion of the pad bottom 210 along a preset direction, and the preset extension direction is such that a first connection surface 211 of the pad bottom 210 and a second connection surface 221 of the first pad side portion 220 intersect, and an included angle between the first connection surface 211 and the second connection surface 221 is greater than 0° and less than 180°, so that when the electronic component 300 is mounted on the circuit board, the pin pad 310 of the electronic component 300 is connected to both the adjacent first connection surface 211 and the second connection surface 221 of the main body pad 200, thereby increasing the connection area between the electronic component 300 and the main body pad 200, and further reducing the impedance between the electronic component 300 and the main body pad 200, thereby improving the flow capacity between the electronic component 300 and the circuit board, and since the contact area between the electronic component 300 and the main body pad 200 is increased, heat dissipation of the electronic component 300 is facilitated.
[0026] In order to optimize the thickness of the circuit board to adapt to the thin and light design of the electronic device, optionally, the circuit board body 100 may be provided with a receiving groove, and the pad bottom 210 may be arranged on the bottom wall of the receiving groove.
[0027] The circuit board disclosed in the embodiment of the present application opens a receiving groove in the circuit board body 100, so that the pad bottom 210 is arranged on the bottom wall of the receiving groove, so that at least a part of the body pad 200 is located in the receiving groove, which is beneficial to reduce the overall thickness of the circuit board, and further when the electronic component 300 is installed on the circuit board, it is beneficial to reduce the overall thickness of the circuit board and the electronic component 300 after installation.
[0028] Furthermore, the first pad side portion 220 is flush with the notch of the receiving groove, or lower than the notch of the receiving groove, thereby preventing the body pad 200 from extending out of the receiving groove, which is beneficial to better reduce the thickness of the circuit board.
[0029] In an optional embodiment, the circuit board may include at least two body pads 200, and the at least two body pads 200 may include a first body pad 200a and a second body pad 200b. The first body pad 200a and the second body pad 200b may be arranged at intervals, and the second connection surface 221 of the first body pad 200a is opposite to the second connection surface 221 of the second body pad 200b. The first body pad 200a and the second body pad 200b can be used to respectively connect to the pin pads 310 located at two opposite ends of the electronic component 300.
[0030] The circuit board disclosed in the embodiment of the present application sets a first body pad 200a and a second body pad 200b so that the second connection surface 221 of the first body pad 200a is opposite to the second connection surface 221 of the second body pad 200b, so that the pin pads 310 at the two opposite ends of the electronic component 300 can be connected to the first body pad 200a and the second body pad 200b respectively, so that the connection areas of the pin pads 310 at the two opposite ends of the electronic component 300 and the first body pad 200a and the second body pad 200b are both large, so that the impedance between the electronic component 300 and the body pad 200 can be better reduced, thereby improving the flow capacity between the electronic component 300 and the circuit board, and improving the heat dissipation performance of the electronic component 300.
[0031] In one embodiment, the bottom of the accommodating groove can be a planar structure. When the electronic component 300 is connected to the first body pad 200a and the second body pad 200b, a hollow area a can be formed between the pad bottom 210 of the first body pad 200a and the pad bottom 210 of the second body pad 200b, thereby facilitating heat dissipation of the electronic component 300.
[0032] In another embodiment, the circuit board body 100 may include a protrusion 110, which may be disposed on the bottom wall of the receiving groove and located between the first body pad 200a and the second body pad 200b. Specifically, the protrusion 110 may be flush with the first connection surface 211. Of course, when the surface of the electronic component 300 is not a flat plane, the protrusion 110 may be adaptively disposed to be higher than the first connection surface 211 or lower than the first connection surface 211 to support the electronic component 300.
[0033] The circuit board disclosed in the embodiment of the present application is provided with a protrusion 110 at the bottom of the accommodating groove, so that when the electronic component 300 is connected to the first connection surface 211 and the second connection surface 221 of the first body pad 200a and the second body pad 200b, the protrusion 110 can support and cooperate with the electronic component 300, which is beneficial to improve the stability of the connection between the electronic component 300 and the circuit board, and the protrusion 110 can be set as a heat-distributing material, so that the heat generated by the electronic component 300 can be evenly distributed, which is beneficial to the heat dissipation of the electronic component 300.
[0034] In order to improve the installation stability of the first body pad 200a and the second body pad 200b, optionally, the side of the first pad side 220 facing away from the second connection surface 221 can be connected to the side wall of the accommodating groove, the second end of the pad bottom 210 can be connected to the protruding portion 110, and the first end of the pad bottom 210 is opposite to the second end of the pad bottom 210, so that the first body pad 200a and the second body pad 200b can be clamped between the side wall of the corresponding accommodating groove and the protruding portion 110, which is beneficial to improve the installation stability of the first body pad 200a and the second body pad 200b.
[0035] In order to further increase the contact area between the main body pad 200 and the electronic component 300, optionally, the main body pad 200 may also include a second pad side, and the two ends of the pad bottom 210 adjacent to the first end of the pad bottom 210 may be provided with a second pad side, and the second pad side may protrude from the pad bottom 210 along one side extending from the first pad side 220, so that the pad bottom 210, the first pad side 220 and the two oppositely arranged second pad sides form a connection space connected to the pin pad 310 of the electronic component 300.
[0036] When the main body pad 200 is installed with the electronic component 300, the pin pad 310 of the electronic component 300 can be located in the connection space, and the first connection surface 211, the second connection surface 221 and the two second pad sides are all connected to the pin pad 310 of the electronic component 300, thereby increasing the contact area between the main body pad 200 and the electronic component 300, and further reducing the impedance between the electronic component 300 and the main body pad 200, thereby improving the flow capacity between the electronic component 300 and the circuit board, and facilitating the heat dissipation of the electronic component 300, and the connection space enclosed by the pad bottom 210, the first pad side 220 and the two oppositely arranged second pad sides can limit the pin pad 310 of the electronic component 300, thereby improving the stability of the installation of the electronic component 300 and the circuit board.
[0037] Optionally, the circuit board may further include a circuit layer 120 , and the circuit layer 120 may be electrically connected to the pad bottom 210 and / or the first pad side 220 , thereby achieving electrical connection between the circuit layer 120 and the body pad 200 .
[0038] The present application also discloses a circuit board device, which includes an electronic component 300 and the circuit board disclosed in the above embodiment. The main body pad 200 can be connected to the electronic component 300, and the first connection surface 211 and the second connection surface 221 can both be connected to the pin pad 310 of the electronic component 300.
[0039] The circuit board device disclosed in the embodiment of the present application can increase the connection area between the electronic component 300 and the main body pad 200 by adopting the circuit board disclosed in the above embodiment, thereby reducing the impedance between the electronic component 300 and the main body pad 200, thereby improving the flow capacity between the electronic component 300 and the circuit board, and further, can increase the contact area between the electronic component 300 and the main body pad 200, which is beneficial to the heat dissipation of the electronic component 300.
[0040] In order to facilitate the connection between the pin pad 310 of the electronic component 300 and the main body pad 200, optionally, the first connecting surface 211 and the second connecting surface 221 can be provided with a solder paste layer 400. When the pin pad 310 of the electronic component 300 is connected to the main body pad 200, the connection between the pin pad 310 of the electronic component 300 and the main body pad 200 can be achieved through a reflow soldering process.
[0041] Optionally, the circuit board body 100 may be provided with a receiving groove, the pad bottom 210 may be provided on the bottom wall of the receiving groove, and the electronic component 300 may be flush with or lower than the notch of the receiving groove.
[0042] The circuit board device disclosed in the embodiment of the present application opens a receiving groove in the circuit board body 100 so that the pad bottom 210 is arranged on the bottom wall of the receiving groove, and the electronic component 300 is flush with or lower than the notch of the receiving groove, thereby facilitating a thinner thickness of the circuit board device.
[0043] The present application also discloses an electronic device, and the disclosed electronic device includes the circuit board device disclosed in the above embodiment. The electronic device disclosed in the embodiment of the present application can increase the connection area between the electronic component 300 and the body pad 200 by adopting the circuit board device disclosed in the above embodiment, thereby reducing the impedance between the electronic component 300 and the body pad 200, thereby improving the flow capacity between the electronic component 300 and the circuit board, and further increasing the contact area between the electronic component 300 and the body pad 200, thereby facilitating the heat dissipation of the electronic component 300.
[0044] Specifically, the electronic device may be a mobile phone, a tablet, a game console, a computer, etc. The embodiments of the present application do not limit the type of the electronic device.
[0045] The above embodiments of the present invention focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.
[0046] The embodiments of the utility model are described above in conjunction with the accompanying drawings, but the utility model is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the enlightenment of the utility model, ordinary technicians in this field can also make many forms without departing from the scope of protection of the utility model and the claims, all of which are within the protection of the utility model.
Claims
1. A circuit board for mounting electronic components, characterized in that: The invention comprises a circuit board body (100) and a body pad (200) arranged on the circuit board body (100), wherein the body pad (200) comprises a pad bottom (210) and a first pad side portion (220) extending from a first end portion of the pad bottom portion (210) along a preset direction, wherein the preset direction extends so that a first connection surface (211) of the pad bottom portion (210) and a second connection surface (221) of the first pad side portion (220) intersect, and an angle between the first connection surface (211) and the second connection surface (221) is greater than 0° and less than 180°; When the electronic component (300) is mounted on the body pad (200), both the first connection surface (211) and the second connection surface (221) are connected to the pin pad (310) of the electronic component (300).
2. The circuit board according to claim 1, characterized in that: The circuit board body (100) is provided with a receiving groove, and the pad bottom (210) is arranged on the bottom wall of the receiving groove.
3. The circuit board according to claim 2, characterized in that: The first pad side portion (220) is flush with the notch of the receiving groove, or lower than the notch of the receiving groove.
4. The circuit board according to claim 2, characterized in that: The circuit board comprises at least two body pads (200), wherein the at least two body pads (200) comprise a first body pad (200a) and a second body pad (200b), wherein the first body pad (200a) and the second body pad (200b) are arranged at intervals, wherein the second connection surface (221) of the first body pad (200a) is opposite to the second connection surface (221) of the second body pad (200b), and the first body pad (200a) and the second body pad (200b) are used to respectively connect to the pin pads (310) located at two opposite ends of the electronic component (300).
5. The circuit board according to claim 4, characterized in that: The circuit board body (100) comprises a protruding portion (110), wherein the protruding portion (110) is arranged on the bottom wall of the accommodating groove and is located between the first body soldering pad (200a) and the second body soldering pad (200b).
6. The circuit board according to claim 5, characterized in that: The side of the first pad side (220) facing away from the second connection surface (221) is connected to the side wall of the accommodating groove, the second end of the pad bottom (210) is connected to the protruding portion (110), and the first end of the pad bottom (210) is opposite to the second end of the pad bottom (210).
7. The circuit board according to claim 5, characterized in that: The body pad (200) further comprises a second pad side portion, and both ends of the pad bottom (210) adjacent to the first end of the pad bottom (210) are provided with the second pad side portion, and one side of the second pad side portion extending along the first pad side portion (220) protrudes from the pad bottom (210); When the electronic component (300) is mounted on the body pad (200), the first connection surface (211), the second connection surface (221) and the two second pad side portions are all connected to the pin pad (310) of the electronic component (300).
8. The circuit board according to claim 1, characterized in that: The circuit board body (100) comprises a circuit layer (120), and the circuit layer (120) is electrically connected to the pad bottom (210) and / or the first pad side (220).
9. A circuit board device, characterized in that: The invention comprises an electronic component (300) and a circuit board according to any one of claims 1 to 8, wherein the electronic component (300) is connected to the body pad (200), and the first connection surface (211) and the second connection surface (221) are both connected to the pin pad (310) of the electronic component (300).
10. The circuit board device according to claim 9, characterized in that: The circuit board body (100) is provided with a receiving groove, the pad bottom (210) is arranged on the bottom wall of the receiving groove, and the electronic component (300) is flush with or lower than the notch of the receiving groove.
11. An electronic device, characterized in that: A circuit board device comprising the circuit board device according to claim 9 or 10.