A coaxial high-speed interface device for semiconductor testing

Abstract

The utility model provides a coaxial high-speed interface device for semiconductor testing, comprising: a base, the base is made of metal material, and is suitable for being conductively connected to a test mainboard for semiconductor testing through a first coaxial cable; a signal end, the signal end is made of metal material, arranged on the base, and insulated and connected to the base through an insulating member; the signal end is suitable for being conductively connected to the test mainboard through a second coaxial cable; a grounding end, the grounding end is made of metal material, arranged on the base, and conductively connected to the base; the grounding end is suitable for being conductively connected to the base and then connected to the conductive plate of the test mainboard through the first coaxial cable. The coaxial high-speed interface device for semiconductor testing provided by the utility model avoids the generation of signal crosstalk in a high-speed transmission environment by improving the connection design of the signal end, the grounding end, and the test mainboard, thereby realizing a chip detection function with high precision and high reliability.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to a coaxial high-speed interface device for semiconductor testing. Background Art

[0002] After the integrated circuit chips are produced, they need to be tested to detect unqualified chips and deal with them.

[0003] At present, the interface device of the chip detection equipment includes multiple signal terminals and multiple ground terminals, and the multiple signal terminals and the multiple ground terminals are arranged in an interval arrangement, and each signal terminal and / or each ground terminal is connected to the chip detection equipment through a cable. The traditional interface design can meet the transmission and processing of low-speed digital signals, but for analog signals with high signal quality requirements and the transmission of high-speed digital signals, the design of multiple signal transmission cables is very likely to generate signal crosstalk, interfere with chip detection results, and affect the reliability of chip detection equipment.

[0004] Therefore, it is necessary to provide an improved coaxial high-speed interface device for semiconductor testing to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to provide a coaxial high-speed interface device for semiconductor testing, which avoids the generation of signal crosstalk in a high-speed transmission environment, especially when the transmission frequency is in the range of 100Mbps-200Mbps, by improving the connection design between the signal terminal, the ground terminal and the test mainboard, thereby realizing a high-precision and high-reliability chip detection function.

[0006] The present invention provides a coaxial high-speed interface device for semiconductor testing, comprising:

[0007] A base, the base is made of metal and is suitable for being electrically connected to a test mainboard for semiconductor testing through a first coaxial cable;

[0008] A signal terminal, which is made of metal, is disposed on the base, and is insulated and connected to the base through an insulating member; the signal terminal is suitable for being conductively connected to the test mainboard through a second coaxial cable;

[0009] The grounding terminal is made of metal, is disposed on the base, and is conductively connected to the base; the grounding terminal is suitable for being conductively connected to the base and then connected to the conductive plate of the test mainboard through the first coaxial cable.

[0010] Optionally, the signal end is a signal spring needle; the base is provided with a first slot; one end of the signal spring needle is axially inserted into the interior of the first slot and connected to the second coaxial cable; the other end of the signal spring needle is arranged outside the first slot; the insulating member is circumferentially sleeved on the outside of the signal spring needle, and radially insulates the outer wall of the signal spring needle and the inner wall of the first slot.

[0011] Optionally, the insulating member is a collar, and the collar is made of a low dielectric constant material; the collar is sleeved outside the signal spring pin and coincides with the axis of the signal spring pin.

[0012] Optionally, the grounding end is a grounding spring pin; the base is provided with a second slot; one end of the grounding spring pin is axially inserted into the interior of the second slot and is conductively connected to the base; the other end of the grounding spring pin is arranged outside the second slot.

[0013] Optionally, a drum spring is further included, which is circumferentially sleeved outside the grounding spring pin and radially arranged between the outer wall of the grounding spring pin and the inner wall of the second slot; the drum spring is suitable for radially abutting the grounding spring pin.

[0014] Optionally, the impedance of the signal terminal and the ground terminal is 50Ω.

[0015] Optionally, a diameter of the signal spring needle is the same as a diameter of an inner conductor of the second coaxial cable.

[0016] Optionally, an outer diameter of the insulating member is the same as an outer diameter of an insulating envelope layer of the second coaxial cable.

[0017] Optionally, a diameter of the ground spring pin is the same as a diameter of an inner conductor of the first coaxial cable.

[0018] Compared with the prior art, the technical solution of the embodiment of the utility model has at least the following beneficial effects:

[0019] The coaxial high-speed interface device for semiconductor testing provided by the utility model adopts a base made of metal material, and is conductively connected to the base through a ground terminal, so that multiple ground terminals and the base form a grounding whole, so as to realize a design that the grounding whole can be connected to the test mainboard through only one first coaxial cable, thereby avoiding the generation of signal crosstalk in a high-speed transmission environment, especially when the transmission frequency is in the range of 100Mbps-200Mbps, and realizing a high-precision and high-reliability chip detection function. By adding an insulating part to insulate the signal terminal from the metal base, it is ensured that the signal terminal and the ground terminal are insulated from each other to meet impedance matching. The design that multiple signal terminals are connected to the test mainboard through a second coaxial cable further reduces the possibility of signal crosstalk and improves the test accuracy and reliability.

[0020] Furthermore, by arranging a drum spring between the grounding spring needle and the base, the outer wall of the drum spring fits against the inner wall of the second slot of the base, and when one end of the grounding spring needle is axially inserted into the second slot of the base, the drum spring is radially squeezed to compress and deform the drum spring. The elastic potential energy generated by the compressed and deformed drum spring ensures that the inner wall of the drum spring always radially abuts against the outer wall of the grounding spring needle, thereby achieving reliable contact between the grounding spring needle and the base, that is, the reliability of the conductive connection between the grounding spring needle and the base is greatly improved.

[0021] Furthermore, the signal end, the ground end and the test mainboard are connected through a coaxial cable. Compared with the traditional multi-cable connection solution, it not only effectively avoids signal crosstalk, but also saves interface material costs, reduces losses and extends service life.

[0022] Furthermore, the signal spring pin and the ground spring pin are pluggably arranged in the first slot and the second slot of the base, which is convenient for replacement, further extending the overall service life of the interface device and improving economic benefits. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of a coaxial high-speed interface device for semiconductor testing in an embodiment of the utility model;

[0024] Figure 2 It is a partial structural schematic diagram of a coaxial high-speed interface device for semiconductor testing in an embodiment of the utility model;

[0025] Figure 3 It is another partial structural schematic diagram of the coaxial high-speed interface device for semiconductor testing in an embodiment of the utility model.

[0026] Description of reference numerals:

[0027] 10. base; 101 first slot 102 second slot;

[0028] 11. Signal terminal; 12. Insulation component; 13. Ground terminal;

[0029] 14. drum spring; 21. second coaxial cable; 211 insulating envelope layer of the second coaxial cable;

[0030] 212 inner conductor of the second coaxial cable; 22, first coaxial cable; 221 insulating envelope layer of the first coaxial cable;

[0031] 222 inner conductor of the first coaxial cable; 3. test mainboard; 30. signal pad;

[0032] 31. Ground pad. DETAILED DESCRIPTION

[0033] In order to make the purpose, features and beneficial effects of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. It is understood that the specific embodiments described below are only used to explain the present invention, rather than to limit the present invention. In addition, the same or similar reference numerals may be used in the figures to refer to the same or similar elements in different embodiments, and the description of the same or similar elements in different embodiments and the description of the prior art elements, features, effects, etc. may be omitted.

[0034] As shown in this specification and claims, unless otherwise specified or obvious from the context, all numerical values ​​provided herein are modified by the term "about", which should be understood to be within the normal tolerance range in the field. "About" can be understood as allowing a tolerance of 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1%, 0.5%, 0.1%, 0.05% or 0.01% of the numerical value. The axial, radial and circumferential directions described in the embodiments of the utility model respectively represent the axial, radial and circumferential directions of the signal spring pin.

[0035] Figure 1 It is a structural schematic diagram of a coaxial high-speed interface device for semiconductor testing in an embodiment of the utility model; Figure 2 It is a partial structural schematic diagram of a coaxial high-speed interface device for semiconductor testing in an embodiment of the utility model; Figure 3 It is another partial structural schematic diagram of the coaxial high-speed interface device for semiconductor testing in an embodiment of the utility model.

[0036] Reference Figures 1 to 3The embodiment of the utility model provides a coaxial high-speed interface device for semiconductor testing. By improving the connection design between the signal terminal, the ground terminal and the test mainboard, the signal crosstalk is avoided in a high-speed transmission environment, especially when the transmission frequency is in the range of 100Mbps-200Mbps, thereby realizing a high-precision and high-reliability chip detection function.

[0037] The coaxial high-speed interface device for semiconductor testing provided by the embodiment of the utility model comprises:

[0038] A base 10, which is made of metal and is suitable for being electrically connected to a test mainboard 3 for semiconductor testing via a first coaxial cable 22;

[0039] The signal terminal 11 is made of metal, is disposed on the base 10, and is insulated and connected to the base 10 through an insulating member 12; the signal terminal 11 is suitable for being conductively connected to the test mainboard 3 through a second coaxial cable 21;

[0040] The ground terminal 13 is made of metal, is disposed on the base 10, and is conductively connected to the base 10; the ground terminal 13 is suitable for being conductively connected to the base 10 and then connected to the conductive plate of the test mainboard 3 through the first coaxial cable 22.

[0041] The base is made of metal material and is conductively connected to the base 10 through the grounding terminal 13, so that multiple grounding terminals 13 and the base 10 form a grounding entity, so as to realize a design in which the grounding entity can be connected to the test mainboard 3 only through a first coaxial cable 22, thereby avoiding signal crosstalk caused by transmitting signals through multiple cables in a high-speed transmission environment, especially when the transmission frequency is in the range of 100Mbps-200Mbps, and realizing a high-precision and high-reliability chip detection function.

[0042] By adding an insulating part 12 to insulate the signal terminal 11 from the metal base 10, the signal terminal and the ground terminal are insulated from each other to meet impedance matching. The design of connecting multiple signal terminals 11 to the test main board 3 through a second coaxial cable 21 further reduces the possibility of signal crosstalk and improves test accuracy and reliability.

[0043] In an embodiment of the present invention, the ground terminal 13 is conductively connected to the ground pad 30 of the test mainboard 3 through the inner conductor 222 of the first coaxial cable 22 .

[0044] In an embodiment of the present invention, the signal end 11 is conductively connected to the signal pad 31 of the test mainboard 3 through the inner conductor 212 of the second coaxial cable 21 .

[0045] In one embodiment of the utility model, the signal end 11 is a signal spring needle; the base 10 is provided with a first slot 101; one end of the signal spring needle is axially inserted into the interior of the first slot 101 and connected to the second coaxial cable 21; the other end of the signal spring needle is arranged outside the first slot 101; the insulating member 12 is circumferentially sleeved on the outside of the signal spring needle, and radially insulates the outer wall of the signal spring needle and the inner wall of the first slot 101.

[0046] In a specific embodiment, the insulating member 12 is a collar made of a low dielectric constant material; the collar is sleeved outside the signal spring pin and coincides with the axis of the signal spring pin, and the collar and the signal spring pin can be connected by a clearance fit.

[0047] In one embodiment of the utility model, the grounding terminal 13 is a grounding spring pin; the base 10 is provided with a second slot 102; one end of the grounding spring pin is axially inserted into the interior of the second slot 102 and is conductively connected to the base 10; the other end of the grounding spring pin is arranged outside the second slot 102.

[0048] In one embodiment of the utility model, the coaxial high-speed interface device for semiconductor testing also includes a drum spring 14, which is circumferentially sleeved outside the grounding spring pin and radially arranged between the outer wall of the grounding spring pin and the inner wall of the second slot 102; the drum spring 14 is suitable for radially abutting the grounding spring pin.

[0049] For example, when the dielectric constant of the insulating member 12 is 1.08, the outer diameter D of the insulating member 12 is 3 mm, and the diameter d1 of the signal spring pin and the diameter d2 of the ground spring pin are 1.25 mm, the impedance of the signal terminal and the ground terminal is calculated to be 50Ω.

[0050] In an embodiment of the present invention, the diameter d1 of the signal spring pin is the same as the diameter of the inner conductor 212 of the second coaxial cable 21 .

[0051] In an embodiment of the present invention, the outer diameter of the insulating member 12 is the same as the outer diameter of the insulating envelope 211 of the second coaxial cable 21 .

[0052] In an embodiment of the present invention, the diameter d2 of the grounding spring pin is the same as the diameter of the inner conductor 222 of the first coaxial cable 22 .

[0053] In an embodiment of the present invention, the outer diameter of the insulating envelope 221 of the first coaxial cable 22 is the same as the outer diameter of the insulating envelope 211 of the second coaxial cable 21 .

[0054] The coaxial high-speed interface device for semiconductor testing provided by the embodiment of the utility model adopts a base 10 made of metal material, and is conductively connected to the base 10 through the ground terminal 13, so that multiple ground terminals 13 and the base 10 form a grounding whole, so as to realize the design that the grounding whole can be connected to the test mainboard 3 only through a first coaxial cable 22, thereby avoiding the generation of signal crosstalk in a high-speed transmission environment, especially when the transmission frequency is in the range of 100Mbps-200Mbps, and realizing a high-precision and high-reliability chip detection function. By adding an insulating member 12 to insulate the signal terminal 11 from the metal base 10, it is ensured that the signal terminal 11 and the ground terminal 13 are insulated from each other to meet impedance matching. The design that multiple signal terminals 11 are connected to the test mainboard 3 through a second coaxial cable 21 further reduces the possibility of signal crosstalk and improves the test accuracy and reliability.

[0055] Furthermore, by arranging a drum spring 14 between the grounding spring needle and the base 10, the outer wall of the drum spring 14 fits against the inner wall of the second slot 102 of the base 10, and when one end of the grounding spring needle is axially inserted into the second slot 102 of the base 10, the drum spring 14 is radially squeezed to compress and deform the drum spring 14. The elastic potential energy generated by the compressed and deformed drum spring 14 ensures that the inner wall of the drum spring 14 always radially abuts against the outer wall of the grounding spring needle, thereby achieving reliable contact between the grounding spring needle and the base 10, that is, the reliability of the conductive connection between the grounding spring needle and the base 10 is greatly improved.

[0056] Furthermore, the signal end, the ground end and the test mainboard are connected through a coaxial cable. Compared with the traditional multi-cable connection solution, it not only effectively avoids signal crosstalk, but also saves interface material costs, reduces losses and extends service life.

[0057] Furthermore, the signal spring pin and the ground spring pin are pluggably arranged in the first slot and the second slot of the base, which is convenient for replacement, further extending the overall service life of the interface device and improving economic benefits.

[0058] Although specific embodiments have been described above, these embodiments are not intended to limit the scope of the present disclosure, even when only a single embodiment is described with respect to specific features. The feature examples provided in the present disclosure are intended to be illustrative rather than limiting, unless otherwise stated. In specific implementations, the technical features of one or more dependent claims may be combined with the technical features of the independent claim, based on actual needs and where technically feasible, and may be derived from the technical features of the corresponding independent claim in any appropriate manner rather than simply through the specific combination listed in the claims.

[0059] Although the utility model is disclosed as above, the utility model is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the utility model. Therefore, the protection scope of the utility model shall be subject to the scope defined by the claims.

Claims

1. A coaxial high-speed interface device for semiconductor testing, characterized in that: include: A base, the base is made of metal and is suitable for being electrically connected to a test mainboard for semiconductor testing through a first coaxial cable; A signal terminal, which is made of metal, is disposed on the base, and is insulated and connected to the base through an insulating member; the signal terminal is suitable for being conductively connected to the test mainboard through a second coaxial cable; A grounding terminal, which is made of metal, is disposed on the base, and is conductively connected to the base; The grounding terminal is suitable for being conductively connected to the base and then connected to the conductive plate of the test mainboard through the first coaxial cable.

2. The coaxial high-speed interface device for semiconductor testing according to claim 1, characterized in that: The signal end is a signal spring needle; the base is provided with a first slot; one end of the signal spring needle is axially inserted into the interior of the first slot and connected to the second coaxial cable; the other end of the signal spring needle is arranged outside the first slot; the insulating member is circumferentially sleeved on the outside of the signal spring needle, and radially insulates the outer wall of the signal spring needle and the inner wall of the first slot.

3. The coaxial high-speed interface device for semiconductor testing according to claim 2, characterized in that: The insulating member is a sleeve ring, and the sleeve ring is made of a low dielectric constant material; the sleeve ring is sleeved outside the signal spring pin and coincides with the axis of the signal spring pin.

4. The coaxial high-speed interface device for semiconductor testing according to claim 1, characterized in that: The grounding end is a grounding spring pin; the base is provided with a second slot; one end of the grounding spring pin is axially inserted into the inside of the second slot and is conductively connected to the base; the other end of the grounding spring pin is arranged outside the second slot.

5. The coaxial high-speed interface device for semiconductor testing according to claim 4, characterized in that: It also includes a drum spring, which is circumferentially sleeved outside the grounding spring pin and radially arranged between the outer wall of the grounding spring pin and the inner wall of the second slot; the drum spring is suitable for radially abutting the grounding spring pin.

6. The coaxial high-speed interface device for semiconductor testing according to claim 5, characterized in that: The impedance of the signal terminal and the ground terminal is 50Ω.

7. The coaxial high-speed interface device for semiconductor testing according to claim 2, characterized in that: The diameter of the signal spring pin is the same as the diameter of the inner conductor of the second coaxial cable.

8. The coaxial high-speed interface device for semiconductor testing according to claim 7, characterized in that: The outer diameter of the insulating member is the same as the outer diameter of the insulating envelope of the second coaxial cable.

9. The coaxial high-speed interface device for semiconductor testing according to claim 4, characterized in that: The diameter of the ground spring pin is the same as the diameter of the inner conductor of the first coaxial cable.

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