Core board test device
By designing a test device suitable for half-hole core plates, and using probes with curved arc structures to achieve electrical connections, the existing testing methods are solved, and flexible and applicable efficient testing results are achieved.
Patent Information
- Application Number
- CN202421134441.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-22
- Publication Date
- 2025-04-04
- Estimated Expiration
- 2034-05-22
AI Technical Summary
The existing half-hole type core board test methods use fixed sockets, resulting in high testing costs, low efficiency, and inability to apply to core boards of different sizes and specifications.
A core board testing device is designed, including the test motherboard, core board and probe. The probe has an arc-bending structure, which can be inserted into the slot hole and contact the test motherboard, and abuts with the inner side of the half-hole through the other end of the arc-bending structure, thereby achieving electrical connection.
The device reduces testing cost and time, improves testing efficiency, can be applied to semi-hole core plates of different sizes and specifications, and reduces test errors caused by poor contact, improving the representativeness of test results.
Smart Images
Figure CN222719614U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of chip detection technology, and in particular to a core board testing device. Background Art
[0002] With the rapid development of electronic technology, electronic products are developing towards miniaturization, lightness, multi-function, high integration and high reliability. As the support and connector of electronic components, printed circuit boards often need to be matched with some core small carrier boards and sets of boards for inlay in applications. For example, the Bluetooth module / NBlot module of the Internet of Things, these indispensable communication modules can be soldered to the core board like chips. These small carrier boards are small in size and have a whole row of metallized half holes. Through these metallized half holes, they are soldered to the motherboard and the pins of the components. The industry calls this PCB process the half-hole process. It has now been widely used in communications, the Internet of Things, automotive electronics, industrial control, military industry, etc., but its difficulty lies in the control of the aperture of the half hole and the production and testing process.
[0003] Most of the existing testing methods for half-hole type core boards on the market use dedicated fixed sockets or tooling to test half-hole type core boards or modules. Such testing means and methods have very high fixture design costs and relatively low testing efficiency, and lack flexibility for different core boards, and cannot be applied to core boards of various sizes and specifications. Utility Model Content
[0004] In view of this, the present application proposes a core board testing device to solve the above problems.
[0005] According to one aspect of the present application, a core board testing device is provided, which is suitable for testing a half-hole core board, comprising: a testing main board, a core board and a probe; a mounting groove is provided in the middle of the testing main board, and the core board is arranged on the mounting groove; the probe is conductive, the material of the probe is an elastic material, the probe is arranged on the testing main board, and the probe abuts against the core board;
[0006] The outer periphery of the core plate is provided with half holes, and a plurality of the half holes are arranged at intervals;
[0007] The test main board is provided with slotted holes, which are arranged in a one-to-one correspondence with the half holes; the test main board is provided with welding holes, which are arranged in a one-to-one correspondence with the half holes, and the welding holes and the half holes are arranged on both sides of the slot length of the slotted holes;
[0008] The probe is provided with a curved arc structure, which is inserted into the interior of the slot; wherein, one end of the curved arc structure extends downward, and the other end of the curved arc structure extends upward; one end of the probe is inserted into the welding hole and abuts against the test main board, and the other end of the curved arc structure abuts against the inner side of the half hole.
[0009] In a possible implementation, the probe further includes: a first bending structure; the first bending structure is arranged at an end extending downward from the arc structure, and the first bending structure and the arc structure have a setting distance; the setting distance is equal to the distance between the welding hole and the slot hole.
[0010] In a possible implementation, the inner side of the upper end of the first bending structure fits with the upper end surface of the test mainboard; specifically, the setting height of the highest point of the first bending structure is equal to the setting height of one end of the arc structure close to the welding hole.
[0011] In a possible implementation, the size of the curved structure matches the size of the slot; and the outer periphery of the curved structure abuts against the inner wall of the slot.
[0012] In a possible implementation, the welding hole is set through the test main board, the slot hole is set through the test main board, the downwardly extending end of the probe extends out of the welding hole, and the bottom of the curved structure extends out of the slot hole.
[0013] In a possible implementation, it also includes: a packaging cover; fixing holes are provided at the corners of the packaging cover, and the packaging cover connects the core board to the test main board through screws; specifically, a square opening is provided in the middle of the packaging cover, and the inner periphery of the packaging cover abuts against the side of the probe extending upward; the packaging cover is provided with a circular hole, and the position of the circular hole is set corresponding to the position of the welding hole.
[0014] In a possible implementation, the probe further includes: a bend structure; the bend structure is disposed at one end of the probe close to the half hole; the bend structure extends upward and bends toward the middle of the slot.
[0015] In a possible implementation, the center line of the half hole coincides with the center line of the corresponding slot hole, and the center line of the slot hole coincides with the center line of the corresponding welding hole; the distance between two adjacent half holes on the same side is equal, the distance between two adjacent welding holes on the same side is equal, and the distance between two adjacent slot holes on the same side is equal.
[0016] In a possible implementation, the first bending structure is in the shape of a right-angle structure, and a horizontal line structure of the first bending structure is arranged parallel to the center line of the slot; and an end of the arc structure close to the half hole extends upward and outward.
[0017] In a possible implementation, the core board and the test main board are both square structures; the half hole is a semicircular hole structure; the slot hole is a long strip structure, and semicircular holes extend from both ends of the slot hole along the slot length direction; the welding hole is a circular hole.
[0018] Beneficial effects of this application:
[0019] The core board test device proposed in the present application is convenient for system burning, testing and experiments on half-hole core boards. The overall cost and test efficiency of the test device are greatly reduced, thereby creating core competitiveness for the mass and high-quality production of half-hole modules. Specifically, the end of the curved arc structure close to the half hole extends outward and upward, and extends the package cover, so that the probe can abut against the core board of smaller size, and the probe is electrically connected to the core board through physical contact. The other end of the curved arc structure extends downward and abuts against the test main board, so that the probe is electrically connected to the test main board, and the test main board tests the test main board through the probe. The probe of the present application is provided with a curved arc structure, and the curved arc structure is inserted into the slot and contacts the test main board. The curved arc structure extends upward near the end of the half hole and abuts the inside of the half hole. Compared with the existing pin-type connection method, the test error caused by poor contact is reduced, and the test results of the core board test device of the present application are more representative.
[0020] Other features and aspects of the present application will become apparent from the following detailed description of exemplary embodiments with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate exemplary embodiments, features, and aspects of the present application and, together with the description, serve to explain the principles of the present application.
[0022] Figure 1 A schematic diagram showing a core board testing device according to an embodiment of the present application;
[0023] Figure 2 A top view of a core board testing device according to an embodiment of the present application is shown;
[0024] Figure 3 A schematic diagram showing the structure of a core board testing device according to an embodiment of the present application is shown;
[0025] Figure 4 A partial structural schematic diagram of a core board testing device according to an embodiment of the present application is shown. DETAILED DESCRIPTION
[0026] Various exemplary embodiments, features and aspects of the present application will be described in detail below with reference to the accompanying drawings. The same reference numerals in the accompanying drawings represent elements with the same or similar functions. Although various aspects of the embodiments are shown in the accompanying drawings, the drawings are not necessarily drawn to scale unless otherwise specified.
[0027] Among them, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application or simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0029] The word “exemplary” is used exclusively herein to mean “serving as an example, example, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.
[0030] In addition, in order to better illustrate the present application, numerous specific details are given in the following specific embodiments. It should be understood by those skilled in the art that the present application can also be implemented without certain specific details. In some examples, methods, means, components and circuits well known to those skilled in the art are not described in detail in order to highlight the subject matter of the present application.
[0031] like Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, the core board testing device is suitable for testing the half-hole core board, comprising: a test main board 100, a core board 200 and a probe 300; a mounting groove is provided in the middle of the test main board 100, and the core board 200 is arranged on the mounting groove; the probe 300 is conductive, and the material of the probe 300 is elastic material, and the probe 300 is arranged on the test main board 100, and the probe 300 is in contact with the core board 200; the outer periphery of the core board 200 has a half hole 210, and a plurality of the half holes 210 are arranged at intervals; a slot hole 110 is provided on the test main board 100, and the slot hole 110 and the half hole 210 are arranged at intervals; 0 are arranged in a one-to-one correspondence; a welding hole 120 is opened on the test main board 100, and the welding hole 120 is arranged in a one-to-one correspondence with the half hole 210, and the welding hole 120 and the half hole 210 are relatively arranged on both sides of the slot length of the slot hole 110; the probe 300 is provided with a curved structure 310, and the curved structure 310 is inserted into the interior of the slot hole 110; wherein, one end of the curved structure 310 extends downward, and the other end of the curved structure 310 extends upward; one end of the probe 300 is inserted into the welding hole 120, abuts against the test main board 100, and the other end of the curved structure 310 abuts against the inner side of the half hole 210.
[0032] The core board test device proposed in the present application has a simple structure. Compared with the existing detection of the core board 200 by selecting a fixed socket, the test device of the core board 200 is provided with a curved arc structure 310 of a probe 300, so that one end of the curved arc structure 310 is inserted into the welding hole 120, and it is not easy to change the position, and the other end of the curved arc structure 310 is in contact with the core board 200, so that the half hole 210 core board 200 is tightly embedded in the test main board 100. So that the pad of the core board 200 is fully in contact with the peripheral pin, and then the core board 200 is burned The system, aging, testing and other operations. And the probe 300 is a metal material, using a pin-type method, so that the core board 200 and the test main board 100 are electrically connected by the probe 300, which is convenient for the test main board 100 to transmit a test signal to the core board 200. Because the probe 300 and the core board 200 and the test device all have a certain elasticity, the core board test device of the present application is more flexible to test the core board 200 of different sizes. Further, the probe 300 of the present application is provided with a curved structure 310, and the curved structure 310 is inserted into the slot 110, and contacts the test mainboard 100, and the curved structure 310 extends upward near one end of the half hole 210, and abuts the inside of the half hole 210. Compared with the existing pin-type connection method, the test error caused by poor contact is reduced, and the test result of the core board test device of the present application is more representative. Specifically, the curved structure 310 extends outward and upward near one end of the half hole 210, and extends out of the package cover, so that the probe 300 can abut against the core board 200 of smaller size, and through physical contact, the probe 300 is electrically connected to the core board 200. The other end of the curved structure 310 extends downward and abuts against the test mainboard 100, so that the probe 300 is electrically connected to the test mainboard 100, so that the test mainboard 100 tests the test mainboard 100 through the probe 300. The angle of the arc structure 310 extending outwards near one end of the half hole 210 is 65 to 90 degrees. In the present embodiment, the preferred outward extension angle is 85 degrees. If the size of the core board 200 is relatively large, the inner wall of the half hole 210 and the abutment probe 300, the probe 300 is an elastic material, slightly tilted inward, the core board 200 is elastic, and the surrounding micro-bulges toward the middle of the core board 200, so that the probe 300 can also be electrically connected to the core board 200 of a larger size; if the size of the core board 200 is relatively small, the physical contact between the probe 300 and the half hole 210 is made by packaging technology, so that the probe 300 and the core board 200 are electrically connected.
[0033] In a possible implementation, the probe 300 further includes: a first bending structure 320; the first bending structure 320 is arranged at one end of the curved structure 310 extending downward, and the first bending structure 320 and the curved structure 310 have a setting distance; the setting distance is equal to the distance between the welding hole 120 and the slot 110. In this embodiment, it should be noted that the first bending structure 320 is arranged so that the probe 300 can be inserted into the welding hole 120 and compared with the existing pin-type connection, the position of the probe 300 in the core board test device of the present application in the welding hole 120 is more stable, so that the test results obtained are more valuable for reference.
[0034] In a possible implementation, the inner side of the upper end of the first bending structure 320 is in contact with the upper end surface of the test main board 100; specifically, the highest point of the first bending structure 320 is set at the same height as the end of the arc structure 310 close to the welding hole 120. In this embodiment, it should be noted that it is convenient to install the packaging cover so that the test main board 100 is electrically connected to the core board 200 through the probe 300.
[0035] In a possible implementation, the size of the arc structure 310 matches the size of the slot 110; the outer periphery of the arc structure 310 abuts against the inner wall of the slot 110. In this embodiment, it should be noted that the arc structure 310 is in contact with the test main board 100, thereby improving the detection efficiency of the test main board 100 for the core board 200. It should also be noted that the arc structure is a U-shaped structure, and the two ends of the arc structure 310 are flush, so that the probe 300 can fit with the test main board 100 at both ends of the arc structure 310, and the overall test device is more harmonious and beautiful.
[0036] In a possible implementation, the welding hole 120 is set through the test main board 100, the slot 110 is set through the test main board 100, the downwardly extending end of the probe 300 extends out of the welding hole 120, and the bottom of the curved structure 310 extends out of the slot 110. In this embodiment, it should be noted that the probe 300 is in contact with the test main board 100 over a large area, so that the test main board 100 can test the core board 200.
[0037] In a possible implementation, it also includes: a packaging cover; a fixing hole 130 is provided at the corner of the packaging cover, and the packaging cover connects the core board 200 with the test main board 100 by screws; specifically, a square mouth is provided in the middle of the packaging cover, and the inner circumference of the packaging cover abuts against the side of the probe 300 extending upward; the packaging cover is provided with a circular hole, and the position of the circular hole is arranged corresponding to the position of the welding hole 120. In this embodiment, it should be noted that the probe 300 is processed and prepared by steel wire, and the surface layer of the probe 300 is gold-plated, so that the probe 300 has good conductivity, so that the probe 300 can electrically connect the test main board 100 with the core board 200, so that the test main board 100 can be used to detect the core board 200. Specifically, the diameter of the probe 300 matches the aperture of the welding hole 120, so that the probe 300 can be quickly inserted into the welding hole 120, and can abut against the welding hole 120, so that the probe 300 is electrically connected to the test main board 100. The distance between the two ends of the curved structure 310 matches the slot length of the slot 110. Wherein, the diameter of the steel wire is 0.3mm-0.4mm, and the steel wire selected in the present embodiment is 0.35mm, and the steel wire has elasticity, so that it can be adapted to different core boards 200 and test mainboards 100, saving the cost of testing different core boards 200. The diameter of the welding hole 120 is 0.42mm, and the slot length of the slot 110 is 3.94mm. Further, the middle part of the slot 110 is a rectangular structure, and there is a semicircular hole at the extension along the slot length direction, and the diameter of the semicircular hole is 0.65mm. The center of the welding hole 120 is preferably 2.3mm to the nearest distance of the slot 110. The distance between the center of the welding hole 120 and the midpoint of the slot length of the slot 110 is 4.27mm. It should be further explained that the center of the welding hole 120 is taken as the origin of the entire package, and the distance between the package origin and the deepest edge of the half hole 210 is 6.11 mm.
[0038] In a possible implementation, the probe 300 further includes: a bend structure 330; the bend structure 330 is arranged at one end of the probe 300 close to the half hole 210; the bend structure 330 extends upward, and the bend structure 330 bends toward the middle of the slot 110. In this embodiment, it should be noted that the bend structure 330 is provided to prevent the end of the probe 300 extending upward from stabbing the tester in this field. It should also be noted that a second bending structure 340 is provided between the curved arc structure 310 and the bend structure 330, and the end of the curved structure close to the half hole 210 extends upward and outward to the second bend, so that the second bend can be in full contact with the core board 200, and then the second bend extends upward and inward to the bend structure 330, so as to prevent the tester's hand from being stabbed, and at the same time facilitate the tester to observe the test status of the core board 200. It should also be noted that the bend structure 330 is preferably a closed structure to prevent the probe 300 from stabbing the tester.
[0039] In a possible implementation, the center line of the half hole 210 coincides with the center line of the corresponding slot hole 110, and the center line of the slot hole 110 coincides with the center line of the corresponding welding hole 120; the distance between the two adjacent half holes 210 on the same side is equal, the distance between the two adjacent welding holes 120 on the same side is equal, and the distance between the two adjacent slot holes 110 on the same side is equal. In this embodiment, it should be noted that the layout of the core board test device is made more neat and reasonable. And the core board 200 can be fully detected by the test motherboard 100.
[0040] In a possible implementation, the first bending structure 320 is in a right-angle structure, and the horizontal line structure of the first bending structure 320 is arranged parallel to the center line of the slot 110; the arc structure 310 extends upward and outward at one end close to the half hole 210. In this embodiment, it should be noted that the first bending structure 320 is in a right-angle structure, which, on the one hand, makes the bottom side of the first bend fit better with the test main board 100, and facilitates the insertion of the probe 300 into the welding hole 120, thereby enabling the test main board 100 to test the core board 200.
[0041] In a possible implementation, the core board 200 and the test main board 100 are both in a square structure; the half hole 210 is in a semicircular hole structure; the slot 110 is in a long strip structure, and the slot 110 extends semicircular holes at both ends along the slot length direction; the welding hole 120 is a circular hole. In this embodiment, it should be noted that circular holes are provided at the corners of the test main board 100 to facilitate the test main board 100 to connect the remaining test elements. It should be further noted that the radius of the semicircular hole is preferably equal to the radius of the half hole 210, and the radius of the semicircular hole is preferably equal to the radius of the welding hole 120. It should be further noted that the half hole 210, the slot 110 and the welding hole 120 in the same straight line are longitudinally arranged on one side of the core board 200 where the half hole 210 is located.
[0042] It should be noted that, although the core board test device is introduced as an example in this application, it can be understood by those skilled in the art that this application should not be limited thereto. In fact, the user can flexibly set it according to personal preference and / or actual application scenario, as long as it is reasonable.
[0043] The embodiments of the present application have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.
Claims
1. A core board testing device, suitable for testing a half-hole core board, characterized in that: include: Test the main board, core board and probe; A mounting groove is provided in the middle of the test mainboard, and the core board is arranged on the mounting groove; the probe is conductive, and the probe is made of elastic material, and the probe is arranged on the test mainboard, and the probe abuts against the core board; The outer periphery of the core plate is provided with half holes, and a plurality of the half holes are arranged at intervals; The test main board is provided with slotted holes, which are arranged in a one-to-one correspondence with the half holes; the test main board is provided with welding holes, which are arranged in a one-to-one correspondence with the half holes, and the welding holes and the half holes are arranged on both sides of the slot length of the slotted holes; The probe is provided with a curved arc structure, which is inserted into the interior of the slot; wherein, one end of the curved arc structure extends downward, and the other end of the curved arc structure extends upward; one end of the probe is inserted into the welding hole and abuts against the test main board, and the other end of the curved arc structure abuts against the inner side of the half hole.
2. The core board testing device according to claim 1, characterized in that: The probe further includes: a first bending structure; the first bending structure is arranged at an end of the curved structure extending downward, and the first bending structure and the curved structure have a setting distance; the setting distance is equal to the distance between the welding hole and the slot hole.
3. The core board testing device according to claim 2, characterized in that: The inner side of the upper end of the first bending structure is in contact with the upper end surface of the test main board; specifically, the setting height of the highest point of the first bending structure is equal to the setting height of one end of the arc structure close to the welding hole.
4. The core board testing device according to claim 1, characterized in that: The size of the curved structure matches the size of the slot hole; the outer periphery of the curved structure abuts against the inner wall of the slot hole.
5. The core board testing device according to claim 1, characterized in that: The welding hole is set through the testing main board, the slot is set through the testing main board, one end of the probe extending downward extends out of the welding hole, and the bottom of the curved structure extends out of the slot.
6. The core board testing device according to any one of claims 1 to 5, characterized in that: Also includes: A packaging cover; fixing holes are provided at the corners of the packaging cover, and the packaging cover connects the core board to the test main board through screws; specifically, a square opening is provided in the middle of the packaging cover, and the inner periphery of the packaging cover abuts against the side of the probe extending upward; the packaging cover is provided with a circular hole, and the position of the circular hole is arranged corresponding to the position of the welding hole.
7. The core board testing device according to claim 6, characterized in that: The probe further includes: a return bend structure; the return bend structure is arranged at one end of the probe close to the half hole; the return bend structure extends upward and bends toward the middle of the slot hole.
8. The core board testing device according to claim 6, characterized in that: The center line of the half hole coincides with the center line of the corresponding slot hole, and the center line of the slot hole coincides with the center line of the corresponding welding hole; the distance between two adjacent half holes on the same side is equal, the distance between two adjacent welding holes on the same side is equal, and the distance between two adjacent slot holes on the same side is equal.
9. The core board testing device according to claim 2 or 3, characterized in that: The first bending structure is in a right-angle structure shape, and the horizontal line structure of the first bending structure is arranged parallel to the center line of the slot hole; and the end of the arc structure close to the half hole extends upward and outward.
10. The core board testing device according to claim 6, characterized in that: The core board and the test main board are both in square structure; the half hole is in semicircular hole structure; the slot hole is in long strip structure, and semicircular holes extend from both ends of the slot hole along the slot length direction; the welding hole is a circular hole.