Electronic package

Abstract

An electronic package includes a package module having a first side and a second side opposite to each other and including a first electronic component disposed on the first side; the antenna module is provided with a first surface and a second surface which are opposite to each other, and the antenna module is arranged on the second side of the packaging module through a plurality of conductive elements on the first surface; the second electronic component is arranged between the second side of the packaging module and the first surface of the antenna module; and a cladding layer for cladding the second electronic component, in which the second electronic component and the cladding layer are thinned to reduce the thickness of the electronic package.

Description

Technical Field

[0001] The present application relates to a semiconductor packaging process, and in particular to an electronic packaging component with an antenna structure. Background Art

[0002] Nowadays, wireless communication technology has been widely used in various consumer electronic products (such as mobile phones, tablet computers, etc.) to receive or send various wireless signals. At the same time, in order to meet the portability and Internet access convenience of consumer electronic products, the manufacturing and design of wireless communication modules are developed towards the requirements of lightness, thinness, shortness and smallness. Among them, patch antennas are widely used in wireless communication modules of electronic products due to their small size, light weight and easy manufacturing.

[0003] Figure 1 1 is a cross-sectional view of a conventional semiconductor package 1 integrated with an antenna. The semiconductor package 1 includes a package module 1a and an antenna module 1b. The package module 1a includes a substrate 10, a radio frequency chip 11 and a power amplifier chip 12. The substrate 10 has a first side 10a and a second side 10b opposite to each other. The radio frequency chip 11 and the power amplifier chip 12 are disposed on the first side 10a of the substrate 10. The antenna module 1b is disposed on the second side 10b of the substrate 10 via a plurality of conductive elements 13.

[0004] In the conventional semiconductor package 1, in order to cope with the rapid attenuation of the radio frequency signal, the radio frequency chip 11 and the power amplifier chip 12 must be disposed on the first side 10a of the substrate 10 to enhance the signal strength. However, this design increases the layout area of ​​the substrate 10, thereby increasing the volume of the semiconductor package 1, making it difficult for the semiconductor package 1 to meet the requirements of being light, thin and short.

[0005] In addition, the semiconductor package 1 needs to be designed with a conductive element 13 of sufficient size to support the substrate 10 and the RF chip 11 and the power amplifier chip 12 thereon. However, under the same area, a larger conductive element 13 will reduce the spacing between each other, and in order to meet the number of conductive elements 13 required by the original design, the size of the packaging module 1a must be increased (and the antenna module 1b must also be increased at the same time), which will not meet the requirements of the terminal product for being thin, light and short.

[0006] Therefore, how to overcome the above-mentioned problems of the prior art has become a topic that needs to be solved urgently. Utility Model Content

[0007] In view of the various deficiencies of the above-mentioned prior art, the present application provides an electronic package, comprising: a packaging module, having a first side and a second side opposite to each other and including a first electronic component and a plurality of conductive bumps, wherein the first electronic component is arranged on the first side and the plurality of conductive bumps are arranged on the second side; an antenna module, having a first surface and a second surface opposite to each other, and a plurality of conductive elements are arranged on the first surface so that the antenna module can be connected to the plurality of conductive bumps of the packaging module through the plurality of conductive elements; a second electronic component is arranged on the second side of the packaging module or the first surface of the antenna module so that the second electronic component is on the same side as the plurality of conductive bumps or the plurality of conductive elements; and a covering layer for covering the second electronic component and the plurality of conductive bumps or the plurality of conductive elements on the same side as the second electronic component.

[0008] The present application also provides a method for manufacturing an electronic package, comprising: providing a packaging module and an antenna module, wherein the packaging module has a first side and a second side opposite to each other and is combined with a first electronic component and a plurality of conductive bumps, the first electronic component is arranged on the first side, the plurality of conductive bumps are arranged on the second side, and the antenna module has a first surface and a second surface opposite to each other, and a plurality of conductive elements are arranged on the first surface; arranging a second electronic component on the second side of the packaging module or the first surface of the antenna module so that the second electronic component and the plurality of conductive bumps or the plurality of conductive elements are on the same side; covering the second electronic component and the plurality of conductive bumps or the plurality of conductive elements on the same side as the second electronic component with a covering layer; and connecting the antenna module to the plurality of conductive bumps of the packaging module with the plurality of conductive elements.

[0009] As in the aforementioned electronic package, the covering layer and the second electronic element are thinned and disposed between the packaging module and the antenna module.

[0010] As in the aforementioned electronic package, the first electronic component is a radio frequency chip, and the second electronic component is a power amplifier chip.

[0011] As in the aforementioned electronic package, the second electronic component is disposed on the first surface of the antenna module in a flip chip manner, or is disposed on the second side of the package module in a flip chip manner.

[0012] As in the aforementioned electronic package, the packaging module further includes a connecting element disposed on the first side.

[0013] As in the aforementioned electronic package, it also includes a bottom filling glue arranged between the packaging module and the antenna module, for covering the plurality of conductive bumps or the plurality of conductive elements not covered by the covering layer.

[0014] As in the aforementioned electronic package, a portion of the surface of the second electronic component is exposed from the coating layer.

[0015] As in the aforementioned electronic package, the second electronic component is not exposed outside the covering layer.

[0016] As in the aforementioned electronic package, a plurality of the antenna modules are included, so that the package module is connected to the plurality of conductive elements of the plurality of antenna modules through the plurality of conductive bumps.

[0017] As in the aforementioned electronic package, the antenna module includes a plurality of antenna structures arranged on the second surface.

[0018] As in the aforementioned electronic package, it also includes a covering layer disposed on the antenna module to cover the multiple antenna structures.

[0019] In summary, the electronic package of the present application mainly places the second electronic component between the packaging module and the antenna module, together with the conductive bumps (or conductive components) covered by the coating layer and thinned, which not only maintains the number of conductive connections on the antenna module side, but also reduces the size of the overall electronic package. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a cross-sectional schematic diagram of a conventional semiconductor package.

[0021] FIG. 2A to FIG. 2C It is a cross-sectional schematic diagram of the manufacturing method of the electronic package of the present application.

[0022] Figure 3 It is a cross-sectional schematic diagram of a second embodiment of the electronic package of the present application.

[0023] Figure 4A and Figure 4B It is a cross-sectional schematic diagram of a third embodiment of the electronic package of the present application.

[0024] Figure 5A and Figure 5B It is a cross-sectional schematic diagram of a fourth embodiment of the electronic package of the present application.

[0025] Fig. 6A and Figure 6B It is a cross-sectional schematic diagram of a fifth embodiment of the electronic package of the present application.

[0026] Fig. 7A and Figure 7B It is a cross-sectional schematic diagram of a sixth embodiment of the electronic package of the present application.

[0027] Main component symbols

[0028] 1 Semiconductor Package

[0029] 1a,2a Encapsulated Module

[0030] 1b,2b Antenna Module

[0031] 10,20 base plate

[0032] 10a,20a First side

[0033] 10b,20b Second side

[0034] 11 RF Chip

[0035] 12 Power amplifier chip

[0036] 13 Conductive elements

[0037] 2,3,4A,4B,5A,5B,6A,6B,7A,7B Electronic packaging

[0038] 200,230 Dielectric materials

[0039] 201,231 Wiring Layer

[0040] 21 First Electronic Components

[0041] 22 Second electronic component

[0042] 22a Active surface

[0043] 22b Non-active surface

[0044] 220 Bump

[0045] 221 Primer

[0046] 23 plate body

[0047] 23a First surface

[0048] 23b Second surface

[0049] 24 Antenna Structure

[0050] 25 Conductive element

[0051] 26 Conductive bumps

[0052] 27 Coating

[0053] 28 Connecting elements

[0054] 29 Encapsulation layer

[0055] 30 Shielding structure

[0056] 40 Underfill

[0057] 70 Overlay. DETAILED DESCRIPTION

[0058] The following describes the implementation methods of the present application through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.

[0059] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings attached to this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of this application, so they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects and purposes that can be achieved by this application, should still fall within the scope of the technical contents disclosed in this application. At the same time, the terms such as "on", "first", "second", and "one" cited in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of this application. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of this application without substantially changing the technical contents.

[0060] FIG. 2A to FIG. 2C It is a cross-sectional schematic diagram of a method for manufacturing the electronic package 2 of the present application.

[0061] like Figure 2A As shown, a packaging module 2a is provided. The packaging module 2a is a system in package (SiP) structure, which includes a substrate 20, a first electronic component 21 and a connecting component 28 disposed on the substrate 20, and a packaging layer 29 disposed on the substrate 20 and covering the first electronic component 21.

[0062] The substrate 20 has a first side 20a and a second side 20b opposite to each other, and is, for example, a substrate with a core layer or a coreless carrier, which forms a plurality of wiring layers 201 on a dielectric material 200, such as a redistribution layer (RDL).

[0063] The first electronic component 21 is disposed on the first side 20a of the substrate 20 and is electrically connected to the wiring layer 201. The first electronic component 21 can be, for example, an active component, a passive component, or a combination thereof. The active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, and an inductor.

[0064] In this embodiment, the first electronic component 21 is a semiconductor chip, specifically a radio frequency chip (RF IC), and is flip-chip disposed on the first side 20a of the substrate 20. In other embodiments, the first electronic component 21 can also be electrically connected to the wiring layer 201 through wire bonding, direct contact or other appropriate methods.

[0065] The connecting element 28 is disposed on the first side 20a of the substrate 20 and is exposed from the packaging layer 29, and is spaced apart from the first electronic element 21. The connecting element 28 may be a connector.

[0066] The packaging layer 29 is disposed on the first side 20a of the substrate 20 and covers the first electronic component 21. In the present embodiment, the packaging layer 29 can be an insulating material, such as polyimide (PI), dry film, epoxy resin packaging colloid or molding compound, but is not limited to the above.

[0067] In addition, a plurality of conductive bumps 26 such as solder balls are disposed on the wiring layer 201 on the second side 20 b of the substrate 20 .

[0068] In one embodiment, the shielding structure 30 can be formed on the packaging layer 29 as required, so that the shielding structure 30 covers the first electronic component 21, so that the first electronic component 21 is not subject to external electromagnetic interference. Further, the layout area of ​​the shielding structure 30 can be extended to the side of the substrate 20 as required.

[0069] like Figure 2B As shown, an antenna module 2 b is provided; a plurality of conductive elements 25 and a plurality of second electronic elements 22 are disposed on the antenna module 2 b; and a coating layer 27 covering the plurality of second electronic elements 22 and the plurality of conductive elements 25 is formed.

[0070] The antenna module 2b includes a board 23 and a plurality of antenna structures 24. The board 23 is a base material of an antenna substrate, and has a first surface 23a and a second surface 23b opposite to each other, and has a dielectric material 230 and a wiring layer 231, so that the board 23 can be a substrate with a core layer and a circuit structure or a circuit structure without a core layer (coreless), but is not limited to the above. The plurality of antenna structures 24 are arranged on the second surface 23b of the board 23 in an array manner, for example, and can include a planar antenna layer (Patch Antenna) with multi-layer circuit coupling (coupling), and can be a single-frequency antenna design or a multi-frequency antenna design with more than two bandwidths, so that the second surface 23b of the board 23 is used as an antenna signal receiving and transmitting surface.

[0071] In the present embodiment, the wiring layer 231 is made of copper, and the dielectric material 230 is, for example, polybenzoxazole (PBO), polyimide (PI), prepreg (PP), etc.

[0072] The plurality of conductive elements 25 are disposed on the first surface 23a of the board 23 and are electrically connected to the wiring layer 231. For example, the plurality of conductive elements 25 may be spherical or columnar solder or copper materials, but are not limited thereto. In other embodiments, the conductive elements 25 may also be copper core balls, but are not limited thereto.

[0073] The second electronic component 22 has an active surface 22a and an inactive surface 22b opposite to each other, and the active surface 22a is disposed on the first surface 23a of the antenna module 2b via a bump 220 and a primer 221 to be electrically connected to the wiring layer 231. The second electronic component 22 is, for example, a semiconductor chip, specifically a power amplifier chip (Amplifier IC).

[0074] In this embodiment, the second electronic component 22 is disposed on the first surface 23 a of the antenna module 2 b in a flip chip manner, but is not limited thereto and may also be electrically connected to the wiring layer 231 in other appropriate manners.

[0075] In addition, a coating layer 27 is formed on the first surface 23a of the plate body 23 to cover the second electronic component 22 and the conductive component 25 on the same side, and a thinning process such as grinding can be performed to expose the coating layer 27 on the inactive surface 22b of the second electronic component 22 and the end surface of the conductive component 25. The coating layer 27 can be, for example, an insulating material such as polyimide (PI), a dry film, a packaging colloid such as epoxy resin, or a molding compound.

[0076] In one embodiment, Figure 2A The package module 2a and Figure 2B There is no specific order in the manufacturing process of the antenna module 2b, and the antenna module 2b can be manufactured simultaneously in different production lines, or can be manufactured sequentially in the same production line.

[0077] like Figure 2C As shown, the packaging module 2a is connected to the conductive element 25 of the antenna module 2b through the conductive bump 26, so that the second electronic element 22 is located between the packaging module 2a and the antenna module 2b, and the packaging module 2a and the antenna module 2b are electrically connected to each other to obtain the electronic package 2 of the present application.

[0078] In addition, if the conductive bump 26 and the conductive element 25 are made of the same or similar material, they may be fused into one after high-temperature welding.

[0079] Since the present application can perform a grinding process on the non-active surface 22b and the coating layer 27 of the second electronic component 22 to reduce the thickness of the second electronic component 22 and the coating layer 27, and use a small-sized conductive element 25 to increase the number of contacts, the distance between the first surface 23a of the plate body 23 and the second side 20b of the substrate 20 can be reduced, thereby thinning the overall thickness of the electronic package 2.

[0080] See also Figure 3 , which is a schematic diagram of a second embodiment of the electronic package 3 of the present application. This embodiment is substantially the same as the aforementioned embodiment. Compared with the aforementioned embodiment, the second electronic component 22 (power amplifier chip) is disposed on the antenna module 2b and on the same side as the conductive component 25 so as to be closer to the antenna structure 24. In this embodiment, the second electronic component 22 is disposed on the second side 20b of the substrate 20 of the packaging module 2a in a flip-chip manner and is electrically connected to the wiring layer 201, so that the second electronic component 22 (power amplifier chip) is on the same side as the conductive bump 26 and is closer to the first electronic component 21 (RF chip). At the same time, a coating layer 27 covering the second electronic component 22 and the conductive bump 26 is formed on the second side 20b of the substrate 20, and a thinning process such as grinding is performed to expose the coating layer 27 to the outside of the inactive surface 22b of the second electronic component 22 and the end surface of the conductive bump 26. In addition, a plurality of conductive elements 25 are disposed on the antenna module 2 b so that the packaging module 2 a can be connected to the conductive elements 25 of the antenna module 2 b through the conductive bumps 26 .

[0081] See also Figure 4A and Figure 4B , which is a schematic diagram of a third embodiment of the electronic package 4A, 4B of the present application. This embodiment is substantially the same as the previous embodiment, with the main difference being that after the package module 2a is connected to the conductive element 25 of the antenna module 2b through the conductive bump 26, an underfill 40 is filled between the package module 2a and the antenna module 2b, so that the underfill 40 covers the conductive element 25 of the antenna module 2b. Figure 4A The conductive bump 26 shown or the coating as shown Figure 4B The conductive element 25 is shown.

[0082] See also Figure 5A and Figure 5B , which is a schematic diagram of the fourth embodiment of the electronic package 5A, 5B of the present application. This embodiment is substantially the same as the aforementioned embodiment, with the main difference being that the second electronic component 22 does not expose the coating layer 27, while the end surface of the conductive component 25 exposes the coating layer 27 to electrically connect the conductive bump 26.

[0083] See also Fig. 6A and Figure 6B, which is a schematic diagram of the fifth embodiment of the electronic package 6A, 6B of the present application. This embodiment is substantially the same as the previous embodiment, with the main difference being that this embodiment has a plurality of antenna modules 2b for the packaging module 2a to electrically connect the plurality of conductive elements 25 of the plurality of antenna modules 2b through a plurality of conductive bumps 26.

[0084] See also Fig. 7A and Figure 7B , which is a schematic diagram of the sixth embodiment of the electronic package 7A, 7B of the present application. This embodiment is substantially the same as the aforementioned embodiment, with the main difference being that a covering layer 70 is formed on the antenna module 2b to cover the antenna structure 24. The covering layer 70 is, for example, an epoxy molding compounds (EMC) with a high dielectric constant (Dk>3.7).

[0085] To summarize, the electronic package of the present application mainly places the second electronic component (power amplifier chip) between the antenna module and the packaging module. In addition to improving signal performance, it can also effectively reduce the layout area required for the packaging module and reduce the overall volume of the electronic package, so that the electronic package meets the requirements of being light, thin and short.

[0086] Furthermore, since the second electronic component (power amplifier chip) together with the conductive bumps (or conductive elements) are coated and thinned by the coating layer, not only can the number of conductive connections on the antenna module side be maintained, but also the final electronic package can be made thin and small (because the power amplifier chip can be thinned). In detail, the power amplifier chip cannot be thinned and then placed on the antenna module (or packaging module) because if it is thinned at the beginning and then placed on the antenna module (or packaging module), the mechanical suction nozzle will not be able to suck the power amplifier chip to the antenna module (or packaging module) for the placement process because the power amplifier chip is too thin. Therefore, in this case, the power amplifier chip is first placed on the antenna module (or packaging module), and the power amplifier chip is coated with a coating layer, so that the power amplifier chip can be further thinned, and the size of the overall electronic package can be reduced.

[0087] In addition, the aforementioned structure can solve the existing technical problems in the industry without adding new development processes and materials or purchasing equipment, so there will not be a lot of additional cost expenditure.

[0088] The above embodiments are only used to illustrate the principles and effects of the present application, and are not used to limit the present application. Any person skilled in the art may modify the above embodiments without violating the spirit and scope of the present application. Therefore, the scope of protection of the present application should be as listed in the claims.

Claims

1. An electronic package, characterized in that: include: A packaging module having a first side and a second side opposite to each other, and combined with a first electronic component and a plurality of conductive bumps, wherein the first electronic component is disposed on the first side, and the plurality of conductive bumps are disposed on the second side; The antenna module has a first surface and a second surface opposite to each other, and a plurality of conductive elements are disposed on the first surface so that the antenna module can be connected to the plurality of conductive bumps of the packaging module through the plurality of conductive elements; A second electronic component is disposed on the second side of the packaging module or the first surface of the antenna module, so that the second electronic component and the plurality of conductive bumps or the plurality of conductive components are on the same side; and The covering layer is used for covering the second electronic component and the plurality of conductive bumps or the plurality of conductive components on the same side as the second electronic component.

2. The electronic package according to claim 1, wherein: The covering layer and the second electronic element are thinned and arranged between the packaging module and the antenna module.

3. The electronic package according to claim 1, wherein: The first electronic component is a radio frequency chip, and the second electronic component is a power amplifier chip.

4. The electronic package according to claim 1, wherein: The second electronic component is disposed on the first surface of the antenna module in a flip chip manner, or is disposed on the second side of the packaging module in a flip chip manner.

5. The electronic package according to claim 1, wherein: The packaging module also includes a connecting element disposed on the first side.

6. The electronic package according to claim 1, wherein: The electronic package also includes a bottom filling glue arranged between the packaging module and the antenna module, which is used to cover the plurality of conductive bumps or the plurality of conductive elements not covered by the covering layer.

7. The electronic package according to claim 1, wherein: A portion of the surface of the second electronic component is exposed outside the coating layer.

8. The electronic package according to claim 1, wherein: The second electronic component is not exposed outside the covering layer.

9. The electronic package according to claim 1, wherein: The electronic package also includes a plurality of the antenna modules, so that the packaging module is connected to the plurality of conductive elements of the plurality of antenna modules through the plurality of conductive bumps.

10. The electronic package according to claim 1, wherein: The antenna module includes a plurality of antenna structures arranged on the second surface.

11. The electronic package according to claim 10, wherein: The electronic package also includes a covering layer which is arranged on the antenna module to cover the multiple antenna structures.

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