Ultra-thin flexible circuit board

Abstract

The utility model discloses an ultra-thin flexible circuit board, comprising: a flexible circuit board body, on which a circuit pattern is printed, and which can be bent and folded as required; a bending and folding structure, on which adhesive is arranged, and the flexible circuit board body is installed on the bending and folding structure through the adhesive; and a cooling structure, which is arranged on the bending and folding structure, and the flexible circuit board body is cooled by the cooling structure. The flexible circuit board body of the utility model can be bent and folded as required, so that it can adapt to installation spaces and product designs of various shapes, thereby improving the application range of the circuit board.

Description

Technical Field

[0001] The utility model relates to a circuit board, in particular to an ultra-thin flexible circuit board. Background Art

[0002] Traditional hard printed circuit boards (PCBs) cannot be effectively bent or folded due to their rigid texture, which greatly limits their use in certain application scenarios.

[0003] In addition, traditional PCBs also face heat dissipation problems in high-power or long-term operation environments. Insufficient heat dissipation may cause performance degradation or damage to the circuit board. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide an ultra-thin flexible circuit board to solve the problems existing in the background technology.

[0005] The ultra-thin flexible circuit board of the utility model is realized by the following technical solutions, including:

[0006] A flexible circuit board body, on which a circuit pattern is printed and which can be bent and folded as needed;

[0007] A curved and folding structure, wherein adhesive is provided on the curved and folding structure, and the flexible circuit board body is mounted on the curved and folding structure by the adhesive;

[0008] The cooling structure is arranged on the bent and folded structure, and the flexible circuit board body is cooled by the cooling structure.

[0009] As a preferred technical solution, the curved folding structure includes a first folding plate and a second folding plate;

[0010] The first folding plate and the second folding plate are rotatably connected at one end of the rotating rod and the rotating cylinder, and the other ends of the first folding plate and the second folding plate are provided with a support block, and the other ends of the first folding plate and the second folding plate are supported by the support block;

[0011] The flexible circuit board body is fixed to the front sides of the first folding plate and the second folding plate by adhesive, and the cooling structure is respectively arranged on the back sides of the first folding plate and the second folding plate.

[0012] As a preferred technical solution, the cooling structure includes semiconductor refrigeration sheets and heat dissipation fins;

[0013] The cooling end of the semiconductor refrigeration plate is fixed to the back side of the first folding plate, and the heat dissipation fin is fixed to the heating end of the semiconductor refrigeration plate, and the heat generated by the semiconductor refrigeration plate is dissipated through the heat dissipation fin.

[0014] As a preferred technical solution, a damping ring is arranged between the rotating rod at one end of the first folding plate and the second folding plate and the rotating cylinder; the damping ring is used to achieve rotation limiting between the rotating rod and the rotating cylinder, so that the first folding plate and the second folding plate can stay at any position.

[0015] As a preferred technical solution, magnets are provided on the support blocks of the first folding plate and the second folding plate, and the first folding plate and the second folding plate are adsorbed by the magnets.

[0016] As a preferred technical solution, the first folding plate and the second folding plate of the curved folding structure are both made of aluminum alloy.

[0017] The beneficial effects of the utility model are:

[0018] 1. The main body of the flexible circuit board of the utility model can be bent and folded as needed, so that it can adapt to installation spaces and product designs of various shapes, thereby improving the application range of the circuit board.

[0019] 2. The utility model installs the flexible circuit board body on the bending and folding structure by gluing, which ensures that the circuit board can remain stable even in the bending and folding state, and reduces circuit failures caused by displacement.

[0020] 3. The integrated cooling structure of the utility model can effectively cool the flexible circuit board body. The use of semiconductor cooling sheets and heat dissipation fins can effectively manage the heat of the circuit board, protect circuit components, and extend the service life of the product.

[0021] 4. The curved folding structure of the utility model is provided with a damping ring, which allows the first folding plate and the second folding plate to stay stably at any position, providing a better user experience and flexibility of use. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0024] Figure 2 It is a schematic diagram of the expanded structure of the utility model;

[0025] Figure 3 It is a schematic diagram of the planar structure of the utility model;

[0026] Figure 4 It is a partial enlarged view of the utility model.

[0027] Description of reference numerals:

[0028] 1. Flexible circuit board body; 3. First folding plate; 4. Second folding plate; 5. Rotating rod; 6. Rotating cylinder; 7. Support block; 8. Semiconductor cooling plate; 9. Heat dissipation fins; 10. Damping ring; 11. Magnet. DETAILED DESCRIPTION

[0029] All features disclosed in this specification, or steps in all methods or processes disclosed, except mutually exclusive features and / or steps, can be combined in any manner.

[0030] like Figure 1-Figure 3 As shown, an ultra-thin flexible circuit board of the utility model comprises a flexible circuit board body 1, on which a circuit pattern is printed and which can be bent and folded as required;

[0031] It also includes a bending and folding structure 2, on which adhesive is provided, and the flexible circuit board body 1 is installed on the bending and folding structure 2 by the adhesive;

[0032] It also includes a cooling structure, which is arranged on the bending and folding structure 2, and the flexible circuit board body 1 is cooled by the cooling structure.

[0033] In this embodiment, the curved folding structure 2 includes a first folding plate 3 and a second folding plate 4;

[0034] The first folding plate 3 and the second folding plate 4 are rotatably connected at one end of a rotating rod 5 and a rotating cylinder 6, and the other ends of the first folding plate 3 and the second folding plate 4 are provided with a support block 7, and the other ends of the first folding plate 3 and the second folding plate 4 are supported by the support block 7;

[0035] The flexible circuit board body 1 is fixed to the front sides of the first folding plate 3 and the second folding plate 4 by adhesive, and the cooling structures are respectively arranged on the back sides of the first folding plate 3 and the second folding plate 4 .

[0036] The cooling structure includes a semiconductor cooling sheet 8 and a heat dissipation fin 9;

[0037] The cooling end of the semiconductor refrigeration sheet 8 is fixed to the back side of the first folding plate 3, and the heat dissipation fins 9 are fixed to the heating end of the semiconductor refrigeration sheet 8, and the heat generated by the semiconductor refrigeration sheet 8 is dissipated through the heat dissipation fins 9; when the flexible circuit board body 1 is working, the semiconductor refrigeration sheet 8 absorbs the heat generated by the flexible circuit board body 1, and dissipates the heat through the heat dissipation fins 9, thereby maintaining the low temperature operation of the flexible circuit board body 1.

[0038] like Figure 4 As shown, a damping ring 10 is arranged between the rotating rod 5 at one end of the first folding plate 3 and the second folding plate 4 and the rotating cylinder 6; the damping ring 10 can effectively limit the rotation angle between the rotating rod and the rotating cylinder, so that the folding plate can stay at any required position, providing users with greater freedom of use.

[0039] In addition, magnets 11 are provided on the support blocks 7 of the first folding plate 3 and the second folding plate 4, and the first folding plate 3 and the second folding plate 4 are adsorbed by the magnets 11, thereby ensuring the stability of the circuit board in the folded state.

[0040] In addition, the first folding plate 3 and the second folding plate 4 of the curved folding structure 2 are both made of aluminum alloy.

[0041] The ultra-thin flexible circuit board of the utility model not only has high flexibility and reliability, but also can effectively solve the problems of heat dissipation and folding of traditional circuit boards;

[0042] It can be bent and folded as needed, so that it can adapt to a variety of installation spaces and product designs of different shapes, which increases the application range of the circuit board;

[0043] The flexible circuit board body is mounted on the bending and folding structure by adhesive, which ensures that the circuit board can remain stable even in the bending and folding state, reducing circuit failures caused by displacement;

[0044] The integrated cooling structure can effectively cool the main body of the flexible circuit board, and the use of semiconductor cooling sheets and heat sinks can effectively manage the heat of the circuit board, protect circuit components, and extend the service life of the product.

[0045] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that are not conceived through creative work should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope defined in the claims.

Claims

1. An ultra-thin flexible circuit board, characterized in that: include: A flexible circuit board body (1), on which a circuit pattern is printed and which can be bent and folded as required; A bending and folding structure (2), wherein adhesive is provided on the bending and folding structure (2), and the flexible circuit board body (1) is mounted on the bending and folding structure (2) by means of the adhesive; A cooling structure is provided on the bent and folded structure (2), and the flexible circuit board main body (1) is cooled by the cooling structure.

2. The ultra-thin flexible circuit board according to claim 1, characterized in that: The curved folding structure (2) comprises a first folding plate (3) and a second folding plate (4); One end of the first folding plate (3) and the second folding plate (4) are rotatably connected by a rotating rod (5) and a rotating cylinder (6); the other end of the first folding plate (3) and the second folding plate (4) is provided with a supporting block (7), and the other end of the first folding plate (3) and the second folding plate (4) are supported by the supporting block (7); The flexible circuit board body (1) is fixed to the front sides of the first folding plate (3) and the second folding plate (4) by means of adhesive, and the cooling structure is respectively arranged on the back sides of the first folding plate (3) and the second folding plate (4).

3. The ultra-thin flexible circuit board according to claim 1, characterized in that: The cooling structure comprises a semiconductor cooling sheet (8) and a heat dissipation fin (9); The cooling end of the semiconductor cooling plate (8) is fixed to the back side of the first folding plate (3), and the heat dissipation fin (9) is fixed to the heating end of the semiconductor cooling plate (8), and the heat generated by the semiconductor cooling plate (8) is dissipated through the heat dissipation fin (9).

4. The ultra-thin flexible circuit board according to claim 2, characterized in that: A damping ring (10) is provided between the rotating rod (5) at one end of the first folding plate (3) and the second folding plate (4) and the rotating cylinder (6); The damping ring (10) is used to achieve rotational limiting between the rotating rod (5) and the rotating cylinder (6), so that the first folding plate (3) and the second folding plate (4) can stay at any position.

5. The ultra-thin flexible circuit board according to claim 2, characterized in that: The support blocks (7) of the first folding plate (3) and the second folding plate (4) are both provided with magnets (11); The first folding plate (3) and the second folding plate (4) are adsorbed by a magnet (11).

6. The ultra-thin flexible circuit board according to claim 1, characterized in that: The first folding plate (3) and the second folding plate (4) of the curved folding structure (2) are both made of aluminum alloy.

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