Electronic devices

Abstract

The present application discloses an electronic device, comprising: a shell, in which a heat exchange channel is provided; a circuit board group, arranged in the shell, the circuit board group is located on one side of the heat exchange channel, and the circuit board group comprises a first circuit board and components; a fan, arranged in the shell, and the fan is provided with an air outlet, the air outlet is connected to the heat exchange channel, and the fan is used to guide air from a first end of the heat exchange channel to a second end of the heat exchange channel; when the shell is provided with a sound outlet and a charging interface, the first end of the heat exchange channel is connected to one of the sound outlet and the charging interface, and the second end of the heat exchange channel is connected to the other of the sound outlet and the charging interface; when the shell is provided with a sound outlet, a charging interface and an earphone interface, at least one of the sound outlet, the charging interface and the earphone interface is connected to the first end of the heat exchange channel, and at least one of the sound outlet, the charging interface and the earphone interface is connected to the second end of the heat exchange channel.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to an electronic equipment. Background Art

[0002] With the development of smart chips, the power consumption of mobile phones is getting higher and higher, especially when playing games. In order to give users a good gaming experience, cooling fans are added to the mobile phones.

[0003] In the related art, an air inlet and an air outlet of a cooling fan are additionally provided on the housing of the mobile phone, which seriously damages the overall appearance of the electronic device, reduces the structural strength of the housing, and increases the probability of deformation of the housing. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide an electronic device that can effectively solve or improve the technical problems of adding additional air inlets and outlets of a cooling fan on the casing of the electronic device, destroying the overall appearance of the electronic device, and reducing the structural strength of the casing.

[0005] An embodiment of the present application provides an electronic device, comprising: a shell, in which a heat exchange channel is provided; a circuit board group, arranged in the shell, the circuit board group is located on one side of the heat exchange channel, and the circuit board group includes a first circuit board and components; a fan, arranged in the shell, and the fan is provided with an air outlet, the air outlet is connected to the heat exchange channel, and the fan is used to guide air from a first end of the heat exchange channel to a second end of the heat exchange channel; when the shell is provided with a sound outlet and a charging interface, the first end of the heat exchange channel is connected to one of the sound outlet and the charging interface, and the second end of the heat exchange channel is connected to the other of the sound outlet and the charging interface; when the shell is provided with a sound outlet, a charging interface and an earphone interface, at least one of the sound outlet, the charging interface and the earphone interface is connected to the first end of the heat exchange channel, and at least one of the sound outlet, the charging interface and the earphone interface is connected to the second end of the heat exchange channel.

[0006] In an embodiment of the present application, the electronic device includes a housing, a circuit board group and a fan.

[0007] A heat exchange channel is provided in the housing, a fan is provided in the housing, and the circuit board group is located on one side of the heat exchange channel. The fan is provided with an air outlet, and the air outlet is connected to the heat exchange channel. The circuit board group includes a first circuit board and components, and the components are electrically connected to the first circuit board. The components include a controller, a power supply and other devices, which are not listed here one by one.

[0008] When the electronic device is working, if the temperature of the circuit board group is too high, the fan is controlled to work to drive the airflow in the environment to enter the heat exchange channel from the first end of the heat exchange channel and flow out of the housing through the second end of the heat exchange channel. When the airflow flows through the heat exchange channel, it can exchange heat with the circuit board group located on one side of the heat exchange channel to take away the heat from the circuit board group, which can reduce the temperature of the circuit board group, achieve the purpose of heat dissipation of the circuit board group, and help to extend the service life of the circuit board group.

[0009] A heat exchange channel is arranged in the shell, and the heat exchange channel has a first end and a second end.

[0010] When the shell is provided with a sound outlet and a charging interface, the first end of the heat exchange channel is connected to the sound outlet, and the second end of the heat exchange channel is connected to the charging interface, or the first end of the heat exchange channel is connected to the charging interface, and the second end of the heat exchange channel is connected to the sound outlet.

[0011] When the shell is provided with a sound outlet, a charging interface and an earphone interface, at least one of the sound outlet, the charging interface and the earphone interface is connected to the first end of the heat exchange channel, and at least one of the sound outlet, the charging interface and the earphone interface is connected to the second end of the heat exchange channel. For example, one of the sound outlet, the charging interface and the earphone interface is connected to the first end of the heat exchange channel. For example, both of the sound outlet, the charging interface and the earphone interface are connected to the first end of the heat exchange channel. For example, the sound outlet, the charging interface and the earphone interface are all connected to the first end of the heat exchange channel. For example, one of the sound outlet, the charging interface and the earphone interface is connected to the second end of the heat exchange channel. For example, both of the sound outlet, the charging interface and the earphone interface are connected to the second end of the heat exchange channel. For example, the sound outlet, the charging interface and the earphone interface are all connected to the second end of the heat exchange channel.

[0012] In other words, the existing structure of the shell (such as the sound outlet, charging port and headphone port) is reasonably utilized, and while ensuring the effectiveness and feasibility of the airflow flowing in the heat exchange channel, no additional opening connected to the heat exchange channel is opened on the shell. In this way, the overall appearance of the electronic device will not be damaged, and the structural strength and rigidity of the shell will not be reduced. Compared with setting an opening on the shell that is connected to the fan, the probability of deformation of the shell will be greatly reduced, which is conducive to improving the performance and market competitiveness of the product.

[0013] It can be understood that when the shell is provided with a sound outlet and a charging port, the heat exchange channel of the shell reuses the sound outlet and the charging port, enriching the use functions of the sound outlet and the charging port, and can ensure the overall appearance of the shell, and can ensure the appearance of the whole machine. Beautiful and streamlined.

[0014] It can be understood that when the shell is provided with a sound outlet, a charging port and a headphone port, the heat exchange channel of the shell reuses the sound outlet, the charging port and the headphone port, enriching the use functions of the sound outlet, the charging port and the headphone port, and can ensure the overall appearance of the shell, and can ensure the beautiful appearance and streamline of the shell.

[0015] It can be understood that the heat exchange channel has the function of limiting the flow path of the airflow. While ensuring heat exchange with the circuit board group, it also has the function of directional guidance, so that the airflow after heat exchange can be effectively discharged from the shell, avoiding the hot air from flowing to other areas in the shell, and ensuring the heat exchange effect of the electronic equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of the first part of the structure of an electronic device provided by an embodiment of the present application is shown;

[0017] Figure 2 A schematic diagram of the structure of a connector provided by an embodiment of the present application is shown;

[0018] Figure 3 A schematic diagram of the second part of the structure of an electronic device provided by an embodiment of the present application is shown.

[0019] in, Figures 1 to 3 The corresponding relationship between the reference numerals and the component names is as follows:

[0020] 10 electronic device, 100 housing, 110 heat exchange channel, 112 first end, 114 second end, 120 sound outlet, 122 first sound hole, 124 second sound hole, 130 charging interface, 140 headphone interface, 160 bracket, 162 heat conductor, 164 fin, 166 first frame, 168 second frame, 200 circuit board group, 210 first circuit board, 220 components, 300 fan, 310 first air outlet, 320 second air outlet, 330 air outlet, 400 connector, 410 connecting shell, 412 connecting port, 420 conductive terminal, 430 connecting channel, 500 heat conducting part, 600 sealing component, 700 second circuit board. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0022] The terms "first", "second", etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way are interchangeable where appropriate, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0023] The following is combined with Figures 1 to 3 An electronic device 10 provided in an embodiment of the present application is described.

[0024] like Figure 1 and Figure 2 As shown, in some embodiments of the present application, an electronic device 10 is provided, including: a housing 100, in which a heat exchange channel 110 is provided; a circuit board group 200 is provided in the housing 100, the circuit board group 200 is located on one side of the heat exchange channel 110, and the circuit board group 200 includes a first circuit board 210 and components 220; a fan 300 is provided in the housing 100, and the fan 300 is provided with an air outlet 330, the air outlet 330 is connected to the heat exchange channel 110, and the fan 300 is used to guide air from the first end 112 of the heat exchange channel 110 to the second end 114 of the heat exchange channel 110; when the housing 100 is provided with a sound outlet When the shell 100 is provided with a sound outlet 120, a charging interface 130 and an earphone interface 140, at least one of the sound outlet 120, the charging interface 130 and the earphone interface 140 is connected to the first end 112 of the heat exchange channel 110, and at least one of the sound outlet 120, the charging interface 130 and the earphone interface 140 is connected to the second end 114 of the heat exchange channel 110.

[0025] In the embodiment of the present application, the electronic device 10 includes a housing 100 , a circuit board assembly 200 and a fan 300 .

[0026] A heat exchange channel 110 is provided in the housing 100, a fan 300 is provided in the housing 100, and a circuit board group 200 is located on one side of the heat exchange channel 110. The fan 300 is provided with an air outlet 330, and the air outlet 330 is connected to the heat exchange channel 110. Among them, the circuit board group 200 includes a first circuit board 210 and components 220, and the components 220 are electrically connected to the first circuit board 210. The components 220 include controllers, power supplies and other devices, which are not listed one by one here.

[0027] When the electronic device 10 is working, if the temperature of the circuit board group 200 is too high, the fan 300 is controlled to work to drive the airflow in the environment to enter the heat exchange channel 110 from the first end 112 of the heat exchange channel 110, and flow out of the housing 100 through the second end 114 of the heat exchange channel 110. When the airflow flows through the heat exchange channel 110, it can exchange heat with the circuit board group 200 located on one side of the heat exchange channel 110 to take away the heat from the circuit board group 200, which can reduce the temperature of the circuit board group 200, achieve the purpose of dissipating heat from the circuit board group 200, and help to extend the service life of the circuit board group 200.

[0028] A heat exchange channel 110 is disposed in the housing 100 . The heat exchange channel 110 has a first end 112 and a second end 114 .

[0029] When the shell 100 is provided with a sound outlet 120 and a charging interface 130 , the first end 112 of the heat exchange channel 110 is connected to the sound outlet 120 , and the second end 114 of the heat exchange channel 110 is connected to the charging interface 130 , or the first end 112 of the heat exchange channel 110 is connected to the charging interface 130 , and the second end 114 of the heat exchange channel 110 is connected to the sound outlet 120 .

[0030] When the housing 100 is provided with a sound outlet 120, a charging interface 130 and an earphone interface 140, at least one of the sound outlet 120, the charging interface 130 and the earphone interface 140 is connected to the first end 112 of the heat exchange channel 110, and at least one of the sound outlet 120, the charging interface 130 and the earphone interface 140 is connected to the second end 114 of the heat exchange channel 110. For example, one of the sound outlet 120, the charging interface 130 and the earphone interface 140 is connected to the first end 112 of the heat exchange channel 110. For example, both of the sound outlet 120, the charging interface 130 and the earphone interface 140 are connected to the first end 112 of the heat exchange channel 110. For example, the sound outlet 120, the charging interface 130 and the earphone interface 140 are all connected to the first end 112 of the heat exchange channel 110. For example, one of the sound outlet 120, the charging interface 130 and the earphone interface 140 is connected to the second end 114 of the heat exchange channel 110. For example, two of the sound outlet 120 , the charging interface 130 , and the headphone interface 140 are connected to the second end 114 of the heat exchange channel 110 . For example, the sound outlet 120 , the charging interface 130 , and the headphone interface 140 are all connected to the second end 114 of the heat exchange channel 110 .

[0031] In other words, the existing structure of the housing 100 (such as the sound outlet 120, the charging interface 130 and the headphone interface 140) is reasonably utilized, and while ensuring the effectiveness and feasibility of the airflow flowing in the heat exchange channel 110, no additional opening connected to the heat exchange channel 110 is opened on the housing 100. In this way, the overall appearance of the electronic device 10 will not be damaged, and the structural strength and rigidity of the housing 100 will not be reduced. Compared with setting an opening on the housing 100 that is connected to the fan 300, the probability of deformation of the housing 100 will be greatly reduced, which is conducive to improving the performance and market competitiveness of the product.

[0032] It can be understood that when the shell 100 is provided with a sound outlet 120 and a charging interface 130, the heat exchange channel 110 of the shell 100 reuses the sound outlet 120 and the charging interface 130, enriching the use functions of the sound outlet 120 and the charging interface 130, and can ensure the overall appearance of the shell 100, and can ensure the appearance of the whole machine. Beautiful and streamlined.

[0033] It can be understood that when the shell 100 is provided with a sound outlet 120, a charging interface 130 and an earphone interface 140, the heat exchange channel 110 of the shell 100 reuses the sound outlet 120, the charging interface 130 and the earphone interface 140, enriching the use functions of the sound outlet 120, the charging interface 130 and the earphone interface 140, and can ensure the overall appearance of the shell 100, and can ensure the beautiful appearance and streamline of the shell 100.

[0034] It can be understood that the heat exchange channel 110 has the function of limiting the flow path of the airflow. While ensuring heat exchange with the circuit board group 200, it also has the function of directional guidance, so that the airflow after heat exchange can be effectively discharged from the shell 100, avoiding the hot air from flowing to other areas in the shell 100, and ensuring the heat exchange effect of the electronic device 10.

[0035] Optionally, the electronic device 10 can be a mobile terminal such as a mobile phone, a wearable device, a tablet computer, a laptop computer, a mobile computer, an augmented reality device (also known as an AR device), a virtual reality device (also known as a VR device), a handheld game console, etc.

[0036] In some embodiments of the present application, Figure 1 and Figure 2 As shown, the electronic device 10 further includes: a connector 400 disposed in the housing 100 , the connector 400 is electrically connected to the first circuit board 210 , and the connector 400 is provided with a communication port 412 , and the charging interface 130 and the heat exchange channel 110 are connected through the communication port 412 .

[0037] In the embodiment of the present application, the structure of the electronic device 10 is further limited.

[0038] The electronic device 10 further includes a connector 400 .

[0039] The connector 400 is disposed in the housing 100 and is electrically connected to the first circuit board 210. When other devices are plugged and connected to the connector 400 via a data line, the other devices can exchange data with the electronic device 10.

[0040] Among them, the connector 400 is provided with a communication port 412, the charging interface 130 is connected to the communication port 412, and the heat exchange channel 110 is connected to the communication port 412. That is, the charging interface 130 and the heat exchange channel 110 are connected through the communication port 412 of the connector 400. In other words, the connector 400 plays a role of switching, so that the airflow of the heat exchange channel 110 can flow to the charging interface 130 via the connector 400, or the airflow in the external environment can flow to the connector 400 and the heat exchange channel 110 in turn via the charging interface 130. This setting provides structural support for the charging interface 130 as the basis for the heat exchange channel 110 to communicate with the outside world.

[0041] It can be understood that the present application reuses the structure of the connector 400 and enriches the functions of the connector 400 , so that the connector 400 not only has the function of transmitting data, but also has the function of connecting the charging interface 130 and the heat exchange channel 110 .

[0042] In some embodiments of the present application, Figure 1 and Figure 2 As shown, the connector 400 includes: a connecting shell 410, the connecting shell 410 is provided with a connecting port 412, and the connecting shell 410 and the circuit board group 200 are located on the same side of the heat exchange channel 110; a conductive terminal 420, the connecting shell 410 surrounds the conductive terminal 420, and the inner surface of the connecting shell 410 and the conductive terminal 420 enclose a connecting channel 430, and the connecting channel 430 connects the charging interface 130 and the connecting port 412.

[0043] In the embodiment of the present application, the structure of the connector 400 is further limited.

[0044] The connector 400 includes a connection shell 410 and a conductive terminal 420. The conductive terminal 420 is disposed in the connection shell 410, and the connection shell 410 surrounds the conductive terminal 420. That is, the connection shell 410 has a function of protecting the conductive terminal 420, and the conductive terminal 420 is electrically connected to the first circuit board 210.

[0045] The inner surface of the connection shell 410 and the conductive terminal 420 enclose a connection channel 430, and the connection shell 410 is provided with a communication port 412, the connection channel 430 is connected to the charging interface 130, and the connection channel 430 is connected to the communication port 412. In this way, the charging interface 130 is connected to the communication port 412 through the connection channel 430, and the communication port 412 is connected to the heat exchange channel 110, that is, the use requirement of the heat exchange channel 110 being connected to the charging interface 130 can be guaranteed.

[0046] This configuration rationally utilizes the structure of the connection shell 410 of the connector 400, and while ensuring the effectiveness of connecting the charging interface 130 and the heat exchange channel 110, avoids the use of other devices to connect the charging interface 130 and the heat exchange channel 110, which is beneficial to reducing the modification cost of the electronic device 10 and the difficulty of processing the electronic device 10.

[0047] Among them, the connecting shell 410 and the circuit board group 200 are located on the same side of the heat exchange channel 110. When the airflow flows through the heat exchange channel 110, it can also exchange heat with the connector 400, take away the heat at the connector 400, and reduce the temperature of the connector 400, thereby achieving the purpose of dissipating heat for the circuit board group 200 and the connector 400.

[0048] In the present application, the circuit board group 200 and the connector 400 are arranged at intervals along the first end 112 to the second end 114 of the heat exchange channel 110 .

[0049] In some other embodiments, at least a portion of the circuit board assembly 200 is located between the connector 400 and the heat exchange channel 110 .

[0050] In some embodiments of the present application, Figure 1 As shown, a bracket 160 is disposed in the housing 100 , the bracket 160 and the inner surface of the housing 100 enclose a heat exchange channel 110 , and the fan 300 is connected to the bracket 160 .

[0051] In the embodiment of the present application, the structure of the housing 100 is further limited.

[0052] A bracket 160 is disposed in the housing 100 .

[0053] The bracket 160 and the inner surface of the housing 100 enclose the heat exchange channel 110, and the fan 300 is connected to the bracket 160. That is, the matching structure of the heat exchange channel 110 and the fan 300 can be ensured, so that the fan 300 can be connected to the heat exchange channel 110 to meet the use requirement of the fan 300 driving the airflow from the first end 112 of the heat exchange channel 110 to the second end 114 of the heat exchange channel 110.

[0054] Optionally, the bracket 160 includes a plastic bracket, a plastic bracket, etc., which are not listed here one by one. The plastic bracket has the function of being light in weight and being able to mitigate impact force.

[0055] In some embodiments of the present application, Figure 1 As shown, a portion of the bracket 160 is a heat conductive member 162 , and the component 220 is located between the first circuit board 210 and the heat conductive member 162 .

[0056] In the embodiment of the present application, the matching structure between the bracket 160 and the circuit board assembly 200 is further defined.

[0057] A portion of the bracket 160 is a heat conducting member 162, and the component 220 is located between the first circuit board 210 and the heat conducting member 162. This shortens the distance between the component 220 and the heat exchange channel 110. The heat conducting member 162 has the function of effectively transferring heat, so that the heat generated by the component 220 can be transferred to the heat exchange channel 110 in time, so as to enhance the heat dissipation effect of the circuit board group 200.

[0058] Among them, a part of the bracket 160 is a heat conductor 162. Compared with the entire part of the bracket 160 being the heat conductor 162, this setting can not only improve the heat dissipation effect of the circuit board group 200, but also prevent heat from being transferred to other areas of the electronic device 10, thereby ensuring the performance of the electronic device 10.

[0059] Optionally, the heat conductive member 162 includes a graphene member, a silicone member, a silicone grease member, etc., which are not listed here one by one.

[0060] In some embodiments of the present application, Figure 1 As shown, the heat conducting member 162 is provided with fins 164 .

[0061] In the embodiment of the present application, the structure of the heat conducting member 162 is further limited so that the heat conducting member 162 is provided with fins 164 .

[0062] The fins 164 have the function of increasing the heat conduction area of ​​the heat conductor 162 , and can increase the contact area with the airflow, thereby enhancing the heat dissipation effect of the electronic device 10 .

[0063] Optionally, the number of fins 164 is one. For example, the fins 164 are spiral fins.

[0064] Optionally, there are multiple fins 164, and the multiple fins 164 are arranged at intervals.

[0065] In some embodiments of the present application, Figure 1 As shown, the fins 164 are located within the heat exchange channel 110 .

[0066] In the embodiment of the present application, the setting position of the fin 164 is further limited.

[0067] Specifically, the fin 164 is located in the heat exchange channel 110. This arrangement can not only increase the contact area between the heat conductor 162 and the airflow, but also avoid interference between the fin 164 and the components on the outer surface of the bracket 160, and also avoid occupying the external installation area of ​​the bracket 160, which facilitates the reasonable layout of other components of the electronic device 10.

[0068] In some embodiments of the present application, Figure 1 As shown, a heat conducting portion 500 is further disposed in the housing 100 , and the heat conducting portion 500 is connected between the heat conducting member 162 and the component 220 .

[0069] In the embodiment of the present application, the structure of the housing 100 is further limited.

[0070] The housing 100 further includes a heat conducting portion 500 , which is connected to the heat conducting member 162 , and is connected to the component 220 . The heat conducting portion 500 is connected between the heat conducting member 162 and the component 220 .

[0071] The heat conducting part 500 is in good contact with the component 220 and the heat conducting member 162 , and plays a role in effectively transferring the heat of the component 220 to the heat conducting member 162 , which is beneficial to enhancing the heat dissipation effect of the circuit board assembly 200 .

[0072] Optionally, the heat-conducting part 500 includes a heat-conducting mud, a silicone part, a silicone grease part, etc., which are not listed here one by one.

[0073] In some embodiments of the present application, Figure 1 As shown, there are two air vents 330 , which are respectively denoted as a first air vent 310 and a second air vent 320 . The bracket 160 includes: a first frame 166 , which is connected between the first air vent 310 and the sound outlet 120 ; a second frame 168 , which is connected between the second air vent 320 and the charging port 130 , and a portion of the second frame 168 is a heat conductor 162 .

[0074] In the embodiment of the present application, the structure of the bracket 160 is further limited.

[0075] Specifically, the bracket 160 includes a first frame body 166 and a second frame body 168 .

[0076] The fan 300 has two air outlets 330, which are respectively recorded as a first air outlet 310 and a second air outlet 320. The first frame 166 is connected between the first air outlet 310 and the sound outlet 120, and the second frame 168 is connected between the second air outlet 320 and the charging interface 130. In this way, the airflow can flow into the first frame 166 through the sound outlet 120, and flow to the charging interface 130 through the first air outlet 310, the second air outlet 320 and the second frame 168 in sequence. Alternatively, the airflow can flow into the second frame 168 through the charging interface 130, and flow to the sound outlet 120 through the second air outlet 320, the first air outlet 310 and the first frame 166 in sequence.

[0077] It can be understood that the first frame 166 , the second frame 168 and the inner surface of the shell 100 enclose a heat exchange channel 110 .

[0078] It is understandable that a portion of the second frame 168 is the heat conducting member 162 to ensure that the component 220 is located between the first circuit board 210 and the heat conducting member 162 .

[0079] In some embodiments of the present application, Figure 1 As shown, the electronic device 10 further includes: a seal 600 , which is used to seal the connection between the bracket 160 and the inner surface of the housing 100 , and to seal the connection between the fan 300 and the bracket 160 .

[0080] In the embodiment of the present application, the structure of the electronic device 10 is further limited.

[0081] Specifically, the electronic device 10 further includes a seal 600. The seal 600 is located between the bracket 160 and the inner surface of the housing 100, and the seal 600 is used to seal the connection between the bracket 160 and the inner surface of the housing 100. The seal 600 is also located between the fan 300 and the bracket 160, and the seal 600 is also used to seal the connection between the fan 300 and the bracket 160.

[0082] This arrangement can prevent the airflow from leaking out through the connection between the bracket 160 and the inner surface of the housing 100, and can also prevent the airflow from leaking out through the connection between the fan 300 and the bracket 160. In this way, the cooling effect of the circuit board assembly 200 can be ensured, and the airflow can be prevented from flowing to other areas of the electronic device 10, so that the temperature at different positions of the electronic device 10 can be guaranteed.

[0083] Optionally, the seal 600 is also used to seal the connection between the connector 400 and the inner surface of the housing 100 .

[0084] Optionally, the sealing member 600 includes foam, rubber, silicone, etc., which are not listed here one by one.

[0085] In some embodiments of the present application, Figure 3 As shown, the sound outlet 120 includes at least one first sound hole 122 and at least one second sound hole 124 , and the heat exchange channel 110 is in communication with the at least one first sound hole 122 .

[0086] In the embodiment of the present application, the matching structure of the sound outlet 120 and the heat exchange channel 110 is further defined.

[0087] The sound outlet 120 includes at least one first sound hole 122 and at least one second sound hole 124. The first end 112 of the heat exchange channel 110 is connected to the at least one first sound hole 122, and / or the second end 114 of the heat exchange channel 110 is connected to the at least one first sound hole 122.

[0088] That is, the area of ​​the sound outlet 120 is divided so that a part of the area of ​​the sound outlet 120 (i.e., at least one first sound hole 122) is connected to the heat exchange channel 110. In this way, the effective flow of air between the heat exchange channel 110 and the external environment can be ensured, and the increase of the operating noise of the electronic device 10 during operation can be avoided.

[0089] It can be understood that a portion of the sound outlet 120 is used for emitting sound, and another portion of the sound outlet 120 is used for communicating with the heat exchange channel 110 .

[0090] In some embodiments of the present application, the component 220 includes a controller and / or a power supply.

[0091] In the embodiment of the present application, the types of components 220 are further limited.

[0092] Specifically, the component 220 includes a controller and / or a power supply.

[0093] For example, the components 220 include a controller. For example, the components 220 include a power supply. For example, the components 220 include a controller and a power supply.

[0094] In some embodiments of the present application, Figure 1 As shown, the electronic device 10 further includes: a second circuit board 700 , the second circuit board 700 is electrically connected to the connector 400 , and the second circuit board 700 is electrically connected to the first circuit board 210 .

[0095] In the embodiment of the present application, the structure of the electronic device 10 is further limited.

[0096] Specifically, the electronic device 10 further includes a second circuit board 700. The second circuit boards 700 are spaced apart on one side of the first circuit board 210, and are electrically connected to the connector 400, and the second circuit board 700 is electrically connected to the first circuit board 210. The second circuit board 700 is electrically connected to the first circuit board 210 via a connecting line.

[0097] The charging interface 130 of the present application is used as an air outlet for heat dissipation, and a part of the sound outlet 120 is used as an air inlet for heat dissipation, thereby eliminating separate air outlets and air inlets, which can meet the heat dissipation requirements of the product and beautify the appearance of the electronic device 10.

[0098] Alternatively, if Figure 1 As shown, a controller (eg, a central processing unit (CPU)) is fixed on a first circuit board 210, a connector 400 (eg, a Type-C connector) is fixed on a second circuit board 700, and the second circuit board 700 is electrically connected to the first circuit board 210 via a cable.

[0099] Alternatively, if Figure 1 As shown, a communication port 412 is provided on the side of the connector 400, and the connector 400 is sealed with the housing 100 through a seal 600 (e.g., foam), and the connector 400 is sealed with the bracket 160 through a seal 600. The bracket 160 and the inner surface of the housing 100 enclose a heat exchange channel 110, and air flows from the heat exchange channel 110 to the outside of the electronic device 10.

[0100] Alternatively, if Figure 1 As shown, the bracket 160 includes a first frame 166 and a second frame 168 . The first frame 166 and the second frame 168 are both plastic frames, and the heat conducting member 162 is a heat conducting sheet.

[0101] Optionally, the heat conducting part 500 includes heat conducting mud, and the heat conducting part 500 is in good contact with the controller and the heat conducting sheet, so as to transfer the heat of the controller to the heat conducting sheet. The heat conducting sheet is provided with fins 164 to increase the contact area with the airflow, thereby enhancing the heat dissipation effect.

[0102] Optionally, the fan 300 is electrically connected to the first circuit board 210 via a cable. When the temperature of the controller rises too high during operation of the electronic device 10, the fan 300 is driven to start working, and the gas of the electronic device 10 is discharged from the housing 100 through the heat exchange channel 110, thereby achieving a heat dissipation effect.

[0103] Alternatively, if Figure 3 As shown, the sound outlets 120 around the electronic device 10 hide the air intake holes for heat dissipation. Most of the sound outlet 120 is used for sound production, and a small part of the sound outlet 120 is used as an air intake hole. Air flows continuously from the air intake holes around the electronic device 10 and then flows out from the connecting port 412 of the connector 400, forming a complete air flow channel. Figure 1 The arrows in the diagram indicate the direction of air flow.

[0104] Optionally, the bracket 160 and the inner surface of the shell 100 enclose a separately sealed heat exchange channel 110 to achieve waterproof and dustproof effects.

[0105] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0106] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: A shell, wherein a heat exchange passage is provided in the shell; A circuit board group is arranged in the housing, the circuit board group is located on one side of the heat exchange channel, and the circuit board group includes a first circuit board and components; A fan is disposed in the housing and is provided with an air outlet, the air outlet is connected to the heat exchange channel, and the fan is used to guide the flow from the first end of the heat exchange channel to the second end of the heat exchange channel; When the housing is provided with a sound outlet and a charging interface, the first end of the heat exchange channel is connected to one of the sound outlet and the charging interface, and the second end of the heat exchange channel is connected to the other of the sound outlet and the charging interface; When the shell is provided with a sound outlet, a charging interface and an earphone interface, at least one of the sound outlet, the charging interface and the earphone interface is connected to the first end of the heat exchange channel, and at least one of the sound outlet, the charging interface and the earphone interface is connected to the second end of the heat exchange channel.

2. The electronic device according to claim 1, characterized in that: Also includes: A connector is disposed in the housing, the connector is electrically connected to the first circuit board, and the connector is provided with a communication port, and the charging port and the heat exchange channel are communicated through the communication port.

3. The electronic device according to claim 2, characterized in that: The connector comprises: A connecting shell, wherein the connecting shell is provided with the communicating port, and the connecting shell and the circuit board group are located on the same side of the heat exchange channel; A conductive terminal, the connecting shell surrounds the conductive terminal, the inner surface of the connecting shell and the conductive terminal enclose a connecting channel, and the connecting channel connects the charging interface and the connecting port.

4. The electronic device according to any one of claims 1 to 3, characterized in that: A bracket is arranged in the shell, the bracket and the inner surface of the shell enclose the heat exchange channel, and the fan is connected to the bracket.

5. The electronic device according to claim 4, characterized in that: A portion of the bracket is a heat conducting member, and the component is located between the first circuit board and the heat conducting member.

6. The electronic device according to claim 5, characterized in that: A heat conducting part is also provided in the shell, and the heat conducting part is connected between the heat conducting member and the component.

7. The electronic device according to claim 5, characterized in that: The number of the air outlets is two, the two air outlets are respectively recorded as a first air outlet and a second air outlet, and the bracket includes: A first frame, the first frame being connected between the first air outlet and the sound outlet; The second frame is connected between the second air outlet and the charging interface, and a part of the second frame is the heat conductive element.

8. The electronic device according to claim 4, characterized in that: Also includes: A sealing member is used for sealing a connection between the bracket and the inner surface of the housing, and for sealing a connection between the fan and the bracket.

9. The electronic device according to any one of claims 1 to 3, characterized in that: The sound outlet includes at least one first sound hole and at least one second sound hole, and the heat exchange channel is connected to at least one of the first sound holes.

10. The electronic device according to claim 2 or 3, characterized in that: Also includes: A second circuit board is electrically connected to the connector, and the second circuit board is electrically connected to the first circuit board.

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