Anti-open circuit packaging structure for light source module

Abstract

The utility model discloses an anti-open circuit packaging structure for a light source module, comprising a packaging cup body and a bracket arranged inside the packaging cup body, the bracket is open and upward, and a chip is welded to the bottom of the bracket through a lead wire, a lens with a hollow structure is arranged above the bracket, and the bottom edge of the lens is bonded and connected to the packaging cup body and the edge of the bracket. The utility model solves the problem of easy open circuit and disconnection of semiconductors and light source modules in the prior art using traditional glue filling and other methods.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, in particular to an open circuit prevention packaging structure for a light source module. Background Art

[0002] In the current traditional light source module and other semiconductor packaging processes, packaging is generally carried out by injection molding, molding, glass and other methods. These packaging methods dispense glue on the chip, and the glue is an organic matter with strong water absorption. The light source needs to be soldered with tin at high temperature during packaging. When the temperature exceeds 100°C, water will evaporate, thereby generating stress. When the stress is greater than the tension of the welding wire, the welding wire will break, resulting in poor electrical performance.

[0003] In view of this, this technical solution proposes an anti-open circuit packaging structure for the light source module, which adopts a high-temperature bonding structure between the silicone lens and the edge of the cup. There is no glue in the cup, and the traditional method of injecting glue in the cup is no longer used, so that the light source will no longer be broken by the stress of the glue and cause open circuit and other electrical problems. Utility Model Content

[0004] The technical solution of this utility model is intended to at least partially solve one of the technical problems in the related art. To this end, the main purpose of this utility model is to provide an anti-open circuit packaging structure for light source modules, aiming to solve the problem of semiconductor and light source modules being prone to open circuit and disconnection when using traditional methods such as glue potting in the prior art.

[0005] To achieve the above object, the utility model provides an anti-open circuit packaging structure for a light source module, comprising a packaging cup body and a bracket arranged inside the packaging cup body, the bracket being open upward, and a chip being welded to the bottom of the bracket through a lead wire.

[0006] A lens with a hollow structure is provided above the bracket, and the bottom edge of the lens is bonded and connected to the packaging cup body and the edge of the bracket.

[0007] As a further solution of the present invention, the lens is a silicone cap structure.

[0008] As a further solution of the present invention, the bracket is a plastic frame structure.

[0009] As a further solution of the present invention, the bonding structure between the lens, the bracket and the edge of the packaging cup body is high-temperature hot-melt bonding.

[0010] The beneficial effects of the utility model are as follows:

[0011] This new design utilizes a hollow silicone cap-shaped lens structure to prevent open circuits in light source modules. This eliminates the need for glue to be injected into the lens cup, thus preventing the light source from breaking or opening due to glue stress. The lens is connected to the bracket and packaging cup using hot melt bonding. The silicone cap structure saves raw materials, simplifies assembly, and extends product life. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the utility model technical solution or the utility model technical solution in the prior art, the drawings required for use in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model technical solution. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0013] Figure 1 This is a perspective structural diagram of the packaging product of the utility model.

[0014] Figure 2 This is a schematic diagram of the top perspective structure of the packaging product of the utility model.

[0015] Figure 3 This is a perspective structural diagram of a prior art packaging product.

[0016] [Main parts / assembly reference numerals]

[0017] Label name Label name 1 lens 30 lead 2 bracket 4 Packaging cup 3 chip DETAILED DESCRIPTION

[0018] as follows:

[0019] Please see the attached Figure 1-3

[0020] The main structure includes a packaging cup body 4 and a bracket 2 arranged inside the packaging cup body 4. The bracket 2 is open upward, and a chip 3 is welded to the bottom of the bracket 2 through a lead 30. A hollow lens 1 is provided above the bracket 2, and the bottom edge of the lens 1 is bonded to the packaging cup body 4 and the edge of the bracket 2.

[0021] Here’s how it works:

[0022] Since the full-glue injection structure of the traditional packaging structure is abandoned, the stress effect during the high-temperature soldering of the chip 3 is avoided, and the open circuit problem caused by the disconnection of the bonding wire is avoided.

[0023] The assembly process is roughly as follows: first, a mold is made to make the silicone lens 1, and after cutting, silicone is used for high-temperature bonding to ensure that there is no colloid in the cup.

[0024] A preferred embodiment of the present invention: the lens 1 is a silicone cap structure.

[0025] A preferred embodiment of the present invention is that the bracket 2 is a plastic frame structure. The bonding structure of the lens 1, the bracket 2 and the edge of the packaging cup 4 is a high-temperature hot melt bonding.

[0026] The above are only preferred embodiments of the technical solution of the present utility model, and do not limit the patent scope of the technical solution of the present utility model. All equivalent structural transformations made by using the contents of the description and drawings of the technical solution of the present utility model under the conception of the technical solution of the present utility model, or direct / indirect application in other related technical fields are included in the patent protection scope of the technical solution of the present utility model.

Claims

1. An anti-open circuit packaging structure for a light source module, characterized in that: include A packaging cup body, and a bracket arranged inside the packaging cup body, wherein the bracket is open upward, and a chip is welded to the bottom of the bracket through a lead wire. A lens with a hollow structure is provided above the bracket, and the bottom edge of the lens is bonded to the packaging cup body and the edge of the bracket. The lens is a silicone cap structure, and the bonding structure between the lens, the bracket and the edge of the packaging cup body is high-temperature hot-melt bonding.

2. The anti-open circuit packaging structure for a light source module according to claim 1, characterized in that: The support is a plastic frame structure.

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