Cleaning system

Abstract

The utility model discloses a cleaning system. The cleaning system comprises: a housing (10); the circuit board (20) is arranged in the shell (10); and the heat dissipation assembly (30) is connected with the shell (10) and is attached to the circuit board (20).

Description

Technical Field

[0001] The present application belongs to the field of electrical appliance technology, and specifically relates to a cleaning system. Background Art

[0002] With the advancement of science and technology and the development of society, cleaning systems for automatic cleaning, such as sweeping robots and floor scrubbers, have gradually entered people's lives. In order to realize that the cleaning system can perform automatic cleaning, a CPU (Central Processing Unit) is set in the cleaning system, and the CPU performs data processing to control the cleaning system to perform automatic cleaning.

[0003] However, in the prior art, during data processing, the energy loss generated by the internal electronic components of the cleaning system's CPU is converted into heat, causing the cleaning system's CPU to overheat, causing the CPU to freeze under high load, which may trigger temperature protection and automatically reduce the frequency, thereby reducing CPU performance. Summary of the invention

[0004] In order to solve the technical problem that the CPU of the current cleaning system is overheated, resulting in reduced CPU performance, the present application provides a cleaning system.

[0005] In a first aspect of the present application, a cleaning system is provided, comprising: a shell; a circuit board disposed in the shell; and a heat dissipation component connected to the shell and bonded to the circuit board.

[0006] In some embodiments, the heat dissipation assembly includes: a heat conductive member, which is attached to the circuit board and connected to the housing; and a plurality of heat dissipating members, which are arranged in parallel and at intervals on the end surface of the heat conductive member facing away from the circuit board.

[0007] In some embodiments, the heat conducting member includes: a heat conducting portion, which is attached to the circuit board and connected to the plurality of heat dissipating members; and a connecting portion, which is connected to the heat conducting portion and the housing.

[0008] In some embodiments, a first connecting hole is formed on the connecting portion, a second connecting hole is formed on the shell, and the cleaning system further comprises a plurality of connecting members, and the connecting members are passed through the first connecting hole and connected to the second connecting hole.

[0009] In some embodiments, a plurality of heat sinks are disposed between the heat conducting portion and an inner wall of the housing.

[0010] In some embodiments, the housing has a button mounting position and a distance measuring component mounting position, and the heat dissipation assembly is located between the button mounting position and the distance measuring component mounting position.

[0011] In some embodiments, the heat dissipation assembly is provided with an avoidance groove for avoiding the button installation position.

[0012] In some embodiments, the heat dissipation assembly has a heat dissipation channel, and an extension direction of the heat dissipation channel is staggered with the button installation position and the distance measuring component installation position.

[0013] In some embodiments, the circuit board has a heat-conducting area that is in contact with the heat dissipation component.

[0014] The cleaning system provided according to one or more embodiments of the present application has at least the following technical effects:

[0015] Since the circuit board is arranged in the shell, the shell accommodates the circuit board to protect the circuit board, avoid the collision of the circuit board with external debris, avoid external impurities (such as dust, water, etc.) from falling on the circuit board, ensure the safety of the circuit board, and at the same time, avoid the circuit board from being exposed to the outside, ensure the beauty of the cleaning system as a whole.

[0016] Since the heat dissipation assembly is connected to the shell, the heat dissipation assembly can be supported by the shell to ensure the stability of the installation of the heat dissipation assembly. At the same time, the heat dissipation assembly can be avoided from being installed on the circuit board, thereby ensuring the integrity of the circuit board.

[0017] Since the heat dissipation component is attached to the circuit board, the heat generated by the circuit board during data processing will be transferred to the heat dissipation component and dissipated through the heat dissipation component to achieve rapid cooling of the circuit board, reduce the possibility of overheating of the circuit board, avoid the circuit board from freezing under high load, and avoid automatic frequency reduction of the circuit board, thereby ensuring the performance of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 A schematic diagram of the structure of a cleaning system in one or more embodiments of the present application is shown.

[0020] Figure 2 Shows Figure 1 Exploded view of the cleaning system.

[0021] Figure 3 Shows Figure 2 Schematic diagram of the bonding between the heat dissipation component and the circuit board of the cleaning system.

[0022] Figure 4 Shows Figure 2 Schematic diagram of the connection between the heat dissipation component and the shell of the cleaning system.

[0023] Figure 5 Shows Figure 2 Schematic diagram of the structure of the heat dissipation component of the cleaning system.

[0024] Description of reference numerals:

[0025] 10-housing; 101-button mounting position; 102-distance measuring component mounting position; 20-circuit board; 30-heat dissipation assembly; 301-heat conducting component; 3011-heat conducting part; 3012-connecting part; 3013-first connecting hole; 302-heat dissipation component; 303-avoidance groove; 304-heat dissipation channel; 40-connecting component. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0027] In addition, the present application may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity, and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides various specific examples of processes and materials, but those of ordinary skill in the art may recognize the application of other processes and / or the use of other materials.

[0028] See also Figure 1 and Figure 2 In a first aspect of the present application, a cleaning system is provided, including: a housing 10, a circuit board 20 and a heat dissipation assembly 30. The circuit board 20 is disposed in the housing 10. The heat dissipation assembly 30 is connected to the housing 10 and is bonded to the circuit board 20.

[0029] The cleaning system may be an automatic floor scrubber, a sweeping robot, an automatic sweeper, etc., and the embodiments of the present application are not limited thereto.

[0030] The heat dissipation component 30 may be made of metal, such as copper, aluminum, aluminum alloy, etc.

[0031] Since the circuit board 20 is arranged in the shell 10, the shell 10 accommodates the circuit board 20 to protect the circuit board 20, avoid the collision of the circuit board 20 with external debris, avoid external impurities (such as dust, water, etc.) from falling on the circuit board 20, ensure the safety of the circuit board 20, and at the same time, avoid the circuit board 20 from being exposed to the outside, ensure the beauty of the cleaning system as a whole.

[0032] Since the heat dissipation assembly 30 is connected to the housing 10 , the housing 10 can support the heat dissipation assembly 30 to ensure the stability of the installation of the heat dissipation assembly 30 . At the same time, the heat dissipation assembly 30 can be avoided from being installed on the circuit board 20 , thereby ensuring the integrity of the circuit board 20 .

[0033] Since the heat dissipation component 30 is attached to the circuit board 20, during the process of data processing by the circuit board 20, the heat generated by the circuit board 20 will be transferred to the heat dissipation component 30 and dissipated through the heat dissipation component 30 to achieve rapid cooling of the circuit board 20, reduce the possibility of overheating of the circuit board 20, avoid the circuit board 20 from freezing under high load, and avoid automatic frequency reduction of the circuit board 20, thereby ensuring the performance of the circuit board 20.

[0034] See also Figure 2 Figure 3 and Figure 5 In some embodiments, in order to achieve heat dissipation of the circuit board 20, the heat dissipation assembly 30 includes: a heat conductive member 301 and a plurality of heat dissipation members 302. The heat conductive member 301 is attached to the circuit board 20 and connected to the housing 10.

[0035] In some embodiments, in order to facilitate the assembly and disassembly of the circuit board 20 in the housing 10, the circuit board 20 can be connected to the housing 10 by bolts. Of course, in some other embodiments, the circuit board 20 can also be connected to the housing 10 by buckles. This application embodiment is not limited.

[0036] In some embodiments, during the process of data processing by the circuit board 20, the heat generated by the circuit board 20 will be transferred to the heat conductor 301, and then transferred to the heat sink 302 through the heat conductor 301. The heat is dissipated by the heat sink 302 to achieve rapid cooling of the circuit board 20, reduce the possibility of overheating of the circuit board 20, avoid the circuit board 20 from freezing under high load, and avoid automatic frequency reduction of the circuit board 20, thereby ensuring the performance of the circuit board 20.

[0037] In some embodiments, in order to ensure that the heat conductive member 302 can fit the circuit board 20, multiple heat sinks 302 are arranged on the end surface of the heat conductive member 301 facing away from the circuit board 20, so that the heat generated by the circuit board 20 can be fully transferred to the heat conductive member 301, thereby achieving rapid cooling of the circuit board 20.

[0038] See also Figure 3 and Figure 5 In some embodiments, in order to ensure the heat dissipation effect of the circuit board 20, multiple heat sinks 302 are arranged in parallel and spaced apart, which can increase the heat dissipation area, achieve full dissipation of the heat transferred by the heat conductor 301, achieve rapid cooling of the circuit board 20, reduce the possibility of overheating of the circuit board 20, avoid the circuit board 20 from freezing under high load, and avoid automatic frequency reduction of the circuit board 20, thereby ensuring the performance of the circuit board 20.

[0039] In some embodiments, in order to ensure the stability of the connection between the heat conducting member 301 and the plurality of heat dissipating members 302 and also to reduce the processing cost, the heat conducting member 301 and the plurality of heat dissipating members 302 may be integrally formed.

[0040] In some embodiments, in order to further improve the heat dissipation effect of the circuit board 20, the length of the heat sink 302 matches the length of the heat conductor 301. The heat conductor 301 can fully transfer the heat of the circuit board 20 to the heat sink 302, thereby ensuring the heat dissipation area, achieving rapid cooling of the circuit board 20, reducing the possibility of overheating of the circuit board 20, avoiding the circuit board 20 from freezing under high load, and avoiding automatic frequency reduction of the circuit board 20, thereby ensuring the performance of the circuit board 20.

[0041] See also Figure 2 , Figure 3 and Figure 5 In some embodiments, in order to achieve heat conduction, the heat conducting member 301 includes: a heat conducting portion 3011 and a connecting portion 3012. The heat conducting portion 3011 is attached to the circuit board 20 and connected to the plurality of heat dissipating members 302. The connecting portion 3012 is connected to the heat conducting portion 3011 and the housing 10.

[0042] In some embodiments, during the process of data processing by the circuit board 20, the heat generated by the circuit board 20 will be transferred to the heat conducting portion 3011, and then transferred to the heat sink 302 through the heat conducting portion 3011. The heat is dissipated by the heat sink 302 to achieve rapid cooling of the circuit board 20, reduce the possibility of overheating of the circuit board 20, avoid the circuit board 20 from freezing under high load, and avoid automatic frequency reduction of the circuit board 20, thereby ensuring the performance of the circuit board 20.

[0043] In some embodiments, the heat conducting part 3011 is installed on the shell 10 through the connecting part 3012, and the heat conducting part 3011 can be supported by the shell 10 to ensure the stability of the installation of the heat conducting part 3011. At the same time, the heat conducting part 3011 can be avoided from being installed on the circuit board 20, thereby ensuring the integrity of the circuit board 20.

[0044] In some embodiments, in order to further ensure the stability of the connection between the heat conductive member 301 and the shell 10, the number of the connecting parts 3012 can be two, and the two connecting parts 3012 are respectively located on two opposite sides of the heat conductive member 3011, and are connected to the shell 10 through the two connecting parts 3012, thereby ensuring the stability of the shell 10 supporting the heat conductive member 301.

[0045] In some embodiments, when the number of the connecting parts 3012 is two, the length of one of the two connecting parts 3012 matches the length of the heat conducting part 3011, and the length of the other of the two connecting parts 3012 is less than the length of the heat conducting part 3011, so as to avoid other components in the shell 10 and facilitate the arrangement of other components in the shell 10.

[0046] See also Figure 3 , Figure 4 and Figure 5 In some embodiments, in order to achieve the connection between the connecting portion 3012 and the housing 10, a first connecting hole 3013 is provided on the connecting portion 3012, and a second connecting hole is provided on the housing 10. The cleaning system further includes: a plurality of connecting members 40. The connecting members 40 are provided through the first connecting hole 3013 and connected with the second connecting hole. The connecting members 40 may be bolts.

[0047] In some embodiments, the connecting member 40 is passed through the first connecting hole 3013 and connected to the second connecting hole to fasten the connecting part 3012 to the shell 10, so that the shell 10 supports the heat conducting part 3011 to ensure the stability of the installation of the heat conducting part 3011. At the same time, the heat conducting part 3011 can be avoided from being installed on the circuit board 20, thereby ensuring the integrity of the circuit board 20.

[0048] In some embodiments, the number of first connecting holes 3013 may be multiple, the number of second connecting holes may be multiple, and the number of connecting members 40 may be multiple. The multiple first connecting holes 3013 and the multiple second connecting holes correspond one-to-one with the multiple connecting members 40, and the connecting members 40 are inserted into the corresponding first connecting holes 3013 and connected with the second connecting holes.

[0049] Of course, in some other embodiments, the connecting part 3012 can also be connected to the shell 10 by a snap, so that the shell 10 supports the heat conducting part 3011 to ensure the stability of the installation of the heat conducting part 3011. At the same time, it can avoid installing the heat conducting part 3011 on the circuit board 20, thereby ensuring the integrity of the circuit board 20.

[0050] See also Figure 1 and Figure 2In some embodiments, in order to ensure the heat dissipation effect of the circuit board 20, multiple heat sinks 302 are arranged between the heat conducting part 3011 and the inner wall of the shell 10, that is, the multiple heat sinks 302 and the circuit board 20 are respectively located on the opposite sides of the heat conducting part 3011. When the heat conducting part 3011 transfers the heat of the circuit board 20 to the heat sink 302, the heat sink 302 can dissipate the heat in the direction away from the circuit board 20, so as to achieve rapid cooling of the circuit board 20, reduce the possibility of overheating of the circuit board 20, avoid the circuit board 20 from being frozen under high load, and avoid the circuit board 20 from automatically reducing the frequency, thereby ensuring the performance of the circuit board 20.

[0051] See also Figure 3 , Figure 4 and Figure 5 In some embodiments, in order to ensure the heat dissipation effect of the circuit board 20, the heat conducting portion 3011 has a plane that fits with the circuit board 20, so that the heat of the circuit board 20 can be fully transferred to the heat conducting portion 3011, and transferred to the heat sink 302 through the heat conducting portion 3011. The heat is dissipated through the heat sink 302 to achieve rapid cooling of the circuit board 20, reduce the possibility of overheating of the circuit board 20, avoid the circuit board 20 from being frozen under high load, and avoid automatic frequency reduction of the circuit board 20, thereby ensuring the performance of the circuit board 20.

[0052] See also Figure 3 , Figure 4 and Figure 5 In some embodiments, in order to prevent the heat dissipation component 30 from interfering with the installation of components inside the shell 10, the shell 10 has a button installation position 101 and a distance measuring component installation position 102, and the heat dissipation component 30 is located between the button installation position 101 and the distance measuring component installation position 102, so that the heat dissipation component 30 avoids the button installation position 101 and the distance measuring component installation position 102, so as to facilitate the installation of components at the button installation position 101 and the distance measuring component installation position 102. At the same time, the space inside the shell 10 can be fully utilized, thereby improving space utilization.

[0053] See also Figure 3 , Figure 4 and Figure 5 In some embodiments, in order to prevent the heat dissipation component 30 from interfering with the installation of the button on the housing 10, a avoidance groove 303 is provided on the heat dissipation component 30 to avoid the button installation position 101, so as to facilitate the installation of the button on the button installation position 101. The avoidance groove 303 can be provided on the connection portion 3012 of the heat dissipation component 30.

[0054] See also Figure 3 , Figure 4 and Figure 5In some embodiments, in order to ensure the normal operation of the components in the housing 10, the heat dissipation assembly 30 has a heat dissipation channel 304, and the extension direction of the heat dissipation channel 304 is staggered with the button installation position 101 and the distance measuring component installation position 102, so as to prevent the heat dissipation channel 304 from dissipating heat to the button installation position 101 and the distance measuring component installation position 102, and to prevent the heat dissipated by the heat dissipation channel 304 from interfering with the operation of the components at the button installation position 101 and the distance measuring component installation position 102. Among them, a heat dissipation channel is formed between two adjacent heat dissipation parts 302 of the multiple heat dissipation parts 302 of the heat dissipation assembly 30.

[0055] In some embodiments, in order to ensure the heat dissipation effect of the circuit board 20, the circuit board 20 has a heat-conducting area that is in contact with the heat dissipation component 30. That is to say, the heat-conducting area can be a high-temperature area of ​​the circuit board 20, and no other structure will be installed in the heat-conducting area. Sufficient space is provided for the circuit board 20 to be in contact with the heat dissipation component 30 to ensure that the circuit board 20 can be fully in contact with the heat dissipation component 30.

[0056] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0057] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise" and "counterclockwise" indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0058] It should be noted that all directional indications in the embodiments of the present application are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0059] In this application, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0060] In addition, the descriptions of "first", "second", etc. in this application are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0061] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.

[0062] In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0063] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A cleaning system, characterized in that: include: Housing (10); A circuit board (20) is arranged in the housing (10); A heat dissipation component (30) connected to the housing (10) and bonded to the circuit board (20); Wherein, the circuit board (20) has a heat-conducting area that fits the heat dissipation component (30).

2. The cleaning system according to claim 1, characterized in that The heat dissipation component (30) comprises: A heat conducting member (301) is attached to the circuit board (20) and connected to the housing (10); A plurality of heat dissipating elements (302) are arranged in parallel and at intervals on the end surface of the heat conducting element (301) facing away from the circuit board (20).

3. The cleaning system according to claim 2, characterized in that: The heat conducting member (301) comprises: A heat conducting portion (3011) is attached to the circuit board (20) and connected to the plurality of heat sinks (302); A connecting portion (3012) is connected to the heat conducting portion (3011) and the shell (10).

4. The cleaning system according to claim 3, characterized in that: The connecting portion (3012) is provided with a first connecting hole (3013), the shell (10) is provided with a second connecting hole, and the cleaning system further comprises a plurality of connecting members (40), wherein the connecting members (40) are passed through the first connecting hole (3013) and connected to the second connecting hole.

5. The cleaning system according to claim 3, characterized in that: The plurality of heat sinks (302) are arranged between the heat conducting portion (3011) and the inner wall of the shell (10).

6. The cleaning system according to claim 3, characterized in that: The heat conducting portion (3011) has a plane that fits the circuit board (20).

7. The cleaning system according to any one of claims 1 to 6, characterized in that: The housing (10) has a button mounting position (101) and a distance measuring component mounting position (102), and the heat dissipation component (30) is located between the button mounting position (101) and the distance measuring component mounting position (102).

8. The cleaning system according to claim 7, characterized in that The heat dissipation component (30) is provided with an avoidance groove (303) for avoiding the button installation position (101).

9. The cleaning system according to claim 7, characterized in that: The heat dissipation assembly (30) has a heat dissipation channel (304), and the extension direction of the heat dissipation channel (304) is staggered with the button installation position (101) and the distance measuring component installation position (102).

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