A wave soldering tool for convenient material removal

Abstract

The utility model relates to the technical field of wave soldering tooling, and specifically to a wave soldering tooling for convenient material removal, comprising a group of bases, wherein the group of bases are arranged in pairs, a base plate is arranged on the opposite side of the group of bases through a driven shaft, a clamping mechanism is arranged on one side of the group of bases, and a plurality of connecting columns are installed between the group of bases, and a driving shaft is rotatably arranged between the opposite ends of the group of bases, a rotating switching mechanism is arranged between the driving shaft and the group of bases, and a spacing adjustment mechanism is arranged between the base plate and the driving shaft, and the rotating switching mechanism comprises a fixed collar, a fixed sleeve, a sliding collar, a connecting rod, a second limit block, a rotating ring, a first limit block, a reinforcing sleeve and a first limit groove, the reinforcing sleeve is arranged on the outside of the driving shaft, and the first limit groove is opened along the circumferential direction of the outer wall of the reinforcing sleeve. The utility model facilitates the clamping and tightness of the circuit board by adjusting the positions of the base plates on both sides of the base, thereby facilitating the removal of materials for wave soldering.

Description

Technical Field

[0001] The utility model relates to the technical field of wave soldering tooling, in particular to a wave soldering tooling which is convenient for taking out materials. Background Art

[0002] Wave soldering is to make the welding surface of the plug-in board directly contact with high-temperature liquid tin to achieve the purpose of welding. The high-temperature liquid tin maintains an inclined surface, and a special device is used to make the liquid tin form a wave-like phenomenon, so it is called "wave soldering". Its main material is solder bar, which mainly uses molten soft solder (lead-tin alloy) to spray into the designed solder wave by an electric pump or electromagnetic pump. It can also be formed by injecting nitrogen into the solder pool, so that the printed circuit board pre-installed with components passes through the solder wave, and the mechanical and electrical connection between the component welding end or pin and the printed circuit board pad is achieved. However, in the current process of tinning the PCB circuit board through wave soldering, tooling and fixtures are needed to fix the circuit board to make the circuit board more stable, thereby improving the welding effect of wave soldering.

[0003] The existing Chinese patent publication number is: CN218745385U, a wave soldering tool for a wave soldering furnace, which utilizes a first limit frame and a third limit frame of a rectangular ring-shaped structural member, and the horizontal thickness of the third limit frame is greater than the horizontal thickness of the first limit frame, so that the extension of the third limit frame and the second limit frame form a placement groove for placing the circuit board, which can be more consistent with the circuit board and improve the stability of the circuit board. The circuit board can be further limited and fixed by the installed limit assembly to improve its stability. When the wave soldering is completed, the circuit board can be ejected from the placement groove by the installed board removal assembly, thereby facilitating the removal of the circuit board. Compared with the traditional tooling without a board removal assembly, it is more convenient to remove the circuit board, which helps to improve the efficiency of wave soldering. However, the first limiter and the second limiter used in the board removal assembly when in use have a complex composition structure, which leads to inconvenience in use and affects the removal of materials. Utility Model Content

[0004] In view of the above problems, the present application provides a wave soldering tool that is convenient for removing materials, thereby solving the problem of inconvenient material removal in wave soldering mentioned in the above background technology.

[0005] The technical solution of the present invention is: a wave soldering tool for convenient material removal, comprising a group of bases, a group of bases are arranged in pairs, a base plate is arranged on the opposite side of a group of bases through a driven shaft, a clamping mechanism is arranged on one side of a group of bases, and a plurality of connecting columns are installed between the group of bases, and a driving shaft is rotatably arranged between the opposite ends of the group of bases, a rotation switching mechanism is arranged between the driving shaft and the group of bases, and a spacing adjustment mechanism is arranged between the base plate and the driving shaft, wherein;

[0006] A rotation switching mechanism is configured to switch the rotation state of the driving shaft, and adjust whether the driving shaft rotates or not, so as to facilitate the adjustment of the device;

[0007] The spacing adjustment mechanism is configured to adjust the movement of the driven shaft to complete the adjustment of the spacing between the substrate and the base.

[0008] Preferably, the rotation switching mechanism includes a fixed ring, a mounting sleeve, a sliding ring, a connecting rod, a second limit block, a rotating ring, a first limit block, a reinforcement sleeve and a first limit groove. The reinforcement sleeve is installed on the outside of the active shaft, and the first limit groove is circumferentially opened along the outer wall of the reinforcement sleeve. The fixed ring is sleeved on the outside of the active shaft, and the connecting rod is circumferentially arranged along the fixed ring. The mounting sleeve is slidingly sleeved on the connecting column, and the other end of the connecting rod is connected to the mounting sleeve. The rotating ring is rotatably clamped on the outer wall of the fixed ring, and a sliding ring is installed on the other side of the rotating ring through the fixed column. The first limit block is fixed on the inner wall of the sliding ring, and the second limit block is installed on the inner wall of the fixed ring.

[0009] Preferably, the cross-sectional dimensions of the first limiting block and the second limiting block match the cross-sectional dimensions of the first limiting groove, and the angle difference between adjacent first limiting blocks is the same as the angle difference between the second limiting blocks and the angle difference between adjacent first limiting grooves.

[0010] Preferably, the connecting column is fixed around the driving shaft, and an auxiliary spring is adjusted on the outside of one end of the connecting column connected to the base, and the other end of the auxiliary spring is installed on the mounting sleeve, and when the auxiliary spring is in a relaxed state, the second limit block is connected to the first limit groove.

[0011] Preferably, when the second limiting block is connected to the first limiting groove, the sliding collar is located outside the reinforcing sleeve.

[0012] Preferably, the spacing adjustment mechanism includes a driven shaft, a second limiting groove, a fixed sleeve and a third limiting block. The driven shaft is hollow inside and is slidably arranged inside the base. One end of the driving shaft is threadedly inserted into the driven shaft. The second limiting groove is provided on two opposite sides of the outer wall of the driven shaft, and the fixed sleeve is installed on the side of the base opposite to the substrate, and the third limiting block is installed on the inner walls on both sides of the base opposite to each other.

[0013] Preferably, the position of the third limiting block corresponds to the position of the second limiting groove, the third limiting block is inserted into the second limiting groove, and the cross-sectional size of the third limiting block is the same as the cross-sectional size of the second limiting groove.

[0014] Preferably, the clamping mechanism includes an adjustment plate, an adjustment column, a pressing plate and a bottom plate, the bottom plate is installed on one side of the bottom of the base, and the adjustment column is arranged on one side of the base through a support plate, and the adjustment plate is arranged at the bottom of the adjustment column, and the pressing plate is arranged along the length direction of the bottom of the adjustment plate.

[0015] Preferably, the pressing sheet is a spring sheet, and the bottom of the pressing sheet is an arc-shaped structure.

[0016] Preferably, the adjusting column thread penetrates through the supporting plate, and the adjusting column and the adjusting plate are rotatably connected.

[0017] The beneficial effects of the utility model are as follows:

[0018] The utility model discloses a wave soldering tool for facilitating the removal of materials. The rotation switching mechanism is used to switch the positions of the fixed collar and the sliding collar on the connecting column, thereby completing the rotation adjustment of the driving shaft. The position adjustment of the driven shaft can be completed by the rotation adjustment of the driving shaft, and then the adjustment of the distance between the base and the substrate can be completed, thereby making it possible to remove the wave soldering material and reducing the difficulty of removing it. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0020] Figure 1 A schematic diagram of the structure of a wave soldering tool for convenient material removal provided by the utility model Figure 1 ;

[0021] Figure 2 A schematic diagram of the structure of a wave soldering tool for convenient material removal provided by the utility model Figure 2 ;

[0022] Figure 3 A schematic cross-sectional structure diagram of a wave soldering tooling provided by the utility model for convenient material removal;

[0023] Figure 4 for Figure 3 The enlarged schematic diagram of the mechanism at A in the middle;

[0024] Figure 5 A schematic diagram of the structure of a rotating switching mechanism of a wave soldering tooling for convenient material removal provided by the utility model Figure 1 ;

[0025] Figure 6 A schematic diagram of the structure of a rotating switching mechanism of a wave soldering tooling for convenient material removal provided by the utility model Figure 2 ;

[0026] Figure 7 A schematic diagram of the structure of a rotating switching mechanism of a wave soldering tooling for convenient material removal provided by the utility model Figure 3 .

[0027] In the figure: 1. base; 2. base plate; 3. adjustment plate; 4. adjustment column; 5. pressing plate; 6. bottom plate; 7. connecting column; 8. driving shaft; 9. fixing ring; 10. fixing sleeve; 11. sliding ring; 12. auxiliary spring; 13. fixing column; 14. reinforcing sleeve; 15. first limit groove; 16. second limit block; 17. connecting rod; 18. rotating ring; 19. first limit block; 20. driven shaft; 21. second limit groove; 22. fixing sleeve; 23. third limit block. DETAILED DESCRIPTION

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the utility model will be briefly introduced below in combination with the drawings and the description of the embodiments or the prior art. Obviously, the following description of the structure of the drawings is only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. It should be noted that the description of these embodiments is used to help understand the utility model, but does not constitute a limitation of the utility model.

[0029] like Figure 1-Figure 7 As shown, the embodiment of the utility model provides a wave soldering tool for convenient material removal, including a group of bases 1, a group of bases 1 are arranged in pairs, a base plate 2 is arranged on the opposite side of a group of bases 1 through a driven shaft 20, a clamping mechanism is arranged on one side of a group of bases 1, and a plurality of connecting columns 7 are installed between a group of bases to complete the installation and fixation between a group of bases 1, improve the stability of the device, and a driving shaft 8 is rotatably arranged between the opposite ends of a group of bases 1, a rotation switching mechanism is arranged between the driving shaft 8 and a group of bases 1, and a spacing adjustment mechanism is arranged between the base plate 2 and the driving shaft 8, wherein;

[0030] A rotation switching mechanism is configured to switch the rotation state of the driving shaft 8, and adjust whether the driving shaft 8 rotates or not, so as to facilitate the adjustment of the device;

[0031] The spacing adjustment mechanism is configured to adjust the movement of the driven shaft 20 to adjust the spacing between the substrate 2 and the base 1 .

[0032] In this embodiment, the rotation switching mechanism includes a fixed collar 9, a mounting sleeve 10, a sliding collar 11, a connecting rod 17, a second limit block 16, a rotating ring 18, a first limit block 19, a reinforcing sleeve 14 and a first limit groove 15. The reinforcing sleeve 14 is installed on the outside of the active shaft 8, and the first limit groove 15 is circumferentially opened along the outer wall of the reinforcing sleeve 14. The fixed collar 9 is sleeved on the outside of the active shaft 8, and the connecting rod 17 is circumferentially arranged along the fixed collar 9. The mounting sleeve 10 is slidably sleeved on the connecting column 7, and the other end of the connecting rod 17 is connected to the mounting sleeve 10. The rotating ring 18 is rotatably clamped on the outer wall of the fixed collar 9, and the other side of the rotating ring 18 is fixed The fixed column 13 is installed with a sliding ring 11, the first limit block 19 is fixed on the inner wall of the sliding ring 11, and the second limit block 16 is installed on the inner wall of the fixed ring 9. The first limit block 19 and the second limit block 16 are respectively engaged with the first limit groove 15 to switch the rotation of the driving shaft 8. When the first limit block 19 is plugged into the first limit groove 15, the driving shaft 8 can rotate with the rotation of the sliding ring 11, and when the second limit block 16 is plugged into the first limit groove 15, the driving shaft 8 is stuck by the fixed ring 9 and cannot rotate, so that the driving shaft 8 stops rotating, completing the fixation of the distance between the base 1 and the substrate 2.

[0033] Specifically, the cross-sectional dimensions of the first limit block 19 and the second limit block 16 match the cross-sectional dimensions of the first limit groove 15, and the angle difference between adjacent first limit blocks 19 is the same as the angle difference between the second limit blocks 16 and the angle difference between adjacent first limit grooves 15, which facilitates the insertion between the first limit block 19, the second limit block 16 and the first limit groove 15.

[0034] Specifically, the connecting column 7 is fixed around the driving shaft 8, and an auxiliary spring 12 is adjusted on the outer side of one end of the connecting column 7 connected to the base 1, and the other end of the auxiliary spring 12 is installed on the mounting sleeve 10, and when the auxiliary spring 12 is in a relaxed state, the second limit block 16 is connected to the first limit groove 15, so that when wave soldering is performed, the overall stability of the device can be maintained, and the clamping of the circuit board can be maintained, which facilitates the wave soldering.

[0035] Specifically, when the second limiting block 16 is connected to the first limiting groove 15 , the sliding collar 11 is located outside the reinforcing sleeve 14 to prevent the rotation of the driving shaft 8 from being affected.

[0036] In this embodiment, the spacing adjustment mechanism includes a driven shaft 20, a second limiting groove 21, a fixed sleeve 22 and a third limiting block 23. The driven shaft 20 is hollow inside and is slidably arranged inside the base 1. One end of the driving shaft 8 is threadedly inserted into the driven shaft 20. The second limiting groove 21 is provided on two opposite sides of the outer wall of the driven shaft 20, and the fixed sleeve 22 is installed on the side of the base 1 opposite to the substrate 2, and the third limiting block 23 is installed on the inner walls of the base 1 on both sides. It is convenient to clamp the third limiting block 23 with the second limiting groove 21, so that the driven shaft 20 cannot rotate, but slides on the base 1, thereby completing the adjustment of the spacing between the substrate 2 and the base 1.

[0037] Specifically, the position of the third limit block 23 corresponds to the position of the second limit groove 21, the third limit block 23 is inserted into the second limit groove 21, and the cross-sectional size of the third limit block 23 is the same as the cross-sectional size of the second limit groove 21, ensuring the sliding stability of the driven shaft 20.

[0038] In this embodiment, the clamping mechanism includes an adjustment plate 3, an adjustment column 4, a pressure plate 5 and a bottom plate 6. The bottom plate 6 is installed on one side of the bottom of the base 1, and the adjustment column 4 is arranged on one side of the base 1 through a support plate, and the adjustment plate 3 is arranged at the bottom of the adjustment column 4. The pressure plate 5 is arranged along the length direction of the bottom of the adjustment plate 3, which is convenient for completing the position adjustment of the pressure plate 5, facilitating the clamping of the circuit board, and facilitating wave soldering.

[0039] Specifically, the pressing sheet 5 is a spring sheet, and the bottom of the pressing sheet 5 is an arc-shaped structure, which improves the clamping stability of the circuit board.

[0040] Specifically, the adjusting column 4 is threadedly passed through the supporting plate, and the adjusting column 4 is rotatably connected to the adjusting plate 3, so that the adjustment of the device is convenient and the operation difficulty of the device is reduced.

[0041] Working principle: When the operator clamps circuit boards of different models and sizes on the base 1, he pushes the fixed ring 9 to disengage from the reinforcement sleeve 14, and at the same time makes the sliding ring 11 and the reinforcement sleeve 14, and then rotates the sliding ring 11 to synchronously drive the active shaft 8 to rotate, and then drives the driven shaft 20 to drive the spacing between the substrate 2 and the base 1 to adjust. After the spacing is adjusted appropriately, the operator releases the sliding ring 11. At this time, under the rebound of the auxiliary spring 12, the fixed ring 9 drives the second limit block 16 to connect with the first limit groove 15 on the reinforcement sleeve 14 again, and the operator adjusts the adjustment column 4 to cooperate with the clamping of the circuit board, which is convenient for wave soldering. When taking out the material, the above operation is performed in reverse, which can facilitate the removal of the circuit board and reduce the difficulty of operating the device.

[0042] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the protection scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wave soldering tool for convenient material removal, comprising a set of bases (1), wherein the set of bases (1) are arranged in pairs, and characterized in that: A base plate (2) is disposed on opposite sides of a group of bases (1) via a driven shaft (20), a clamping mechanism is disposed on one side of a group of bases (1), a plurality of connecting columns (7) are installed between the group of bases (1), a driving shaft (8) is rotatably disposed between opposite ends of the group of bases (1), a rotation switching mechanism is disposed between the driving shaft (8) and the group of bases (1), and a spacing adjustment mechanism is disposed between the base plate (2) and the driving shaft (8), wherein; A rotation switching mechanism is configured to switch the rotation state of the driving shaft (8) and adjust whether the driving shaft (8) rotates, thereby facilitating the adjustment of the device; The spacing adjustment mechanism is configured to adjust the movement of the driven shaft (20) to complete the adjustment of the spacing between the substrate (2) and the base (1).

2. A wave soldering tool for facilitating material removal as claimed in claim 1, characterized in that: The rotation switching mechanism comprises a fixed collar (9), a mounting sleeve (10), a sliding collar (11), a connecting rod (17), a second limit block (16), a rotating ring (18), a first limit block (19), a reinforcing sleeve (14) and a first limit groove (15); the reinforcing sleeve (14) is mounted on the outside of the driving shaft (8); the first limit groove (15) is opened along the circumferential direction of the outer wall of the reinforcing sleeve (14); the fixed collar (9) is sleeved on the outside of the driving shaft (8); and the connecting rod (17) The mounting sleeve (10) is slidably sleeved on the connecting column (7) along the circumference of the fixed sleeve (9), and the other end of the connecting rod (17) is connected to the mounting sleeve (10). The rotating ring (18) is rotatably clamped on the outer wall of the fixed sleeve (9), and the other side of the rotating ring (18) is installed with a sliding sleeve (11) through a fixed column (13). The first limit block (19) is fixed on the inner wall of the sliding sleeve (11), and the second limit block (16) is installed on the inner wall of the fixed sleeve (9).

3. A wave soldering tool for facilitating material removal as claimed in claim 2, characterized in that: The cross-sectional dimensions of the first limiting block (19) and the second limiting block (16) both match the cross-sectional dimensions of the first limiting groove (15), and the angle difference between adjacent first limiting blocks (19) is the same as the angle difference between the second limiting blocks (16) and the angle difference between adjacent first limiting grooves (15).

4. A wave soldering tool for facilitating material removal as claimed in claim 2, characterized in that: The connecting column (7) is fixed around the driving shaft (8), and an auxiliary spring (12) is adjusted on the outer side of one end of the connecting column (7) connected to the base (1), and the other end of the auxiliary spring (12) is installed on the mounting sleeve (10), and when the auxiliary spring (12) is in a relaxed state, the second limit block (16) is connected to the first limit groove (15).

5. A wave soldering tool for facilitating material removal as claimed in claim 2, characterized in that: When the second limiting block (16) is connected to the first limiting groove (15), the sliding collar (11) is located outside the reinforcing sleeve (14).

6. A wave soldering tool for convenient material removal as claimed in claim 1, characterized in that: The spacing adjustment mechanism comprises a driven shaft (20), a second limiting groove (21), a fixing sleeve (22) and a third limiting block (23); the driven shaft (20) is hollow inside and is slidably arranged inside the base (1); one end of the driving shaft (8) is threadedly inserted into the driven shaft (20); the second limiting groove (21) is arranged on two opposite sides of the outer wall of the driven shaft (20); the fixing sleeve (22) is installed on a side of the base (1) opposite to the substrate (2); and the third limiting block (23) is installed on two opposite inner walls of the base (1).

7. A wave soldering tool for facilitating material removal as claimed in claim 1, characterized in that: The position of the third limiting block (23) corresponds to the position of the second limiting groove (21), the third limiting block (23) is inserted into the second limiting groove (21), and the cross-sectional dimensions of the third limiting block (23) are the same as the cross-sectional dimensions of the second limiting groove (21).

8. A wave soldering tool for convenient material removal as claimed in claim 1, characterized in that: The clamping mechanism comprises an adjustment plate (3), an adjustment column (4), a pressing plate (5) and a bottom plate (6); the bottom plate (6) is mounted on one side of the bottom of the base (1); the adjustment column (4) is arranged on one side of the base (1) through a support plate; the adjustment plate (3) is arranged at the bottom of the adjustment column (4); and the pressing plate (5) is arranged along the length direction of the bottom of the adjustment plate (3).

9. A wave soldering tool for facilitating material removal as claimed in claim 8, characterized in that: The pressing sheet (5) is a spring sheet, and the bottom of the pressing sheet (5) is an arc-shaped structure.

10. A wave soldering tool for convenient material removal as claimed in claim 8, characterized in that: The adjusting column (4) is threadedly passed through the supporting plate, and the adjusting column (4) is rotatably connected to the adjusting plate (3).

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