Automatic chip packaging device

Abstract

The utility model discloses an automatic chip packaging device, which relates to the field of packaging equipment, including a placement rack, a pressing rack is arranged on the top of the placement rack, and a plurality of transverse placement slots are opened on the opposite sides of the placement rack and the pressing rack, and the interior of the placement slot is used to place chips, and two film transmission devices are arranged between the placement rack and the pressing rack. The automatic chip packaging device described in the utility model, by arranging a placement rack, a pressing rack and a film, places the chips in the interior of the placement slot through the film, and the pressing rack moves down to cover the surface of the chips with another layer of film, and then the film is heated by a heating block to complete the packaging of the chips. The more the number of placement slots, the more the number of chips that can be packaged at the same time, and the higher the production efficiency. At the same time, the chips do not need to be transmitted and packaged in the process, so the overall installation space is smaller than that of existing equipment.

Description

Technical Field

[0001] The utility model relates to the field of packaging equipment, in particular to an automatic chip packaging device. Background Art

[0002] Mahjong is a traditional Chinese intellectual game, usually used for entertainment. Chips are usually used to determine the final winner of the game. There are many types of chips on the market, generally round chips. In the process of chip production, in order to better package and sell chips, manufacturers will accumulate a certain number of chips into a pile, and sell and transport them in piles. Therefore, automated chip packaging equipment is indispensable in the chip production process.

[0003] When packaging chips, a specific number of chips need to be placed manually on a conveyor belt with a round shaft. The round shaft can prevent the chips from rolling. The conveyor belt can transport the chips to the area that needs to be packaged and then proceed to the next part of the packaging step. However, a larger space is required to install the chip packaging equipment at this time, and only one stack of chips can be packaged at a time, which greatly affects the chip packaging efficiency. Utility Model Content

[0004] The main purpose of the utility model is to provide an automatic chip packaging device, which can effectively solve the problems in the background technology.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: an automatic chip packaging device, including a placing rack, a pressing rack is arranged on the top of the placing rack, and a plurality of transverse placing grooves are opened on the opposite sides of the placing rack and the pressing rack, and the interior of the placing grooves is used to place chips, and two film transmission devices are arranged between the placing rack and the pressing rack, and the film passes transversely between the placing rack and the pressing rack, and a lifting component is installed on the surface of the placing rack for controlling the lifting and lowering of the pressing rack, and a heating component is arranged inside the pressing rack.

[0006] The film transmission device includes multiple mounting plates, which are fixed on both sides of the extrusion rack / placement rack. A rotating shaft is installed on the surface of the mounting plate. The film roll is fixedly sleeved on the rotating shaft on one side, and the other end of the film roll is fixed on another rotating shaft. A motor is fixedly installed on the surface of the mounting plate, and the motor is used to drive the rotation of the rotating shaft.

[0007] Two motors are arranged on the surface of the extrusion frame, which are used to rotate the rotating shafts on both sides of the extrusion frame at the same time.

[0008] The lifting assembly includes a plurality of electric push rods, which are fixedly mounted on the surface of the placement rack. A fixing plate is fixedly mounted on the surface of the extrusion rack, and the output shafts of the electric push rods are fixed on the surface of the fixing plate.

[0009] The heating assembly comprises a plurality of rectangular heating blocks, and the heating blocks are located around the placement slot.

[0010] The surface of the placement rack is provided with a plurality of grooves arranged horizontally and vertically, the surface of the extrusion rack is installed with a plurality of cutting knives arranged horizontally and vertically, the surface of the extrusion rack is provided with a slide groove, the longitudinally arranged cutting knives are installed inside the slide groove, a connecting spring is arranged inside the slide groove, and one end of the connecting spring is fixed to the surface of the cutting knife.

[0011] Compared with the prior art, the utility model has the following beneficial effects:

[0012] 1. In the utility model, by setting a placement rack, an extrusion rack and a film, the chips are placed inside the placement slot through the film, the extrusion rack moves down, and another layer of film is covered on the surface of the chips. At this time, the film is heated by a heating block to complete the packaging of the chips. The more placement slots there are, the more chips can be packaged at the same time, and the production efficiency is higher. At the same time, there is no need to transport and repackage the chips in this process, so the overall installation space is smaller than that of existing equipment.

[0013] 2. In the utility model, by setting a cutting knife, when the extrusion frame moves downward, the horizontal cutting knife first cuts the edge, then the film is heated at high temperature, and finally the extrusion force of the connecting spring is used to make the longitudinal cutting knife cut each stack of chip packages, which is convenient for transportation and further improves the production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the overall structure of an automatic chip packaging device of the utility model;

[0015] Figure 2 This is a schematic diagram of the disassembly structure of the film and the placement rack of an automatic chip packaging device of the utility model;

[0016] Figure 3 This is a partial structural schematic diagram of the cutting knife position of an automatic chip packaging device of the utility model;

[0017] Figure 4 This is a schematic diagram of the structure of the connection spring position part of an automatic chip packaging device of the utility model.

[0018] In the figure: 1. placement rack; 2. extrusion rack; 3. placement slot; 4. film; 5. mounting plate; 6. rotating shaft; 7. motor; 8. electric push rod; 9. fixing plate; 10. heating block; 11. groove; 12. cutting knife; 13. slide slot; 14. connecting spring. DETAILED DESCRIPTION

[0019] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0020] like Figure 1-4 As shown, an automated chip packaging device comprises a placing rack 1, a pressing rack 2 is arranged on the top of the placing rack 1, a plurality of transverse placing grooves 3 are provided on opposite sides of the placing rack 1 and the pressing rack 2, the positions of the placing grooves 3 correspond one to one, and the radius thereof is the same as the radius of the chips, the interior of the placing grooves 3 is used for placing the chips, two film 4 transmission devices are arranged between the placing rack 1 and the pressing rack 2, the film 4 passes transversely between the placing rack 1 and the pressing rack 2, a lifting assembly is installed on the surface of the placing rack 1 for controlling the lifting and lowering of the pressing rack 2, and a heating assembly is arranged inside the pressing rack 2.

[0021] First, stretch the film 4 at the placement rack 1, and place the chips inside the placement slot 3 through the film 4. Then use the lifting assembly to move the extrusion rack 2 downward, and cover the surface of the chips with another layer of film 4. At this time, use the heating assembly to heat the film 4 to complete the packaging of the chips. The more placement slots 3 there are, the more chips can be packaged at the same time, and the production efficiency is higher. At the same time, there is no need to transport and repackage the chips during this process, so the overall installation space is smaller than that of existing equipment.

[0022] The film 4 transmission device includes multiple mounting plates 5, which are fixed on both sides of the extrusion rack 2 / placing rack 1, and the number of mounting plates 5 on each side is two. A rotating shaft 6 is installed on the surface of the mounting plate 5. The film 4 roll is fixedly sleeved on the rotating shaft 6 on one side, and the other end of the film 4 roll is fixed on the other rotating shaft 6. A motor 7 is fixedly installed on the surface of the mounting plate 5, and the motor 7 is used to drive the rotation of the rotating shaft 6. The rotation of the motor 7 can drive the film 4 to rotate, and a new film 4 for packaging can be re-laid.

[0023] Two motors 7 are disposed on the surface of the extrusion frame 2 for simultaneously rotating the rotating shafts 6 on both sides of the extrusion frame 2 to control the tension of the film 4 .

[0024] The lifting assembly includes multiple electric push rods 8, four of which are arranged in the present embodiment to ensure that there is enough space for placing chips. The electric push rods 8 are fixedly mounted on the surface of the placement rack 1, and a fixing plate 9 is fixedly mounted on the surface of the extrusion rack 2. The output shaft of the electric push rod 8 is fixed on the surface of the fixing plate 9. When the electric push rod 8 is started, it can drive the extrusion rack 2 to move up and down.

[0025] The heating assembly includes a plurality of rectangular heating blocks 10 , which are located around the placement slot 3 . The heating blocks 10 can be heated by electric current, and the current generating device is installed on the surface of the extrusion frame 2 .

[0026] The surface of the placing rack 1 is provided with a plurality of grooves 11 arranged horizontally and vertically, and the surface of the extrusion rack 2 is installed with a plurality of cutting knives 12 arranged horizontally and vertically. A cutting knife 12 is required on both sides of each heating block 10 to cut each packaged chip separately, and the horizontal cutting knife 12 cuts the edge position. A slide groove 13 is provided on the surface of the extrusion rack 2, and the longitudinally arranged cutting knife 12 is installed inside the slide groove 13. A connecting spring 14 is arranged inside the slide groove 13, and one end of the connecting spring 14 is fixed to the surface of the cutting knife 12.

[0027] During the downward movement of the extrusion frame 2, the horizontal cutting knife 12 first cuts the edge of the film 4, and then the film 4 is heated at high temperature. At this time, the surrounding parts of the film 4 are still connected, so the new film 4 can be connected and rotated. Finally, the extrusion force of the connecting spring 14 is used to make the longitudinal cutting knife 12 cut each stack of chip packages for easy transportation.

[0028] It should be noted that the utility model is an automatic chip packaging device. When in use, the film 4 at the placement frame 1 is first stretched, and the chips are placed inside the placement slot 3 through the film 4. The electric push rod 8 is started to drive the extrusion frame 2 to move downward, and the horizontal cutting knife 12 cuts the edge of the film 4. At this time, the surrounding parts of the film 4 are still connected, so a new film 4 can be connected and rotated. The heating block 10 is energized to heat the film 4, and the extrusion force of the connecting spring 14 is used to make the longitudinal cutting knife 12 cut each stack of chip packaging, thereby improving production efficiency. Finally, the electric push rod 8 moves the extrusion frame 2 upward to take away the packaged chips. At the same time, all the motors 7 are started, so that the used film 4 is wound and the new film 4 is unwound to facilitate the next operation.

[0029] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. An automated chip packaging device, comprising a placement rack (1), characterized in that: The top of the placing rack (1) is provided with an extrusion rack (2), and opposite sides of the placing rack (1) and the extrusion rack (2) are provided with a plurality of transverse placing grooves (3), the interior of the placing grooves (3) being used for placing chips, two film (4) transmission devices are provided between the placing rack (1) and the extrusion rack (2), the film (4) transversely passes between the placing rack (1) and the extrusion rack (2), a lifting component is installed on the surface of the placing rack (1) for controlling the lifting of the extrusion rack (2), and a heating component is provided inside the extrusion rack (2).

2. The automatic chip packaging device according to claim 1, characterized in that: The film (4) transmission device comprises a plurality of mounting plates (5), wherein the mounting plates (5) are fixed on both sides of the extrusion rack (2) / placing rack (1), a rotating shaft (6) is installed on the surface of the mounting plates (5), the film (4) roll is fixedly sleeved on the rotating shaft (6) on one side, and the other end of the film (4) roll is fixed on the other rotating shaft (6), and a motor (7) is fixedly installed on the surface of the mounting plates (5), and the motor (7) is used to drive the rotation of the rotating shaft (6).

3. The automatic chip packaging device according to claim 2, characterized in that: Two motors (7) are provided on the surface of the extrusion frame (2) and are used to simultaneously rotate the rotating shafts (6) on both sides of the extrusion frame (2).

4. The automatic chip packaging device according to claim 1, characterized in that: The lifting assembly comprises a plurality of electric push rods (8), wherein the electric push rods (8) are fixedly mounted on the surface of the placement frame (1), a fixing plate (9) is fixedly mounted on the surface of the extrusion frame (2), and the output shafts of the electric push rods (8) are fixed on the surface of the fixing plate (9).

5. The automatic chip packaging device according to claim 1, characterized in that: The heating assembly comprises a plurality of rectangular heating blocks (10), wherein the heating blocks (10) are located around the placement slot (3).

6. The automatic chip packaging device according to claim 1, characterized in that: The surface of the placement rack (1) is provided with a plurality of grooves (11) arranged horizontally and vertically, the surface of the extrusion rack (2) is provided with a plurality of cutting knives (12) arranged horizontally and vertically, the surface of the extrusion rack (2) is provided with a slide groove (13), the longitudinally arranged cutting knives (12) are installed inside the slide groove (13), and a connecting spring (14) is arranged inside the slide groove (13), and one end of the connecting spring (14) is fixed to the surface of the cutting knife (12).

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