Ultrasonic electroplating device

Abstract

The utility model discloses an ultrasonic electroplating device which comprises an ultrasonic generator, a metal supporting net, a plating tank, an electrode assembly, a liquid storage tank and a pipeline assembly, the ultrasonic generator is provided with an ultrasonic generating tank, the metal supporting net is hung on the side wall of the ultrasonic generating tank, and the metal supporting net and the bottom wall of the ultrasonic generating tank are arranged at intervals; the plating tank is a cylindrical piece with two open ends and is arranged on one side, away from the bottom wall, of the metal supporting net, the electrode assembly comprises a cathode plate and an anode plate, the cathode plate is connected with the plating tank and seals the bottom opening of the plating tank, and the cathode plate is conductively connected with the metal supporting net; the anode plate is hung on the top opening of the plating tank, a part of the anode plate extends into the plating tank through the top opening of the plating tank, and the pipeline assembly communicates with the liquid storage tank and the plating tank and is used for driving the electroplating liquid in the liquid storage tank to enter the plating tank and driving the electroplating liquid in the plating tank to enter the liquid storage tank. According to the ultrasonic electroplating device, powder is in full contact with electroplating liquid, and the electroplating uniformity is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating equipment, in particular to an ultrasonic electroplating device. Background Art

[0002] The electroplating process is a method of applying a layer of metal to a conductor using the principle of electrolysis. Electroplating metal graphite powder is to plate a layer of metal on the surface of graphite powder using chemical reduction or electrochemical deposition. Electroplating metal graphite powder composite materials have the advantages of both graphite and metal: they have electrical conductivity, thermal conductivity, lubricity, and high mechanical strength and magnetic properties. Therefore, in addition to having great application prospects in military wave absorption, they are also widely used in microelectronics, catalysts, spray materials, brushes, self-lubricating bearings and other fields.

[0003] In the prior art, when electroplating a metal graphite powder composite material using an electroplating device, the uniformity of the electroplating is poor and cannot meet the use requirements. Utility Model Content

[0004] The purpose of the utility model is to at least solve the problem of how to improve the uniformity of electroplating. This purpose is achieved through the following technical solutions:

[0005] The utility model proposes an ultrasonic electroplating device, which comprises:

[0006] An ultrasonic generator, wherein the ultrasonic generator has an ultrasonic generating groove;

[0007] A metal support net, wherein the metal support net is detachably hung on the side wall of the ultrasonic generating tank, and the metal support net is spaced apart from the bottom wall of the ultrasonic generating tank;

[0008] A plating tank, which is an insulating member and a cylindrical member with two ends opened, and is arranged on a side of the metal support mesh away from the bottom wall;

[0009] An electrode assembly, the electrode assembly comprising a cathode plate and an anode plate, the cathode plate being connected to the plating tank and closing the bottom opening of the plating tank, the cathode plate being conductively connected to the metal support mesh, the anode plate being hung at the top opening of the plating tank and part of the body extending into the plating tank through the top opening of the plating tank;

[0010] A liquid storage tank, the liquid storage tank is used to store electroplating solution;

[0011] A pipeline assembly is respectively connected to the liquid storage tank and the plating tank, and is used to drive the electroplating liquid in the liquid storage tank into the plating tank, and drive the electroplating liquid in the plating tank into the liquid storage tank.

[0012] According to the ultrasonic electroplating device of the utility model, when electroplating is performed, powder is placed in a plating tank and a plating solution is injected, water is injected into an ultrasonic generating tank and part of the plating tank is immersed in water, the pipeline assembly is operated and the ultrasonic generator is turned on, the plating solution in the liquid storage tank enters the plating tank and impacts the powder in the plating tank, causing the powder to tumble in the plating solution, and at the same time, the powder is more fully contacted with the plating solution under the action of the ultrasonic generator, the pipeline assembly and the ultrasonic generator are stopped, and the anode plate and the cathode plate are energized to achieve electroplating of the powder.

[0013] Based on the ultrasonic electroplating device in the present application, the powder can be fully contacted with the electroplating solution, thereby improving the uniformity of the electroplating and effectively enhancing the effect of the electroplating.

[0014] In addition, the ultrasonic electroplating device according to the utility model may also have the following additional technical features:

[0015] In some embodiments of the present invention, the ultrasonic electroplating device further includes an electromagnetic component, the electromagnetic component includes an electromagnetic coil, and the electromagnetic coil is disposed in the liquid storage tank.

[0016] In some embodiments of the present invention, the outer side of the electromagnetic coil is wrapped with a waterproof structure.

[0017] In some embodiments of the present invention, the pipeline assembly includes:

[0018] a first connecting pipe, one end of which is connected to the plating tank, and the other end of which is connected to the liquid storage tank;

[0019] a second connecting pipe, one end of which is connected to the plating tank, the other end of which is connected to the liquid storage tank, and the first connecting pipe and the second connecting pipe are arranged at intervals along the circumferential direction of the plating tank;

[0020] a first driving pump, wherein the first driving pump is arranged on the first connecting pipe;

[0021] A second driving pump, the second driving pump is arranged on the second connecting pipe, one of the first driving pump and the second driving pump is used to pump the electrolyte in the plating tank to the liquid storage tank, and the other of the first driving pump and the second driving pump is used to pump the electrolyte in the liquid storage tank to the plating tank.

[0022] In some embodiments of the present invention, the metal support mesh includes two oppositely arranged hanging ears, and the two hanging ears are respectively hung on the notches of the ultrasonic generating groove.

[0023] In some embodiments of the present invention, the ultrasonic electroplating device further comprises an insulating spacer block, wherein the insulating spacer block is arranged between one of the hanging ears and the notch of the ultrasonic generating groove so that the metal support mesh is inclined relative to the bottom wall.

[0024] In some embodiments of the present invention, the anode plate comprises:

[0025] A first plate body, the first plate body is arranged in the plating tank and is spaced apart from and parallel to the cathode plate, and the spacing distance between the first plate body and the cathode plate is less than or equal to the depth of the plating tank;

[0026] Two second plates, one second plate being connected to each of the opposite ends of the first plate, and the two second plates being located on the same side of the first plate and being perpendicular to the bottom surface of the plating tank;

[0027] Two third plates, one end of each second plate body facing away from the first plate body is connected with the third plate body, and the two third plates are arranged to face each other and overlap the top opening of the plating tank respectively.

[0028] In some embodiments of the present invention, the plating tank is a transparent component, and the transparent component is a plastic component or a glass component.

[0029] In some embodiments of the utility model, the plating tank is a hexagonal structure, comprising a first side wall, a second side wall, a third side wall, a fourth side wall, a fifth side wall and a sixth side wall connected end to end in sequence, the first side wall is parallel to the fourth side wall, and along the circumferential direction of the plating tank, the lengths of the first side wall and the fourth side wall are equal, and the lengths of the first side wall and the fourth side wall are greater than the lengths of any other side walls, and the first side wall or the fourth side wall receives the electrolyte flowing into the plating tank.

[0030] In some embodiments of the present invention, the angle between the second side wall and the third side wall is in the range of 45 degrees to 75 degrees;

[0031] And / or, an angle between the fifth side wall and the sixth side wall is in the range of 45 degrees to 75 degrees. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] By reading the detailed description of the preferred embodiment below, various other advantages and benefits will become clear to those of ordinary skill in the art. The accompanying drawings are only used for the purpose of illustrating the preferred embodiment and are not to be considered as limiting the present invention. Moreover, the same reference numerals are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0033] Figure 1The schematic diagram of the structure of the ultrasonic electroplating device according to the embodiment of the utility model is schematically shown;

[0034] Figure 2 for Figure 1 A perspective view of an ultrasonic electroplating apparatus shown in;

[0035] Figure 3 for Figure 1 Schematic diagram of the structure of the plating tank shown in.

[0036] The reference numerals are as follows:

[0037] 100 is an ultrasonic plating device;

[0038] 10 is an ultrasonic generator;

[0039] 11 is an ultrasonic wave generating tank;

[0040] 20 is a metal support mesh;

[0041] 30 is a plating tank;

[0042] 31 is a first side wall; 32 is a second side wall; 33 is a third side wall; 34 is a fourth side wall; 35 is a fifth side wall; 36 is a sixth side wall;

[0043] 40 is an electrode assembly;

[0044] 41 is an anode plate; 411 is a first plate body; 412 is a second plate body; 413 is a third plate body; 42 is a cathode plate;

[0045] 50 is a liquid storage tank;

[0046] 60 is a pipeline assembly;

[0047] 61 is a first connecting pipe; 62 is a first driving pump; 63 is a second connecting pipe; 64 is a second driving pump;

[0048] 70 is an electromagnetic component;

[0049] 71 is an electromagnetic coil;

[0050] 80 is an insulating spacer;

[0051] 200 for powder. DETAILED DESCRIPTION

[0052] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0053] It should be understood that the terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive, and therefore specify the existence of stated features, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0054] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.

[0055] For ease of description, spatial relative terms may be used herein to describe the relationship of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure is turned over, then the elements described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." can include both above and below orientations.

[0056] like Figures 1 to 3As shown, according to the embodiment of the utility model, an ultrasonic electroplating device 100 is proposed, and the ultrasonic electroplating device 100 includes an ultrasonic generator 10, a metal support mesh 20, a plating tank 30, an electrode assembly 40, a liquid storage tank 50 and a pipeline assembly 60. The ultrasonic generator 10 has an ultrasonic generating tank 11, and the metal support mesh 20 is detachably hung on the side wall of the ultrasonic generating tank 11, and the metal support mesh 20 is spaced from the bottom wall of the ultrasonic generating tank 11. The plating tank 30 is an insulating member and a cylindrical member with openings at both ends. The plating tank 30 is arranged on the metal support mesh 20. The electrode assembly 40 is on the side of the metal support mesh 20 away from the bottom wall, and includes a cathode plate and an anode plate. The cathode plate is connected to the plating tank 30 and closes the bottom opening of the plating tank 30. The cathode plate is conductively connected to the metal support mesh 20. The anode plate is hung on the top opening of the plating tank 30 and part of its body extends into the plating tank 30 through the top opening of the plating tank 30. The liquid storage tank 50 is used to store the electroplating solution. The pipeline assembly 60 is respectively connected to the liquid storage tank 50 and the plating tank 30, and is used to drive the electroplating solution in the liquid storage tank 50 into the plating tank 30, and drive the electroplating solution in the plating tank 30 into the liquid storage tank 50.

[0057] It should be understood that in the present application, the powder 200 must be a conductive powder, which may be a conductive metal powder or a non-metallic powder having a conductive metal coating layer on the surface, as well as an organic conductive powder, etc. Before electroplating, the powder 200 may be appropriately surface activated according to its properties, so that the surface is more easily plated with a metal coating during electroplating.

[0058] The metal support net 20 can be separated from the ultrasonic generator 10. When the plating tank 30 is arranged on the metal support net 20, the plating tank 30 is spaced apart from the bottom wall of the ultrasonic generator tank 11 to reduce the vibration of the plating tank 30 caused by the ultrasonic generator 10. At the same time, the internal space of the ultrasonic generator tank 11 is large enough to further reduce the vibration of the plating tank 30 caused by the ultrasonic generator 10. When the plating tank 30 is arranged on the metal support net 20, the outer peripheral wall of the plating tank 30 and the side wall of the ultrasonic generator tank 11 are spaced apart to reduce the vibration of the plating tank 30 caused by the side wall of the ultrasonic generator tank 11.

[0059] In addition, the ultrasonic generating tank 11 is filled with water, wherein the water level does not exceed one quarter of the height of the plating tank 30 from the top notch downward.

[0060] In addition, the cathode plate is made of conductive inactive metal materials, such as graphite, niobium, etc., and the cathode plate is in good contact with the metal support mesh 20, ensuring that the cathode plate and the cathode electrode are stably electrically connected through the support mesh so that the electroplating process can continue to react.

[0061] According to the ultrasonic electroplating device 100 of the utility model, when electroplating is performed, powder 200 is placed in the plating tank 30 and a plating solution is injected, and water is injected into the ultrasonic generator tank 11 so that part of the plating tank 30 is immersed in water. The pipeline assembly 60 is operated and the ultrasonic generator 10 is turned on. The plating solution in the liquid storage tank 50 enters the plating tank 30 and impacts the powder 200 in the plating tank 30, so that the powder 200 tumbles in the plating solution. At the same time, under the action of the ultrasonic generator 10, the powder 200 can be suspended in the plating solution and more fully contacted with the plating solution. The pipeline assembly 60 and the ultrasonic generator 10 are stopped, and the anode plate and the cathode plate are energized to achieve electroplating of the powder 200.

[0062] Based on the ultrasonic electroplating device 100 in the present application, the powder 200 can be fully contacted with the electroplating solution, thereby improving the uniformity of the electroplating and effectively enhancing the effect of the electroplating.

[0063] In some embodiments of the present invention, Figure 1 to Figure 2 As shown, the ultrasonic electroplating device 100 further includes an electromagnetic assembly 70 , and the electromagnetic assembly 70 includes an electromagnetic coil 71 , and the electromagnetic coil 71 is disposed in the liquid storage tank 50 .

[0064] Specifically, the electromagnetic coil 71 is arranged in the liquid storage tank 50. When the electroplating of the powder 200 is completed, the pipeline assembly 60 transports the electroplating solution and the electroplated powder 200 to the liquid storage tank 50. The electromagnetic assembly 70 is turned on, and the electroplated powder 200 is adsorbed by the electromagnetic coil 71. The unplated powder 200 is transported to the plating tank 30 again through the pipeline assembly 60 for further electroplating. The electromagnetic assembly 70 is arranged so that the electroplated powder can be effectively sorted, further improving the effect of electroplating.

[0065] In some embodiments of the present invention, the outer side of the electromagnetic coil 71 is wrapped with a waterproof structure.

[0066] Specifically, by providing a waterproof structure, the electromagnetic coil 71 can be isolated from the electroplating solution, thereby improving the insulation performance of the electromagnetic coil 71. In addition, the waterproof structure can effectively separate the electromagnetic coil 71 after the electromagnetic coil 71 is powered off, thereby improving the convenience of electroplating powder.

[0067] It should be pointed out that, in the present application, the waterproof structure may be a plastic covering or the like.

[0068] In some embodiments of the present invention, Figure 1 to Figure 2As shown, the pipeline assembly 60 includes a first connecting pipe 61, a second connecting pipe 63, a first driving pump 62 and a second driving pump 64. One end of the first connecting pipe 61 is connected to the plating tank 30, and the other end of the first connecting pipe 61 is connected to the liquid storage tank 50. One end of the second connecting pipe 63 is connected to the plating tank 30, and the other end of the second connecting pipe 63 is connected to the liquid storage tank 50. Along the circumferential direction of the plating tank 30, the first connecting pipe 61 and the second connecting pipe 63 are spaced apart. The first driving pump 62 is arranged on the first connecting pipe 61, and the second driving pump 64 is arranged on the second connecting pipe 63. One of the first driving pump 62 and the second driving pump 64 is used to pump the electrolyte in the plating tank 30 to the liquid storage tank 50, and the other of the first driving pump 62 and the second driving pump 64 is used to pump the electrolyte in the liquid storage tank 50 to the plating tank 30.

[0069] Specifically, before electroplating the powder 200, the first driving pump 62 is turned on (the second driving pump 64 is turned off) so that the plating solution in the liquid storage tank 50 enters the plating tank 30 through the first connecting pipe 61 and impacts the powder 200, so that the powder 200 is tumbled in the plating solution to improve the uniformity of the mixing of the powder 200 and the plating solution. After the electroplating of the powder 200 is completed, the second driving pump 64 is turned on (the first driving pump 62 is turned off) so that the plating solution in the plating tank 30 enters the liquid storage tank 50 through the second connecting pipe 63 to separate the electroplated powder 200.

[0070] It should be noted that, in the present application, both the first driving pump 62 and the second driving pump 64 are diaphragm pumps. In addition, both the first connecting pipe 61 and the second connecting pipe 63 are rubber tubes, and the rubber tubes can meet the requirement that the powder 200 can pass through without being blocked.

[0071] In addition, the first connecting tube 61 is inserted into the plating tank 30 and is spaced apart from the bottom wall of the plating tank 30 . At the same time, the distance between the first connecting tube 61 and the bottom wall of the plating tank 30 can be adjusted. The second connecting tube 63 is inserted into the plating tank 30 , and its insertion position is the bottom of the plating tank 30 .

[0072] In some embodiments of the present invention, Figure 1 to Figure 2 As shown, the metal support mesh 20 includes two oppositely arranged hanging ears, and the two hanging ears are respectively hung on the notches of the ultrasonic generating groove 11.

[0073] Specifically, the metal support mesh 20 includes a mesh body, and hanging ears are respectively provided on opposite sides of the mesh body. The metal support mesh 20 and the ultrasonic generator 10 are matched by hanging with the hanging ears, which has a simple structure and improves convenience during use.

[0074] It should be noted that the metal support mesh 20 is made of conductive inactive metal material, such as graphite, niobium, etc., and serves to connect the bottom of the plating tank 30 with the cathode plate 42, but must not interfere with the chemical reaction of the electroplating system.

[0075] In some embodiments of the present invention, the ultrasonic electroplating device 100 further includes an insulating spacer 80 , which is arranged between a hanging ear and a notch of the ultrasonic generating slot 11 so that the metal support mesh 20 is inclined relative to the bottom wall.

[0076] Specifically, the insulating spacer 80 is made of insulating materials such as rubber and plastic to prevent it from interfering with the electroplating process, and the insulating spacer 80 is of moderate size. When the device is actually constructed, the insulating spacer 80 can be placed on either side to tilt the electroplating system formed by the metal support mesh 20 and the plating tank 30 at a certain angle to ensure that the powder 200 is spread flat on the bottom of the plating tank 30 without relative movement.

[0077] Since the electroplating system has an inclined angle, the flow of the electroplating solution entering the plating tank 30 through the second connecting pipe 63 is affected by gravity to form a tiny water vortex, which rolls up the powder 200 in a row and slowly churns it.

[0078] In some embodiments of the present invention, Figure 1 to Figure 2 As shown, the anode plate 41 includes a first plate body 411, two second plate bodies 412 and two third plate bodies 413. The first plate body 411 is arranged in the plating tank 30 and is spaced apart from the cathode plate 42 in parallel. The spacing distance between the first plate body 411 and the cathode plate 42 is less than or equal to the depth of the plating tank 30. The opposite ends of the first plate body 411 are respectively connected to a second plate body 412. The two second plate bodies 412 are located on the same side of the first plate body 411 and are respectively perpendicular to the bottom surface of the plating tank 30. A third plate body 413 is connected to the end of each second plate body 412 facing away from the first plate body 411. The two third plates 413 are arranged opposite to each other and overlap the top opening of the plating tank 30 respectively.

[0079] Specifically, the first plate body 411 is a circular structure, and the second plate body 412 and the third plate body 413 are both rectangular structures. The structure of the anode plate 41 enables it to be stably placed on the plating tank 30 with both ends extending beyond the edge of the plating tank 30. When the amount of electroplating solution added does not exceed three quarters of the volume of the plating tank 30, the circular structure of the first plate body 411 can be completely immersed in the plating solution.

[0080] The second plate 412 is perpendicular to the bottom surface of the plating tank 30, and the first plate 411 is parallel to the bottom surface of the plating tank 30, so that the facing area between the two is maximized, that is, the anode and cathode electron exchange area is maximized, so as to achieve the purpose of improving the electroplating efficiency and optimizing the plating effect.

[0081] The anode plate 41 is made of magnetic metals such as iron, cobalt, and nickel to obtain a magnetic powder material after plating. The cations in the plating solution must be ions of the metal used for the anode plate 41, and the plating solution is a highly soluble harmless salt solution.

[0082] In some embodiments of the present invention, the plating tank 30 is a transparent component, and the transparent component is a plastic component or a glass component.

[0083] Specifically, the plating tank 30 is configured as a transparent component, thereby facilitating observation during the electroplating process and improving convenience during use.

[0084] In some embodiments of the present invention, Figure 3 As shown, the plating tank 30 is a hexagonal structure, and the plating tank 30 includes a first side wall 31, a second side wall 32, a third side wall 33, a fourth side wall 34, a fifth side wall 35 and a sixth side wall 36 which are connected in sequence end to end. The first side wall 31 is parallel to the fourth side wall 34. Along the circumferential direction of the plating tank 30, the lengths of the first side wall 31 and the fourth side wall 34 are equal, and the lengths of the first side wall 31 and the fourth side wall 34 are greater than the lengths of any other side walls. The first side wall 31 or the fourth side wall 34 receives the electrolyte flowing into the plating tank 30.

[0085] Specifically, the plating tank 30 is configured so that the electroplating solution entering the plating tank 30 can be fully expanded to achieve the purpose of flushing the bottom powder 200 horizontally and evenly.

[0086] In some embodiments of the present invention, the angle between the second side wall 32 and the third side wall 33 is in the range of 45 degrees to 75 degrees, and / or the angle between the fifth side wall 35 and the sixth side wall 36 is in the range of 45 degrees to 75 degrees.

[0087] Specifically, during use, the most suitable angle can be selected according to the volume of the plating solution in the plating tank 30 and the amount of the powder 200 used.

[0088] For example, the angle between the second side wall 32 and the third side wall 33 may be 45 degrees, 60 degrees, 75 degrees, etc., and the angle between the fifth side wall 35 and the sixth side wall 36 may be 45 degrees, 60 degrees, 75 degrees, etc.

[0089] When the ultrasonic electroplating device 100 of the present application is used to electroplate the powder 200:

[0090] First, a certain amount of water is placed in the ultrasonic generator 10 ultrasonic generator 11, a certain mass of the powder 200 to be plated is added to the transparent plating tank 30, evenly laid, and then a certain volume of electroplating solution is poured, and the anode plate 41 is hung on the transparent plating tank 30. Then the transparent plating tank is placed in the center of the metal support net 20, and the first connecting pipe 61 and the second connecting pipe 63 are connected to a suitable height to ensure that the plating solution can be extracted but the powder 200 cannot be extracted, and the switches of the first driving pump 62 and the second driving pump 64 on both sides are turned on at the same time. After the volume of the electroplating solution in the plating tank 30 is stable, the ultrasonic generator 10 is turned on and the ultrasound is started. At the same time, the water flow sprayed by the second connecting pipe 63 gradually expands along the wall of the plating tank 30, realizing the horizontal flushing of the powder 200 on the surface of the cathode plate 42, so that the powder 200 moves as a whole. Due to the inclination angle of the electroplating system, the stream is affected by gravity to form a tiny water vortex, which rolls up the powder 200 to be plated in a row and slowly tumbles. After the ultrasound is finished, turn off the ultrasonic power supply, turn off the first miniature driving pump 62 and the second driving pump 64, and let the reaction device stand for a period of time. After the churning powder 200 falls on the bottom surface of the plating tank 30, the anode plate 41 of the constant current power supply is connected to the metal sheet, the cathode plate 42 is connected to the metal support net 20, the constant current power supply is turned on, and electroplating begins. After the electroplating ends, enter the ultrasonic stage again and start the next cycle. In this way, the effect of pulse electroplating can be achieved. The electromagnetic coil 71 is not energized all the time during the electroplating cycle. After reaching a certain number of electroplating cycles, the electroplating solution is kept in a circulating state, the constant current power supply is turned off, the electromagnetic coil 71 is turned on, and the rubber tube of the first connecting tube 61 is inserted to the bottom so that it can suck the powder 200 and the plating solution into the rear liquid storage tank 50 together. By adjusting the magnetic force of the electromagnetic coil 71, it can adsorb the magnetic powder 200 with relatively intact plating, thereby achieving the purpose of sorting the magnetic powder 200, and the powder 200 that is not adsorbed will continue to follow the plating solution back to the plating tank 30 for the next electroplating.

[0091] The above is only a preferred specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. An ultrasonic electroplating device, characterized in that: The ultrasonic electroplating device comprises: An ultrasonic generator, wherein the ultrasonic generator has an ultrasonic generating groove; A metal support net, wherein the metal support net is detachably hung on the side wall of the ultrasonic generating tank, and the metal support net is spaced apart from the bottom wall of the ultrasonic generating tank; A plating tank, which is an insulating member and a cylindrical member with two ends opened, and is arranged on a side of the metal support mesh away from the bottom wall; An electrode assembly, the electrode assembly comprising a cathode plate and an anode plate, the cathode plate being connected to the plating tank and closing the bottom opening of the plating tank, the cathode plate being conductively connected to the metal support mesh, the anode plate being hung at the top opening of the plating tank and part of the body extending into the plating tank through the top opening of the plating tank; A liquid storage tank, the liquid storage tank is used to store electroplating solution; A pipeline assembly is respectively connected to the liquid storage tank and the plating tank, and is used to drive the electroplating liquid in the liquid storage tank into the plating tank, and drive the electroplating liquid in the plating tank into the liquid storage tank.

2. The ultrasonic plating device according to claim 1, characterized in that: The ultrasonic electroplating device further comprises an electromagnetic component, wherein the electromagnetic component comprises an electromagnetic coil, and the electromagnetic coil is arranged in the liquid storage tank.

3. The ultrasonic plating device according to claim 2, characterized in that: The outer side of the electromagnetic coil is wrapped with a waterproof structure.

4. The ultrasonic plating device according to claim 1, characterized in that: The pipeline assembly comprises: a first connecting pipe, one end of which is connected to the plating tank, and the other end of which is connected to the liquid storage tank; a second connecting pipe, one end of which is connected to the plating tank, the other end of which is connected to the liquid storage tank, and the first connecting pipe and the second connecting pipe are arranged at intervals along the circumferential direction of the plating tank; a first driving pump, wherein the first driving pump is arranged on the first connecting pipe; A second driving pump, the second driving pump is arranged on the second connecting pipe, one of the first driving pump and the second driving pump is used to pump the electrolyte in the plating tank to the liquid storage tank, and the other of the first driving pump and the second driving pump is used to pump the electrolyte in the liquid storage tank to the plating tank.

5. The ultrasonic plating device according to claim 1, characterized in that: The metal support net comprises two hanging ears arranged opposite to each other, and the two hanging ears are respectively hung on the notches of the ultrasonic generating groove.

6. The ultrasonic plating device according to claim 5, characterized in that: The ultrasonic electroplating device also includes an insulating spacer block, which is arranged between one of the hanging ears and the notch of the ultrasonic generating groove so that the metal support mesh is inclined relative to the bottom wall.

7. The ultrasonic plating device according to claim 1, characterized in that: The anode plate comprises: A first plate body, the first plate body is arranged in the plating tank and is spaced apart from and parallel to the cathode plate, and the spacing distance between the first plate body and the cathode plate is less than or equal to the depth of the plating tank; Two second plates, one second plate being connected to each of the opposite ends of the first plate, and the two second plates being located on the same side of the first plate and being perpendicular to the bottom surface of the plating tank; Two third plates, one end of each second plate body facing away from the first plate body is connected with the third plate body, and the two third plates are arranged to face each other and overlap the top opening of the plating tank respectively.

8. The ultrasonic plating device according to claim 1, characterized in that: The plating tank is a transparent component, and the transparent component is a plastic component or a glass component.

9. The ultrasonic plating device according to claim 1, characterized in that: The plating tank has a hexagonal structure, and includes a first side wall, a second side wall, a third side wall, a fourth side wall, a fifth side wall and a sixth side wall which are connected end to end in sequence, the first side wall is parallel to the fourth side wall, and along the circumferential direction of the plating tank, the lengths of the first side wall and the fourth side wall are equal, and the lengths of the first side wall and the fourth side wall are greater than the lengths of any other side walls, and the first side wall or the fourth side wall receives the electrolyte flowing into the plating tank.

10. The ultrasonic plating device according to claim 9, characterized in that: The angle between the second side wall and the third side wall is in the range of 45 degrees to 75 degrees; And / or, an angle between the fifth side wall and the sixth side wall is in the range of 45 degrees to 75 degrees.

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