Conductive conveyor roller for copper foil plating mechanism

Abstract

The utility model discloses a conductive conveying roller of a carrier copper foil copper plating mechanism, which is arranged beside an electroplating tank, used for conveying a substrate and in contact with the substrate, and the conductive conveying roller is equipped with a cathode conductive structure in contact with the conductive conveying roller, and the cathode conductive structure is electrically connected to the cathode of a power supply. The conductive conveying roller of the present design is electrically connected to the cathode of the power supply through the cathode conductive structure, and then, the substrate is electrically connected to the cathode of the power supply through contact with the conductive conveying roller, so that the substrate directly becomes an electrode at one end of the electroplating tank, which is conducive to the simplification of the structure of the electroplating equipment.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating, in particular to electroplating equipment. Background Art

[0002] Electroplating is a material surface treatment process that uses the chemical reaction principle of electrolysis to lay a layer of metal on the surface of a conductor. Common types of electroplating include chrome plating, nickel plating, copper plating, zinc plating, etc.

[0003] The principle of electroplating is that under the action of power supply, current flows to the anode, the anode plate continuously loses electrons, and the metal copper ions that lose electrons diffuse into the plating solution (that is, the dissolution process of the anode); driven by the power supply potential, the lost electrons move in the opposite direction of the current and are enriched on the cathode through the DC power supply. The copper ions continuously gain electrons on the cathode and are reduced to a metal coating, that is, a layer of metal is laid on the surface of the conductor.

[0004] The patent document with the authorization announcement number CN217324362U discloses an adjustment and conveying device for a conductive cloth copper plating mechanism, which mainly relates to the field of conductive cloth copper plating. It includes an unwinding drive device, which includes an unwinding motor and upper and lower tightly matched unwinding rollers; the unwinding motor drives the roller shaft of the lower unwinding roller to rotate and then drives the upper unwinding roller to rotate, so that the conductive cloth passing through the gap between the upper and lower unwinding rollers is transported to the next process. The patent controls the running speed of the conductive cloth in the electrolytic cell by setting an unwinding drive device.

[0005] In the above patent document, the semi-finished conductive cloth (substrate) is directly used as one electrode of the electrolytic cell, and copper is used as the other electrode to carry out the electrolysis reaction of copper. Utility Model Content

[0006] The technical problem solved by the utility model is: how to make a substrate directly become an electrode at one end of an electroplating cell.

[0007] In order to solve the above technical problems, the utility model provides the following technical solutions: the conductive conveying roller of the carrier copper foil copper plating mechanism is arranged beside the electroplating pool, is used to convey the substrate and is in contact with the substrate, and the conductive conveying roller is equipped with a cathode conductive structure in contact with the conductive conveying roller, and the cathode conductive structure is electrically connected to the cathode of the power supply.

[0008] The conductive conveying roller of the utility model is electrically connected to the cathode of the power supply through the cathode conductive structure. Furthermore, the substrate is electrically connected to the cathode of the power supply through contact with the conductive conveying roller. In this way, the substrate directly becomes one end electrode of the electroplating cell, which is beneficial to the simplification of the electroplating equipment structure.

[0009] During electroplating, the anode plate in the electroplating cell continuously loses electrons. The metal copper ions that lose electrons diffuse into the plating solution and, driven by the power supply potential, move toward the cathode substrate direction. They are enriched on the substrate through the DC power supply. The copper ions continuously gain electrons on the substrate and are reduced to a metal coating.

[0010] The conductive transmission roller of the utility model has the function of rectifying the electric current in addition to the transmission function and the conductive function.

[0011] The cathode conductive structure includes an insulating box, a conductive module arranged in the insulating box and connected to the cathode of the power supply, and a clamping structure arranged on the conductive module. The clamping structure clamps the conductive conveying roller and maintains contact with the conductive conveying roller to achieve current transmission.

[0012] The conductive module is provided with a wiring part, which is an integrated structure with the conductive module, and the wiring part is connected to the cathode of the power supply through a wire.

[0013] As an improvement, the conductive conveying roller is hollow and filled with cooling liquid, and cooling pipe joints are connected to both ends of the conductive conveying roller. The conductive conveying roller is connected to the cooling pipe through the cooling pipe joint, and a heat exchange device is provided on the cooling pipe. Through the heat exchange device, the cooling liquid exchanges heat with the outside, and the temperature of the cooling liquid decreases. Under the action of the water pump, the cooling liquid circulates between the conductive conveying roller and the heat exchange device to cool down the conductive conveying roller that is heated by conduction.

[0014] The conductive conveying roller is equipped with a follower roller. The conductive conveying roller and the follower roller clamp the substrate and convey it forward. The conductive conveying roller rotates due to the drive of the motor, and the clamped substrate causes the follower roller to rotate. While the follower roller cooperates with the conductive conveying roller to convey the substrate, the substrate and the conductive conveying roller keep in contact, the conductive ability of the conductive conveying roller is maintained, and the water droplets on the substrate can be squeezed out. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The utility model is further described below in conjunction with the accompanying drawings:

[0016] Figure 1 It is a front view of the carrier copper foil copper plating mechanism;

[0017] Figure 2 for Figure 1 A cross-sectional view of

[0018] Figure 3 for Figure 1 A top view of

[0019] Figure 4 for Figure 1 Rear view of

[0020] Figure 5 It is a three-dimensional diagram of the copper plating mechanism of the carrier copper foil;

[0021] Figure 6 for Figure 3 Enlarged view of point A in the middle;

[0022] Figure 7 for Figure 5 Enlarged view of point B in the middle;

[0023] Figure 8 for Figure 7 Schematic diagram of the conductive conveying roller 21;

[0024] Fig. 9 for Figure 8 sectional view of .

[0025] Explanation of symbols in the figure:

[0026] 10. Electroplating bath;

[0027] 20. First group of conveying rollers; 21. First conductive conveying roller; 22. Cathode conductive structure; 221. Insulating box; 222. Conductive module; 223. Clamping structure; 224. Wiring part; 23. Cooling pipe joint; 25. Follower roller;

[0028] 30. A second group of conveying rollers; 31. A second conductive conveying roller;

[0029] 40. Pool bottom conveyor roller;

[0030] 50. Anode plate; 51. Anode plate carrier frame; 52. Anode plate conductive member; 53. Spraying system; 531. Bottom pipeline of the spraying system; 532. Spraying head;

[0031] 60. cleaning tank; 61. guide roller; 62. third set of conveying rollers; 63. cleaning tank conveying rollers;

[0032] 71. a first motor; 72. a second motor;

[0033] 80. Base material. DETAILED DESCRIPTION

[0034] like Figure 2 A carrier copper foil copper plating mechanism includes an electroplating cell 10 and a conveying device used in conjunction with the electroplating cell, wherein the conveying device includes a first group of conveying rollers 20 and a second group of conveying rollers 30 arranged on both sides of the top of the electroplating cell, and a bottom conveying roller 40 arranged at the bottom of the electroplating cell, and an anode plate 50 is arranged in the electroplating cell.

[0035] A cleaning pool 60 is arranged beside the electroplating pool 10, and guide rollers 61 and a third group of conveying rollers 62 are arranged on both sides of the top of the cleaning pool, respectively. The first group of conveying rollers 20, the second group of conveying rollers 30, the guide rollers 61, and the third group of conveying rollers 62 are linked by a first belt. Any conveying roller of the third group of conveying rollers 62 is connected to the first motor 71, and under the drive of the first motor, the first group of conveying rollers 20, the second group of conveying rollers 30, the guide rollers 61, and the third group of conveying rollers 62 are linked.

[0036] A cleaning tank conveying roller 63 is provided in the cleaning tank 60 , and the cleaning tank conveying roller is connected to the second motor 72 . The cleaning tank conveying roller 63 is linked with the tank bottom conveying roller 40 through a second belt.

[0037] The substrate 80 is sequentially conveyed forward by the first group of conveying rollers 20, the bottom conveying rollers 40, the second group of conveying rollers 30, the guide rollers 61, the cleaning tank conveying rollers 63, and the third group of conveying rollers 62, and sequentially passes through the electroplating tank 10 and the cleaning tank 60. The substrate 80 is parabolic in the electroplating tank 10 and the cleaning tank 60.

[0038] Combination Figure 2 , Figure 6 , Figure 7 One conveying roller in the first group of conveying rollers 20 is connected to the cathode of the power supply and is set as the first conductive conveying roller 21 , and one conveying roller in the second group of conveying rollers 30 is connected to the cathode of the power supply and is set as the second conductive conveying roller 31 .

[0039] A cathode conductive structure 22 is provided at one end of any conductive conveying roller, and the cathode conductive structure includes an insulating box 221, a conductive module 222 disposed in the insulating box and connected to the cathode of the power supply, and a clamping structure 223 disposed on the conductive module, and the clamping structure clamps the conductive conveying roller. Among them, the conductive module 222 is provided with a wiring part 224, and the wiring part and the conductive module are an integral structure, and the wiring part is connected to the cathode of the power supply through a wire. The conductive conveying roller of the utility model is electrically connected to the cathode of the power supply through the cathode conductive structure 22, and then, the substrate 80 is electrically connected to the cathode of the power supply through contact with the conductive conveying roller, so that the substrate directly becomes an electrode at one end of the electroplating cell 10.

[0040] As an improvement, any conductive conveying roller is hollow and filled with cooling liquid, and cooling pipe joints 23 are connected to both ends of the conductive conveying roller. The conductive conveying roller is connected to the cooling pipe through the cooling pipe joint 23, and a heat exchange device is provided on the cooling pipe. Through the heat exchange device, the cooling liquid exchanges heat with the outside, and the temperature of the cooling liquid decreases. Under the action of the water pump, the cooling liquid circulates between the conductive conveying roller and the heat exchange device to cool down the conductive conveying roller that generates heat due to conduction.

[0041] Any conductive conveying roller is equipped with a follower roller 25, and the conductive conveying roller and the follower roller clamp the substrate 80 and convey it forward. The conductive conveying roller rotates due to the drive of the motor, and the follower roller 25 rotates through the clamped substrate 80. While the follower roller 25 cooperates with the conductive conveying roller to convey the substrate, the substrate and the conductive conveying roller are kept in contact, the conductive conveying roller's conductivity is maintained, and water drops on the substrate can be squeezed out.

[0042] like Figure 2 Anode plates 50 are arranged in the electroplating tank 10. The number of anode plates 50 is a pair, and they are located on both sides of the parabolic substrate in the electroplating tank 10. Anode plates 50 are located in an anode plate carrier frame 51. Anode plate conductive members 52 are arranged above the anode plate carrier frame. The anode plate conductive members are connected to the anode of the power supply to realize electrical connection between the anode plates and the anode of the power supply.

[0043] During electroplating, the anode plate 50 continuously loses electrons, and the metal copper ions that have lost electrons diffuse into the plating solution. Driven by the power supply potential, they move toward the cathode substrate 80 and are enriched on the substrate through the DC power supply. The copper ions continuously gain electrons on the substrate 80 and are reduced to a metal coating.

[0044] As an improvement, Figure 2 A spray system 53 for spraying upward is provided below the anode plate 50, and a bottom pipe 531 of the spray system passes downward through the bottom of the electroplating tank 10 and is connected to a circulation pipe, which is connected to the electroplating tank 10. Driven by a pump, the circulation pipe draws plating solution from the electroplating tank, and the plating solution is sprayed upward by a spray head 532 at the top of the spray system 53, disturbing the plating solution around the anode plate 50, which is beneficial for the rapid precipitation and flow of the metal copper ions on the anode plate.

[0045] After the electroplating is completed, the substrate enters the cleaning tank 60 for cleaning under the conveyance of the guide roller 61 , the cleaning tank conveying roller 63 , and the third group of conveying rollers 62 .

[0046] The utility model plates a thin copper layer on a soft substrate with a thickness of 1-3 microns, and then peels the thin copper layer off the substrate for processing circuit boards or new energy vehicle batteries.

[0047] The above contents are only preferred implementation modes of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there may be changes in the specific implementation mode and application scope. The content of this specification should not be understood as limiting the present invention.

Claims

1. A conductive conveying roller of a carrier copper foil plating mechanism, arranged beside the electroplating tank (10), used for conveying a substrate (80), in contact with the substrate, characterized in that: The conductive conveying roller is equipped with a cathode conductive structure (22) in contact with the conductive conveying roller, and the cathode conductive structure is electrically connected to the cathode of the power supply.

2. The conductive conveying roller of the carrier copper foil plating mechanism according to claim 1, characterized in that: The cathode conductive structure (22) comprises an insulating box (221), a conductive module (222) arranged in the insulating box and connected to the cathode of the power supply, and a clamping structure (223) arranged on the conductive module, wherein the clamping structure clamps the conductive conveying roller.

3. The conductive conveying roller of the carrier copper foil plating mechanism according to claim 2, characterized in that: The conductive module (222) is provided with a wiring portion (224), and the wiring portion and the conductive module are an integral structure.

4. The conductive conveying roller of the carrier copper foil copper plating mechanism according to claim 2, characterized in that: The conductive conveying roller is hollow and filled with cooling liquid. Both ends of the conductive conveying roller are connected with cooling pipeline joints (23).

5. The conductive conveying roller of the carrier copper foil copper plating mechanism according to claim 1, characterized in that: The conductive conveying roller is matched with a follower roller (25), and the conductive conveying roller and the follower roller clamp the substrate (80) and convey it forward.

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