Wafer probing equipment using probe card positioning module

Abstract

A wafer detection device using a probe card positioning module can combine the precise movement capabilities of a wafer carrier and a probe card positioning module to achieve precise positioning of multiple probe cards to support parallel testing, and through simple operation of a lifting mechanism, it is convenient and quick to temporarily remove the obstruction above the wafer carrier, allowing a more flexible wafer placement method, and also making it easier to repair and maintain the probe card positioning module and the wafer carrier. Moreover, the probe card positioning module is arranged on a load-bearing bracket, which can make the design of the probe card positioning module more flexible, and help to change or simplify the mechanism design to adapt to more diverse application requirements. The utility model further discloses that at least one image capture device is arranged on the probe card positioning module to monitor and correct the probe positioning drift problem caused by temperature changes, so as to achieve more stable and reliable wafer detection capabilities.

Description

Technical Field

[0001] The utility model is a wafer detection device applied to a wafer-level automatic test system. The innovative integrated setting method of the wafer carrier and the probe card positioning module is used to enhance the precision positioning capability of multiple probe cards and provide more flexible mechanism design freedom, which is conducive to the development of more reliable, convenient and cost-effective parallel testing solutions to enhance wafer testing capacity. Background Art

[0002] As semiconductor technology and industry scale continue to grow, more powerful chips have also emerged, making it necessary to obtain more test data for more accurate and effective analysis of semiconductor component parameters or reliability, so more wafer testers are needed to obtain sufficient test capacity. However, the space of factory test lines or laboratories is limited, and it is difficult to continuously plan more space to expand wafer testers. Therefore, how to improve the test capacity per unit time and limited space has always been an important issue of concern to the industry.

[0003] In order to achieve greater testing capacity within a limited space, parallel testing is a typical development direction. It is known that to test multiple DUTs in parallel, multiple probe cards can be used to simultaneously detect DUTs at different locations on the wafer surface. Fig.24 and Fig.25 As shown, the conventional detection device is provided with a first track 2 and a second track 3 on both sides of the platform 1, and is also provided with a third track 4 whose two ends can slide on the first track 2 and the second track 3. However, the conventional technology still has many shortcomings, five of which are listed below:

[0004] 1. The third track 4 of the conventional technology must cross the opening 5 of the platform 1, and the two ends of the third track 4 are slidably arranged on the first track 2 and the second track 3 on both sides of the opening 5, so that the length of the third track 4 must be sufficient to cross the opening 5. This condition restriction is not conducive to the freedom of track length design. More importantly, the use of a longer track can easily magnify the influence of thermal expansion and contraction caused by temperature changes, especially there is a carrier 6 under the third track 4 that needs to be heated at a high temperature (for example: 200°C), which is a problem that cannot be ignored for wafer detection equipment that requires ultra-high precision positioning.

[0005] 2. In conventional technology, a plurality of detection stations 8 are arranged on the third track 4, and there are many ways for these detection stations 8 to interfere with each other. For example, the detection stations 8 can interfere with each other via the connection of the third track 4, and the plurality of third tracks 4 can also interfere with each other via the connection of the first track 2 or the second track 3. However, in the initial operation of the test process, the detection stations 8 must be adjusted in sequence so that each probe card 9 can be accurately aligned with the component A to be tested below. If there are too many mechanical connections between the detection stations 8, which makes it easy for them to interfere with each other, it will be difficult to adjust and align the probe cards 9 in sequence.

[0006] 3. The track fixing base of the conventional technology is the platform 1 below the track, but the platform 1 is adjacent to a large-sized carrier 6 that needs to be heated at high temperature. The temperature control device 7 of the carrier 6 is not very stable, and its operation still has temperature fluctuations. Moreover, during the wafer testing process, each detection station 8 or the third track 4 often needs to change its relative position relative to the carrier 6 or the platform 1. These factors make it difficult to maintain an ideal thermal balance between the mechanisms. This situation is a problem for the conventional technology that uses the platform 1 adjacent to the high-temperature heat source as the basic structure.

[0007] 4. Although the use of multiple sets of detection stations 8 is helpful to achieve parallel testing, when facing the temperature rise and fall test of the wafer, the dimensional error caused by the thermal expansion and contraction effect is likely to be more serious due to the large spatial distribution range of the multiple sets of detection stations 8, which makes it easier to produce the problem of probe positioning drift. Therefore, how to ensure that the multiple sets of detection stations 8 can maintain good positioning without drifting during the wafer testing process is a big challenge. However, the conventional technology only performs manual observation and adjustment at the initial stage of the operation process to align each probe card 9 one by one, so that each probe card 9 and the component A to be tested are temporarily aligned, but in the subsequent test process, the positioning status of each probe card 9 of each detection station 8 is not monitored or recorded, so it is impossible to immediately detect whether the contact position between each probe card 9 and the component A to be tested has drifted. Usually, it is not until the wafer test task is completed that the cause of the test abnormality is tracked because there are too many abnormalities in the test data.

[0008] 5. The third track 4 set by the conventional technology and the multiple sets of detection tables 8 carried by it will directly block the opening 5 of the platform 1 and the carrier 6 below. Therefore, the wafer cannot be placed from above the opening 5 of the platform 1, and the wafer can only be placed from the side of the carrier 6 below the opening 5 of the platform 1. This will lead to limitations in the design of the mechanism, making it impossible to adopt some system design concepts that can reduce costs, and will also make the maintenance of the carrier 6 very inconvenient.

[0009] In order to solve many problems of conventional solutions, the creators have conducted long-term observation and active thinking, and have conducted multiple prototype tests and related improvements, and have developed a wafer detection device using a probe card positioning module, which can completely solve or effectively improve many deficiencies of conventional solutions. Utility Model Content

[0010] The purpose of the utility model is to provide a wafer detection device using a probe card positioning module, which has a simple structure and is easy to operate and maintain. It can effectively overcome many shortcomings of conventional solutions, provide good stability and availability, effectively delay its loss to increase its service life, and improve the probe positioning drift problem caused by the unstable thermal balance between the high-temperature heat source and the mechanism. It can adapt to more diverse application scenarios or support a greater degree of mechanism simplification to reduce equipment costs, provide more stable and reliable wafer detection capabilities, and be more practical.

[0011] To achieve the above object, the utility model discloses a wafer detection device using a probe card positioning module, which is characterized by comprising:

[0012] A wafer detection machine base, the wafer detection machine base is provided with a wafer carrier and a carrier moving device, the wafer carrier is located above the carrier moving device and the carrier moving device can drive the wafer carrier to move, the wafer carrier carries and adsorbs a wafer, and the wafer detection machine base is provided with a lifting mechanism, and the lifting mechanism is provided with a load-bearing bracket;

[0013] At least one probe card positioning module, the probe card positioning module is arranged on the load-bearing bracket, the probe card positioning module has at least one probe alignment device, the probe alignment device is provided with at least one probe card, and the probe card is provided with at least one probe;

[0014] An electromechanical control system is electrically connected to the probe card positioning module.

[0015] Among them, a heating device is arranged inside the wafer carrier and the carrier moving device drives the wafer carrier to move in three axes.

[0016] The probe alignment device includes at least one electric fine-tuning device, which is directly or indirectly combined with the probe card and electrically connected to the electromechanical control system so that the electromechanical control system controls the probe alignment device to drive the probe card to move, rotate or tilt.

[0017] The probe alignment device includes at least one manual fine-tuning device, which is directly or indirectly combined with the probe card so that the probe card is driven to move, rotate or tilt by manual operation of the manual fine-tuning device.

[0018] The probe card positioning module is provided with at least one detection track, and the detection track is provided with at least one detection slide, and the probe alignment device is arranged on the detection slide.

[0019] The detection slide is electrically connected to the electromechanical control system so that the electromechanical control system controls the detection slide to move along the detection track.

[0020] One side of the detection track is connected to a driving device, the driving device is electrically connected to the electromechanical control system, and the detection slide is driven by the driving device to move on the detection track.

[0021] One side of the detection track is connected to a manual operating device so that the manual operating device is manually operated to move the detection slide on the detection track.

[0022] The lifting mechanism adopts a split design and is placed on one side of the wafer detection machine base, or adopts an integrated design so that the lifting mechanism and the wafer detection machine base are integrated into one.

[0023] Wherein, an extension fixing piece is provided on one side or the lower end surface of the probe alignment device, and the extension fixing piece is provided with the probe card.

[0024] The device also includes at least one image capture device for acquiring optical imaging or thermal imaging data.

[0025] Wherein, the image capturing device is arranged on the detection slide.

[0026] Wherein, at least one auxiliary track is arranged on the load-bearing bracket, the auxiliary track and the detection track are spaced apart by a distance, the auxiliary track is provided with at least one camera positioning slide, and the image capture device is arranged on the camera positioning slide.

[0027] The camera positioning slide is electrically connected to the electromechanical control system so that the electromechanical control system can control the camera positioning slide to move along the auxiliary track.

[0028] The electric fine-tuning device adopts a piezoelectric platform, a piezoelectric actuator, a piezoelectric motor, a stepper motor, a servo motor or a voice coil motor.

[0029] The probe card positioning module is provided with at least one image capturing device for acquiring optical imaging or thermal imaging data.

[0030] It can be seen from the above structure that the advantages of the utility model are as follows:

[0031] 1. Good stability and availability: Since the utility model completely abandons the third track with two ends that can slide above the platform as in the conventional technology, there is no need to configure motors at both ends of the long track to push the sliding long track. Therefore, there is no need to worry about the burden and loss caused by the motor that pushes the two ends of the third track to slide having to bear the weight of the track itself and the weight of multiple sets of detection platforms. Moreover, the utility model does not have to be limited by the track length limitation problem caused by the track of the conventional technology that must cross the platform opening due to the design of the load-bearing bracket. Therefore, it can flexibly use the design of independently setting multiple probe alignment devices or using short tracks. Therefore, if the probe card positioning module in the utility model is actuated by an electric device, the weight burden it bears can be reduced, which helps to improve the reliability of the wafer detection equipment and extend its service life. Moreover, the utility model integrates and uses the currently mature and stable stage moving device, which is mainly responsible for executing the relative movement between the probe card and the wafer. Therefore, the workload of the probe card positioning module can be greatly reduced, thereby effectively delaying its loss.

[0032] 2. Reduce the thermal balance problem between the high-temperature heat source and the mechanism: The utility model uses the load-bearing bracket set by the lifting mechanism as the fixed base of the probe card positioning module. Therefore, compared with the conventional design adopted in the conventional technology, the probe card positioning module in the utility model is not conventionally set on the platform in the conventional technology, so the fixed base of the mechanism is already far away from the high-temperature heat source of the wafer carrier below, which can reduce the impact of the high-temperature heat source and help improve the probe positioning drift problem caused by the unstable thermal balance between the high-temperature heat source and the mechanism.

[0033] 3. More freedom in wafer placement: The utility model can easily and quickly temporarily remove the obstruction above the wafer carrier (for example, the probe card positioning module and the load-bearing bracket) by simply operating the lifting mechanism. This can provide a more flexible and diverse way of wafer placement. The wafer can be placed from the top or side of the wafer carrier, allowing the hardware design of the wafer detection equipment to have more degrees of freedom to adapt to more diverse application scenarios or support a greater degree of structural simplification to reduce equipment costs.

[0034] 4. Easy machine maintenance and parts replacement: With the help of the lifting mechanism, the utility model can easily and quickly temporarily remove the obstruction above the wafer carrier, so it is easier to maintain the wafer carrier. In addition, the utility model can set a plurality of probe card positioning modules on the load-bearing bracket. Since each probe card positioning module can achieve good mechanical independence, it is very easy to repair and replace. There is no complicated linkage and superposition between the mechanisms, and there is no need for complicated disassembly and assembly operations.

[0035] 5. Improving mechanical interference: The utility model further discloses that an extension fixture is respectively provided on each of the probe alignment devices. With the assistance of the extension fixtures, the limitations caused by the mechanical interference between the probe alignment devices can be effectively improved, so that the relative distance between the probe cards can be closer to support more application requirements.

[0036] 6. Providing more stable and reliable wafer detection capabilities: The utility model further discloses that at least one image capture device is arranged on each probe card positioning module or on an auxiliary track. Through the arrangement of these image capture devices, optical imaging or thermal imaging data can be conveniently collected, which helps to more efficiently align each probe card with the wafer in the initial stage of the test process, and in the subsequent wafer testing process, it can also be used to detect and record or actively correct the positioning deviation of each probe card, thereby effectively solving the probe positioning drift problem that conventional technology still often faces. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a three-dimensional diagram of the first embodiment of the utility model.

[0038] Figure 2 for Figure 1 A partial enlarged view at point A.

[0039] Figure 3 It is a schematic diagram of the lowering of the lifting mechanism of the first embodiment of the utility model.

[0040] Figure 4 It is a three-dimensional diagram of the second embodiment of the utility model.

[0041] Figure 5 for Figure 4 A partial enlarged view at point B.

[0042] Figure 6 It is a three-dimensional diagram of the third embodiment of the utility model.

[0043] Figure 7 for Figure 6 A partial enlargement of point C.

[0044] Figure 8 It is a three-dimensional diagram of the fourth embodiment of the utility model.

[0045] Fig. 9 for Figure 8 A partial enlarged view at point D.

[0046] Fig.10 It is a three-dimensional diagram of the fifth embodiment of the utility model.

[0047] Fig.11It is a schematic diagram of the descending lifting mechanism of the fifth embodiment of the utility model.

[0048] Fig.12 It is a three-dimensional diagram of the sixth embodiment of the utility model.

[0049] Fig.13 for Fig.12 A partial enlarged view of the load-bearing bracket after it is lifted up.

[0050] Fig.14 It is a three-dimensional diagram of the seventh embodiment of the present utility model.

[0051] Fig.15 for Fig.14 A partial enlarged view of the probe card positioning module.

[0052] Fig.16 It is a three-dimensional diagram of the eighth embodiment of the present utility model.

[0053] Fig.17 for Fig.16 A partial enlarged view at point E.

[0054] Fig.18 It is a three-dimensional diagram of the ninth embodiment of the present utility model.

[0055] Fig.19 for Fig.18 A partial enlarged view at F.

[0056] Fig. 20 It is a three-dimensional diagram of the tenth embodiment of the utility model.

[0057] Fig.21 for Fig. 20 A local enlarged view at G.

[0058] Fig. 22 It is a three-dimensional diagram of the eleventh embodiment of the present utility model.

[0059] Fig.23 for Fig. 22 A partial enlarged view at point H.

[0060] Fig.24 It is a top view schematic diagram of a conventional detection device.

[0061] Fig.25 It is a cross-sectional schematic diagram of a conventional detection device. DETAILED DESCRIPTION

[0062] See also Figures 1 to 3 FIG. 1 is a first embodiment of the present invention, which discloses a wafer detection device 100 using a probe card positioning module, comprising:

[0063] A wafer detection machine base 10 is provided with a wafer carrier 11 and a carrier moving device 12. The wafer carrier 11 is located above the carrier moving device 12 so that the carrier moving device 12 can drive the wafer carrier 11 to move in three axes. The wafer carrier 11 carries a wafer 111 on its upper end surface by vacuum adsorption. A heating device 112 is provided inside the wafer carrier 11 to heat the wafer 111 to a high temperature (e.g., 200°C). A lifting mechanism 13 is provided on one side of the wafer detection machine base 10. In the embodiment, the lifting mechanism 13 adopts a rotary design and a split design, so that the lifting mechanism 13 and the wafer detection base 10 can be separated from each other to disperse the weight of the equipment and make it easier to carry. However, in some embodiments, the lifting mechanism 13 and the wafer detection base 10 can be changed to an integrated design, or a vertical lifting or other equivalent design can be adopted. In this embodiment, the lifting mechanism 13 is pivotally connected to a load-bearing bracket 14, but the load-bearing bracket 14 can be easily changed into a variety of different equivalent designs, and is not limited to the form disclosed in this embodiment.

[0064] A probe card positioning module 20. In this embodiment, the probe card positioning module 20 is arranged on the bottom surface of the load-bearing bracket 14. However, the combination of the probe card positioning module 20 and the load-bearing bracket 14 can be easily changed into a variety of different equivalent arrangements, which is not limited to the method of this embodiment. The probe card positioning module 20 has a plurality of probe alignment devices 21, and each of the probe alignment devices 21 is independently arranged on the probe card positioning module 20, which can greatly reduce the problem of mutual interference, and is conducive to the sequential adjustment of each of the probe alignment devices 21 to align with the object to be tested (the wafer 111). Each of the probe alignment devices 21 includes an electric fine-tuning device 211, and each of the electric fine-tuning devices The device 211 includes a Z-axis actuator 2111, a Y-axis actuator 2112 and an X-axis actuator 2113, so that it has the ability of electrically controlled micro-motion in the three axes of X, Y and Z. Each of the electric micro-adjustment devices 211 can flexibly use a piezoelectric platform, a piezoelectric actuator, a piezoelectric motor, a stepper motor, a servo motor, a voice coil motor or other actuators with electronically controlled micro-motion capabilities. In some more complex application cases, the electric micro-adjustment devices 211 can also include an actuator with a rotation or tilting function, which can provide a more advanced micro-adjustment function. In this embodiment, the lower end surface of each probe alignment device 21 is respectively provided with a probe card 24, and each probe card 24 is respectively provided with at least one probe 241.

[0065] An electromechanical control system 30 is provided, and the electromechanical control system 30 is electrically connected to the probe card positioning module 20 and the probe alignment devices 21, so that the electromechanical control system 30 can control each of the probe alignment devices 21 to drive each of the probe cards 24 to move. In some more complex application cases, the electromechanical control system 30 can also further control each of the probe alignment devices 21 to drive each of the probe cards 24 to rotate or tilt. In this embodiment, the electromechanical control system 30 is arranged on the load-bearing bracket 14, but the setting of the electromechanical control system 30 can be easily changed, and its position is not limited to this embodiment.

[0066] Before conducting wafer testing, first confirm whether each probe alignment device 21 has correctly set the probe card 24, and then adjust each probe alignment device 21 to an appropriate position by operating the electromechanical control system 30. At this time, the lifting mechanism 13 can drive the probe card positioning module 20 to descend in height until each probe 241 is close to the surface of the wafer 111, and then operate the electromechanical control system 30 and the stage moving device 12 to fine-tune each probe alignment device 21 and the wafer stage 11 respectively, so that each probe 241 of each probe card 24 can contact the appropriate position on the surface of the wafer 111, thereby completing the precise alignment between each probe card 24 and the wafer 111.

[0067] Among them, since each of the probe alignment devices 21 can be independently arranged on the probe card positioning module 20, during the sequential precision alignment adjustment process, it is not easy for the probe alignment devices 21 to interfere with each other and require multiple re-fine adjustments.

[0068] After completing the alignment step, the actual wafer testing task can be carried out. In particular, the testing process is mainly driven by the carrier moving device 12 to drive the wafer carrier 11 to perform precise three-axis movement, so that the wafer 111 can be accurately displaced relative to each of the probe cards 24, so that each of the probes 241 can correctly contact different positions on the surface of the wafer 111, so that the testing instrument (not shown) can test the circuit component characteristics at different positions on the surface of the wafer 111 in parallel.

[0069] Continue reading Figure 4 and Figure 5As shown, it discloses the second embodiment of the utility model. The second embodiment of the utility model is different from the aforementioned first embodiment in that the probe card positioning module 20 is provided with a detection track 22, and a plurality of detection slides 23 are provided on the detection track 22. Each of the probe alignment devices 21 is respectively arranged on each of the detection slides 23. In this embodiment, the electric fine-tuning device 211 includes the Y-axis actuator 2112 and the X-axis actuator 2113, and is the electric fine-tuning device 211 in the X and Y axes made by piezoelectric technology. The fine-tuning function in the Z-axis direction has been omitted to reduce costs, and the electromechanical control system 30 is electrically connected to each of the detection slides 23 and each of the probe alignment devices 21, so that the electromechanical control system 30 can control each of the detection slides 23 to move along the detection track 22, and can control each of the probe alignment devices 21 to move precisely in the X- and Y-axis directions. In this way, by combining the larger range of movement provided by the detection track 22 and the precise movement capability of each of the probe alignment devices 21, the utility model has sufficient application flexibility.

[0070] In the second embodiment of the utility model, the detection track 22 is fixedly arranged on the load-bearing bracket 14, and the two ends of the detection track 22 do not slide. Compared with the third track with sliding ends used in the conventional technology, the detection track 22 has better basic stability, and the length design of the detection track 22 is more free, which can completely eliminate the length requirement of the track in the conventional technology that must cross the platform opening, and the detection track 22 is relatively located at a higher place, and is farther away from the high-temperature heat source of the wafer carrier 11 below, so that the impact of the thermal balance problem can be relatively reduced.

[0071] Continue reading Figure 6 and Figure 7 As shown, it discloses the third embodiment of the present invention. The difference between the third embodiment of the present invention and the aforementioned second embodiment is that the probe card positioning module 20 is rotated 90 degrees relative to the load-bearing bracket 14 and then arranged on the load-bearing bracket 14. From this embodiment, it can be seen that since the probe card positioning module 20 adopts a good modular design, the complexity of the large slide rail mechanism of the conventional technology that is staggered and overlapped can be avoided, so the present invention can easily change the design form in different orientations.

[0072] Continue reading Figure 8 and Fig. 9As shown, it discloses the fourth embodiment of the utility model. The fourth embodiment of the utility model is different from the aforementioned second embodiment in that each of the probe alignment devices 21 includes the electric fine-tuning device 211 and a manual fine-tuning device 212, each of the manual fine-tuning devices 212 is respectively arranged on the lower end surface of each of the electric fine-tuning devices 211, and each of the probe cards 24 is respectively arranged on the lower end surface of each of the manual fine-tuning devices 212. Moreover, each of the electric fine-tuning devices 211 and each of the manual fine-tuning devices 212 has been simplified to only provide single-direction precision movement fine-tuning. In more practical applications, the manual fine-tuning function included in each of the probe alignment devices 21 can be expanded or changed according to specific needs. For example, the manual fine-tuning device 212 that supports movement, rotation or tilting function is added, so that each of the manual fine-tuning devices 212 can be manually operated to drive each of the probe cards 24 to move, rotate or tilt, so as to greatly simplify the electric mechanism design to reduce costs, and also avoid increasing system complexity or failure rate due to unnecessary electric mechanism design.

[0073] Among them, the electric fine-tuning device 211 in the above-mentioned fourth embodiment is indirectly combined with the probe card 24, while in the first embodiment, the probe card 24 is provided on the lower end surface of the electric fine-tuning device 211, so the probe card 24 is directly or indirectly combined with the electric fine-tuning device 211.

[0074] Among them, the manual fine-tuning device 212 of the fourth embodiment is directly combined with the probe card 24, while in other application cases, the probe alignment device 21 can change the combination order between the electric fine-tuning device 211 and the manual fine-tuning device 212 according to different application requirements, so that the probe card 24 is directly or indirectly combined with the manual fine-tuning device 212.

[0075] Continue reading Fig.10 and Fig.11 As shown, it discloses the fifth embodiment of the utility model. The fifth embodiment of the utility model is different from the first embodiment and the fourth embodiment in that the wafer detection machine base 10 is provided with an auxiliary platform 15 extending inwardly from the upper end surface, and the top surface of the auxiliary platform 15 is provided with two positioning blocks 16, and the load-bearing bracket 14 is respectively provided with a positioning column 17 corresponding to each positioning block 16, as shown in FIG. Fig.11 As shown, each positioning column 17 can be inserted and fixed in each positioning block 16, thereby assisting in the accurate positioning of the load-bearing bracket 14 and providing some dust-proof and light-shielding effects to the wafer carrier 11, wherein the shape and position of the auxiliary platform 15 can be changed according to different application requirements, and each positioning block 16 and each positioning column 17 can also be changed equivalently and set at different positions.

[0076] Continue reading Fig.12 and Fig.13 As shown, it discloses the sixth embodiment of the utility model. The sixth embodiment of the utility model is different from the aforementioned second embodiment in that a plurality of the probe card positioning modules 20 are arranged on the load-bearing bracket 14, and each of the probe card positioning modules 20 is arranged to be separated from each other. Each of the probe card positioning modules 20 is respectively provided with the detection rail 22, and each of the detection rails 22 is respectively provided with a detection slide 23, and each side of the detection rail 22 is respectively connected to a driving device 25, and the driving device 25 is electrically connected to the electromechanical control system 30. Each of the driving devices 25 can be a stepping motor or an electric device with equivalent efficacy. Each of the detection slides 23 is driven by each of the driving devices 25 to move on each of the detection rails 22. Move upward, each probe alignment device 21 is arranged on the end surface of each detection slide 23, but the arrangement method can also be changed, and is not limited to this. In the present embodiment, each detection rail 22 adopts a short rail. Therefore, since each detection rail 22 is matched with each detection slide 23 and each probe alignment device 21 in a modular arrangement, in addition to using a short rail to reduce costs, each probe card positioning module 20 has good mechanical independence, and there is no mechanical linkage and superposition between each other, so it is very easy to repair and replace, and each probe alignment device 21 effectively avoids the problem of mutual interference during the adjustment process of the test process for precise alignment of the wafer to be tested.

[0077] Continue reading Fig.14 and Fig.15 And with Fig.13 As shown, it discloses the seventh embodiment of the utility model. The difference between the seventh embodiment of the utility model and the aforementioned sixth embodiment is that, in order to save more space, the lifting mechanism 13 adopts an integrated design of vertical lifting, so that the lifting mechanism 13 and the wafer detection machine base 10 are integrated into one body, and the vertical lifting of the load-bearing bracket 14 is realized by the setting of a screw device 131, avoiding the disadvantage of the split type and the rotary type design occupying the factory space. In order to save equipment costs, one side of each detection rail 22 is respectively connected to a manual operating device 26, rather than the driving device 25 (stepping motor) used in the sixth embodiment. This embodiment can manually operate each manual operating device 26 to enable each detection slide 23 to move on each detection rail 22. It is more suitable for cases where cost reduction is given priority and the detection slide 23 does not need to be moved frequently. In particular, for many applications, the precise movement capability of the wafer carrier 11 can already provide the relative displacement function required for the wafer testing process, and each detection slide 23 can remain stationary after the initial adjustment.

[0078] Continue reading Fig.16 and Fig.17As shown, it discloses the eighth embodiment of the utility model. The difference between the eighth embodiment of the utility model and the aforementioned first and second embodiments is that an extension fixing member 27 is respectively provided on one side or the lower end surface of each probe alignment device 21, and a probe card 24 is respectively provided on the lower end surface of each extension fixing member 27, wherein the shape or size of the extension fixing members 27 can be adjusted according to application requirements (the same or partially the same or not the same as each other). Therefore, through the provision of the extension fixing members 27, the limitations caused by the mechanical interference between the probe alignment devices 21 can be effectively improved, so that the distance between the probe cards 24 can be closer to support more application requirements, and in some application cases, the design changes of the extension fixing members 27 can also make the probe alignment devices 21 farther away from the wafer carrier 11 below to reduce the influence of high-temperature heat sources.

[0079] Continue reading Fig.18 and Fig.19 As shown, it discloses the ninth embodiment of the utility model. The ninth embodiment of the utility model is different from the aforementioned second embodiment in that each of the detection slides 23 is also provided with an image capture device 28. The image capture device 28 can be used to obtain optical imaging or thermal imaging recording data of each of the probes 241 and the surface of the wafer 111 to analyze whether the positioning of each of the probes 241 is deviated, which helps to solve the problem caused by temperature changes. For example, if the wafer 111 is subjected to a temperature increase test, the temperature change will cause the effect of thermal expansion and contraction, which can easily cause each of the probes 241 to be deformed. The precise alignment between the probe card 41 and the wafer 111 cannot maintain stability for a long time. Therefore, through the configuration of the image capture devices 28, it is convenient to collect optical imaging or thermal imaging data. In addition to helping to more efficiently perform the alignment adjustment between each probe 241 and the wafer 111 in the initial stage, in the subsequent wafer testing process, the artificial intelligence related technologies of machine vision and image analysis can be further used, so that the utility model can actively correct the positioning deviation of each probe card 24, thereby effectively solving the problem of probe positioning drift that is still troubled by the conventional technology.

[0080] See also Fig. 20 and Fig.21As shown, it discloses the tenth embodiment of the utility model. The tenth embodiment of the utility model is different from the aforementioned ninth embodiment in that an auxiliary track 29 is additionally provided on the load-bearing bracket 14. The auxiliary track 29 and the detection track 22 are spaced apart from each other by an appropriate distance. The auxiliary track 29 is provided with a plurality of camera positioning slides 291. Each of the camera positioning slides 291 is respectively provided with an image capture device 28. The camera positioning slides 291 are electrically connected to the electromechanical control system 30 so that the electromechanical control system 30 can control each of the camera positioning slides. The table 291 moves along the auxiliary track 29, so that each image capture device 28 can accurately capture the contact position between each probe 241 and the wafer 111. In addition, since the image capture devices 28 are all arranged on the auxiliary track 29, interference with the precise positioning capability of the probe card positioning module 20 can be avoided, and each image capture device 28 is respectively arranged at an angle above each probe card 24, and can capture images individually or simultaneously, so as to monitor whether the probe positioning drifts in real time during the wafer testing process, and even perform automatic correction in real time.

[0081] See also Fig. 22 and Fig.23 As shown, it discloses the eleventh embodiment of the utility model. Compared with the first embodiment of the utility model, the most important difference of the eleventh embodiment of the utility model is that the probe card positioning module 20 in this embodiment is provided with a plurality of the image capture devices 28, and each of the image capture devices 28 is respectively arranged corresponding to each of the probe alignment devices 21. The optical imaging or thermal imaging information provided by the image capture devices 28 can assist in the early probe alignment adjustment steps of the wafer testing process, and then can also assist in real-time analysis and correction of the probe positioning drift problem during the wafer testing process.

Claims

1. A wafer detection device using a probe card positioning module, characterized in that Include: A wafer detection machine base, the wafer detection machine base is provided with a wafer carrier and a carrier moving device, the wafer carrier is located above the carrier moving device and the carrier moving device can drive the wafer carrier to move, the wafer carrier carries and adsorbs a wafer, and the wafer detection machine base is provided with a lifting mechanism, and the lifting mechanism is provided with a load-bearing bracket; At least one probe card positioning module, the probe card positioning module is arranged on the load-bearing bracket, the probe card positioning module has at least one probe alignment device, the probe alignment device is provided with at least one probe card, and the probe card is provided with at least one probe; An electromechanical control system is electrically connected to the probe card positioning module.

2. The wafer detection device using the probe card positioning module as claimed in claim 1, characterized in that: A heating device is arranged inside the wafer carrier and the carrier moving device drives the wafer carrier to move in three axes.

3. The wafer detection device using the probe card positioning module as claimed in claim 1, characterized in that: The probe alignment device includes at least one electric fine-tuning device, which is directly or indirectly combined with the probe card and electrically connected to the electromechanical control system so that the electromechanical control system controls the probe alignment device to drive the probe card to move, rotate or tilt.

4. The wafer detection device using the probe card positioning module as claimed in claim 1, characterized in that: The probe alignment device includes at least one manual fine-tuning device, which is directly or indirectly combined with the probe card so that the probe card is driven to move, rotate or tilt by manual operation of the manual fine-tuning device.

5. The wafer detection device using the probe card positioning module as claimed in claim 1, characterized in that: The probe card positioning module is provided with at least one detection track, and the detection track is provided with at least one detection slide, and the probe alignment device is arranged on the detection slide.

6. The wafer detection device using the probe card positioning module as claimed in claim 5, characterized in that: The detection slide is electrically connected to the electromechanical control system so that the electromechanical control system controls the detection slide to move along the detection track.

7. The wafer detection device using the probe card positioning module as claimed in claim 5, characterized in that: One side of the detection track is connected to a driving device, the driving device is electrically connected to the electromechanical control system, and the detection slide is driven by the driving device to move on the detection track.

8. The wafer detection device using the probe card positioning module as claimed in claim 5, characterized in that: One side of the detection track is connected to a manual operating device so that the manual operating device is manually operated to move the detection slide on the detection track.

9. The wafer detection device using the probe card positioning module as claimed in claim 1, characterized in that: The lifting mechanism adopts a split design and is placed on one side of the wafer detection machine base, or adopts an integrated design so that the lifting mechanism and the wafer detection machine base are integrated into one.

10. The wafer detection device using the probe card positioning module according to claim 1 or 5, characterized in that: An extension fixing piece is arranged on one side or the lower end surface of the probe alignment device, and the extension fixing piece is provided with the probe card.

11. The wafer detection device using the probe card positioning module according to claim 5, characterized in that: It also includes at least one image capture device for acquiring optical imaging or thermal imaging data.

12. The wafer detection device using the probe card positioning module according to claim 11, characterized in that: The image capturing device is arranged on the detection slide table.

13. The wafer detection device using the probe card positioning module according to claim 11, characterized in that: The load-bearing bracket is provided with at least one auxiliary track, the auxiliary track and the detection track are spaced apart by a distance, the auxiliary track is provided with at least one camera positioning slide, and the image capture device is arranged on the camera positioning slide.

14. The wafer detection device using the probe card positioning module as claimed in claim 13, characterized in that: The camera positioning slide is electrically connected to the electromechanical control system so that the electromechanical control system can control the camera positioning slide to move along the auxiliary track.

15. The wafer detection device using the probe card positioning module as claimed in claim 3, characterized in that: The electric fine-tuning device adopts a piezoelectric platform, a piezoelectric actuator, a piezoelectric motor, a stepping motor, a servo motor or a voice coil motor.

16. The wafer detection device using the probe card positioning module according to claim 1, characterized in that: The probe card positioning module is provided with at least one image capturing device for acquiring optical imaging or thermal imaging data.

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