A multi-mode heat dissipation computer case

Abstract

The utility model discloses a multi-mode heat dissipation computer case, comprising an outer shell and a hard disk cooling mechanism; the outer shell: the inner wall of the front side thereof is provided with evenly distributed mounting seats, support frames are clamped between vertically adjacent mounting seats, evenly distributed mounting plates are fixedly connected between the rear side faces of the two support frames, two heat dissipation holes are opened on the rear side of the bottom wall of the outer shell, and supporting feet are symmetrically arranged at the four corners of the lower surface of the outer shell; the hard disk cooling mechanism: it comprises a heat dissipation seat and a semiconductor refrigeration sheet, the heat dissipation seat is respectively arranged on the front side face of the mounting plate, the rear side face of the heat dissipation seat is provided with a semiconductor refrigeration sheet, the heating ends of the semiconductor refrigeration sheets are respectively in contact with the rear side faces of adjacent heat dissipation seats, the multi-mode heat dissipation computer case is convenient for heat dissipation of the inside of the case and the power supply by arranging heat dissipation holes at multiple positions, and the heat dissipation of the hard disk is realized by a refrigeration mechanism that is easy to disassemble.

Description

Technical Field

[0001] The utility model relates to the technical field of computer chassis, in particular to a multi-mode heat dissipation computer chassis. Background Art

[0002] As a part of computer accessories, the main function of the chassis is to place and fix various computer accessories, and play a supporting and protective role. When in use, the chassis will adopt various methods to dissipate heat inside the chassis. Usually, air cooling is used to dissipate heat. The external air is sent into the chassis through the cooling fan to dissipate heat inside the chassis. This is relatively simple. When the power supply is installed, the fan of the power supply faces the inside of the chassis, which is not convenient for the heat dissipation of the power supply. At the same time, the existing chassis generally lacks special hard disk heat dissipation, which has a certain impact on the service life of the hard disk. For this reason, we propose a multi-mode heat dissipation computer chassis. Utility Model Content

[0003] The technical problem to be solved by the utility model is to overcome the existing defects and provide a multi-mode heat dissipation computer case, which facilitates the heat dissipation of the inside of the case and the power supply by setting heat dissipation holes in multiple positions, and at the same time realizes the heat dissipation of the hard disk through a refrigeration mechanism that is easy to disassemble, which can effectively solve the problems in the background technology.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a multi-mode heat dissipation computer case, including a housing and a hard disk cooling mechanism;

[0005] Shell: The inner wall of the front side is provided with evenly distributed mounting seats, and support frames are clamped between the vertically adjacent mounting seats. An evenly distributed mounting plate is fixedly connected between the rear sides of the two support frames. The rear side of the bottom wall of the shell is provided with two heat dissipation holes, and the four corners of the lower surface of the shell are symmetrically provided with supporting feet;

[0006] Hard disk cooling mechanism: It includes a heat sink and a semiconductor refrigeration sheet. The heat sinks are respectively arranged on the front side of the mounting plate, and the rear side of the heat sink is provided with a semiconductor refrigeration sheet. The heating ends of the semiconductor refrigeration sheets are respectively in contact with the rear side of the adjacent heat sink. By arranging heat dissipation holes at multiple positions, the heat dissipation inside the chassis and the power supply is facilitated, and the heat dissipation of the hard disk is achieved through a refrigeration mechanism that is easy to disassemble.

[0007] Furthermore, a control switch is provided on the front side of the shell, and a single-chip microcomputer is provided on the inner wall of the front side of the shell. The input end of the control switch is electrically connected to the output end of the computer power supply, the input end of the single-chip microcomputer is electrically connected to the output end of the control switch, and the input ends of the semiconductor cooling plates are electrically connected to the output ends of the single-chip microcomputer to control the heat dissipation elements of the chassis.

[0008] Furthermore, the hard disk cooling mechanism also includes a micro air pump, a support plate, a mounting column and a fan blade assembly. The edge of the front side surface of the heat sink is provided with evenly distributed mounting columns. The middle part of the front side surface of the heat sink is rotatably connected to the fan blade assembly via a rotating shaft. The micro air pump and the support plate are connected between the front ends of the mounting columns located on the same heat sink by bolts. The support plates are respectively located between adjacent micro air pumps and heat sinks. The air outlets of the micro air pumps are all directed toward the semiconductor refrigeration plates respectively located on the same heat sink. The input ends of the micro air pumps are electrically connected to the output ends of the single-chip microcomputer to transport external air and accelerate the heat dissipation of the heat sink.

[0009] Furthermore, the hard disk cooling mechanism also includes a magnetic suction cup, and the front side surface of the mounting plate is bonded with a magnetic suction cup by double-sided tape. The cooling ends of the semiconductor refrigeration plate are respectively adsorbed on the front side surfaces of adjacent magnetic suction cups to fix the semiconductor refrigeration plate and facilitate the removal of the semiconductor refrigeration plate.

[0010] Furthermore, the fan blade assembly includes guide blades and auxiliary blades. The middle part of the front side of the heat sink is rotatably connected to the guide blades via a rotating shaft, and the front side of the guide blades is provided with auxiliary blades to improve the heat dissipation efficiency of the heat sink.

[0011] Furthermore, a heat dissipation hole 1 is opened on the rear side of the shell, and a heat dissipation fan is fixedly connected to the inner wall of the rear side of the shell. The heat dissipation fan is located in front of the heat dissipation hole 1, and the input end of the heat dissipation fan is electrically connected to the output end of the control switch to achieve heat dissipation inside the shell.

[0012] Furthermore, the right side wall of the shell is provided with three heat dissipation holes which are symmetrically distributed up and down, so as to realize the escape of air outside the shell.

[0013] Compared with the prior art, the beneficial effects of the utility model are: the multi-mode heat dissipation computer case has the following advantages:

[0014] 1. Install various computer accessories inside the case respectively. When installing the power supply, the fan of the power supply faces downward and is located at the upper end of the second heat dissipation hole. The legs of the outer shell make the case higher than a plane away from the position where the case is placed, so as to facilitate the circulation of hot air blown out by the fan of the power supply. The hard disks are installed on the rear side of the mounting plate respectively. The cooling fan sends external air into the inside of the case. After the external air is mixed with the air inside the case, the air inside the case escapes from the third heat dissipation hole, so as to realize the circulation of the external air and the air inside the case, realize the heat dissipation inside the case, and realize the heat dissipation inside the case and the computer power supply.

[0015] 2. When the calculator is running, the mainboard of the calculator sends a cooling efficiency adjustment signal of the semiconductor refrigeration plate according to the load condition of the calculator. The single chip computer receives the signal and controls the cooling efficiency of the semiconductor refrigeration plate. The hard disk is cooled by conduction through the mounting plate. The heat sink absorbs the heat from the heating end of the adjacent semiconductor refrigeration plate. The air outlet of the micro air pump blows in external air. The auxiliary fan blades first contact with the external air. The external air drives the auxiliary fan blades to rotate. The auxiliary fan blades drive the adjacent guide fan blades to rotate. The guide fan blades break up the external air and send it to the heat sink of the heat sink, so as to achieve rapid heat dissipation of the heat sink of the heat sink and improve the heat dissipation efficiency of the heat sink. At the same time, if there is no mounting plate for the hard disk, the corresponding hard disk cooling mechanism can be directly pulled out to avoid wasting electricity. The heat dissipation of the hard disk is achieved through cooling with the semiconductor refrigeration plate, thereby extending the service life of the hard disk. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of the utility model;

[0017] Figure 2 It is a cross-sectional structural schematic diagram of the utility model from the rear;

[0018] Figure 3 This is a structural schematic diagram of the hard disk cooling mechanism of the utility model;

[0019] Figure 4 It is a cross-sectional structural schematic diagram of the hard disk cooling mechanism of the utility model.

[0020] In the figure: 1 housing, 2 hard disk cooling mechanism, 21 micro air pump, 22 support plate, 23 mounting column, 24 fan blade assembly, 241 guide blade, 242 auxiliary blade, 25 heat sink, 26 semiconductor cooling sheet, 27 magnetic suction cup, 3 single chip computer, 4 mounting seat, 5 support frame, 6 mounting plate, 7 cooling fan, 8 cooling hole 1, 9 cooling hole 2, 10 control switch, 11 cooling hole 3. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-4 ,This embodiment provides a technical solution: a multi-mode heat dissipation computer case, comprising a housing 1 and a hard disk cooling mechanism 2;

[0023] Shell 1: The inner wall of the front side is provided with evenly distributed mounting seats 4, and support frames 5 are clamped between the vertically adjacent mounting seats 4. Evenly distributed mounting plates 6 are fixedly connected between the rear sides of the two support frames 5. The rear side of the bottom wall of the shell 1 is provided with heat dissipation holes 2 9. The four corners of the lower surface of the shell 1 are symmetrically provided with supporting feet. The rear side of the shell 1 is provided with heat dissipation holes 1 8. The rear inner wall of the shell 1 is fixedly connected with a heat dissipation fan 7. The heat dissipation fan 7 is located in front of the heat dissipation hole 1 8. The input end of the heat dissipation fan 7 is electrically connected to the output end of the control switch 10. The right side wall of the shell 1 is provided with symmetrically distributed The heat dissipation holes 3 11 are used to install various computer accessories inside the chassis. When installing the power supply, the fan of the power supply faces downward and is located at the upper end of the heat dissipation holes 2 9. The legs of the housing 1 make the chassis higher than a plane away from the chassis placement position, which is convenient for the circulation of hot air blown out by the fan of the power supply. The hard disks are respectively installed on the rear side of the mounting plate 6. The heat dissipation fan 7 sends external air into the interior of the housing 1. After the external air is mixed with the air inside the housing 1, the air inside the chassis escapes from the heat dissipation holes 3 11, so that the external air and the air inside the housing 1 can circulate and the heat inside the housing 1 can be dissipated.

[0024] The hard disk cooling mechanism 2 includes a heat sink 25 and a semiconductor cooling sheet 26. The heat sinks 25 are respectively arranged on the front side of the mounting plate 6. The rear side of the heat sink 25 is provided with a semiconductor cooling sheet 26. The heating ends of the semiconductor cooling sheets 26 are respectively in contact with the rear side of the adjacent heat sink 25. The hard disk cooling mechanism 2 also includes a micro air pump 21, a support plate 22, a mounting column 23 and a fan blade assembly 24. The edge of the front side of the heat sink 25 is provided with evenly distributed mounting columns 23. The middle of the front side of the heat sink 25 is provided with a semiconductor cooling sheet 26. A fan blade assembly 24 is rotatably connected to the shaft, and a micro air pump 21 and a support plate 22 are connected between the front ends of the mounting columns 23 located on the same heat sink 25 by bolts. The support plates 22 are respectively located between the adjacent micro air pumps 21 and the heat sinks 25. The air outlets of the micro air pumps 21 are all directed toward the semiconductor cooling sheets 26 respectively located on the same heat sink 25. The input ends of the micro air pumps 21 are electrically connected to the output ends of the single chip computer 3. The hard disk cooling mechanism 2 also includes a magnetic suction cup 27. The front side of the mounting plate 6 is The magnetic suction cup 27 is bonded by double-sided adhesive, and the cooling ends of the semiconductor cooling sheet 26 are respectively adsorbed on the front side of the adjacent magnetic suction cup 27. The fan blade assembly 24 includes a guide blade 241 and an auxiliary blade 242. The middle part of the front side of the heat sink 25 is rotatably connected with the guide blade 241 through a rotating shaft, and the front side of the guide blade 241 is provided with an auxiliary blade 242. When the calculator is running, the main board of the calculator sends a cooling efficiency adjustment signal of the semiconductor cooling sheet 26 according to the load condition of the calculator, and the single-chip computer 3 receives the signal and The cooling efficiency of the semiconductor refrigeration plate 26 is controlled, and the hard disk is cooled by conduction through the mounting plate 6. The heat sink 25 absorbs the heat from the heating end of the adjacent semiconductor refrigeration plate 26. The air outlet of the micro air pump 21 blows in external air. The auxiliary fan blades 242 first come into contact with the external air. The external air drives the auxiliary fan blades 242 to rotate. The auxiliary fan blades 242 drive the adjacent guide blades 241 to rotate. The guide blades 241 break up the external air and send it to the heat sink of the heat sink 25, thereby achieving rapid heat dissipation of the heat sink of the heat sink 25.

[0025] It also includes a control switch 10, which is arranged on the front side of the shell 1. The inner wall of the front side of the shell 1 is provided with a single-chip computer 3. The input end of the control switch 10 is electrically connected to the output end of the computer power supply, the input end of the single-chip computer 3 is electrically connected to the output end of the control switch 10, and the input ends of the semiconductor cooling plate 26 are electrically connected to the output end of the single-chip computer 3.

[0026] The working principle of a multi-mode heat dissipation computer case provided by the utility model is as follows: various computer accessories are installed inside the case respectively; when the power supply is installed, the fan of the power supply faces downward and is located at the upper end of the heat dissipation hole 29; the legs of the outer shell 1 make the case higher than a plane away from the case placement position, which is convenient for the circulation of hot air blown out by the fan of the power supply; the hard disks are respectively installed on the rear side of the mounting plate 6; when the calculator is running, the mainboard of the calculator sends a cooling efficiency adjustment signal of the semiconductor cooling sheet 26 according to the load condition of the calculator; the single chip computer 3 receives the signal and controls the cooling efficiency of the semiconductor cooling sheet 26; the hard disk is cooled by conduction through the mounting plate 6; the heat sink 25 absorbs the heat generated by the semiconductor cooling sheet 2 ... The heat of the heating end of the adjacent semiconductor refrigeration sheet 26 is absorbed, and the outlet of the micro air pump 21 blows in external air. The auxiliary fan blades 242 first come into contact with the external air, and the external air drives the auxiliary fan blades 242 to rotate. The auxiliary fan blades 242 drive the adjacent guide fan blades 241 to rotate, and the guide fan blades 241 break up the external air and send it to the heat sink of the heat sink 25, so as to achieve rapid heat dissipation of the heat sink 25 and improve the heat dissipation efficiency of the heat sink 25. The cooling fan 7 sends external air into the interior of the outer shell 1. After the external air is mixed with the air inside the outer shell 1, the air inside the chassis escapes from the heat dissipation hole three 11, so as to achieve the circulation of the external air and the air inside the outer shell 1 and achieve the heat dissipation inside the outer shell 1.

[0027] It is worth noting that the single chip microcomputer 3 disclosed in the above embodiments can select STM32F103C8T6, the semiconductor refrigeration plate 26 can select PT4 semiconductor refrigeration plate, the micro air pump 21 can select MZB1001 T02 air pump 21, and the control switch 10 is provided with a control button corresponding to the single chip microcomputer 3 and controlling its switch. The single chip microcomputer 3 controls the semiconductor refrigeration plate 26, the micro air pump 21 and the cooling fan 7 using methods commonly used in the prior art.

[0028] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A multi-mode heat dissipation computer case, characterized in that: It comprises a housing (1) and a hard disk cooling mechanism (2); The housing (1) has evenly distributed mounting seats (4) on its front inner wall, support frames (5) are clamped between vertically adjacent mounting seats (4), evenly distributed mounting plates (6) are fixedly connected between the rear side surfaces of the two support frames (5), two heat dissipation holes (9) are opened on the rear side of the bottom wall of the housing (1), and support feet are symmetrically provided at the four corners of the lower surface of the housing (1); The hard disk cooling mechanism (2) comprises a heat sink (25) and a semiconductor cooling sheet (26), wherein the heat sink (25) is respectively arranged on the front side of the mounting plate (6), and the rear side of the heat sink (25) is respectively provided with a semiconductor cooling sheet (26), and the heating end of the semiconductor cooling sheet (26) is respectively in contact with the rear side of the adjacent heat sink (25).

2. A multi-mode heat dissipation computer case according to claim 1, characterized in that: It also includes a control switch (10), the control switch (10) is arranged on the front side of the housing (1), the inner wall of the front side of the housing (1) is provided with a single-chip computer (3), the input end of the control switch (10) is electrically connected to the output end of the computer power supply, the input end of the single-chip computer (3) is electrically connected to the output end of the control switch (10), and the input end of the semiconductor cooling plate (26) is electrically connected to the output end of the single-chip computer (3).

3. A multi-mode heat dissipation computer case according to claim 2, characterized in that: The hard disk cooling mechanism (2) further comprises a micro air pump (21), a support plate (22), a mounting column (23) and a fan blade assembly (24); the edge of the front side surface of the heat sink (25) is provided with evenly distributed mounting columns (23); the middle part of the front side surface of the heat sink (25) is rotatably connected to the fan blade assembly (24) via a rotating shaft; the micro air pump (21) and the support plate (22) are connected between the front ends of the mounting columns (23) located on the same heat sink (25) via bolts; the support plates (22) are respectively located between adjacent micro air pumps (21) and heat sinks (25); the air outlets of the micro air pumps (21) are all directed towards the semiconductor cooling sheets (26) respectively located on the same heat sink (25); and the input ends of the micro air pumps (21) are all electrically connected to the output ends of the single chip computer (3).

4. The multi-mode heat dissipation computer case according to claim 1, characterized in that: The hard disk cooling mechanism (2) further comprises a magnetic suction cup (27), the front side surfaces of the mounting plate (6) are bonded with the magnetic suction cup (27) by double-sided adhesive, and the cooling ends of the semiconductor cooling sheets (26) are respectively adsorbed on the front side surfaces of adjacent magnetic suction cups (27).

5. The multi-mode heat dissipation computer case according to claim 3, characterized in that: The fan blade assembly (24) comprises a guide blade (241) and an auxiliary blade (242); the middle portion of the front side surface of the heat sink (25) is rotatably connected to the guide blade (241) via a rotating shaft; and the front side surface of the guide blade (241) is provided with an auxiliary blade (242).

6. The multi-mode heat dissipation computer case according to claim 2, characterized in that: A heat dissipation hole (8) is provided on the rear side of the housing (1); a heat dissipation fan (7) is fixedly connected to the inner wall of the rear side of the housing (1); the heat dissipation fan (7) is located in front of the heat dissipation hole (8); and the input end of the heat dissipation fan (7) is electrically connected to the output end of the control switch (10).

7. The multi-mode heat dissipation computer case according to claim 1, characterized in that: The right side wall of the housing (1) is provided with three heat dissipation holes (11) which are symmetrically distributed up and down.

Images