A heat sink assembly

By designing multi-component detachable heat sink assembly, and using components such as graphite blocks and spiral columns to accelerate heat transfer, the existing heat sinks are solved, and the problems of difficulty in maintaining and low heat dissipation efficiency are achieved, achieving more efficient heat dissipation effects and lower production costs.

CN222734456UActive Publication Date: 2025-04-08DONGGUAN JINGSONG HARDWARE ELECTRONICS CO LTD
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Patent Information

Application Number
CN202420604847.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-03-26
Publication Date
2025-04-08
Estimated Expiration
2034-03-26

AI Technical Summary

Technical Problem

The existing heat sinks are formed in one piece, cannot be disassembled, difficult to maintain, slow heat dissipation speed and low cooling efficiency.

Method used

A multi-component detachable heat sink assembly is designed, including a heat sink base, a slot, a card block, a graphite block, a heat sink flap and a spiral column. Through the combination and structural design of these components, rapid heat conduction and heat dissipation are achieved.

Benefits of technology

The removability of the heat sink is achieved, maintenance and production costs are reduced, and the heat dissipation speed and cooling efficiency are improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a heat sink assembly in the field of heat sinks, including a heat sink base, wherein the heat sink base is provided with at least two card slots with two sides connected and the top open, wherein the card slot is equipped with a card block pushed and fixed from the side, wherein a graphite block is further provided between the bottom of the card slot and the card block, wherein at least two detachable heat sink fins are provided on the top of the card block, wherein the ends of the heat sink fins are provided with spiral columns twisted to be fixed inside the card block, wherein the ends of the spiral columns are screwed in and contact with the graphite block, and wherein a gasket protruding and closely attached to the surface of the card block is further provided between the spiral columns and the heat sink fins. The heat sink is composed of a plurality of detachable parts, which is convenient for the replacement and maintenance of the parts in the later stage, and effectively reduces the production cost, wherein a graphite block is added in the card slot of the heat sink base, wherein the graphite block can be used to quickly transfer the heat in the heat sink base to the card block and the heat sink fins, thereby accelerating the speed of heat conduction and improving the heat dissipation effect.
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Description

Technical Field

[0001] The utility model relates to the technical field of heat sinks, in particular to a heat sink assembly. Background Art

[0002] Heat sink is a widely used heat dissipation device for computer components. Its main function is to absorb and dissipate the heat generated inside the computer to ensure the normal temperature of computer components, thereby extending their service life and avoiding problems such as unstable system operation or component burnout caused by overheating. In general, heat sink is an important computer component that can effectively solve the problem of overheating of internal computer components and improve the performance and stability of the computer.

[0003] However, the current heat sink is basically formed in one piece and cannot be assembled by assembling multiple parts. If damaged, the entire heat sink needs to be replaced, which makes subsequent maintenance difficult and increases production costs. At the same time, the current heat sink is formed in one piece and has to conduct and dissipate heat by itself, which has a slow heat dissipation speed and low cooling efficiency. Utility Model Content

[0004] In order to overcome the deficiencies of the existing technical solutions, the utility model provides a heat sink assembly, which can effectively solve the current technical problems that the heat sink cannot be disassembled and the heat dissipation effect is poor.

[0005] The technical solution adopted by the utility model to solve its technical problems is:

[0006] A heat sink assembly comprises a heat sink base, wherein the heat sink base is provided with at least two card slots which are conductive on both sides and open on the top, wherein a card block which is pushed in and fixed from the side is installed in the card slot, a graphite block is also provided between the bottom of the card slot and the card block, and at least two detachable heat sink fins are installed on the top of the card block, wherein the ends of the heat sink fins are provided with spiral columns which are twisted to be fixed inside the card block, wherein the ends of the spiral columns are in contact with the graphite block after being screwed in, and a gasket which is protruded and closely contacts the surface of the card block is also provided between the spiral column and the heat sink fins.

[0007] Furthermore, the bottom width of the slot is greater than the width of the top opening end.

[0008] Furthermore, the heat dissipation fin is provided with a plurality of conducting air holes.

[0009] Furthermore, the surface of the clamping block is provided with at least two gasket grooves for clamping corresponding gaskets, and the gasket grooves are provided with fixing grooves for screwing the spiral pillars.

[0010] Furthermore, L-shaped connecting pieces for sealing all the slot openings are provided on both sides of the heat dissipation base, and at least two fixing holes are provided on a side of the connecting piece away from the heat dissipation base.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] The heat sink of the utility model is composed of multiple detachable parts, which is convenient for the later replacement and maintenance of the parts and effectively reduces the production cost. A graphite block is added in the card slot of the heat sink base. The graphite block can quickly transfer the heat in the heat sink base to the card block and the heat sink fins, which speeds up the heat conduction and improves the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the utility model;

[0014] Figure 2 This is a schematic diagram of the internal structure of an embodiment of the utility model;

[0015] Figure 3 This is a schematic diagram of the heat dissipation base structure of an embodiment of the utility model;

[0016] Figure 4 This is a schematic diagram of the card block structure of an embodiment of the utility model;

[0017] Figure 5 This is a schematic diagram of the heat dissipation fin structure of an embodiment of the utility model;

[0018] Numbers in the figure:

[0019] 1-heat dissipation base, 2-card slot, 3-card block, 4-graphite block, 5-heat dissipation fin, 6-spiral column, 7-gasket, 8-air hole, 9-gasket slot, 10-fixing slot, 11-connecting plate, 12-fixing hole. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] like Figure 1-5As shown, the utility model provides a heat sink assembly, which is mainly used for CPU heat dissipation in a computer host. A heat sink base 1 is attached to the CPU surface for heat dissipation. The heat sink assembly provided by the technical solution is a multi-component detachable structure, which is more flexible to assemble and use. Its specific structure mainly includes a heat sink base 1, and the heat sink base 1 is provided with at least two card slots 2 with conductive sides and an open top. The card slot 2 is equipped with a card block 3 pushed and fixed from the side, and the top of the card block 3 is equipped with at least two detachable heat dissipation fins 5. A detachable structure is formed among the heat sink base, the card block 3 and the heat dissipation fins 5, and the card block 3 is used as a connecting component. The bottom width of the card slot 2 in the heat sink base 1 where the card block 3 is placed is greater than the width of one end of the top opening, and the bottom is a flat structure, so that no jamming occurs when the card block 3 is slid.

[0022] A graphite block 4 is further provided between the bottom of the card slot 2 and the card block 3. In order to quickly transfer the heat absorbed by the heat dissipation base 1 to the card block 3 and then to the heat dissipation fins 5, a graphite block 4 is added at the bottom of the card slot 2 and is closely attached to the card block 3. The graphite block 4 has a fast heat conduction effect, and the transfer of internal heat can be accelerated through the graphite block 4, thereby achieving a fast cooling effect.

[0023] The end of the heat dissipation fin 5 is provided with a spiral column 6 which is twisted into the inside of the block 3 and fixed. The end of the spiral column 6 contacts the graphite block 4 after being screwed in. At the same time, a fixing groove 10 for inserting the spiral column 6 is provided on the surface of the block 3, and meshing threaded bodies are provided on the outside of the spiral column 6 and the inside of the fixing groove 10. After the block 3 is fixed in the heat dissipation base 1, in addition to using the block 3 to contact the graphite block 4 to transfer heat, the spiral column 6 also directly contacts the graphite block 4 after being inserted. The spiral column 6 can directly obtain heat from the graphite block 4 and transfer it to the heat dissipation fin 5, reducing the transfer of the intermediate medium, speeding up the heat transfer time, and improving the heat dissipation effect.

[0024] A gasket 7 is also provided between the spiral column 6 and the heat dissipation fin 5, and the gasket 7 is protruded and tightly attached to the surface of the block 3. A gasket groove 9 for clamping the gasket 7 is added on the surface of the block 3, and a fixing groove 10 is provided at the center of the gasket groove 9. The gasket 7 is fixed in the gasket groove 9, which can not only enhance the fixation of the spiral column 6 after insertion and prevent it from tilting, but also keep the heat dissipation fin 5 in a vertical upward state at all times, which can also prevent the heat dissipation fin 5 from tilting. In addition, after the gasket 7 is fixed in the gasket groove 9, the contact area with the block 3 can be increased, which is beneficial for the heat in the block 3 to be quickly transferred to the heat dissipation fin 5.

[0025] The heat dissipation fin 5 is provided with a plurality of conducting air holes 8, which can increase the contact area between the heat dissipation fin 5 and the air, while reducing the obstruction of the heat dissipation fin 5 to the air flow, speeding up the air circulation speed and effectively improving the heat dissipation speed.

[0026] Both sides of the heat dissipation base 1 are provided with L-shaped connecting pieces 11 for sealing the openings of all the card slots 2. The connecting piece 11 is provided with at least two fixing holes 12 on the side away from the heat dissipation base 1. A detachable structure is formed between the connecting pieces 11 on both sides and the heat dissipation base 1. The connection positions are locked by detachable screws. Users can flexibly assemble according to actual usage requirements. The assembled connecting piece 11 can not only prevent the card block 3 in the card slot 2 from slipping, but also be fixed at the assembly position through the fixing holes 12.

[0027] Compared with the traditional technology, the heat sink provided by the present technical solution is composed of multiple detachable parts, which is convenient for the later replacement and maintenance of the parts and effectively reduces the production cost. A graphite block 4 is added in the card slot 2 of the heat dissipation base 1. The graphite block 4 can quickly transfer the heat in the heat dissipation base 1 to the card block 3 and the heat dissipation fin 5, thereby accelerating the speed of heat conduction and improving the heat dissipation effect.

[0028] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention, and any figure mark in the claims should not be regarded as limiting the claims involved.

Claims

1. A heat sink assembly, comprising a heat sink base, characterized in that: The heat dissipation base is provided with at least two card slots with conductive sides and an open top, the card slots are equipped with card blocks pushed and fixed from the sides, a graphite block is also provided between the bottom of the card slot and the card block, at least two detachable heat dissipation fins are provided on the top of the card block, the ends of the heat dissipation fins are provided with spiral columns twisted into the inside of the card block for fixing, the ends of the spiral columns are screwed in and contact with the graphite block, and a gasket with a protrusion that is tightly against the surface of the card block is also provided between the spiral column and the heat dissipation fins.

2. A heat sink assembly according to claim 1, characterized in that: The bottom width of the slot is greater than the width of one end of the top opening.

3. A heat sink assembly according to claim 1, characterized in that: The heat dissipation fin is provided with a plurality of conducting air holes.

4. The heat sink assembly according to claim 1, characterized in that: The surface of the clamping block is provided with at least two gasket grooves for clamping corresponding gaskets, and the gasket groove is provided with a fixing groove for screwing the spiral column.

5. The heat sink assembly according to claim 1, characterized in that: The heat dissipation base is provided with L-shaped connecting pieces for sealing all the slot openings on both sides, and the connecting piece is provided with at least two fixing holes on one side away from the heat dissipation base.