Wafer centering device

Abstract

The utility model discloses a wafer centering device, which comprises a camera, a wafer, an adsorption turntable, a notch detection sensor and a mechanical arm, the camera is positioned right above the wafer, the wafer is placed on the top of the adsorption turntable, the notch detection sensor is positioned on one side of the adsorption turntable, and the mechanical arm is positioned on the other side of the adsorption turntable. According to the utility model, the alignment efficiency and the alignment precision are improved, the mechanical structure design of the device is optimized, and wafers of various specifications and process requirements can be flexibly adapted in consideration of compatibility; the vacuum adsorption holes have good adsorbability to the wafer, so that the situation that the wafer falls off during working, so that the surface or the edge of the wafer is cracked, broken or even completely cracked, the whole wafer cannot be used, and tiny cracks or scratches are possibly introduced to the surface of the wafer even if no obvious crack or slight impact exists is avoided, so that the service life of the wafer is prolonged. These microdefects may affect the performance and yield of integrated circuits fabricated thereon.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a wafer centering device. Background Art

[0002] The wafer centering device is an indispensable equipment in the semiconductor manufacturing industry. It is used to ensure that the wafer is accurately aligned during the transmission, loading, processing, etc., so as to ensure that the subsequent process can be carried out accurately at the predetermined position of the wafer.

[0003] As semiconductor technology advances to smaller process nodes, traditional alignment technology may not be able to meet high-precision requirements, so there is a need to continuously innovate and improve alignment technology.

[0004] In large-scale integrated circuits, due to process complexity and factors such as thermal expansion and contraction, wafers are prone to slight positional offsets between different process steps, which requires a high-precision and stable alignment device for adjustment.

[0005] A wafer that falls during operation may cause cracks, breakage, or even complete rupture on the surface or edge of the wafer, rendering the entire wafer unusable. Even if there is no obvious breakage, a slight impact may introduce tiny cracks or scratches on the surface of the wafer. These microscopic defects may affect the performance and yield of the integrated circuits manufactured on it. The fall may cause changes in the stress distribution inside the wafer, thereby affecting the crystal structure. Especially for wafers that are in the manufacturing process, it may cause some of the completed processes to fail.

[0006] Therefore, how to provide a wafer centering device is a problem that those skilled in the art need to solve urgently. Utility Model Content

[0007] One purpose of the utility model is to provide a wafer centering device, which improves the alignment efficiency and alignment accuracy, optimizes the mechanical structure design of the device, and can flexibly adapt to wafers of various specifications and process requirements in consideration of compatibility.

[0008] According to an embodiment of the utility model, a wafer centering device includes a camera, a wafer, an adsorption turntable, a notch detection sensor and a robotic arm, wherein the camera is located directly above the wafer, the wafer is placed on the top of the adsorption turntable, the notch detection sensor is located on one side of the adsorption turntable, and the robotic arm is located on the other side of the adsorption turntable.

[0009] Furthermore, the workbench supporting the adsorption turntable is provided at the bottom of the adsorption turntable, and the bottom of the notch detection sensor is fixedly installed on the top of the workbench.

[0010] Furthermore, the adsorption turntable is composed of the XYZ axis controller and the vacuum adsorption hole, the XYZ axis controller is fixedly installed on the workbench, and the vacuum adsorption hole adsorbs the back side of the wafer.

[0011] The beneficial effects of the utility model are:

[0012] The utility model improves the alignment efficiency and alignment accuracy, optimizes the mechanical structure design of the device, and can flexibly adapt to wafers of various specifications and process requirements in consideration of compatibility.

[0013] The vacuum adsorption hole of the utility model has good adsorption capacity for the wafer, which prevents the wafer from falling during operation, thereby causing cracks, breakage, or even complete rupture on the surface or edge of the wafer, making the entire wafer unusable. Even if there is no obvious rupture, a slight impact may introduce tiny cracks or scratches on the surface of the wafer. These microscopic defects will affect the performance and yield of the integrated circuits manufactured thereon. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0015] Figure 1 This is an overall side view of a wafer centering device proposed by the utility model;

[0016] Figure 2 The utility model is a top view of the whole of a wafer centering device.

[0017] In the picture: 1. Camera; 2. Wafer; 3. Adsorption turntable; 4. Notch detection sensor; 5. Robotic arm. DETAILED DESCRIPTION

[0018] Now the utility model is further described in detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the utility model in a schematic manner, and therefore only show the components related to the utility model.

[0019] Please refer to Figure 1 to Figure 2The utility model provides a wafer centering device, including a camera 1, a wafer 2, an adsorption turntable 3, a notch detection sensor 4 and a robotic arm 5, wherein the camera 1 is located directly above the wafer 2, and the camera 1 can be fixed directly above the wafer 2 by an external bracket, or the camera 1 can be connected to a workbench by a connecting component, the wafer 2 is placed on the top of the adsorption turntable 3, the notch detection sensor 4 is located on one side of the adsorption turntable 3, the notch detection sensor 4 is used to detect the notch on the wafer 2, and the robotic arm 5 is located on the other side of the adsorption turntable 3, and the robotic arm 5 is used to clamp the wafer 2 to realize working operation.

[0020] Specifically, a workbench supporting the adsorption turntable 3 is arranged at the bottom of the adsorption turntable 3, and the bottom of the notch detection sensor 4 is fixedly installed on the top of the workbench; the adsorption turntable 3 is composed of an XYZ axis controller and a vacuum adsorption hole, the XYZ axis controller is fixedly installed on the workbench, and the vacuum adsorption hole adsorbs the back of the wafer 2.

[0021] Furthermore, the robot arm 5 clamps the wafer 2, places the wafer 2 to be inspected directly under the camera 1, starts the camera 1 to work, and the camera 1 captures the entire wafer 2 in all directions, fits the image contour of the entire wafer 2, and obtains the center position of the wafer 2.

[0022] According to the deviation between the center position of the wafer 2 and the center position of the adsorption turntable 3 , the adsorption turntable 3 moves to the center position of the wafer 2 to receive the wafer 2 and places it on the top of the adsorption turntable 3 .

[0023] The back side of the wafer 2 is adsorbed and fixed by the vacuum adsorption holes to ensure stability during operation.

[0024] The notch detection sensor 4 then detects the notch position of the wafer 2 and drives the wafer 2 to rotate to a fixed angle through the adsorption turntable 3 .

[0025] Camera 1 takes a picture of the notch area of ​​wafer 2, and performs contour matching between the notch area picture and the standard template notch picture. After a successful match, the offset and rotation of the notch area relative to the template notch can be obtained, and then the position of wafer 2 can be further fine-tuned.

[0026] The adsorption turntable 3 can move and rotate along the XYZ axis. The movement of the XYZ axis is controlled by the XYZ axis controller, which drives the rotation. The rotation is driven by a linear pulse motor. The vacuum adsorption holes on the adsorption turntable 3 can adsorb and fix the back side of the wafer 2 during rotation.

[0027] Avoid dropping the wafer 2 during operation, which may cause cracks, breakage, or even complete rupture on the surface or edge of the wafer, rendering the entire wafer unusable. Even if there is no obvious breakage, a slight impact may introduce tiny cracks or scratches on the surface of the wafer. These microscopic defects may affect the performance and yield of the integrated circuits manufactured thereon. Dropping may cause changes in the stress distribution inside the wafer, thereby affecting the crystal structure. Especially for wafers that are in the manufacturing process, it may cause some of the completed processes to fail.

[0028] The above are only preferred specific implementation methods of the utility model, but the protection scope of the utility model is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the utility model, who makes equivalent replacements or changes based on the technical scheme and utility model concept of the utility model, should be covered by the protection scope of the utility model.

Claims

1. A wafer centering device, characterized in that: The invention comprises a camera (1), a wafer (2), an adsorption turntable (3), a notch detection sensor (4) and a mechanical arm (5), wherein the camera (1) is located directly above the wafer (2), the wafer (2) is placed on the top of the adsorption turntable (3), the notch detection sensor (4) is located on one side of the adsorption turntable (3), and the mechanical arm (5) is located on the other side of the adsorption turntable (3).

2. The wafer centering device according to claim 1, characterized in that: A workbench for supporting the adsorption turntable (3) is arranged at the bottom of the adsorption turntable (3), and the bottom of the notch detection sensor (4) is fixedly mounted on the top of the workbench.

3. The wafer centering device according to claim 1, characterized in that: The adsorption turntable (3) is composed of an XYZ axis controller and a vacuum adsorption hole. The XYZ axis controller is fixedly mounted on a workbench. The vacuum adsorption hole adsorbs the back side of the wafer (2).

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