Dual chip package structure

Abstract

The utility model provides a dual-chip packaging structure, wherein the chip layer includes: a copper frame, a first mesh glue layer, a first chip, a second chip, a second glue layer and a third glue layer; the first chip is bonded to one side of the copper frame through the first mesh glue layer; the second chip is bonded to the side of the first chip facing away from the copper frame through the second glue layer; the third glue layer is provided on the side of the second chip facing away from the first chip; and the second glue layer is provided with a plurality of glue dots. The present application improves the problem of tin beads generated by chip stacking by providing a plurality of glue dots on the second glue layer, reduces the soldering void rate, improves the electrical qualification rate of the product, improves the reliability of the product, and improves the production efficiency.

Description

Technical Field

[0001] The utility model relates to the field of chip packaging, in particular to a double-chip packaging structure. Background Art

[0002] At present, the packaging of chips pursues high power components and miniaturization of device appearance. The packaging industry hopes to stack multiple chips in one appearance package, but when two chips are stacked at high temperature, tin beads will be generated, the electrical yield is low, and the reliability of the product is reduced. At present, the existing dispensing methods are as follows: Patent CN217114324U discloses a dual-station wafer chip packaging device; Patent CN105618332B provides a dual dispensing mechanism and its dispensing method. The above existing patents have failed to solve the problem of tin beads generated when two chips are stacked at high temperature. Utility Model Content

[0003] In view of the defects in the prior art, the purpose of the utility model is to provide a dual-chip packaging structure.

[0004] A dual-chip packaging structure provided by the utility model includes: a copper frame, a first mesh glue layer, a first chip, a second chip, a second glue layer and a third glue layer;

[0005] The first chip is bonded to one side of the copper frame through a first mesh glue layer;

[0006] The second chip is bonded to the side of the first chip facing away from the copper frame through a second adhesive layer;

[0007] A third dispensing layer is provided on a side of the second chip facing away from the first chip;

[0008] The second glue dot layer is provided with a plurality of glue dots.

[0009] Preferably, the plurality of glue dots of the second glue dot layer are arranged in a grid shape.

[0010] Preferably, the third glue dot layer is provided with a single glue dot or a plurality of glue dots.

[0011] Preferably, gaps are provided between the plurality of glue dots of the second glue dot layer.

[0012] Preferably, the second glue dispensing layer is dispensed by a glue dispensing block, and the glue dispensing block is provided with a plurality of glue outlet holes.

[0013] Preferably, the copper frame is configured as a copper electrode.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] The present application uses a multi-porous glue dispensing block to provide multiple glue dots on the second glue dispensing layer, with gaps between the multiple glue dots. This improves the problem of tin beads generated by chip stacking, reduces the welding void rate, improves the product electrical qualification rate, improves product reliability, and improves production operation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Other features, objects and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0017] Figure 1 It is a structural schematic diagram of a dual-chip packaging structure;

[0018] Figure 2 is a schematic diagram of the structure of the first mesh adhesive layer;

[0019] As shown in the figure:

[0020] DETAILED DESCRIPTION

[0021] The utility model is described in detail below in conjunction with specific embodiments. The following embodiments will help those skilled in the art to further understand the utility model, but do not limit the utility model in any form. It should be pointed out that for those of ordinary skill in the art, several changes and improvements can be made without departing from the concept of the utility model. These all belong to the protection scope of the utility model.

[0022] In the original industry, the second glue dispensing layer 5 only uses a device with one hole for dispensing glue, that is, there is only one glue point. After dispensing, the glue is all concentrated in the middle position of the chip, which makes it difficult to discharge the bubbles generated when the solder paste melts at high temperature, thereby causing tin explosion. Now, a glue dispensing block with multiple holes for dispensing glue is used for dispensing, and multiple glue points with gaps between them can be formed in the second glue dispensing layer 5, thereby solving the problem of timely discharge of bubbles after the solder paste melts at high temperature, avoiding the occurrence of tin beads caused by tin explosion, and in addition, due to the discharge of bubbles, the void rate of welding is reduced.

[0023] like Figure 1 The embodiment shown includes: a copper frame 1, a first mesh glue layer 2, a first chip 3, a second chip 4, a second glue layer 5 and a third glue layer 6; the first chip 3 is bonded to one side of the copper frame 1 through the first mesh glue layer 2, the second chip 4 is bonded to the side of the first chip 3 facing away from the copper frame 1 through the second glue layer 5, and the third glue layer 6 is provided on the side of the second chip 4 facing away from the first chip 3.

[0024] The second glue dispensing layer 5 produces multiple glue dots through the multiple glue outlet holes of the glue dispensing block, and the multiple glue dots of the second glue dispensing layer 5 are arranged in a grid shape; gaps are set between the multiple glue dots of the second glue dispensing layer 5 to facilitate the discharge of bubbles from the gaps between the glue dots after melting, thereby avoiding the occurrence of tin beads produced by tin explosion.

[0025] In one embodiment, the copper frame 1 is used as an electrode and is made of copper or other conductive materials.

[0026] Implementation process:

[0027] Step 1, printing a first screen glue layer 2 on the copper frame 1;

[0028] Step 2: Use a die-bonding device to place the first chip 3 on the copper frame 1. The first mesh adhesive layer 2 has viscosity and can position the first chip 3.

[0029] Step 3, disposing a second glue dispensing layer 5 on the first chip 3;

[0030] Step 4: Place the second chip 4 on the second glue dispensing layer 5 , and set a third glue dispensing layer 6 on the second chip 4 .

[0031] In the description of the present application, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0032] The above describes the specific embodiments of the present invention. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes or modifications within the scope of the claims, which does not affect the essence of the present invention. In the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other at will.

Claims

1. A dual-chip packaging structure, characterized in that: include: A copper frame (1), a first mesh glue layer (2), a first chip (3), a second chip (4), a second glue dot layer (5) and a third glue dot layer (6); The first chip (3) is bonded to one side of the copper frame (1) via a first mesh adhesive layer (2); The second chip (4) is bonded to the side of the first chip (3) facing away from the copper frame (1) via a second adhesive layer (5); A third glue dispensing layer (6) is provided on a side of the second chip (4) facing away from the first chip (3); The second glue dot layer (5) is provided with a plurality of glue dots.

2. The dual chip package structure according to claim 1, characterized in that: The plurality of glue dots of the second glue dot layer (5) are arranged in a grid shape.

3. The dual chip package structure according to claim 1, characterized in that: The third glue dot layer (6) is provided with a single glue dot or a plurality of glue dots.

4. The dual chip package structure according to claim 1, characterized in that: Gaps are provided between the plurality of glue dots of the second glue dot layer (5).

5. The dual chip package structure according to claim 1, characterized in that: The second glue dispensing layer (5) is dispensed by a glue dispensing block, and the glue dispensing block is provided with a plurality of glue outlet holes.

6. The dual chip package structure according to claim 1, characterized in that: The copper frame (1) is configured as a copper electrode.

7. A dual chip packaging structure, characterized in that: include: A copper frame (1), a first mesh glue layer (2), a first chip (3), a second chip (4), a second glue dot layer (5) and a third glue dot layer (6); The first chip (3) is bonded to one side of the copper frame (1) via a first mesh adhesive layer (2); The second chip (4) is bonded to the side of the first chip (3) facing away from the copper frame (1) via a second adhesive layer (5); A third glue dispensing layer (6) is provided on a side of the second chip (4) facing away from the first chip (3); The second glue dispensing layer (5) is provided with a plurality of glue outlet holes, and the plurality of glue dots of the second glue dispensing layer (5) are arranged in a mesh shape; The third glue dot layer (6) is provided with a single glue dot or a plurality of glue dots; Gaps are provided between the plurality of glue dots of the second glue dot layer (5); The second glue dispensing layer (5) is dispensed by a glue dispensing block, and the glue dispensing block is provided with a plurality of glue outlet holes; The copper frame (1) is configured as a copper electrode.

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